CN112055515A

CN112055515A - Prevent static mobile phone motherboard with heat radiation structure

Info

Publication number: CN112055515A
Application number: CN202010936104.9A
Authority: CN
Inventors: 邓晓斌
Original assignee: Shenzhen Shengbida Communication Co ltd
Current assignee: Shenzhen Shengbida Communication Co ltd
Priority date: 2020-09-08
Filing date: 2020-09-08
Publication date: 2020-12-08
Anticipated expiration: 2040-09-08
Also published as: CN112055515B

Abstract

The invention discloses an anti-static mobile phone mainboard with a heat dissipation structure, which comprises a substrate, wherein the substrate is provided with a mainboard, the mainboard is connected with the substrate through a heat-conducting silica gel layer, the substrate is fixedly connected with an air inlet pipe and an air outlet pipe which are symmetrically arranged at the outer side of the mainboard, a plurality of heat-conducting pipes are connected between the air inlet pipe and the air outlet pipe, the outer walls of the plurality of heat-conducting pipes are contacted with the upper side wall of the mainboard, the upper side wall of the substrate is fixedly connected with a telescopic bag, and one end of the air inlet pipe, which is close to the. The micro telescopic rod is triggered to move when the mainboard is overheated, so that the expansion and expansion of the telescopic bag are realized, airflow flows in the air inlet pipe, the heat conduction pipe and the air outlet pipe, the heat dissipation of the mainboard is realized, static electricity on the mainboard is led out through the conductive rod, the normal use of the mainboard is guaranteed, meanwhile, the pushing plate is driven to move through the flowing of the airflow, the cleaning of the adsorption rod is realized, and the continuous adsorption work of the adsorption rod is guaranteed so as to remove the static electricity.

Description

Prevent static mobile phone motherboard with heat radiation structure

Technical Field

The invention relates to the technical field of electronic equipment, in particular to an anti-static mobile phone mainboard with a heat dissipation structure.

Background

Mobile phones, which are generally called mobile phones or wireless phones, are portable phone terminals that can be used in a wide range, and with the rapid development of electronic communication technology, mobile phones have become indispensable communication tools for people's life.

The mobile phone mainboard is a main body part of the mobile phone and mainly comprises a baseband part, a radio frequency part, a CPU, an internal memory and other parts, and the functions of the mobile phone are gradually increased along with the updating of the mobile phone, so that functional components on the mobile phone mainboard are increased, the energy consumption of the mainboard during working is increased, the generated heat is increased, the mobile phone can generate static electricity in the using process, and more static electricity can affect electronic components, thereby affecting the use of the mobile phone.

Disclosure of Invention

The invention aims to solve the problems in the background art and provides an anti-static mobile phone mainboard with a heat dissipation structure.

In order to achieve the purpose, the invention adopts the following technical scheme:

an anti-static mobile phone mainboard with a heat dissipation structure comprises a substrate, wherein a mainboard is installed on the substrate and is connected with the substrate through a heat-conducting silica gel layer, an air inlet pipe and an air outlet pipe which are symmetrically arranged on the outer side of the mainboard are fixedly connected on the substrate, a plurality of heat-conducting pipes are connected between the air inlet pipe and the air outlet pipe, the outer walls of the plurality of heat-conducting pipes are contacted with the upper side wall of the mainboard, a telescopic bag is fixedly connected on the upper side wall of the substrate, one end, close to the mainboard, of the air inlet pipe is connected with the telescopic bag, a micro telescopic rod positioned on one side, far away from the air inlet pipe, of the telescopic bag is fixedly connected with the substrate, a heat-conducting plate is fixedly connected on the outer wall of the mainboard, a connecting pipe is fixedly connected on the upper side, the connecting pipe is internally filled with expansion liquid positioned on the lower side of the ejector rod, the upper end of the ejector rod is fixedly connected with a connecting rod, the upper side wall of the main board is rotatably connected with a rotating plate, an expansion spring is fixedly connected between the end part of the rotating plate and the upper side wall of the base board, one end of the connecting rod, far away from the ejector rod, extends to a vertical inward extending edge, the flanging is positioned on the lower side of the end part of the rotating plate, the upper side wall of the base board is fixedly provided with a switch, one end of the rotating plate, far away from the extending edge, is positioned on the upper side of the switch, the switch is connected with a micro telescopic rod through a wire, an adsorption rod is arranged in the air outlet pipe, insulating sleeves are fixedly sleeved at two ends of the adsorption rod, a conductive rod is fixedly connected on the base board, the end part of the conductive rod penetrates through the air, keep away from conducting rod one side the fixed cover that is equipped with the baffle on the outer wall of insulating cover, two coupling springs of fixedly connected with between push pedal and the baffle.

