CN112082946A - Automatic detection system and method thereof - Google Patents

Abstract

An automated detection system, comprising: a production line, which comprises a sensing area and a detection area; at least one sensor for sensing at least one object to be detected conveyed by the production line; at least one light supplement element arranged above and/or beside the production line in the detection area; the first photographic device is arranged above the production line at a first distance in the detection area and acquires an upper state picture of the at least one object to be detected; the second photographic device is arranged on the side edge of the production line at a second distance in the detection area and acquires a side edge state picture of the at least one object to be detected; and the computer device receives the upper state picture and the side state picture and carries out image identification on the upper state picture and the side state picture.

Description

Automatic detection system and method thereof

technical field

The present invention is an automatic detection system and a detection method, in particular, an automatic detection system and method for detecting the installation state of components of various electronic products through image recognition.

Background technique

Display card is one of the most basic components of personal computer devices. Its purpose is to convert the display information required by the computer system to drive the display, and to provide progressive or interlaced scanning signals to the display to control the correct display of the display. It is the connection between the display and the display. It is an important component of the motherboard of the personal computer, and one of the important devices for "man-machine dialogue". Furthermore, Field Programmable Gate Array (FPGA) is a product further developed on the basis of PAL, GAL, CPLD and other programmable logic devices. It appears as a semi-customized circuit in the field of special application integrated circuits, which not only solves the shortcomings of full-customized circuits, but also overcomes the shortcomings of the limited number of gate circuits of the original programmable logic device.

Both the graphics card and the FPGA will generate high temperature during operation, which will cause the temperature of the internal components, especially the computing chip, to rise. Therefore, in the current manufacturing process of display cards and FPGAs, manual inspection is usually used to confirm whether the heat dissipation components of each display card and FPGA are installed correctly. However, in the above-mentioned manual detection method, there is often a situation of omission, resulting in a situation where defective products are not detected. In addition, the manual inspection method will lead to longer inspection time, which will lead to a decrease in production capacity.

Based on the above reasons, it is a problem to be solved how to invent an automatic detection system and a detection method, which can quickly and effectively automatically detect the display card and the FPGA.

SUMMARY OF THE INVENTION

In order to achieve the aforementioned object, the present invention provides an automatic detection system, comprising: a production line, including a sensing area and a detection area; at least one sensor, which is arranged at a position adjacent to the production line in the sensing area, the at least one sensor A sensor senses at least one object to be tested conveyed by the production line; at least one supplementary light element is arranged above and/or on the side of the production line in the detection area; a first photographing device is located in the detection area The first camera is arranged above the production line at a first distance, and the first photographing device captures the upper state picture of the at least one item to be tested; and a second photography device is arranged at a second distance in the detection area. On the side of the production line, the second camera device captures the side status picture of the at least one item to be tested; and a computer device is electrically connected to the at least one sensor, the at least one supplementary light element, and the first camera In the device and the second photographing device, the computer device receives the upper state image and the side state image, and performs image recognition on the upper state image and the side state image.

Furthermore, the automated inspection system of the present invention further includes a robotic arm, the robotic arm is electrically connected to the computer device, and the robotic arm is disposed on the side of the production line in the inspection area, and the second photographing device is disposed On the robotic arm, the second photographing device maintains the second distance from the at least one object to be tested by the movement of the robotic arm.

Preferably, the object to be tested is a display card or a field programmable logic gate array, the upper status screen is a fan status screen of the display card or the field programmable logic gate array, and the side status screen is the display Installation status screen between the card or the chip of the field programmable logic gate array and the bus heatsink.

Preferably, the first distance and the second distance are any value between 10-22.99 cm.

Preferably, the first distance and the second distance are 15 cm.

On the other hand, the present invention also provides an automatic detection method, comprising the following steps: conveying at least one object to be tested through a production line, the production line including a sensing area and a detection area; At least one sensor senses the at least one object to be tested, and when the at least one sensor senses the at least one object to be tested, it will turn on at least one supplementary light element, wherein the at least one supplementary light element is disposed in the detection area. upper and/or side; in the detection area, a first camera device disposed at a first distance above the production line captures the upper state picture of the at least one object to be tested; in the detection area Capture the side status picture of the at least one object to be tested by a second camera disposed at a second distance on the side of the production line; and receive the upper status picture and the side status picture by a computer device , and perform image recognition on the upper status screen and the side status screen, wherein the computer device is electrically connected to the at least one sensor, the at least one supplementary light element, the first camera device and the second camera device .

