CN112066273A - LED light source module and lighting device - Google Patents
LED light source module and lighting device Download PDFInfo
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- CN112066273A CN112066273A CN201910494748.4A CN201910494748A CN112066273A CN 112066273 A CN112066273 A CN 112066273A CN 201910494748 A CN201910494748 A CN 201910494748A CN 112066273 A CN112066273 A CN 112066273A
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- 239000000758 substrate Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000005286 illumination Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 10
- 229910052736 halogen Inorganic materials 0.000 description 9
- 150000002367 halogens Chemical class 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED light source module and a lighting device, wherein the LED light source module comprises: a substrate including a first base portion and a chip mounting portion extending from one end of the first base portion, the chip mounting portion having a first mounting surface and a second mounting surface that are opposite to each other; the LED chip comprises a first LED chip attached to a first mounting surface of a chip mounting part and a second LED chip attached to a second mounting surface of the chip mounting part, wherein the first LED chip and the second LED chip correspond to the chip mounting part in size; and the fluorescent layer covers the first LED chip and the second LED chip, the fluorescent layer is arranged around the chip mounting part in the extending direction of the chip mounting part, and the fluorescent layer is penetrated by the chip mounting part in the extending direction of the chip mounting part. Through the arrangement, light emitted by the LED chip can be uniformly dispersed to the periphery by the fluorescent layer, the influence of a dark space caused by the structural design of the double-sided chip is reduced, the structure is compact, the processing difficulty is low, and the LED chip is suitable for actual production and application.
Description
Technical Field
The invention belongs to the technical field of manufacturing of light-emitting semiconductors, and particularly relates to an LED light source module and a lighting device with the same.
Background
As a new illumination light source, LED has a development trend of a new generation of light source due to its advantages of long life, high luminous efficiency, multiple light colors, and one-time light distribution directional irradiation function, and can operate under a safe voltage. At present, with the popularization of the LED light source, the LED light source imitating the halogen filament is also increasingly popularized and applied widely. In some kinds of lamp applications, such as automobile headlamps, it is often required that the light emitting shape of the light source is as close to a halogen filament as possible, and the light field is uniformly distributed in a cylindrical or shuttle (spindle) solid angle, so as to facilitate the optical light distribution design of the lamp.
In the prior art, a conventional halogen lamp-simulated LED light source module adopts an optical design in which LED chips are respectively disposed on two sides of a substrate, and the LED light source module still has a large difference in light emitting shape from an actual halogen lamp and a large dark area in a lateral direction; or, the four sides of the substrate are respectively provided with the plurality of LED lamp beads, so that the light emitting shape of the halogen lamp can be better simulated to a certain extent, but the process difficulty of mounting the LED lamp beads on four sides is high, which is not beneficial to practical production and application, and the optical design of the lamp needs to be adjusted when the lamp is matched with the application of the halogen lamp, which can further improve the manufacturing cost of the whole lamp.
Disclosure of Invention
In view of the above, the present invention provides an LED light source module and a lighting device, which imitate the shape of the light emitting area of a halogen lamp and are convenient for processing and application.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
an LED light source module, comprising:
a substrate including a first base portion and a chip mounting portion extending from one end of the first base portion, the chip mounting portion having a first mounting surface and a second mounting surface that are opposite to each other;
the LED chip comprises a first LED chip attached to a first mounting surface of the chip mounting part and a second LED chip attached to a second mounting surface of the chip mounting part, wherein the first LED chip and the second LED chip correspond to the chip mounting part in size;
the fluorescent layer covers the first LED chip and the second LED chip, the fluorescent layer surrounds the chip mounting part in the extending direction of the chip mounting part, and the fluorescent layer is arranged in the extending direction of the chip mounting part and communicated with the chip mounting part.
In one embodiment, any cross section of the fluorescent layer perpendicular to the extending direction of the chip mounting part is circular; and/or the fluorescent layer is spindle-shaped or ellipsoidal.
In one embodiment, the areas of any cross sections of the fluorescent layer perpendicular to the extending direction of the chip mounting part are equal; or in the extending direction of the chip mounting part, the cross-sectional area of the fluorescent layer, which is perpendicular to the extending direction of the chip mounting part, has the tendency of monotonously increasing and then monotonously decreasing.
