CN112074100A - Method for preventing gold finger from being scrapped due to tin coating - Google Patents
Method for preventing gold finger from being scrapped due to tin coating Download PDFInfo
- Publication number
- CN112074100A CN112074100A CN202010952662.4A CN202010952662A CN112074100A CN 112074100 A CN112074100 A CN 112074100A CN 202010952662 A CN202010952662 A CN 202010952662A CN 112074100 A CN112074100 A CN 112074100A
- Authority
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- China
- Prior art keywords
- layer
- tin
- gold
- gold finger
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 239000010931 gold Substances 0.000 title claims abstract description 95
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 95
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000011248 coating agent Substances 0.000 title description 8
- 238000000576 coating method Methods 0.000 title description 8
- 239000003292 glue Substances 0.000 claims abstract description 84
- 238000007639 printing Methods 0.000 claims abstract description 36
- 238000005507 spraying Methods 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 86
- 239000000741 silica gel Substances 0.000 claims description 41
- 229910002027 silica gel Inorganic materials 0.000 claims description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 34
- 229920001721 polyimide Polymers 0.000 claims description 27
- 239000000499 gel Substances 0.000 claims description 26
- 239000004642 Polyimide Substances 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 229910021389 graphene Inorganic materials 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 7
- 239000012466 permeate Substances 0.000 abstract description 2
- 239000002390 adhesive tape Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000035515 penetration Effects 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- -1 graphite alkene Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of circuit board processing, and provides a method for preventing tin on a gold finger from being scrapped, which is characterized by comprising the following steps of: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming. On the basis of the prior art, the gold finger can be effectively protected by adding the step of printing the peelable blue glue, the scrapping caused by the fact that tin permeates into and sticks to the gold surface in the tin spraying process can be prevented, and the problem that the red glue cannot be manufactured due to the fact that tin seeps in gaps can be effectively solved.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a method for preventing tin on a gold finger from being scrapped.
Background
The gold finger used for the interface on the circuit board can cause friction loss to the gold surface of the gold finger when plugging, in order to increase the plugging times, in the production and manufacturing of the circuit board, after an outer layer circuit and a solder mask layer are manufactured, the gold finger is continuously subjected to electric thick gold processing on the basis of nickel-gold surface processing, so that the gold layer thickness of the gold finger is increased. In the production process of the tin-spraying gold finger circuit board, the peelable printing ink needs to be printed on the surface of a gold finger, and the surface of the gold finger can be protected to prevent the gold surface from being tin-coated during the tin spraying process.
Because of in the hot air solder leveling production process, the red glue department of pasting can appear the gap and lead to tin can permeate the golden finger and influence the use, produces the golden finger on the tin easily, leads to the disability rate high to cause hot air solder leveling process production efficiency low, seriously influence yield, output. Therefore, the scrapping of tin on the golden finger is controlled, and the quality, the output and the cost of products of enterprises are greatly improved.
Disclosure of Invention
In view of the above, the invention provides a method for preventing tin on a gold finger from being scrapped, which can effectively solve the problem that the red glue cannot be manufactured due to tin infiltration caused by a gap.
The technical scheme of the invention is as follows:
a method for preventing tin on a gold finger from being scrapped is characterized by comprising the following steps: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming.
Furthermore, the peelable blue glue is resistant to high temperature of more than 280 ℃, otherwise, the peelable blue glue can melt to pollute the gold surface.
Further, in the process of printing the peelable blue glue, 39T screen printing is adopted twice during printing. After the blue glue is printed, the protection capability is influenced because the blue glue has bubbles, and the protection effect can be ensured through two times of printing.
Furthermore, the thickness of the peelable blue gel is 0.2mm-0.8mm, so that better adhesion tightness can be ensured when the blue gel is adhered with high-temperature red gel, and reinforcement and protection can be realized.
Further, the high-temperature red glue comprises the following components in sequence from top to bottom: the polyimide-silica gel laminated paper comprises a gloss paper layer, a polyimide layer, a graphene sheet layer and a silica gel layer, wherein the polyimide layer is a rubber adhesive layer, and the silica gel layer is a silica gel adhesive layer.
Furthermore, the thickness of the gloss paper layer is 100-150 μm.
Further, the thickness of the polyimide layer is 30-45 μm.
Further, the thickness of the graphene sheet layer is 20-35 μm.
Further, the thickness of the silica gel layer is 15-25 μm.