Preferably, the object to be tested is a display card or a field programmable logic gate array, the upper status screen is a fan status screen of the display card or the field programmable logic gate array, and the side status screen is the display Installation status screen between the card or the chip of the field programmable logic gate array and the bus heatsink.

Preferably, after the computer device receives the installation state picture, the computer device sets a bounding box in the installation state picture, and performs regression analysis based on the amount of the gap in the bounding box and the ratio of the length and width of the bounding box. , so as to determine whether the installation between the chip and the heat sink is correct and whether the heat dissipation paste between the chip and the heat sink is completely coated.

Preferably, the first distance and the second distance are any value between 10-22.99 cm.

Preferably, the first distance and the second distance are 15 cm.

Description of drawings

Those skilled in the art may have a better understanding of various aspects of the present invention and its specific features and advantages after reading the following detailed description with reference to the accompanying drawings, wherein the drawings include:

1 is a schematic top view illustrating the structure of an automated detection system according to an embodiment of the present invention;

2 is a schematic structural diagram illustrating a detection area according to an embodiment of the present invention;

3A is a schematic diagram illustrating a picture captured by a first photographing device according to an embodiment of the present invention;

3B is a schematic diagram illustrating a picture captured by a second photographing device according to an embodiment of the present invention;

4A is a schematic diagram illustrating a picture captured by a first photographing device according to another embodiment of the present invention;

4B is a schematic diagram illustrating a picture captured by a second photographing device according to another embodiment of the present invention;

FIG. 5 is a schematic structural diagram illustrating a detection area according to another embodiment of the present invention; and

FIG. 6 is a flow chart illustrating an automated detection method according to an embodiment of the present invention.

Among them, the reference numerals are described as follows:

2 Automatic detection system

10 production lines

20 Sensors

30 fill light element

40 The first photographic installation

50 Second photographic installation

60 Items to be tested, display cards

70 Bounding Box

101 Sensing area

103 Detection area

501 Robotic Arm

601 Fan

603 chip

605 sink heat sink

607 void

D1 first distance

D2 second distance

S10-S50 steps

Detailed ways

The embodiments of the present invention will be described in more detail below with reference to the drawings and reference numerals, so that those skilled in the art can implement the present invention accordingly.

FIG. 1 is a schematic top view for illustrating the structure of an automated detection system according to an embodiment of the present invention. Referring to FIG. 1 , in an embodiment of the present invention, an automated inspection system 1 includes a production line 10 , at least one sensor 20 , at least one supplementary light element 30 , a first photographing device 40 , a second photographing device 50 , and A computer device (not shown in the figure).

The production line 10 includes a sensing area 101 and a detection area 103 . At least one sensor 20 is disposed at a position adjacent to the production line 10 in the sensing area 101 , such as above the production line 10 , a side of the production line 10 , etc., and is shown to be disposed above the production line 10 in FIG. 1 . At least one sensor 20 can sense at least one object to be tested 60 conveyed by the production line 10 , wherein, in the sensing area 101 of the production line 10 , the at least one sensor 20 can be detected by at least one bracket or slide rail (not shown). As shown in the figure), the device is arranged above or on the side of the production line 10, and the number of the sensors 20 can be more than one. For example, the sensor 20 can be an infrared sensor. When at least one object to be tested 60 passes through the sensor 20 , the sensor 20 can sense the at least one object to be tested 60 .

At least one supplementary light element 30 is disposed above and/or on the side of the detection area 103 , the first photographing device 40 is disposed above the production line 10 at a first distance in the detection area 103 , and the second photographing device 50 is located in the detection area 103 is disposed on the side of the production line 10 at a second distance. In other words, the first camera 40 and the second camera 50 can be selectively arranged with a supplementary light element 30 above and on the side of the production line 10 to further capture the status screen of at least one object to be tested 60 entering the detection area 103 .

The computer device is electrically connected to the sensor 20 , at least one supplementary light element 30 , the first camera device 40 and the second camera device 50 . When the sensor 20 senses the object to be tested 60 , it will send a message to notify the computer device , and then turn on at least one light-filling element 30 , the first photographing device 40 and the second photographing device 50 by the computer device, so as to obtain the object to be tested entering the detection area 103 through the first photographing device 40 and the second photographing device 50 60 status screen. Furthermore, the computer device can receive the status images obtained by the first camera 40 and the second camera 50, and perform image recognition on the status images to determine whether the components of the object to be tested 60 are installed correctly.

