CN112067652A - Chip defect detection positioning system and application method thereof - Google Patents
Chip defect detection positioning system and application method thereof Download PDFInfo
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Abstract
The invention provides a chip defect detection positioning system, which comprises a detection film, a detection film and a positioning device, wherein the detection film comprises a substrate layer, a bonding layer and a temperature-sensitive color-changing layer, the temperature-sensitive color-changing layer is formed by curing temperature-sensitive color-changing slurry, and the temperature-sensitive color-changing slurry comprises liquid crystal microcapsules, main body resin and water; the power supply device provides an electric signal to the chip to be tested; and a signal processing device which collects and processes the test signal. The invention also discloses a method for detecting the defects of the positioning chip. The chip defect detecting and positioning system disclosed by the invention can detect micron-sized chip defects, the detection result is vivid and visual, and the detection method is simple and easy to operate. Meanwhile, the detection film is attached and measured immediately, and can be removed after use, so that special cleaning is not needed, and the detection method is safe and reliable.
Description
Technical Field
The invention relates to a chip defect detecting and positioning system, in particular to a chip defect detecting and positioning system containing liquid crystal microcapsules and an application method thereof.
Background
With the development of technology, there is an increasing demand for chip reliability. As a semiconductor element of an integrated circuit, a chip is a main component of a main board, and functions such as calculation, storage, and the like can be completed by a circuit integrated in the chip. With the continuous development of chip technology, the integrated circuit is continuously developed and iterated, the chip volume is also continuously reduced, the complexity of the circuit on the chip is rapidly increased, and the damage of any tiny details can cause the failure of the whole chip. Since the chip manufacturing and production process often requires hundreds of steps of processes, the damage of the semiconductor device, especially the chip is scratched or the metal element is interconnected during the production process, which results in the loss of the function of the final chip. In actual production and use, not only the cause of chip failure needs to be investigated, but also the damage position needs to be accurately located, so as to explore the cause and specific type of such problems occurring in the production process, and accordingly adjust and improve the specific process module in chip production. A detection method that can accurately locate the failure point is therefore needed.
The generation of a defect (failure point) in the damaged semiconductor element often causes a change in the impedance at this point during operation, and thus is significantly different from the heat generated at a normal position. By using the principle, the existing detection method mainly comprises the technologies of liquid crystal leakage positioning, electrothermal positioning (EMMI (CCD \ InGaAs), laser induction) and the like. The electrothermal positioning technology is used for detecting the position where the impedance has a relatively obvious change under the condition that the laser scans the surface of the chip, and the position is probably a leakage position. In the center of the art, the detection of impedance changes is reflected by voltage and current. As a novel high-resolution microscopic defect positioning technology, the electrothermal positioning technology can rapidly and accurately position device failure defects in a large range, has the advantages of rapidness, universality, cleanness, sensitivity and the like, and has the defects of expensive equipment, high requirements on cleanliness and voltage stability of a detection room, difficulty in accurately positioning a chip with metal shielding or resistance-type defects, requirement on precision maintenance and the like. The liquid crystal leakage positioning technology is characterized in that nematic liquid crystal with certain phase transition temperature is directly coated on a chip in uniform thickness by utilizing the characteristic that the nematic liquid crystal can generate obvious optical change at the temperature of a phase transition point, and transparent points or black points can be seen through a polarization microscope according to the difference of the temperatures of failure points and normal points during testing, so that the failure points are accurately positioned on the chip. The method has lower cost than an electrothermal positioning method, does not have the defects of metal shielding and the like, but has certain toxicity to nematic liquid crystal used by the method and a solvent involved in the subsequent liquid crystal cleaning process, and has certain health hazard to testers. Meanwhile, the method has higher requirements on the temperature of the test environment, so that a specific test environment is required, and the requirements cannot be met for some chips used at high temperature. In addition, the method has high requirements on the coating process, the thickness uniformity of coating can seriously affect the test result, and the liquid crystal cannot be doped with any coating auxiliary agent, so the uniformity and the leveling of pure liquid crystal on a chip and the like are greatly influenced by the types of the liquid crystal and the surface treatment of the chip, thereby the success rate is low, and the time and the labor are wasted.
Therefore, it is desirable to provide a chip defect detecting and positioning system and method thereof, which can accurately detect and position defects, reduce the cost, optimize the operation, and are safe and reliable.