In one embodiment, the phosphor layer is reflectively symmetric with respect to the chip mounting portion.
In one embodiment, the first base portion has a size larger than that of the chip mounting portion.
In one embodiment, at least a portion of the first base portion is gradually widened in a direction away from the chip mounting portion.
In one embodiment, the chip mounting device further comprises a second base part extending from one end of the chip mounting part far away from the first base part; wherein,
a width of the second base portion in a direction away from the chip mounting portion is constant; or,
at least a portion of the second base portion gradually widens in a direction away from the chip mounting portion.
In one embodiment, the first base includes first and second mounting surfaces facing away from each other; wherein,
a first conductive layer is arranged on the first mounting surface of the first base, the first conductive layer comprises a first polarity path and a second polarity path, and the first LED chip is connected to the first polarity path and the second polarity path of the first conductive layer through leads respectively; and/or the presence of a gas in the gas,
and a second conductive layer is arranged on the second mounting surface of the first base, the second conductive layer comprises a first polarity path and a second polarity path, and the second LED chip is connected to the first polarity path and the second polarity path of the second conductive layer through leads respectively.
In one embodiment, the first base part and the second base part are respectively provided with a first mounting surface and a second mounting surface which are opposite to each other; wherein,
a first conducting layer is distributed on the first mounting surface of the first base part and comprises a first polarity path and a second polarity path, a third conducting layer is arranged on the first mounting surface of the second base part and is electrically connected with the second polarity path of the first conducting layer, and the first LED chip is respectively connected to the first polarity path and the third conducting layer of the first conducting layer through leads; and/or the presence of a gas in the gas,
the second mounting surface of the first base is provided with a second conducting layer, the second conducting layer comprises a first polarity path and a second polarity path, the second mounting surface of the second base is provided with a fourth conducting layer, the fourth conducting layer is electrically connected with the second polarity path of the second conducting layer, and the second LED chip is connected to the first polarity path and the fourth conducting layer of the second conducting layer through leads respectively.
In one embodiment, the third conductive layer is electrically connected to the second polarity path of the first conductive layer through a lead disposed in the slot in the thickness direction of the substrate; and/or the presence of a gas in the gas,
the fourth conducting layer is electrically connected with the second polarity path of the second conducting layer through a lead arranged in the groove in the thickness direction of the substrate.
In one embodiment, the light shielding piece is connected to one end of the second base part far away from the chip mounting part.
In one embodiment, the substrate includes a heat conduction portion connected to an end of the first base portion away from the chip mounting portion, the LED light source module further includes a heat dissipation unit, the heat conduction portion is inserted into an assembly groove of the heat dissipation unit, and the heat conduction portion is in heat conduction connection with an inner wall of the assembly groove.
In one embodiment, the heat dissipating unit further includes a mounting hole recessed from a surface thereof and penetrating through the mounting groove in a thickness direction, and the mounting hole is used for a fixing member to pass through to hold the heat conducting portion.
In one embodiment, the heat dissipation unit further includes a holder disposed in the mounting groove, the holder is configured to generate a second directional force that causes the heat conduction portion to abut against the inner wall of the mounting groove under the driving of a first directional force, and the first directional force and the second directional force act in different directions.
In one embodiment, the first LED chip and the second LED chip respectively include a plurality of unit cells capable of emitting light independently, and the plurality of unit cells are connected in series and/or in parallel.
An embodiment of the present application further provides a lighting device, including the LED light source module described above.