FIG. 2 is a schematic diagram for explaining the structure of the detection area according to an embodiment of the present invention. Referring to FIGS. 1 and 2 , the first photographing device 40 is disposed above the production line 10 at a first distance D1 in the inspection area 103 , and the second photographing device 50 is disposed at a second distance in the inspection area 103 D2 is arranged on the side of the production line 10 . When the object to be tested 60 passes through the sensor 20 and enters the detection area 103 , the first photographing device 40 disposed above the production line 10 can obtain the upper status screen of the object to be tested 60 by the supplementary light of the light-filling element 30 , and set the The second photographing device 50 on the side of the production line 10 can obtain the side state picture of the object to be tested 60 by the supplementary light of the supplementary light element 30 .

It is worth mentioning that the first distance D1 and the second distance D2 are very important to the present invention. If the values of the first distance D1 and the second distance D2 are set incorrectly, the first photographing device 40 and the second photographing device 50 will be caused. The acquired picture is unclear, so that the computer device cannot perform image recognition. Therefore, in an embodiment of the present invention, the first distance D1 and the second distance D2 are respectively set to any value between 10-22.99 cm. In a preferred embodiment of the present invention, the first distance D1 is set to and the second distance D2 are both set to 15 cm, such a distance can enable the first photographing device 40 and the second photographing device 50 to obtain the best status images.

On the other hand, the present invention can achieve the integration of the tracking information displayed by the two cameras by integrating the coordinates of the first camera 40 and the second camera 50 to determine the position of the object to be tested 60 .

FIG. 3A is a schematic diagram for illustrating a frame captured by the first photographing device according to an embodiment of the present invention. Referring to FIG. 3A, in an embodiment of the present invention, the object to be tested 60 may be a display card or a field programmable logic gate array. In FIG. 3A, a display card is used as an example, and FIG. 3A shows the first An upper status picture of the object 60 to be tested obtained by the photographing device 40, the upper status picture is the status picture of the fan 601 of the display card 60, the computer device can perform image recognition on the status picture of the fan 601 after receiving the status picture of the fan 601, so as to It is judged whether the state of the fan 601 is good, for example, whether there is any defect such as breakage.

Furthermore, FIG. 3B is a schematic diagram for illustrating a picture acquired by the second photographing device according to an embodiment of the present invention. Please refer to FIG. 3B . FIG. 3B shows the side status picture of the object 60 under test obtained by the second photographing device 50 , and the side status picture is between the chip 603 of the display card 60 and the heat sink 605 Installation status screen. After receiving the installation status screen between the chip 603 and the bus heatsink 605, the computer device can perform image recognition on the mounting status screen between the chip 603 and the bus heatsink 605 to determine the chip 603 and the bussink heatsink. Whether the installation state between the 605 is good, for example, whether the thermal paste is not applied well or whether there is a gap between the chip 603 and the bus 605.

To further illustrate, when the computer device performs image recognition on the installation status screen between the chip 603 and the heat sink 605, the computer device will set a bounding box 70 in the installation status screen, and use the bounding box Regression analysis is performed between the gap amount in 70 and the length-width ratio of the bounding box 70 to determine whether the installation between the chip 603 and the heat sink 605 is correct and whether the thermal paste between the chip 603 and the heat sink 605 is completely coated. The aspect ratio of the bounding box 70 is preset in the computer device, and the amount of clearance in the bounding box 70 refers to the size of the gap between the chip 603 and the heat sink 605. If the chip 603 and the heat sink 605 There is a gap between 605, light can pass through the gap, so that the image of the gap can be captured, the computer device can judge the size of the gap by the aspect ratio of the bounding box 70, if the gap size exceeds a preset The value is judged as defective product. From this, it can be seen that FIG. 3B shows a screen where the chip 603 and the heat sink 605 are judged to be good products, because no gap is identified between the chip 603 and the heat sink 605 .

In addition, the computer device can calculate the plane position and coordinates of the object to be tested 60 on the production line 10 by using the first camera device 40 and the second camera device 50 , so as to set a boundary in the picture obtained by the second camera device 50 Box 70.

FIG. 4A is a schematic diagram illustrating a frame captured by a first photographing device according to another embodiment of the present invention. Referring to FIG. 4A , in another embodiment of the present invention, the object to be tested 60 may be a display card or a field programmable logic gate array. In FIG. 4A , a display card is used as an example, and FIG. 4A shows The first photographing device 40 obtains the upper status screen of the object to be tested 60, and the upper status screen is the fan 601 status screen of the display card 60. After receiving the fan 601 status screen, the computer device can perform image recognition on the fan 601 status screen. In order to judge whether the state of the fan 601 is good, for example, whether there is any defect such as damage.

