CN220271857U - Computer heat dissipation support - Google Patents

Computer heat dissipation support Download PDF

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Publication number
CN220271857U
CN220271857U CN202321771972.1U CN202321771972U CN220271857U CN 220271857 U CN220271857 U CN 220271857U CN 202321771972 U CN202321771972 U CN 202321771972U CN 220271857 U CN220271857 U CN 220271857U
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China
Prior art keywords
heat dissipation
heat
groove
fixed base
inner cavity
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Active
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CN202321771972.1U
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Chinese (zh)
Inventor
荣先红
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Huizhou Wurong Hardware Electronic Co ltd
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Huizhou Wurong Hardware Electronic Co ltd
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Priority to CN202321771972.1U priority Critical patent/CN220271857U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The utility model relates to the technical field of heat dissipation equipment and discloses a computer heat dissipation bracket, which comprises a fixed base, wherein the surface of the fixed base is provided with an installation clamping groove, two ends of an inner cavity of the installation clamping groove are of an inner arc structure, the inner wall surface of the installation clamping groove is stuck with a silica gel heat conduction pad, the inner cavity of the fixed base is of a hollow structure, the bottom of the inner cavity of the installation clamping groove is provided with an embedded groove, the embedded groove extends to the inner cavity of the fixed base, the inner cavity of the embedded groove is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat collecting copper plate, a heat conduction groove, heat dissipation fins and heat dissipation fans, the lower surface of the heat collecting copper plate is connected with the heat dissipation fins at equal intervals, and the heat dissipation fans are symmetrically arranged on the lower surface of the heat dissipation fins. This computer heat dissipation support, heat dissipation support and notebook electrical property form an integral structure, and it is more convenient to carry, and need not to dismantle and assemble when using, uses more convenient, promotes the radiating effect to notebook computer simultaneously.