Preferably, fixedly connected with hardboard on the one end outer wall that the bellows is close to the intake pipe, the lower lateral wall of hardboard and the last lateral wall fixed connection of base plate, tracheal one end that is close to the mainboard runs through the inside intercommunication of hardboard and bellows.

Preferably, the air inlet pipe is provided with a one-way valve, and the one-way valve is positioned at the outer side of the connection part of the heat conduction pipe and the air inlet pipe.

Preferably, a return spring is fixedly connected between the inner walls of the two sides of the telescopic bag.

Preferably, the outer wall of one side of each heat conduction pipe, which is close to the main board, is fixedly embedded with a heat conduction sheet, and the heat conduction sheets are made of copper materials.

Preferably, the expansion liquid is one of alcohol, mercury and dichloromethane.

Compared with the prior art, this prevent static mobile phone motherboard with heat radiation structure's advantage lies in:

1. the micro telescopic rod and the telescopic bag are arranged, the telescopic bag is driven to extrude and expand through the expansion and contraction of the micro telescopic rod, so that the suction and the discharge of air flow are realized, the heat on the mainboard is absorbed and guided out through the flow of the air flow in the air inlet pipe, the heat conducting pipe and the air outlet pipe, and the cooling and the heat dissipation of the mainboard are realized;

2. the heat conducting plate is used for guiding heat on the main board into the connecting pipe, the expansion liquid is heated and expanded under the action of the heat to push the push plate to move upwards, the push plate moves upwards through the connecting rod to further drive the rotating plate to rotate to press the switch, so that the micro telescopic rod works, after the main board is cooled, the expansion liquid is recovered, the micro telescopic rod stops working, the start and stop of working are adjusted according to the change of the heat, and energy is saved and consumption is reduced;

3. the conductive rod, the adsorption rod and the push plate are arranged, static electricity on the substrate is led out to the adsorption rod through the conductive rod, dust in airflow is adsorbed through the adsorption rod, the static electricity is consumed, meanwhile, the push plate is pushed to move by the airflow, the dust on the adsorption rod is pushed down by the push plate and is blown out under the action of the airflow, the dust is cleaned, the static electricity on the substrate is eliminated, and normal use of the mobile phone is guaranteed;

in summary, the micro telescopic rod is triggered to move when the main board is overheated, so that the expansion and unfolding of the telescopic bag are realized, further, airflow flows in the air inlet pipe, the heat conducting pipe and the air outlet pipe, the heat dissipation of the main board is realized, static electricity on the main board is led out through the conducting rod, the normal use of the main board is guaranteed, meanwhile, the push plate is driven to move through the flowing of the airflow, the cleaning of the adsorption rod is realized, and the continuous adsorption work of the adsorption rod is guaranteed so as to remove the static electricity.