The invention has the following beneficial effects: the LED chip mounting structure comprises a substrate, a chip mounting portion, a fluorescent layer, a chip mounting portion and a chip, wherein the chip mounting portion is arranged on the substrate, the two sides of the chip mounting portion are respectively attached to the LED chip, the fluorescent layer is coated on the chip mounting portion in the extending direction and is penetrated through by the chip mounting portion, light emitted by the LED chip can be uniformly dispersed around the fluorescent layer, the influence of dark areas caused by the structural design of the double-sided chip is reduced, the structure is compact, the processing difficulty is low, and the LED chip mounting structure is suitable for practical production and application.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of an LED light source module according to a first embodiment of the present invention without a heat dissipation unit;
FIG. 2 is a side view of the LED light source module without a heat dissipation unit according to the first embodiment of the present invention;
fig. 3 is a schematic structural view of an embodiment of an LED light source module according to a first embodiment of the present invention, the LED light source module being equipped with a heat dissipation unit;
fig. 4 is a schematic structural view of an embodiment of an LED light source module according to a first embodiment of the present invention, the LED light source module being equipped with a heat dissipation unit;
FIG. 5 is a schematic structural view of an LED light source module configured with a light shielding sheet according to a first embodiment of the present invention;
fig. 6 to 8 are schematic structural views of LED light source modules according to second to fourth embodiments of the present invention, respectively.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, a first embodiment of an LED light source module 100 according to the present application is described. In the present embodiment, the LED light source module 100 includes a substrate 10, a first LED chip 21, a second LED chip 22, and a fluorescent layer 30.
The substrate 10 is preferably made of a material with good thermal conductivity, such as copper, aluminum nitride, silicon carbide, or the like, or the substrate 10 may be made of a laminated combination of the above materials to meet the requirements of practical application regarding processing strength and thermal conductivity.
The substrate 10 includes a first base portion 11 and a chip mounting portion 12 extending from one end of the first base portion 11, the chip mounting portion 12 has a first mounting surface and a second mounting surface opposite to each other, and a first LED chip 21 and a second LED chip 22 are respectively attached to the first mounting surface and the second mounting surface of the first base portion 11. The first LED chip 21 and the second LED chip 22 correspond to the size of the chip mounting portion 12, where "size correspondence" means: the first LED chip 21 and the second LED chip 22 are substantially the same in size as the corresponding mounting surfaces on the chip mounting portion 12, and in actual production processing, for example, in a direction perpendicular to the extending direction of the chip mounting portion 12, the width of the chip mounting portion 12 is equal to or slightly larger than the width of the first LED chip 21 and the second LED chip 22, and in the extending direction of the chip mounting portion 12, the length of the chip mounting portion 12 is slightly larger than the length of the first LED chip 21 and the second LED chip 22, so as to balance feasibility of mounting processes while achieving a compact light source structure and a high light source density.
In one embodiment, the first LED chip 21 and the second LED chip 22 each include a plurality of unit cells capable of independently emitting light, and the plurality of unit cells are connected in series and/or in parallel. The structure can reduce the distance between the basic luminous units on one hand, and can also obtain a larger luminous surface in a chip with the same size on the other hand, thereby effectively improving the power density of the chip. In the present embodiment, the first mounting surface and the second mounting surface of the chip mounting portion 12 are provided with only a single one of the first LED chip 21 and the second LED chip 22, respectively, so as to provide sufficient optical power while simulating the light emitting shape of a halogen lamp.
The fluorescent layer 30 covers the first LED chip 21 and the second LED chip 22, where the covering means that the fluorescent layer 30 covers the light emitting surfaces of the first LED chip 21 and the second LED chip 22 and the side surfaces in the chip thickness direction, and the fluorescent layer 30 is usually a curable light-transmitting material mixed with fluorescent powder, for example, in an embodiment, silica gel mixed with fluorescent powder is used. The fluorescent layer 30 is arranged around the chip mounting portion 12 in the extending direction of the chip mounting portion 12, and is penetrated by the chip mounting portion 12 in the extending direction of the chip mounting portion 12, by arranging the fluorescent layer 30 around the chip mounting portion 12, light emitted from the first LED chip 21 and the second LED chip 22 can be dispersed towards the periphery by the fluorescent layer 30 and approaches an optical field formed by a halogen filament, the influence of a dark space caused by the arrangement form of the front and back LED chips is effectively reduced, and compared with a process for mounting the LED chips on multiple surfaces, the process for coating and curing the fluorescent layer 30 in a surrounding manner is low in difficulty, and the application of production and processing is facilitated.