Disclosure of Invention
In order to solve the above problems, an aspect of the present invention provides a chip defect detecting and positioning system, including: the detection film comprises a substrate layer, a bonding layer and a temperature-sensitive color-changing layer, wherein the temperature-sensitive color-changing layer is formed by curing temperature-sensitive color-changing slurry, and the temperature-sensitive color-changing slurry comprises liquid crystal microcapsules, main body resin and water; the power supply device provides an electric signal to the chip to be tested; and a signal processing device which collects and processes the test signal.
In a preferred embodiment, the signal processing device is a microscope system.
In a preferred embodiment, the liquid crystal microcapsule comprises a wall material and a core material, wherein the wall material is a high molecular material, and the core material is cholesteric liquid crystal.
In a preferred embodiment, the host resin includes a natural polymer material, a semi-synthetic polymer material, and a synthetic polymer material. In a more preferred embodiment, the synthetic polymer material includes aqueous acrylic resin, UV light-curable resin, aqueous epoxy resin, aqueous amino resin, polyurethane resin, polyvinyl alcohol, polyester, polyallyl alcohol, polyethylene glycol, and polyvinyl pyrrolidone, the natural polymer material includes gelatin, sodium alginate, and chitosan, and the semi-synthetic polymer material includes hydroxymethyl cellulose, methyl cellulose, and hypromellose.
In a preferred embodiment, the mass of the liquid crystal microcapsule accounts for 60-95% of the temperature-sensitive color-changing slurry, and the mass of the main body resin accounts for 1-30% of the temperature-sensitive color-changing slurry.
In a preferred embodiment, the thermochromic paste further includes an auxiliary agent including a leveling agent, a thickener, a wetting agent, a dispersant and a defoaming agent.
On the other hand, the invention also discloses a method for detecting the defects of the positioning chip, which comprises the following steps: a. preparing a detection film, wherein the detection film comprises a substrate layer, an adhesive layer and a temperature-sensitive color-changing layer; b. removing the substrate layer, and tightly attaching the temperature-sensitive color-changing layer to the chip to be detected through the adhesive layer; c. the power supply device provides an electric signal to the chip to be tested; d. the signal processing device collects and processes the test signals so as to detect and position the defects of the chip to be tested; e. the detection membrane is removed.
In a preferred embodiment, step b further comprises cutting the detection film to a size corresponding to the chip to be tested.
In a preferred embodiment, the step of preparing the detection membrane comprises: preparing temperature sensing color changing slurry according to a certain proportion, and mixing and dispersing uniformly; uniformly coating the temperature-sensitive color-changing slurry on the substrate layer with the adhesive layer to form a uniform wet film; and curing the temperature-sensitive color-changing slurry to form a temperature-sensitive color-changing layer.
In a preferred embodiment, the wet film has a thickness of 5 to 200 μm. In a more preferred embodiment, the wet film has a thickness of 5 to 100 μm.
In a preferred embodiment, the curing is by light curing, heat curing or a combination thereof.
The chip defect detecting and positioning system and the method provided by the invention can detect the micron-sized chip defects by utilizing the characteristic that the liquid crystal microcapsules display different colors along with the temperature, and have the advantages of vivid and visual detection result and simple and easy operation of the detection method. Meanwhile, the detection film is attached and measured immediately, and can be removed after use, so that special cleaning is not needed, and the detection method is safe and reliable.
Drawings
The invention may be better understood by reference to the following description of embodiments of the invention taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a chip detection and positioning system according to the present disclosure;
FIG. 2 is a schematic view of the structure of the detection membrane disclosed in the present invention;
FIG. 3 is a schematic diagram of the operation of the detection membrane disclosed in the present invention;
fig. 4 is a microscope image of a detection membrane prepared according to an embodiment of the present invention while it is in operation.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, it will be apparent to those skilled in the art that the present invention may be practiced without these specific details. The illustrated example embodiments have been set forth only for the purposes of example and that it is not intended to be limiting. Therefore, it is intended that the scope of the invention be limited not by this detailed description, but rather by the claims appended hereto.