Further, in the electric gold finger process, the circuit board is subjected to gold electroplating treatment, and gold is plated on the gold finger until the thickness of the gold layer meets the design requirement.
The high-temperature red glue adopted by the invention has the advantages that the size stability of the outermost layer of the gloss paper in a high-temperature state can be ensured, the size stability of the whole adhesive tape in a high-temperature environment can be ensured, and the abnormity of arching, warping and the like of the edge of the adhesive tape can be avoided, so that the adhesive tape is prevented from being lifted by high-pressure hot air. The coating is in graphite alkene piece top on the high temperature resistant polyimide film of inlayer, is showing to improve its high temperature resistant effect, guarantees not the cull under high temperature environment, and the filling nature of circuit board golden finger step can be guaranteed to suitable glue thickness, guarantees not the tin penetration. Therefore, the characteristic of dimensional stability of the gloss paper material is fully exerted, the characteristic of high-temperature resistance and stability of the graphene sheet is fully exerted, and the characteristic of high-temperature resistance of the silica gel is exerted. The application and operation are simple, the quality is stable, and the yield and the production efficiency are greatly improved.
On the basis of the prior art, the gold finger can be effectively protected by adding the step of printing the peelable blue glue, and the scrapping caused by the fact that tin is infiltrated into the gold surface to be adhered in the tin spraying process is prevented.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A method for preventing tin on a gold finger from being scrapped is characterized by comprising the following steps: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming.
Furthermore, the peelable blue glue is resistant to high temperature of more than 280 ℃, otherwise, the peelable blue glue can melt to pollute the gold surface.
Further, in the process of printing the peelable blue glue, 39T screen printing is adopted twice during printing. After the blue glue is printed, the protection capability is influenced because the blue glue has bubbles, and the protection effect can be ensured through two times of printing.
Furthermore, the thickness of the peelable blue gel is 0.5mm, so that better adhesion tightness can be ensured when the blue gel is adhered with high-temperature red gel, and the blue gel can be reinforced and protected.
Further, the high-temperature red glue comprises the following components in sequence from top to bottom: the polyimide-silica gel laminated paper comprises a gloss paper layer, a polyimide layer, a graphene sheet layer and a silica gel layer, wherein the polyimide layer is a rubber adhesive layer, and the silica gel layer is a silica gel adhesive layer.
Further, the thickness of the gloss paper layer is 120 μm.
Further, the thickness of the polyimide layer is 40 μm.
Further, the thickness of the graphene sheet layer is 28 μm.
Further, the thickness of the silica gel layer is 20 μm.
Further, in the electric gold finger process, the circuit board is subjected to gold electroplating treatment, and gold is plated on the gold finger until the thickness of the gold layer meets the design requirement.
The high-temperature red glue adopted by the invention has the advantages that the size stability of the outermost layer of the gloss paper in a high-temperature state can be ensured, the size stability of the whole adhesive tape in a high-temperature environment can be ensured, and the abnormity of arching, warping and the like of the edge of the adhesive tape can be avoided, so that the adhesive tape is prevented from being lifted by high-pressure hot air. The coating is in graphite alkene piece top on the high temperature resistant polyimide film of inlayer, is showing to improve its high temperature resistant effect, guarantees not the cull under high temperature environment, and the filling nature of circuit board golden finger step can be guaranteed to suitable glue thickness, guarantees not the tin penetration. Therefore, the characteristic of dimensional stability of the gloss paper material is fully exerted, the characteristic of high-temperature resistance and stability of the graphene sheet is fully exerted, and the characteristic of high-temperature resistance of the silica gel is exerted. The application and operation are simple, the quality is stable, and the yield and the production efficiency are greatly improved.
On the basis of the prior art, the gold finger can be effectively protected by adding the step of printing the peelable blue glue, and the scrapping caused by the fact that tin is infiltrated into the gold surface to be adhered in the tin spraying process is prevented.
Example 2
A method for preventing tin on a gold finger from being scrapped is characterized by comprising the following steps: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming.
Furthermore, the peelable blue glue is resistant to high temperature of more than 280 ℃, otherwise, the peelable blue glue can melt to pollute the gold surface.
Further, in the process of printing the peelable blue glue, 39T screen printing is adopted twice during printing. After the blue glue is printed, the protection capability is influenced because the blue glue has bubbles, and the protection effect can be ensured through two times of printing.