Any cross section of the fluorescent layer 30 perpendicular to the extending direction of the chip mounting portion 12 is circular, and in one embodiment, the area of any cross section of the fluorescent layer perpendicular to the extending direction of the chip mounting portion 12 is equal (not shown), that is, the fluorescent layer is substantially cylindrical as a whole. In another embodiment, the cross-sectional area of the fluorescent layer 30 perpendicular to the extending direction of the chip mounting portion 12 in the extending direction of the chip mounting portion 12 tends to monotonically increase and then monotonically decrease, i.e., the fluorescent layer 30 as a whole has a substantially ellipsoidal or spindle shape. In both embodiments, the fluorescent layer 30 can make the light emitted from the first LED chip 21 and the second LED chip 22 more uniformly spread toward the periphery, and in a further preferred embodiment, the fluorescent layer 30 is reflection-symmetric with respect to the chip mounting portion 12, so that each portion of the fluorescent layer 30 more uniformly receives the light emitted from the first LED chip 21 and the second LED, and the uniformity of the light field of the LED light source module 100 is further ensured.
Referring to fig. 3 and 4, the size of the first base portion 11 is larger than that of the chip mounting portion 12, so that the first base portion 11 can efficiently conduct heat generated by the first LED chip 21 and the second LED chip 22 on the chip mounting portion 12, and reduce the temperature of the LED chip portion of the LED light source module 100 by natural heat dissipation or external connection of the heat dissipation unit 80, thereby prolonging the service life of the LED light source module 100.
In one embodiment, the chip mounting portion 12 and the first base portion 11 may be regarded as regions processed to serve different functions from the substrate 10 in one piece, and at least a part of the first base portion 11 is gradually widened in a direction away from the chip mounting portion 12, where the first base portion 11 may be in a tendency of widening as a whole, or the first base portion 11 may be in a tendency of widening at a portion connected to the chip mounting portion 12 and may be kept constant after widening to a set width.
The substrate 10 further includes a heat conduction portion 14 attached to an end of the first base portion 11 remote from the chip mounting portion 12, and the heat conduction portion 14 may be a portion where one end of the substrate 10 is uncovered in configuration. The LED light source module 100 includes a heat dissipating unit 80, and the heat conducting portion 14 is inserted into a mounting groove (not labeled) of the heat dissipating unit and is in heat conducting connection with an inner wall of the mounting groove. Exemplarily, the heat conducting portion 14 may achieve a better attaching heat conducting effect through a heat conducting medium such as heat conducting silicone grease and the like and the inner wall of the assembling groove.
The heat conduction portion 14 may be fixedly connected to the heat dissipation unit 80 in various ways, exemplarily:
referring to fig. 3, in an embodiment, the heat dissipating unit 80 includes a mounting hole (not labeled) recessed from a surface thereof and penetrating through the mounting groove in the thickness direction, the mounting hole being used for a fixing member P to pass through to hold the heat conducting portion 14. Alternatively, the fixing member (e.g., a screw) may be fixedly connected to the heat dissipating unit 80 by passing through a corresponding mounting hole of the heat conducting portion 14; alternatively (not shown), the fixing member may be abutted against the heat conducting portion 14 through the mounting hole, and clamp the heat conducting portion 14 together with the inner wall of the mounting groove.
Referring to fig. 4, in an embodiment, the heat dissipating unit 80 further includes a holding member 81 disposed in the mounting groove, the holding member 81 is configured to generate a second directional force that makes the heat conducting portion 14 abut against the inner wall of the mounting groove under the driving of a first directional force, and the first directional force and the second directional force act in different directions. Specifically, the holding member 81 may be a bevel slider, which is engaged with an inclined surface formed in the mounting groove, and when the bevel slider is subjected to a first direction force from the top, the bevel slider integrally generates a tendency of moving toward a sidewall of the mounting groove under the guidance of the inclined surface, and accordingly generates a second direction force acting on the heat conducting portion 14 against the inner wall of the side of the mounting groove, and the bevel slider and the inner wall of the side of the mounting groove together clamp the heat conducting portion 14.