As shown in fig. 1, the invention discloses a chip defect positioning system, which comprises a detection film 1, a power supply device 2 and a signal processing device 3. During detection, the detection film 1 is tightly attached to the chip 4 to be detected, and different colors can be displayed according to different temperatures of the contact surface of the detection film and the chip 4 to be detected. The power supply device 2 supplies the chip 4 to be tested with an electrical signal for detection, which may be a voltage or a current. In the detection, if the chip 4 to be detected has defects, the position of the chip can generate different temperature from the surrounding temperature under the condition of electric signals, the detection film 1 can generate corresponding test signals, and the signal processing device collects and processes the test signals, so that the positioning defects are detected. The signal processing means may be any means capable of detecting changes in optical properties and analyzing positional information, and in the present invention, the signal processing means is preferably a microscope system capable of detecting and locating defects in the order of micrometers.
As shown in fig. 2, the detection membrane 1 includes a thermochromic layer 11, an adhesive layer 12 and a base layer 13, wherein the thermochromic layer 11 is formed by curing a thermochromic paste including liquid crystal microcapsules 101, a host resin and water, wherein the host resin is cured to form a uniform thermochromic layer 11 and fix the liquid crystal microcapsules 101 therein. The liquid crystal microcapsule 101 is composed of two parts, i.e., a core material and a wall material, wherein the wall material is a high polymer material, such as a natural or synthetic high polymer material, and the core material is a common cholesteric liquid crystal, including a cholesteric ester liquid crystal and a chiral nematic liquid crystal. The pitch of the cholesteric liquid crystal changes with the change of temperature, so that light with different wavelengths is reflected, the liquid crystal microcapsule presents different colors, and finally the temperature-sensitive color-changing layer 11 presents different colors according to the contact temperature. By adjusting the mutual proportion of cholesteric liquid crystals or the content of a chiral agent, the liquid crystal microcapsules which change color in different temperature ranges can be prepared. The liquid crystal microcapsule accounts for 60-95% of the whole thermochromic slurry by mass percent. The main body resin can be natural high molecular material, such as gelatin, sodium alginate, chitosan, etc.; or semi-synthetic polymer material such as hydroxymethyl cellulose, methylcellulose, hypromellose, etc.; or synthetic polymer materials such as aqueous acrylic resin, UV curable resin, aqueous epoxy resin, aqueous amino resin, polyurethane resin, polyvinyl alcohol, polyester, polyvinyl alcohol, polyethylene glycol, polyvinylpyrrolidone, etc. The mass percentage of the main resin in the whole temperature-sensitive color-changing slurry is 1-30%. Preferably, the mass percent of the main body resin in the whole thermochromic slurry is 1-20%.
The thermochromic slurry further comprises auxiliaries including a leveling agent, a thickening agent, a wetting agent, a dispersing agent and a defoaming agent, but the invention is not limited thereto, and auxiliaries having other functions may be added as needed. The leveling agent is used for effectively reducing the surface tension of the slurry on the substrate and controlling the surface tension to be at a uniform level, so that the slurry is wetted on the substrate, and the flowing leveling property is improved. Preferably, the leveling agent is at least one of an organic silicon type leveling agent (e.g., dego Glide 406, TEGO Glide 110, TEGO Glide 410, etc.) and an acrylic type leveling agent (e.g., BYK-381 of bike chemistry, AMS-2020 of guangdong yue chemical industry, etc.). Thickeners are used to alter the viscosity of the overall system, thereby improving the leveling effect of the slurry system. Preferably, the thickener may be selected from at least one of Viscalam PS 166 from Shanghai and chemical, TEGO Visco Plus 3010 from Digao, AMS-201 and RM-2020 from Guangdong Yuemei, or BYK-420 from Pico. However, the present invention is not limited thereto, and other commercially available thickeners may be used. The wetting agent is used for reducing the surface tension of the whole slurry system, so that the slurry has better spreading effect with the surface when being coated. The wetting agent may be at least one of an anionic surfactant, a nonionic surfactant (e.g., digao TEGO Wet 505), and a polyether modified siloxane-based compound (e.g., BYK-333, BYK-348, digao TEGO Twin 4000, etc. of Beech chemical). However, the present invention is not limited thereto, and other types of wetting agents are also commercially available. The defoaming agent is used for inhibiting or controlling foam in the slurry system, so that the formed film layer is more uniform. Preferably, the defoaming agent is at least one of silicone defoaming agents (such as BYK-024, BYK-028 in Pico chemistry, DK-151 in Defeng, TEGO Foamex 805 in Digao, TEGO Foamex 810, etc.) and non-silicone defoaming agents (BYK-011, BYK-012, etc. in Pico chemistry). The dispersing agent is used for enhancing the dispersion process of the system, preventing the agglomeration and sedimentation of particles and ensuring the dispersion uniformity of the slurry system. Preferably, the dispersant may be selected from polyacrylic acid dispersant (such as 445N of Dow chemical, SAGO-9001, etc.), polyester type dispersant (such as SAGO-9610W, etc.) or alkoxy amine salt type dispersant (such as Disperbyk-180 of Bike chemical). However, the present invention is not limited thereto, and other types of dispersants that are commercially available may be used.