Furthermore, the thickness of the peelable blue gel is 0.6mm, so that better adhesion tightness can be ensured when the blue gel is adhered with high-temperature red gel, and the blue gel can be reinforced and protected.
Further, the high-temperature red glue comprises the following components in sequence from top to bottom: the polyimide-silica gel laminated paper comprises a gloss paper layer, a polyimide layer, a graphene sheet layer and a silica gel layer, wherein the polyimide layer is a rubber adhesive layer, and the silica gel layer is a silica gel adhesive layer.
Further, the thickness of the gloss paper layer is 130 μm.
Further, the thickness of the polyimide layer is 38 μm.
Further, the thickness of the graphene sheet layer is 25 μm.
Further, the thickness of the silica gel layer is 18 μm.
Further, in the electric gold finger process, the circuit board is subjected to gold electroplating treatment, and gold is plated on the gold finger until the thickness of the gold layer meets the design requirement.
The high-temperature red glue adopted by the invention has the advantages that the size stability of the outermost layer of the gloss paper in a high-temperature state can be ensured, the size stability of the whole adhesive tape in a high-temperature environment can be ensured, and the abnormity of arching, warping and the like of the edge of the adhesive tape can be avoided, so that the adhesive tape is prevented from being lifted by high-pressure hot air. The coating is in graphite alkene piece top on the high temperature resistant polyimide film of inlayer, is showing to improve its high temperature resistant effect, guarantees not the cull under high temperature environment, and the filling nature of circuit board golden finger step can be guaranteed to suitable glue thickness, guarantees not the tin penetration. Therefore, the characteristic of dimensional stability of the gloss paper material is fully exerted, the characteristic of high-temperature resistance and stability of the graphene sheet is fully exerted, and the characteristic of high-temperature resistance of the silica gel is exerted. The application and operation are simple, the quality is stable, and the yield and the production efficiency are greatly improved.
On the basis of the prior art, the gold finger can be effectively protected by adding the step of printing the peelable blue glue, and the scrapping caused by the fact that tin is infiltrated into the gold surface to be adhered in the tin spraying process is prevented.
Example 3
A method for preventing tin on a gold finger from being scrapped is characterized by comprising the following steps: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming.
Furthermore, the peelable blue glue is resistant to high temperature of more than 280 ℃, otherwise, the peelable blue glue can melt to pollute the gold surface.
Further, in the process of printing the peelable blue glue, 39T screen printing is adopted twice during printing. After the blue glue is printed, the protection capability is influenced because the blue glue has bubbles, and the protection effect can be ensured through two times of printing.
Furthermore, the thickness of the peelable blue gel is 0.4mm, so that better adhesion tightness can be ensured when the blue gel is adhered with high-temperature red gel, and the blue gel can be reinforced and protected.
Further, the high-temperature red glue comprises the following components in sequence from top to bottom: the polyimide-silica gel laminated paper comprises a gloss paper layer, a polyimide layer, a graphene sheet layer and a silica gel layer, wherein the polyimide layer is a rubber adhesive layer, and the silica gel layer is a silica gel adhesive layer.
Furthermore, the thickness of the gloss paper layer is 110 μm.
Further, the thickness of the polyimide layer is 35 μm.
Further, the thickness of the graphene sheet layer is 30 μm.
Further, the thickness of the silica gel layer is 22 μm.
Further, in the electric gold finger process, the circuit board is subjected to gold electroplating treatment, and gold is plated on the gold finger until the thickness of the gold layer meets the design requirement.
The high-temperature red glue adopted by the invention has the advantages that the size stability of the outermost layer of the gloss paper in a high-temperature state can be ensured, the size stability of the whole adhesive tape in a high-temperature environment can be ensured, and the abnormity of arching, warping and the like of the edge of the adhesive tape can be avoided, so that the adhesive tape is prevented from being lifted by high-pressure hot air. The coating is in graphite alkene piece top on the high temperature resistant polyimide film of inlayer, is showing to improve its high temperature resistant effect, guarantees not the cull under high temperature environment, and the filling nature of circuit board golden finger step can be guaranteed to suitable glue thickness, guarantees not the tin penetration. Therefore, the characteristic of dimensional stability of the gloss paper material is fully exerted, the characteristic of high-temperature resistance and stability of the graphene sheet is fully exerted, and the characteristic of high-temperature resistance of the silica gel is exerted. The application and operation are simple, the quality is stable, and the yield and the production efficiency are greatly improved.