The inclined surface to be engaged with the bevel slider 81 may be defined integrally as one side wall of the fitting groove, or alternatively, as an inclined surface of another bevel slider 82 disposed in the fitting groove. The first direction force applied to the tip of the bevel slider 81 can be realized, for example, by a presser M and a fixing member P cooperating with the presser M: one end of the pressing sheet M abuts against the top end of the oblique sliding block 81, and the other end of the pressing sheet M is fixed with the heat dissipation unit 80 through the fixing piece P, when the pressing sheet M is locked by the fixing piece P, the first direction force of the oblique sliding block 81 applied to the end abutting against the top end of the oblique sliding block 81 is enough to generate the second direction force for locking the heat conduction part 14.
In the present embodiment, the LED light source module 100 further includes a second base portion 13 extending from one end of the chip mounting portion 12 away from the first base portion 11, and at least a portion of the second base portion 13 is gradually widened in a direction away from the chip mounting portion 12. In one embodiment, the chip mounting portion 12, the first base portion 11 and the second base portion 13 may be regions that are processed as a single piece of the substrate 10 to serve different functions, and similarly, the second base portion 13 may be a whole that tends to widen, or, starting at a connection portion with the chip mounting portion 12, the second base portion 13 tends to widen and remain unchanged after widening to a set width, and such a widened second base portion 13 may be configured as an anti-glare structure of the LED light source module 100.
The first base portion 11 and the second base portion 13 respectively have a first mounting surface and a second mounting surface which are opposite to each other, the first mounting surface of the first base portion 11 is provided with a first conductive layer (not labeled), the first conductive layer includes a first polarity path 41 and a second polarity path (not shown), the first mounting surface of the second base portion 13 is provided with a third conductive layer 61, the third conductive layer 61 is electrically connected with the second polarity path of the first conductive layer, and the first LED chip 21 is respectively connected to the first polarity path 41 and the third conductive layer 61 of the first conductive layer through leads. The second mounting surface of the first base 11 is disposed with a second conductive layer (not shown) including a first polarity via 51 and a second polarity via (not shown), the second mounting surface of the second base 13 is disposed with a fourth conductive layer 71, the fourth conductive layer 71 is electrically connected to the second polarity via of the second conductive layer, and the second LED chip 22 is connected to the first polarity via 51 and the fourth conductive layer 71 of the second conductive layer respectively through wires.
The first polarity path 41 of the first conductive layer includes a first lead pad 411 and a first external pad 412 at two ends thereof, the third conductive layer 61 includes a third lead pad 611 and a third external pad 612 at two ends thereof, the area of the first lead pad 411 is smaller than that of the first external pad 412, the area of the third lead pad 611 is smaller than that of the third external pad 612, the first lead pad 411 is electrically connected to a pad on the first LED chip 21 by a lead, and the third external pad 612 of the third conductive layer 61 is electrically connected to the second external pad 422 of the second polarity path on the first conductive layer by a lead.
In one embodiment, the leads connected between the third conductive layer 61 and the second polarity vias on the first conductive layer are disposed in the slots in the thickness direction of the substrate 10.
Similarly, the first polarity path of the second conductive layer, the second polarity path, and the pad of the fourth conductive layer may be disposed according to the above embodiments, and the lead connected between the fourth conductive layer and the second polarity path on the second conductive layer is also disposed in the slot in the thickness direction of the substrate 10, which is not described herein again.
In a specific design, the first base portion 11 and the second base portion 13 of the substrate 10 may be respectively provided with an insulating layer 91 on both sides, the conductive layers are disposed on the insulating layer 91 and then covered by an insulating layer 92, and portions of the conductive layers exposed on the insulating layer 92 serve as the lead pads and the external connection pads.
Referring to fig. 5, the LED light source module 100 further includes a light shielding sheet 101 connected to an end of the second base 13 away from the chip mounting portion 12. In some application scenarios, such as an automobile headlamp, it is necessary to avoid the glare caused by the axial light, and the axial glare can be effectively improved by providing the light shielding sheet 101. In a specific mounting structure, the light shielding sheet may be embedded in an end of the second base portion 13 away from the chip mounting portion 12, or may be connected to the second base portion 13 by soldering.