The material of the base layer 13 can be common films, such as PET, PBT, PI; paper may be used, but the invention is not limited thereto and other specialty materials may be used. The base layer 13 is used to protect the adhesive layer 12 and the thermochromic layer 11 when not in use, and the base layer 13 needs to be removed from the detection membrane 1 when in use. The adhesive layer 12 may be formed by a common adhesive, such as a common adhesive sticker, and is used to adhere the thermochromic layer 11 to the surface of the chip to be tested, so that the thermochromic layer is tightly attached to the surface of the chip to be tested. Meanwhile, the adhesive tape has excellent stripping performance, and is convenient to remove from the surface of a chip to be detected after detection and positioning.
The invention also discloses a method for detecting the defects of the positioning chip, which comprises the following steps: preparing a detection film, wherein the detection film comprises a substrate layer, an adhesive layer and a temperature-sensitive color-changing layer; removing the substrate layer, and tightly attaching the temperature-sensitive color-changing layer to the chip to be detected through the adhesive layer; the power supply device provides an electric signal to the chip to be tested; the signal processing device collects and processes the test signals so as to detect and position the defects of the chip to be tested; the detection membrane is removed. In the detection, the detection film can be cut into the size corresponding to the chip to be detected, the detection of the chips with various sizes is met, and meanwhile, the positioning accuracy is improved.
The preparation method of the detection membrane comprises the following steps: preparing temperature-sensitive color-changing slurry according to a certain proportion, and uniformly mixing and dispersing; uniformly coating the temperature-sensitive color-changing slurry on the substrate layer with the adhesive layer to form a uniform wet film; and curing the temperature-sensitive color-changing slurry to form a temperature-sensitive color-changing layer. The thermochromic slurry comprises main resin, liquid crystal microcapsules, an auxiliary agent and water. The curing means may be photo-curing, thermal curing or a combination thereof, depending on the type of the host resin. The thickness of the wet film can be adjusted according to the requirement, and is generally 5 to 200 micrometers. Preferably, the thickness of the wet film is 5 to 100 micrometers.
The thermochromic paste containing liquid crystal microcapsules, the detection film and the chip defect detection positioning system will be described in detail with reference to specific examples.
Example 1
According to the formula, the uniform thermochromic slurry is prepared, wherein the wall material of the liquid crystal microcapsule is polyurea resin, and the color change temperature range is 26-40 ℃. The prepared thermochromic slurry was uniformly coated on a translucent black pressure-sensitive adhesive (adhesive layer and base layer) to a wet film thickness of 60 μm. The coated detection film was placed in an oven at 50 ℃ and baked for 10 minutes. After the detection film is cut to a proper size, the backing paper (substrate layer) of the self-adhesive is removed, and the rest part of the detection film is tightly attached to the chip to be detected. By applying a detection current to the chip, a color change of the liquid crystal microcapsule in the detection film on the surface of the chip is observed by a microscope, as shown in fig. 3 and 4, in which the position indicated by the arrow shows a color different from other positions around, indicating that the position indicated by the arrow has a temperature different from or even higher than that around, thereby detecting the presence of a defect. Meanwhile, the color change point at the defect position is only about 5 micrometers as can be seen from a microscopic picture, which shows that the chip detection positioning system can detect the micrometer-scale defects. The position of the defect can be accurately positioned through the image analysis function of the microscope system. After the detection positioning is completed, the detection film on the chip is slightly uncovered and removed.