Description

Computer heat dissipation support
Technical Field
The utility model relates to the technical field of heat dissipation equipment, in particular to a computer heat dissipation bracket.
Background
The current society is an informatization society, work of office workers is not separated from computers, particularly important components in work and life of middle and young people, the size of a notebook computer is smaller and smaller, heat dissipation performance is affected, and in order to improve the heat dissipation effect of the notebook computer, a user can accelerate the heat radiator below the notebook computer to assist the notebook computer in heat dissipation.
The utility model discloses a notebook computer heat dissipation support (CN 112860041B) according to the description in the patent network, which comprises a notebook computer heat dissipation support body consisting of a telescopic rod, a radiator, a surrounding frame and a blowing seat, wherein the radiator comprises a heat dissipation frame, a dust remover is arranged in the heat dissipation frame, an air suction fan is arranged on the left side of the heat dissipation frame, the right side of the air suction fan is communicated with the left side of the dust remover through a transparent plate, the bottom of the transparent plate is fixedly connected with the top of the inner wall of the heat dissipation frame, the bottom of the heat dissipation frame is fixedly connected with the top of the telescopic rod, and the top of the heat dissipation frame is communicated with the bottom of the blowing seat. This notebook heat dissipation support has solved the notebook when using, through outside increase heat dissipation support for the heat dissipation of notebook, but after long-time use, the inside and the blade of notebook are covered by the dust in the air, and then lead to the radiating effect of notebook to worsen, and the card of whole response speed change is put into, reduces notebook life's problem.
With respect to the above description, the applicant believes that the following problems exist:
in the using process, the heat dissipation bracket and the notebook computer are of split type structures, the notebook computer is of portable design, the heat dissipation bracket is required to be inserted and detached when the notebook computer is put into a bag, and the heat dissipation bracket is required to be installed when the notebook computer is used, so that the heat dissipation bracket is required to be frequently installed and detached, and the heat dissipation bracket of the computer is required to be improved to solve the problems.
Disclosure of Invention
The present utility model is directed to a computer heat dissipation bracket, which solves the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the computer heat dissipation bracket comprises a fixed base, wherein an installation clamping groove is formed in the surface of the fixed base, two ends of an inner cavity of the installation clamping groove are of an inner arc-shaped structure, and a silica gel heat conduction pad is adhered to the surface of the inner wall of the installation clamping groove;
the utility model discloses a solar heat collector, including unable adjustment base, mounting card slot inner chamber bottom has been seted up and has been inlayed and have been established the groove, and inlay and establish the groove and extend to unable adjustment base inner chamber, inlay and establish the groove inner chamber and install heat dissipation mechanism, heat dissipation mechanism includes heat collecting copper, heat conduction groove, radiating fin and heat dissipation fan, heat collecting copper lower surface equidistance is connected with radiating fin, the heat dissipation fan symmetry is installed at the radiating fin lower surface, unable adjustment base bottom surface, heat collecting copper and silica gel heat conduction pad surface equidistance have run through and have been seted up the heat conduction groove.
Preferably, the heat conducting grooves and the heat radiating fins are arranged in a staggered mode.
Preferably, the lower surface of the radiating fin is symmetrically provided with mounting grooves, and the radiating fan is mounted in the mounting grooves.
Preferably, a plurality of groups of supporting seats are arranged on the lower surface of the fixed base at equal intervals, and the supporting seats and the fixed base are integrally formed.
Preferably, exhaust grooves are formed between two adjacent groups of the supporting seats, and the positions of the exhaust grooves correspond to the positions of the heat conducting grooves.
Preferably, the supporting seat surfaces at two ends of the fixed base are provided with angle adjusting mechanisms, and the angle adjusting mechanisms comprise folding storage grooves and folding brackets.
Preferably, the folding storage groove is formed in the lower surface of the end part of the supporting seat, and the folding bracket is rotatably arranged in the inner cavity of the folding storage groove.
Compared with the prior art, the utility model provides the computer heat dissipation bracket, which has the following beneficial effects:
1. this computer heat dissipation support, unable adjustment base accessible installation draw-in groove card is in notebook computer bottom, can realize the quick installation to the heat dissipation support, and the heat dissipation support forms an integral structure with the notebook electrical property, carries more conveniently, and need not to dismantle and assemble when using, uses more convenient.
2. This computer heat dissipation support, the heat on the notebook computer accessible heat conduction groove transmits unable adjustment base in, and silica gel heat conduction pad is laminated mutually with the notebook computer lower surface simultaneously, can be with the quick transfer of heat on the heat collecting copper, heat collecting copper lower surface equidistance is equipped with a plurality of groups radiating fin, and the radiating fan is installed to the mounting groove inner chamber of radiating fin lower surface, can accelerate the air velocity of flow on radiating fin surface through the radiating fan, and unable adjustment base inner chamber's heat accessible exhaust groove both ends are discharged, can realize the quick heat dissipation to the notebook computer.
Drawings
For a clearer description of the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the description below are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art:
FIG. 1 is a schematic view of the appearance structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the present utility model;