Referring to fig. 6, a second embodiment of the LED light source module 200 of the present application is described. In the present embodiment, the LED light source module 200 is different from the first embodiment in the shape of the second base portion 13a, where the width of the second base portion 13a in the direction away from the chip mounting portion 12a is kept constant, that is, the configuration of the second base portion 13a itself as an anti-glare structure is eliminated.
Referring to fig. 7, a third embodiment of the LED light source module 300 of the present application is described. In the present embodiment, the LED light source module 300 is different from the first embodiment in the arrangement of the conductive layers on the first base portion 11b and the second base portion 13 b.
In the present embodiment, the first mounting surface of the first base portion 11b is laid with a first conductive layer (not shown) including a first polarity path (not shown) and a second polarity path (not shown), and the first LED chip 21b is connected to the first polarity path and the second polarity path of the first conductive layer by leads, respectively; the second mounting surface of the first base portion is laid with a second conductive layer (not shown) including a first polarity via and a second polarity via, and the second LED chip (not shown) is connected to the first polarity via and the second polarity via of the second conductive layer by wires, respectively. In this way, the second base 13b itself is configured as an anti-glare structure, which corresponds to the elimination of the conductive layer on the second base 13 in the first embodiment, and the original lead for electrical connection between the conductive layer on the second base 13 and the conductive layer on the first base 11 is omitted, so that the structure is simpler.
Referring to fig. 8, a fourth embodiment of the LED light source module 400 of the present application is described. In the present embodiment, the LED light source module 400 is different from the third embodiment in that the second base 13a is further omitted.
In the second to fourth embodiments, since the improvement of other parts of the LED light source module in the first embodiment is not related, it is not repeated, and the first embodiment may be partially or fully cited about other parts of the LED light source module. In the above embodiments, the pads on the LED chip for external connection may be disposed according to practical application requirements, for example, in the first and second embodiments, the pads on the chip are located on two sides of the chip in a direction away from the first base, and for example, in the third and fourth embodiments, the pads on the chip are located on the same side of the chip adjacent to the first base. In an embodiment of practical processing application, the first LED chip and the second LED chip have a length of 1 to 20mm and a width of 0.5 to 5 mm.
An embodiment of the present application also provides a lighting device, which includes an LED light source module, and the LED light source module herein can be fully cited in the above-mentioned embodiments/examples. Further, since the other parts of the lighting device are not improved, further description of the structure of the other parts of the lighting device is omitted here.
According to the technical scheme, the invention has the following advantages: the LED chip mounting structure comprises a substrate, a chip mounting portion, a fluorescent layer, a chip mounting portion and a chip, wherein the chip mounting portion is arranged on the substrate, the two sides of the chip mounting portion are respectively attached to the LED chip, the fluorescent layer is coated on the chip mounting portion in the extending direction and is penetrated through by the chip mounting portion, light emitted by the LED chip can be uniformly dispersed around the fluorescent layer, the influence of dark areas caused by the structural design of the double-sided chip is reduced, the structure is compact, the processing difficulty is low, and the LED chip mounting structure is suitable for practical production and application.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. An LED light source module, comprising:
a substrate including a first base portion and a chip mounting portion extending from one end of the first base portion, the chip mounting portion having a first mounting surface and a second mounting surface that are opposite to each other;
the LED chip comprises a first LED chip attached to a first mounting surface of the chip mounting part and a second LED chip attached to a second mounting surface of the chip mounting part, wherein the first LED chip and the second LED chip correspond to the chip mounting part in size;
the fluorescent layer covers the first LED chip and the second LED chip, the fluorescent layer surrounds the chip mounting part in the extending direction of the chip mounting part, and the fluorescent layer is arranged in the extending direction of the chip mounting part and communicated with the chip mounting part.