Drawings

Fig. 1 is a schematic structural diagram of an anti-static mobile phone motherboard with a heat dissipation structure according to the present invention;

fig. 2 is a schematic view of an internal structure of a bellows in an anti-static mobile phone motherboard with a heat dissipation structure according to the present invention;

fig. 3 is a schematic view of an internal structure of an air outlet pipe in an anti-static mobile phone motherboard with a heat dissipation structure according to the present invention;

fig. 4 is a side view of a heat pipe in an anti-static mobile phone motherboard with a heat dissipation structure according to the present invention.

In the figure: the device comprises a base plate 1, an air inlet pipe 2, an air outlet pipe 3, a heat conduction pipe 4, a miniature telescopic rod 5, a telescopic bag 6, a check valve 7, a main plate 8, a heat conduction silica gel layer 9, a heat conduction plate 10, a connecting pipe 11, a top rod 12, a connecting rod 13, a rotating plate 14, a telescopic spring 15, a switch 16, a conductive rod 17, a return spring 18, an insulating sleeve 19, an adsorption rod 20, a connecting spring 21, a push plate 22, a heat conduction sheet 23, a hard plate 24 and a baffle 25.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1-4, an anti-static mobile phone motherboard with a heat dissipation structure comprises a substrate 1, a motherboard 8 is installed on the substrate 1, the motherboard 8 is connected with the substrate 1 through a heat-conducting silica gel layer 9, the heat-conducting silica gel is a high-end heat-conducting compound and is not solidified, the characteristic of no electricity conduction can avoid risks such as circuit short circuit, an air inlet pipe 2 and an air outlet pipe 3 which are symmetrically arranged at the outer side of the motherboard 8 are fixedly connected with the substrate 1, a plurality of heat-conducting pipes 4 are connected between the air inlet pipe 2 and the air outlet pipe 3, the outer walls of the plurality of heat-conducting pipes 4 are contacted with the upper side wall of the motherboard 8, a telescopic bag 6 is fixedly connected with the upper side wall of the substrate 1, one end of the air inlet pipe 2 close to the motherboard 8 is connected with the telescopic bag 6, a micro telescopic rod 5 located at one side of, the drive end of miniature telescopic link 5 stretches out and withdraws the extrusion expansion that realizes flexible bag 6, when flexible bag 6 expandes, adsorbs outside air admission to intake pipe 2 in, when flexible bag 6 extrudees, the gas in the flexible bag 6 flows into in heat pipe 4 and outlet duct 3 in proper order, adsorbs the heat on the mainboard 8, again from the tip discharge of outlet duct 3.

The outer wall of the main board 8 is fixedly connected with a heat conducting plate 10, the upper side wall of the main board 8 is fixedly connected with a connecting pipe 11, the end part of the heat conducting plate 10 penetrates through and extends into the connecting pipe 11, a mandril 12 arranged in an inverted T shape is arranged in the connecting pipe 11 in a sliding manner, an expansion liquid positioned on the lower side of the mandril 12 is filled in the connecting pipe 11, the upper end of the mandril 12 is fixedly connected with a connecting rod 13, the upper side wall of the main board 8 is rotatably connected with a rotating plate 14, an expansion spring 15 is fixedly connected between the end part of the rotating plate 14 and the upper side wall of the base board 1, one end of the connecting rod 13, far away from the mandril 12, extends to a vertically inward extending edge, a flanging is positioned on the lower side of the end part of the rotating plate 14, the upper side wall of the base board 1 is fixedly provided with a, when mainboard 8 generates heat, derive the heat to connecting pipe 11 in through heat-conducting plate 10, inflation liquid is heated the inflation under the heat effect, promote ejector pin 12 and up move, ejector pin 12 up moves through connecting rod 13, the tip that extends the area and move commentaries on classics board 14 up rotates extension spring 15, the other end of commentaries on classics board 14 down rotates and carries out pressing of switch 16, miniature telescopic link 5 begins reciprocating work, realize that the pulling of expansion bag 6 expandes and the extrusion shrink.

Further, the miniature telescopic rod 5 adopts a miniature reciprocating telescopic rod.