FIG. 3 is a schematic diagram of a heat dissipation mechanism according to the present utility model;
fig. 4 is a schematic view of the bottom structure of the fixing base of the present utility model.
In the figure: 1. a fixed base; 2. installing a clamping groove; 3. a silica gel heat conduction pad; 4. a heat collecting copper plate; 5. a heat conduction groove; 6. a heat radiation fin; 7. a mounting groove; 8. a heat dissipation fan; 9. a support base; 10. an exhaust groove; 11. folding the storage groove; 12. folding the bracket.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Embodiment one:
referring to fig. 1-4, the present utility model provides a technical solution: the computer heat dissipation bracket comprises a fixed base 1, wherein an installation clamping groove 2 is formed in the surface of the fixed base 1, two ends of an inner cavity of the installation clamping groove 2 are of an inner arc-shaped structure, and a silica gel heat conduction pad 3 is adhered to the surface of the inner wall of the installation clamping groove 2;
the unable adjustment base 1 inner chamber is hollow structure, and the embedding groove has been seted up to installation draw-in groove 2 inner chamber bottom, and the embedding groove extends to unable adjustment base 1 inner chamber, inlays and establishes the groove inner chamber and install heat dissipation mechanism, and heat dissipation mechanism includes heat collecting copper 4, heat conduction groove 5, radiating fin 6 and heat dissipation fan 8, and heat collecting copper 4 lower surface equidistance is connected with radiating fin 6, and heat dissipation fan 8 symmetry is installed at radiating fin 6 lower surface, and unable adjustment base 1 bottom surface, heat collecting copper 4 and silica gel heat conduction pad 3 surface equidistance run through and have seted up heat conduction groove 5.
It should be noted that, unable adjustment base 1 accessible installation draw-in groove 2 card is in the notebook bottom, can realize the quick installation to the heat dissipation support, and the heat dissipation support forms an integral structure with the notebook electrical property, carry more conveniently, and need not to dismantle and assemble when using, it is more convenient to use, the installation draw-in groove 2 inner wall passes through silica gel heat conduction pad 3 and the contact of notebook computer lower surface, can play the cushioning effect to unable adjustment base 1 and notebook computer junction through silica gel heat conduction pad 3, heat on the notebook computer accessible heat conduction groove 5 transmits unable adjustment base 1 in, silica gel heat conduction pad 3 is laminated mutually with the notebook computer lower surface simultaneously, can be with the quick transmission of heat to on the heat collection copper 4, the equidistance of heat collection copper 4 lower surface is equipped with a plurality of radiating fins 6, the radiating fan 8 is installed to the mounting groove 7 inner chamber of radiating fin 6 lower surface, the air velocity of radiating fin 6 surface can be accelerated through radiating fan 8, the quick heat dissipation to the notebook computer can be realized to exhaust.
Further, the heat conducting grooves 5 and the heat radiating fins 6 are arranged in a staggered mode.
The heat can be transferred to the inner cavity of the fixed base 1 through the heat conducting groove 5.
Further, the lower surface of the radiating fin 6 is symmetrically provided with mounting grooves 7, and the radiating fan 8 is mounted in the mounting grooves 7.
The heat radiation fan 8 can be mounted by the mounting groove 7.
Further, the lower surface of the fixed base 1 is equidistantly provided with a plurality of groups of supporting seats 9, the supporting seats 9 and the fixed base 1 are integrally formed, an exhaust groove 10 is formed between two adjacent groups of supporting seats 9, and the position of the exhaust groove 10 corresponds to that of the heat conducting groove 5.
The support base 9 can support the fixing base 1, and the exhaust groove 10 can exhaust heat exhausted from the inner cavity of the fixing base 1.
Embodiment two:
referring to fig. 4, in combination with the first embodiment, further, an angle adjusting mechanism is disposed on the surface of the supporting seat 9 at two ends of the fixed base 1, the angle adjusting mechanism includes a folding storage slot 11 and a folding bracket 12, the folding storage slot 11 is disposed on the lower surface of the end of the supporting seat 9, and the folding bracket 12 is rotatably disposed in the inner cavity of the folding storage slot 11.
It should be noted that, taking out the folding bracket 12 from the folding storage groove 11, the folding bracket 12 can support one end of the fixing base 1, so that the supporting angle of the notebook computer can be adjusted during the use process, and the comfort during the use can be improved.
In actual operation, when this device used, unable adjustment base 1 accessible installation draw-in groove 2 card was in notebook computer bottom, can realize the quick installation to the heat dissipation support, and the heat dissipation support forms an integral structure with the notebook electrical property, it is more convenient to carry, and need not to dismantle and assemble when using, it is more convenient to use, the installation draw-in groove 2 inner wall passes through silica gel heat conduction pad 3 and the contact of notebook computer lower surface, can play the cushioning effect to unable adjustment base 1 and notebook computer junction through silica gel heat conduction pad 3, heat on the notebook computer accessible heat conduction groove 5 transmits unable adjustment base 1 in, silica gel heat conduction pad 3 is laminated mutually with notebook computer lower surface simultaneously, can be with the quick transfer of heat to on the heat collection copper 4, the equidistance of heat collection copper 4 lower surface is equipped with a plurality of heat dissipation fins 6, the cooling fan 8 is installed to the mounting groove 7 inner chamber of heat dissipation fin 6 lower surface, can accelerate the air velocity on cooling fin 6 surface through cooling fan 8, the quick heat accessible groove 10 both ends of unable adjustment base 1 inner chamber discharges, can realize carrying out the notebook computer, can be carried out the folding support from the folding support 12, can take out the folding support 12 from the folding support 1, can carry out the folding support in the folding angle, can use the folding support 1, and use is carried out the comfort in the folding angle is improved to the supporting the folding support 1.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.