2. The LED light source module as claimed in claim 1, wherein any cross section of the fluorescent layer perpendicular to the extending direction of the chip mounting portion is circular; and/or the fluorescent layer is spindle-shaped or ellipsoidal; and/or the areas of any cross sections of the fluorescent layer, which are vertical to the extending direction of the chip mounting part, are equal; or in the extending direction of the chip mounting part, the cross-sectional area of the fluorescent layer, which is vertical to the extending direction of the chip mounting part, has the tendency of monotonously increasing and then monotonously decreasing; and/or the fluorescent layer is reflection-symmetrical with respect to the chip mounting portion; and/or the size of the first base is larger than that of the chip mounting part; and/or at least part of the first base part is gradually widened in a direction away from the chip mounting part; and/or the first LED chip and the second LED chip respectively comprise a plurality of unit cells capable of independently emitting light, and the plurality of unit cells are mutually connected in series and/or in parallel.
3. The LED light source module as set forth in claim 1 or 2, further comprising a second base portion extending from an end of the chip mounting portion away from the first base portion; wherein,
a width of the second base portion in a direction away from the chip mounting portion is constant; or,
at least a portion of the second base portion gradually widens in a direction away from the chip mounting portion.
4. The LED light source module of claim 3, wherein the first base portion comprises a first mounting surface and a second mounting surface opposite to each other; wherein,
a first conductive layer is arranged on the first mounting surface of the first base, the first conductive layer comprises a first polarity path and a second polarity path, and the first LED chip is connected to the first polarity path and the second polarity path of the first conductive layer through leads respectively; and/or the presence of a gas in the gas,
and a second conductive layer is arranged on the second mounting surface of the first base, the second conductive layer comprises a first polarity path and a second polarity path, and the second LED chip is connected to the first polarity path and the second polarity path of the second conductive layer through leads respectively.
5. The LED light source module as claimed in claim 3, wherein the first and second bases have first and second mounting surfaces opposite to each other, respectively; wherein,
a first conducting layer is distributed on the first mounting surface of the first base part and comprises a first polarity path and a second polarity path, a third conducting layer is arranged on the first mounting surface of the second base part and is electrically connected with the second polarity path of the first conducting layer, and the first LED chip is respectively connected to the first polarity path and the third conducting layer of the first conducting layer through leads; and/or the presence of a gas in the gas,
the second mounting surface of the first base is provided with a second conducting layer, the second conducting layer comprises a first polarity path and a second polarity path, the second mounting surface of the second base is provided with a fourth conducting layer, the fourth conducting layer is electrically connected with the second polarity path of the second conducting layer, and the second LED chip is connected to the first polarity path and the fourth conducting layer of the second conducting layer through leads respectively.
6. The LED light source module as claimed in claim 5, wherein the third conductive layer is electrically connected to the second polarity path of the first conductive layer through a lead disposed in the slot in the thickness direction of the substrate; and/or the presence of a gas in the gas,
the fourth conducting layer is electrically connected with the second polarity path of the second conducting layer through a lead arranged in the groove in the thickness direction of the substrate.
7. The LED light source module as claimed in claim 3, further comprising a light shielding sheet attached to an end of the second base portion away from the chip mounting portion.
8. The LED light source module of claim 1, wherein the substrate includes a heat conducting portion connected to an end of the first base portion away from the chip mounting portion, the LED light source module further includes a heat dissipating unit, the heat conducting portion is inserted into a mounting groove of the heat dissipating unit, and the heat conducting portion is thermally connected to an inner wall of the mounting groove.
9. The LED light source module as claimed in claim 8, wherein the heat sink further comprises a mounting hole recessed from a surface thereof and penetrating the mounting groove in a thickness direction, the mounting hole being for a fixing member to pass through to hold the heat conducting portion; or,
the heat dissipation unit further comprises a fixing piece arranged in the assembling groove, the fixing piece is arranged to generate a second direction force which enables the heat conduction part to abut against the inner wall of the assembling groove under the driving of a first direction force, and the action directions of the first direction force and the second direction force are different.
10. An illumination device is characterized by comprising the LED light source module.
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| CN201910494748.4A CN112066273A (en) | 2019-06-10 | 2019-06-10 | LED light source module and lighting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910494748.4A CN112066273A (en) | 2019-06-10 | 2019-06-10 | LED light source module and lighting device |
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