An adsorption rod 20 is arranged in the air outlet pipe 3, two ends of the adsorption rod 20 are fixedly sleeved with insulating sleeves 19, a conductive rod 17 is fixedly connected to the substrate 1, the end part of the conductive rod 17 penetrates through the air outlet pipe 3 and the insulating sleeves 19 to be connected with the adsorption rod 20, a push plate 22 slides on the outer wall of the adsorption rod 20, a baffle plate 25 is fixedly sleeved on the outer wall of the insulating sleeve 19 far away from one side of the conductive rod 17, two connecting springs 21 are fixedly connected between the push plate 22 and the baffle plate 25, the conductive rod 17 guides static electricity on the substrate 1 to the adsorption rod 20, air flow flows in the air inlet pipe 2, the heat conduction pipe 4 and the air outlet pipe 3, the static electricity on the adsorption rod 20 adsorbs dust in the air flow to consume the static electricity on the adsorption rod 20, when the air flow flows into the air outlet pipe 3, the push plate 22 is pushed to move towards one side of the baffle plate 25 under the action of the air flow, the, when the bellows 6 is unfolded, airflow is sucked from the air inlet pipe 2, and under the reverse elasticity of the connecting spring 21, the push plate 22 moves back to reset to wait for the next dust pushing work.

Further, fixedly connected with hardboard 24 on the one end outer wall that bellows 6 is close to intake pipe 2, hardboard 24's lower lateral wall and base plate 1's last lateral wall fixed connection, intake pipe 2's the inside intercommunication that hardboard 24 and bellows 6 are run through to the one end that is close to mainboard 8 sets up hardboard 24 and guarantees the stability of 6 tip of bellows, and the drive end of miniature telescopic link 5 drives bellows 6 and keeps away from 24 one end of hardboard and expand and extrude.

Further, a return spring 18 is fixedly connected between the inner walls of the two sides of the bellows 6, and the return spring 18 is arranged to facilitate the rebound and return of the bellows 6 after extrusion by virtue of the reverse elasticity of the return spring 18.

Further, every heat pipe 4 is close to one side outer wall of mainboard 8 and all fixes to inlay and is equipped with conducting strip 23, conducting strip 23 adopts the copper material to make, furthermore, conducting strip 23 can be connected with outside ground connection, conducting strip 23 exports the heat that mainboard 8 during operation produced with the mainboard 8 contact, realize mainboard 8's heat dissipation, the air current is at intake pipe 2, when heat pipe 4 and outlet duct 3 flow, the air current adsorbs the heat in the heat pipe 4 and exports, realize heat pipe 4's cooling, guarantee the sufficient heat absorption capacity of heat pipe 4.

Further, the inflation liquid is one of alcohol, mercury, dichloromethane, and under the heat effect, alcohol, mercury, dichloromethane have certain expansion degree, through the inflation of inflation liquid with ejector pin 12 jack-up, and then realize the work of miniature telescopic link 5, after the temperature of mainboard 8 reduced, the inflation liquid resumes, under the effect of the elasticity of expanding spring 15, changes 14 and resets, and the tip of commentaries on classics board 14 no longer presses switch 16, and miniature telescopic link 5 stops work.

Further, install check valve 7 on the intake pipe 2, check valve 7 is located the outside of heat pipe 4 with intake pipe 2 junction, and when the air current entered from intake pipe 2, check valve 7 was opened, and when 6 extrusion exhausts of flexible bag, the air current flowed when check valve 7 one side, and check valve 7 closed, and the air current flows to heat pipe 4, flows into to outlet duct 3 in from heat pipe 4 again, accomplishes the radiating process of heat absorption.