On the basis of the prior art, the gold finger can be effectively protected by adding the step of printing the peelable blue glue, and the scrapping caused by the fact that tin is infiltrated into the gold surface to be adhered in the tin spraying process is prevented.
Example 4
A method for preventing tin on a gold finger from being scrapped is characterized by comprising the following steps: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming.
Furthermore, the peelable blue glue is resistant to high temperature of more than 280 ℃, otherwise, the peelable blue glue can melt to pollute the gold surface.
Further, in the process of printing the peelable blue glue, 39T screen printing is adopted twice during printing. After the blue glue is printed, the protection capability is influenced because the blue glue has bubbles, and the protection effect can be ensured through two times of printing.
Furthermore, the thickness of the peelable blue gel is 0.2mm, so that better adhesion tightness can be ensured when the blue gel is adhered with high-temperature red gel, and the blue gel can be reinforced and protected.
Further, the high-temperature red glue comprises the following components in sequence from top to bottom: the polyimide-silica gel laminated paper comprises a gloss paper layer, a polyimide layer, a graphene sheet layer and a silica gel layer, wherein the polyimide layer is a rubber adhesive layer, and the silica gel layer is a silica gel adhesive layer.
Further, the thickness of the gloss paper layer is 100 μm.
Further, the thickness of the polyimide layer is 30 μm.
Further, the thickness of the graphene sheet layer is 20 μm.
Further, the thickness of the silica gel layer is 15 μm.
Further, in the electric gold finger process, the circuit board is subjected to gold electroplating treatment, and gold is plated on the gold finger until the thickness of the gold layer meets the design requirement.
The high-temperature red glue adopted by the invention has the advantages that the size stability of the outermost layer of the gloss paper in a high-temperature state can be ensured, the size stability of the whole adhesive tape in a high-temperature environment can be ensured, and the abnormity of arching, warping and the like of the edge of the adhesive tape can be avoided, so that the adhesive tape is prevented from being lifted by high-pressure hot air. The coating is in graphite alkene piece top on the high temperature resistant polyimide film of inlayer, is showing to improve its high temperature resistant effect, guarantees not the cull under high temperature environment, and the filling nature of circuit board golden finger step can be guaranteed to suitable glue thickness, guarantees not the tin penetration. Therefore, the characteristic of dimensional stability of the gloss paper material is fully exerted, the characteristic of high-temperature resistance and stability of the graphene sheet is fully exerted, and the characteristic of high-temperature resistance of the silica gel is exerted. The application and operation are simple, the quality is stable, and the yield and the production efficiency are greatly improved.
On the basis of the prior art, the gold finger can be effectively protected by adding the step of printing the peelable blue glue, and the scrapping caused by the fact that tin is infiltrated into the gold surface to be adhered in the tin spraying process is prevented.
Example 5
A method for preventing tin on a gold finger from being scrapped is characterized by comprising the following steps: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming.
Furthermore, the peelable blue glue is resistant to high temperature of more than 280 ℃, otherwise, the peelable blue glue can melt to pollute the gold surface.
Further, in the process of printing the peelable blue glue, 39T screen printing is adopted twice during printing. After the blue glue is printed, the protection capability is influenced because the blue glue has bubbles, and the protection effect can be ensured through two times of printing.
Furthermore, the thickness of the peelable blue gel is 0.8mm, so that better adhesion tightness can be ensured when the blue gel is adhered with high-temperature red gel, and the blue gel can be reinforced and protected.
Further, the high-temperature red glue comprises the following components in sequence from top to bottom: the polyimide-silica gel laminated paper comprises a gloss paper layer, a polyimide layer, a graphene sheet layer and a silica gel layer, wherein the polyimide layer is a rubber adhesive layer, and the silica gel layer is a silica gel adhesive layer.
Further, the thickness of the gloss paper layer is 150 μm.
Further, the thickness of the polyimide layer is 45 μm.
Further, the thickness of the graphene sheet layer is 35 μm.
Further, the thickness of the silica gel layer is 25 μm.
Further, in the electric gold finger process, the circuit board is subjected to gold electroplating treatment, and gold is plated on the gold finger until the thickness of the gold layer meets the design requirement.