Claims (7)

1. The utility model provides a computer heat dissipation support, includes unable adjustment base (1), its characterized in that: the surface of the fixed base (1) is provided with an installation clamping groove (2), two ends of an inner cavity of the installation clamping groove (2) are of an inner arc structure, and a silica gel heat conduction pad (3) is adhered to the inner wall surface of the installation clamping groove (2);
the utility model discloses a solar heat collector is characterized in that an inner cavity of a fixed base (1) is of a hollow structure, an embedded groove is formed in the bottom of the inner cavity of an installation clamping groove (2), the embedded groove extends to the inner cavity of the fixed base (1), a heat dissipation mechanism is arranged in the embedded groove and comprises a heat collection copper plate (4), a heat conduction groove (5), a heat dissipation fin (6) and a heat dissipation fan (8), the heat dissipation fin (6) is connected with the lower surface equidistance of the heat collection copper plate (4), the heat dissipation fan (8) is symmetrically arranged on the lower surface of the heat dissipation fin (6), and the heat conduction groove (5) is formed by penetrating through the bottom surface of the fixed base (1), the heat collection copper plate (4) and the surface equidistance of a silica gel heat conduction pad (3).
2. A computer heat sink bracket according to claim 1, wherein: the heat conducting grooves (5) and the radiating fins (6) are arranged in a staggered mode.
3. A computer heat sink bracket according to claim 2, wherein: the heat dissipation fins (6) are symmetrically arranged on the lower surfaces of the heat dissipation fins, mounting grooves (7) are symmetrically formed in the lower surfaces of the heat dissipation fins, and the heat dissipation fans (8) are mounted in the mounting grooves (7).
4. A computer heat sink bracket according to claim 1, wherein: the fixed base (1) lower surface equidistance is equipped with a plurality of groups supporting seat (9), supporting seat (9) and fixed base (1) integrated into one piece.
5. The computer heat sink bracket of claim 4, wherein: an exhaust groove (10) is formed between two adjacent groups of supporting seats (9), and the position of the exhaust groove (10) corresponds to the position of the heat conducting groove (5).
6. A computer heat sink bracket according to claim 1, wherein: the angle adjusting mechanism is arranged on the surfaces of the supporting seats (9) at two ends of the fixed base (1) and comprises a folding storage groove (11) and a folding bracket (12).
7. The computer heat sink bracket of claim 6, wherein: the folding storage groove (11) is formed in the lower surface of the end part of the supporting seat (9), and the folding bracket (12) is rotatably arranged in the inner cavity of the folding storage groove (11).
CN202321771972.1U 2023-07-07 2023-07-07 Computer heat dissipation support Active CN220271857U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321771972.1U CN220271857U (en) 2023-07-07 2023-07-07 Computer heat dissipation support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321771972.1U CN220271857U (en) 2023-07-07 2023-07-07 Computer heat dissipation support

Publications (1)

Publication Number Publication Date
CN220271857U true CN220271857U (en) 2023-12-29

Family

ID=89319876

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321771972.1U Active CN220271857U (en) 2023-07-07 2023-07-07 Computer heat dissipation support

Country Status (1)

Country Link
CN (1) CN220271857U (en)

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