Furthermore, FIG. 4B is a schematic diagram for illustrating a picture acquired by a second photographing device according to another embodiment of the present invention. Please refer to FIG. 4B . FIG. 4B shows the side status screen of the object to be tested 60 obtained by the second camera 50 , and the side status screen is the installation between the chip 603 of the display card 60 and the heat sink 605 A status screen, and in the mounting status screen, there is a gap 607 between the wafer 603 and the heat sink 605 . In this embodiment, the light will pass through the gap 607, so that the image of the gap 607 is captured, and the computer device can determine the size of the gap 607 according to the aspect ratio of the bounding box 70. If the size of the gap 607 exceeds a The default value is determined to be a defective product. In an embodiment of the present invention, the default value of the gap size is 2 mm. If the size of the gap 607 exceeds 2 mm, it means that the chip 603 and the heat sink 605 are not properly installed or thermal paste is not installed. The thickness of the product is insufficient, so it will be judged as a defective product after image recognition by the computer device.

It should be understood that, in order to illustrate the image recognition of the present invention more clearly, FIGS. 3A-4B only show the bounding box 70 and the pictures captured in the bounding box 70 .

FIG. 5 is a schematic diagram for explaining the structure of the detection area according to another embodiment of the present invention. Referring to FIGS. 1 and 5 , in another embodiment of the present invention, the automatic detection system 1 of the present invention further includes a robotic arm 501 , the robotic arm 501 is electrically connected to the computer device, and the robotic arm 501 is in the detection area 103 The middle is disposed on the side of the production line 10 , and at the same time, the second photographing device 50 is disposed on the robotic arm 501 . In this way, the second photographing device 50 can maintain the second distance D2 from the object to be tested 60 by the movement of the mechanical arm 501 . For example, after the coordinates of the object to be tested 60 on the production line 10 are integrated and positioned by the first camera device 40 and the second camera device 50, the position information can be transmitted to the computer device, and the computer device can be used to The robotic arm 501 is controlled to maintain the distance between the second photographing device 50 and the object to be tested 60 at the second distance D2. It should be understood that, in other embodiments of the present invention, the robotic arm 501 can be replaced by a linear sliding rail (not shown in the figure), and the second photographing device 50 is disposed on the linear sliding rail.

On the other hand, in other embodiments of the present invention, the computer device may be further connected with a database (not shown in the figure), when the computer device receives the data obtained by the first camera 40 and the second camera 50 After the image, the images judged to be defective products can be stored in the database, and the image deep learning can be carried out by using various defective images. Display card image samples for training and learning, and perform detection applications.

FIG. 6 is a flow chart for explaining an automatic detection method according to an embodiment of the present invention. 6, the automatic detection method of the present invention includes steps S10-S50, step S10 is: conveying at least one item to be tested by a production line, the production line includes a sensing area and a detection area; Step S20 is: borrowing At least one object to be tested is sensed by at least one sensor disposed in the sensing area, and when the at least one sensor senses the at least one object to be tested, at least one fill light element is turned on, wherein the at least one fill light The components are arranged above and/or on the side of the inspection area; step S30 is: capturing the at least one item to be inspected in the inspection area by a first camera device disposed at a first distance above the production line Step S40 is: capturing the side status picture of the at least one item to be tested by a second camera disposed at a second distance on the side of the production line in the detection area; and the step S50 is: receiving the upper status screen and the side status screen by a computer device, and performing image recognition on the upper status screen and the side status screen, wherein the computer device is electrically connected to the at least one sensor , the at least one supplementary light element, the first photographing device and the second photographing device.

On the other hand, in the automatic detection method of the present invention, the object to be tested can be a display card or a field programmable logic gate array, and the upper status screen is the fan status of the display card or the field programmable logic gate array a screen, the side status screen is an installation status screen between the chip of the display card or the field programmable logic gate array and the bus heatsink.

Furthermore, with reference to the schematic diagram of FIG. 4B , after the computer device receives the installation status screen, the computer device sets a bounding box 70 in the installation status screen, and uses the gap amount and boundary of the gap 607 in the bounding box 70 . The aspect ratio of the frame 70 is subjected to regression analysis to determine whether the installation between the chip 603 and the heat sink 605 is correct and whether the thermal paste between the chip 603 and the heat sink 605 is completely coated.

It is worth mentioning that, referring to FIG. 2 again, the first distance D1 and the second distance D2 are very important to the present invention. If the values of the first distance D1 and the second distance D2 are set incorrectly, the first photographing device 40 will be damaged. And the images obtained by the second photographing device 50 are not clear, so that the computer device cannot perform image recognition. Therefore, in the automatic detection method of the present invention, the first distance D1 and the second distance D2 are respectively set to any value between 10-22.99 cm. In a preferred embodiment of the present invention, the first distance is set to Both D1 and the second distance D2 are set to be 15 cm, such a distance can enable the first photographing device 40 and the second photographing device 50 to obtain the best state picture.