Example 2
According to the formula, the uniform thermochromic slurry is prepared, wherein the wall material of the liquid crystal microcapsule is a gelatin and Arabic gum mixed wall material, and the color change temperature range is 12-35 ℃. The prepared thermochromic slurry was uniformly coated on a translucent black pressure-sensitive adhesive (adhesive layer and base layer) with a wet film thickness of 30 μm. Drying the coated detection film, and placing the detection film in a UV lamp (280-400 nm, 10 w/cm)2) And curing for 10 seconds. After the detection film is cut to a proper size, the backing paper (substrate layer) of the self-adhesive is removed, and the rest part of the detection film is tightly attached to the chip to be detected. And (4) introducing a detection current to the chip, and observing the existence of the defects through a microscope. The position of the defect can be accurately positioned through the image analysis function of the microscope system. After the detection positioning is completed, the detection film on the chip is slightly uncovered and removed.
Example 3
According to the formula, the uniform thermochromic slurry is prepared, wherein the wall material of the liquid crystal microcapsule is urea-formaldehyde resin, and the color change temperature range is 60-80 ℃. The prepared thermochromic slurry was uniformly coated on a translucent black pressure-sensitive adhesive (adhesive layer and base layer) with a wet film thickness of 30 μm. The coated detection film was placed in an oven at 50 ℃ and baked for 10 minutes. After the detection film is cut to a proper size, the backing paper (substrate layer) of the self-adhesive is removed, and the rest part of the detection film is tightly attached to the chip to be detected. And (4) introducing a detection current to the chip, and observing the existence of the defects through a microscope. The position of the defect can be accurately positioned through the image analysis function of the microscope system. After the detection positioning is completed, the detection film on the chip is slightly uncovered and removed.
Example 4
According to the formula, the uniform thermochromic slurry is prepared, wherein the wall material of the liquid crystal microcapsule is polymethyl methacrylate resin, and the color change temperature range is 26-40 ℃. The prepared thermochromic slurry was uniformly coated on a translucent black pressure-sensitive adhesive (adhesive layer and base layer) with a wet film thickness of 30 μm. The coated detection film was placed in an oven at 50 ℃ and baked for 10 minutes. After the detection film is cut to a proper size, the backing paper (substrate layer) of the self-adhesive is removed, and the rest part of the detection film is tightly attached to the chip to be detected. And (4) introducing a detection current to the chip, and observing the existence of the defects through a microscope. The position of the defect can be accurately positioned through the image analysis function of the microscope system. After the detection positioning is completed, the detection film on the chip is slightly uncovered and removed.
Example 5
According to the formula, the uniform thermochromic slurry is prepared, wherein the wall material of the liquid crystal microcapsule is polyurea resin, and the color change temperature range is 26-40 ℃. The prepared thermochromic slurry was uniformly coated on a translucent black pressure-sensitive adhesive (adhesive layer and base layer) with a wet film thickness of 10 μm. The coated detection film was placed in an oven at 50 ℃ and baked for 10 minutes. After the detection film is cut to a proper size, the backing paper (substrate layer) of the self-adhesive is removed, and the rest part of the detection film is tightly attached to the chip to be detected. And (4) introducing a detection current to the chip, and observing the existence of the defects through a microscope. The position of the defect can be accurately positioned through the image analysis function of the microscope system. After the detection positioning is completed, the detection film on the chip is slightly uncovered and removed.
Although several exemplary embodiments have been described above in detail, the disclosed embodiments are merely exemplary and not limiting, and those skilled in the art will readily appreciate that many other modifications, adaptations, and/or alternatives are possible in the exemplary embodiments without materially departing from the novel teachings and advantages of the present disclosure. Accordingly, all such modifications, adaptations, and/or alternatives are intended to be included within the scope of the present disclosure as defined by the following claims.
Claims (12)
1. A chip defect detection and positioning system, comprising:
the detection film comprises a substrate layer, a bonding layer and a temperature-sensitive color-changing layer, wherein the temperature-sensitive color-changing layer is formed by curing temperature-sensitive color-changing slurry, and the temperature-sensitive color-changing slurry comprises liquid crystal microcapsules, main body resin and water;
the power supply device provides an electric signal to the chip to be tested; and
a signal processing device that collects and processes the test signal.
2. The chip defect detecting and positioning system of claim 1, wherein the signal processing device is a microscope system.