Further, unless otherwise specifically stated or limited, the above-described fixed connection is to be understood in a broad sense, and may be, for example, welded, glued, or integrally formed as is conventional in the art.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. The anti-static mobile phone mainboard with the heat dissipation structure comprises a substrate (1) and is characterized in that a mainboard (8) is installed on the substrate (1), the mainboard (8) is connected with the substrate (1) through a heat-conducting silica gel layer (9), an air inlet pipe (2) and an air outlet pipe (3) which are symmetrically arranged on the outer side of the mainboard (8) are fixedly connected to the substrate (1), a plurality of heat-conducting pipes (4) are connected between the air inlet pipe (2) and the air outlet pipe (3), the outer walls of the heat-conducting pipes (4) are contacted with the upper side wall of the mainboard (8), a telescopic bag (6) is fixedly connected to the upper side wall of the substrate (1), one end, close to the mainboard (8), of the air inlet pipe (2) is connected with the telescopic bag (6), a micro telescopic rod (5) positioned on one side, far away from the air inlet pipe (2), of the telescopic bag, the driving end of the micro telescopic rod (5) is fixedly connected with the outer wall of the telescopic bag (6), a heat conducting plate (10) is fixedly connected onto the outer wall of the main board (8), a connecting pipe (11) is fixedly connected onto the upper side wall of the main board (8), the end part of the heat conducting plate (10) penetrates through the connecting pipe (11) and extends to the inside of the connecting pipe, an ejector rod (12) arranged in an inverted T shape is arranged in the connecting pipe (11), an expansion liquid positioned on the lower side of the ejector rod (12) is filled in the connecting pipe (11), a connecting rod (13) is fixedly connected onto the upper end of the ejector rod (12), a rotating plate (14) is rotatably connected onto the upper side wall of the main board (8), a telescopic spring (15) is fixedly connected between the end part of the rotating plate (14) and the upper side wall of the base plate (1), and one end, far, the flanging is positioned at the lower side of the end part of the rotating plate (14), a switch (16) is fixedly arranged on the upper side wall of the base plate (1), one end of the rotating plate (14) far away from the extending edge is positioned at the upper side of the switch (16), the switch (16) is connected with the micro telescopic rod (5) through a lead, an adsorption rod (20) is arranged in the air outlet pipe (3), two ends of the adsorption rod (20) are fixedly sleeved with insulating sleeves (19), the base plate (1) is fixedly connected with a conductive rod (17), the end part of the conductive rod (17) penetrates through the air outlet pipe (3) and the insulating sleeve (19) to be connected with the adsorption rod (20), a push plate (22) slides on the outer wall of the adsorption rod (20), a baffle plate (25) is fixedly sleeved on the outer wall of the insulating sleeve (19) at one side far away from the conducting rod (17), two connecting springs (21) are fixedly connected between the push plate (22) and the baffle plate (25).

2. The antistatic mobile phone motherboard with the heat dissipation structure as claimed in claim 1, wherein a hard board (24) is fixedly connected to the outer wall of the end of the bellows (6) close to the air inlet tube (2), the lower sidewall of the hard board (24) is fixedly connected to the upper sidewall of the base plate (1), and the end of the air inlet tube (2) close to the motherboard (8) penetrates through the hard board (24) and is communicated with the inside of the bellows (6).

3. The antistatic mobile phone motherboard with heat dissipation structure as claimed in claim 1, wherein said air inlet tube (2) is installed with a one-way valve (7), said one-way valve (7) is located outside the connection of the heat pipe (4) and the air inlet tube (2).

4. The antistatic mobile phone motherboard with a heat dissipation structure as claimed in claim 1, wherein a return spring (18) is fixedly connected between the two side inner walls of the expansion bag (6).

5. The antistatic mobile phone motherboard with a heat dissipation structure as claimed in claim 1, wherein a heat conduction sheet (23) is fixedly embedded in an outer wall of one side of each heat conduction tube (4) close to the motherboard (8), and the heat conduction sheet (23) is made of copper material.

6. The antistatic mobile phone motherboard with a heat dissipation structure as claimed in claim 1, wherein the expansion liquid is one of alcohol, mercury, and dichloromethane.