In addition, in the automatic detection method of the present invention, an integrated screen can be displayed in the computer device to display the positioning determination and detection results of the display card on the production line, and a signal is sent to give a green light for the detection pass, and a red light for the detection failure. All images are captured, and the detection data and detection results are stored in a database connected between the main control and the computer device.

To sum up, the present invention successfully provides an automatic detection system and method thereof. The automatic detection system and method of the present invention have the following technical features and advantages: 1. Two cameras are set up in the production line, and the coordinates of the two cameras are integrated to calculate the position of the object to be tested, so as to achieve two cameras The camera device shows the integration of the tracking information. 2. By setting a bounding box in the acquired image, and analyzing the gap between the bounding box and the aspect ratio regression analysis, to determine whether the installation between the chip of the graphics card and the heat sink is correct and the heat dissipation Whether the paste is applied.

The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. It should still be included in the scope of the intended protection of the present invention.

Claims (10)

1. an automatic detection system, is characterized in that, comprises: A production line, including an induction area and a detection area; at least one sensor is disposed at a position adjacent to the production line at the sensing area, and the at least one sensor senses at least one object to be tested conveyed by the production line; At least one supplementary light element is arranged above and/or on the side of the production line in the detection area; a first photographing device disposed above the production line at a first distance in the detection area, and the first photographing device captures an upper state picture of the at least one object to be tested; a second photographing device disposed on the side of the production line at a second distance in the detection area, and the second photographing device captures a side state picture of the at least one object to be tested; and A computer device is electrically connected to the at least one sensor, the at least one supplementary light element, the first camera device and the second camera device, the computer device receives the upper status screen and the side status screen, and responds to the Image recognition is performed on the upper status screen and the side status screen. 2 . The automated inspection system according to claim 1 , further comprising a robotic arm, the robotic arm is electrically connected to the computer device, and the robotic arm is disposed on the side of the production line in the inspection area. 3 . On the side, the second photographing device is disposed on the robotic arm, and the second photographing device maintains the second distance from the at least one object to be tested by the movement of the robotic arm. 3 . The automated inspection system according to claim 1 , wherein the object to be tested is a display card or a field programmable logic gate array, and the upper status screen is the display card or the field programmable logic gate array. 4 . The fan status picture of the side status picture is the installation status picture between the chip of the display card or the field programmable logic gate array and the bus heatsink. 4 . The automatic detection system of claim 1 , wherein the first distance and the second distance are any value between 10-22.99 cm. 5 . 5 . The automatic detection system of claim 4 , wherein the first distance and the second distance are 15 cm. 6 . 6. an automatic detection method, is characterized in that, comprises the following steps: conveying at least one item to be tested through a production line, the production line includes a sensing area and a detection area; At least one object to be tested is sensed by at least one sensor disposed in the sensing area, and when the at least one sensor senses the at least one object to be tested, at least one supplementary light element is turned on, wherein the at least one supplementary The light element is arranged above and/or on the side of the detection area; In the detection area, a first camera device disposed at a first distance above the production line captures an upper state picture of the at least one object to be tested; In the detection area, a side state picture of the at least one object to be tested is captured by a second camera disposed at a second distance from the side of the production line; and Receive the upper status screen and the side status screen by a computer device, and perform image recognition on the upper status screen and the side status screen, wherein the computer device is electrically connected to the at least one sensor, the at least one A supplementary light element, the first photographing device and the second photographing device. 7. The automatic detection method of claim 6, wherein the object to be tested is a display card or a field programmable logic gate array, and the upper status screen is the display card or the field programmable logic gate array the fan status screen, the side status screen is the installation status screen between the chip of the display card or the field programmable logic gate array and the bus heatsink. 8 . The automatic detection method according to claim 7 , wherein after the computer device receives the installation status screen, the computer device sets a bounding box in the installation status screen, and uses the bounding box to set a bounding box. Regression analysis is performed between the gap amount and the length-width ratio of the bounding box to determine whether the installation between the chip and the sink heat sink is correct and whether the thermal paste between the chip and the sink heat sink is completely coated. 9 . The automatic detection method according to claim 6 , wherein the first distance and the second distance are any value between 10-22.99 cm. 10 . 10 . The automatic detection method of claim 9 , wherein the first distance and the second distance are 15 cm. 11 .

Images