3. The chip defect detecting and positioning system of claim 1, wherein the liquid crystal microcapsule comprises a wall material and a core material, the wall material is a polymer material, and the core material is cholesteric liquid crystal.
4. The chip defect detecting and positioning system of claim 1, wherein the main body resin comprises a natural polymer material, a semi-synthetic polymer material and a synthetic polymer material.
5. The chip defect detecting and positioning system of claim 4, wherein the synthetic polymer material comprises water-based acrylic resin, UV light-cured resin, water-based epoxy resin, water-based amino resin, polyurethane resin, polyvinyl alcohol, polyester, polypropylene alcohol, polyethylene glycol and polyvinylpyrrolidone, the natural polymer material comprises gelatin, sodium alginate and chitosan, and the semi-synthetic polymer material comprises hydroxymethyl cellulose, methyl cellulose and hydroxypropyl methyl cellulose.
6. The chip defect detecting and positioning system of claim 1, wherein the thermochromic slurry comprises an auxiliary agent, and the auxiliary agent comprises a leveling agent, a thickening agent, a wetting agent, a dispersing agent and an antifoaming agent.
7. The chip defect detecting and positioning system of claim 1, wherein the liquid crystal microcapsules account for 60% -95% of the thermochromic paste by mass, and the host resin accounts for 1% -30% of the thermochromic paste by mass.
8. A method for detecting and positioning chip defects comprises the following steps:
a. preparing a detection film, wherein the detection film comprises a substrate layer, a sticking layer and a temperature-sensitive color-changing layer;
b. removing the substrate layer, and tightly attaching the temperature-sensitive color-changing layer to a chip to be detected through the adhesive layer;
c. the power supply device provides an electric signal to the chip to be tested;
d. the signal processing device collects and processes the test signals so as to detect and position the defects of the chip to be tested;
e. removing the detection membrane.
9. The method of claim 8, wherein step b further comprises cutting the detection membrane to a size corresponding to the chip under test.
10. The method of claim 8, wherein the step of preparing the detection membrane comprises:
1) preparing temperature sensing color changing slurry according to a certain proportion, and mixing and dispersing uniformly;
2) uniformly coating the thermochromic sizing agent on a substrate layer with an adhesive layer to form a uniform wet film;
3) and curing the temperature-sensitive color-changing slurry to form a temperature-sensitive color-changing layer.
11. The method of claim 10, wherein the wet film has a thickness of 5 to 200 microns.
12. The method of claim 10, wherein the curing is by light curing, heat curing, or a combination thereof.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090073564A (en) * | 2007-12-31 | 2009-07-03 | 주식회사 효성 | Anisotropic conductive film having thermochromic microcapsule or photochromic microcapsule |
| CN102466778A (en) * | 2010-11-17 | 2012-05-23 | 上海华虹Nec电子有限公司 | Failure positioning method for defects of power metal-oxide-semiconductor chip |
| CN102832154A (en) * | 2012-09-21 | 2012-12-19 | 蚌埠玻璃工业设计研究院 | Method used for detecting and repairing leakage defect of film solar battery |
| CN106876296A (en) * | 2017-01-03 | 2017-06-20 | 航天科工防御技术研究试验中心 | A kind of semiconductor device failure localization method |
-
2020
- 2020-08-17 CN CN202010823452.5A patent/CN112067652A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090073564A (en) * | 2007-12-31 | 2009-07-03 | 주식회사 효성 | Anisotropic conductive film having thermochromic microcapsule or photochromic microcapsule |
| CN102466778A (en) * | 2010-11-17 | 2012-05-23 | 上海华虹Nec电子有限公司 | Failure positioning method for defects of power metal-oxide-semiconductor chip |
| CN102832154A (en) * | 2012-09-21 | 2012-12-19 | 蚌埠玻璃工业设计研究院 | Method used for detecting and repairing leakage defect of film solar battery |
| CN106876296A (en) * | 2017-01-03 | 2017-06-20 | 航天科工防御技术研究试验中心 | A kind of semiconductor device failure localization method |
Non-Patent Citations (2)
| Title |
|---|
| 周思萌: "热学量传感器"", 《第二届传感器学术讨论会上》, pages 158 - 160 * |
| 朱敏波等: "《电子设备可靠性工程》", 西安电子科技大学出版社, pages: 161 * |
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Application publication date: 20201211 |