The high-temperature red glue adopted by the invention has the advantages that the size stability of the outermost layer of the gloss paper in a high-temperature state can be ensured, the size stability of the whole adhesive tape in a high-temperature environment can be ensured, and the abnormity of arching, warping and the like of the edge of the adhesive tape can be avoided, so that the adhesive tape is prevented from being lifted by high-pressure hot air. The coating is in graphite alkene piece top on the high temperature resistant polyimide film of inlayer, is showing to improve its high temperature resistant effect, guarantees not the cull under high temperature environment, and the filling nature of circuit board golden finger step can be guaranteed to suitable glue thickness, guarantees not the tin penetration. Therefore, the characteristic of dimensional stability of the gloss paper material is fully exerted, the characteristic of high-temperature resistance and stability of the graphene sheet is fully exerted, and the characteristic of high-temperature resistance of the silica gel is exerted. The application and operation are simple, the quality is stable, and the yield and the production efficiency are greatly improved.
On the basis of the prior art, the gold finger can be effectively protected by adding the step of printing the peelable blue glue, and the scrapping caused by the fact that tin is infiltrated into the gold surface to be adhered in the tin spraying process is prevented.
By the processing method in the embodiments 1-5, the following economic and technical indexes can be achieved:
1. the rejection caused by the influence of tin penetration on the gold finger is reduced:
market average price of 2200 yuan/m according to golden finger and tin spraying plate2The scrapping cost can be reduced every month;
2. the popularity of the golden finger and tin-spraying plate products of enterprises can be improved, and potential customers can be developed;
3. the influence of the quality on market development can be improved, and the market competitiveness is increased.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A method for preventing tin on a gold finger from being scrapped is characterized by comprising the following steps: solder resist, gold finger electric connection, printing peelable blue glue, pasting high-temperature red glue on the peelable blue glue, spraying tin and forming.
2. The method for preventing tin scrap on gold fingers according to claim 1, wherein the peelable blue gel is peelable blue gel resistant to high temperature of more than 280 ℃.
3. The method for preventing tin scrap on gold fingers according to claim 2, wherein the thickness of the peelable blue glue is 0.2mm-0.8 mm.
4. The method for preventing the tin scrap on the gold finger as claimed in claim 1, wherein in the process of printing the peelable blue gel, 39T screen printing is adopted twice during printing.
5. The method for preventing the tin scrap on the gold finger as claimed in claim 1, wherein the high-temperature red glue comprises the following components in sequence from top to bottom: the polyimide-silica gel laminated paper comprises a gloss paper layer, a polyimide layer, a graphene sheet layer and a silica gel layer, wherein the polyimide layer is a rubber adhesive layer, and the silica gel layer is a silica gel adhesive layer.
6. The method for preventing tin scrap on golden fingers according to claim 5, wherein the thickness of the gloss paper layer is 100-150 μm.
7. The method for preventing tin scrap on a gold finger as claimed in claim 5, wherein the thickness of the polyimide layer is 30 μm to 45 μm.
8. The method for preventing the tin scrap on the gold finger according to claim 5, wherein the thickness of the graphene sheet layer is 20-35 μm.
9. The method for preventing the scrapping of tin on the gold finger according to claim 5, wherein the thickness of the silica gel layer is 15 μm to 25 μm.
10. The method for preventing the scrapping of tin on the gold finger as claimed in claim 1, wherein in the electric gold finger process, the gold electroplating treatment is carried out on the circuit board, and gold is plated on the gold finger until the thickness of the gold layer reaches the design requirement.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010952662.4A CN112074100B (en) | 2020-09-11 | 2020-09-11 | Method for preventing tin plating of golden finger from being scrapped |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010952662.4A CN112074100B (en) | 2020-09-11 | 2020-09-11 | Method for preventing tin plating of golden finger from being scrapped |
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| CN112074100B CN112074100B (en) | 2024-03-22 |
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| CN105578778A (en) * | 2015-12-17 | 2016-05-11 | 江门崇达电路技术有限公司 | Manufacturing method of single-face local thick-gold plated PCB |
| CN105578780A (en) * | 2016-01-01 | 2016-05-11 | 广州兴森快捷电路科技有限公司 | Tin spraying method for gold finger plate |
| WO2018214392A1 (en) * | 2017-05-24 | 2018-11-29 | 惠州市金百泽电路科技有限公司 | Method for preparing aluminum-based circuit board having aluminum-based surface protection |
| CN209468361U (en) * | 2018-10-12 | 2019-10-08 | 广东硕成科技有限公司 | A kind of High temperature-resistanadhesive adhesive tape for wiring board spray tin processing procedure golden finger protection |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
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