CN214852417U - Active heat radiation structure of mobile phone motherboard - Google Patents

Abstract

The utility model relates to the technical field of mobile phones, and provides an active heat dissipation structure of a mobile phone mainboard, which comprises a miniature air inlet fan and a metal cover, wherein an air outlet of the miniature air inlet fan is communicated to the metal cover through a pipeline, the metal cover is completely wrapped on a processor mainboard of a mobile phone, the metal cover is connected with a mobile phone shell through at least one Venturi tube, the outlet end of the Venturi tube is provided with a dust cover, the throat of the Venturi tube is provided with an auxiliary air inlet pipe, and the auxiliary air inlet pipe is arranged outside the metal cover; the utility model discloses utilize miniature inlet fan cooperation metal covering to realize realizing alone the heat dissipation of blowing to the treater mainboard, simultaneously, set up the gas vent into venturi, utilize, venturi's characteristic drives, and the outside heat dissipation of metal covering is strengthened to supplementary intake pipe air-out, improves the radiating efficiency of cell-phone.

Description

Active heat radiation structure of mobile phone motherboard

Technical Field

The utility model relates to a mobile phone technology field particularly, relates to an active heat radiation structure of mobile phone motherboard.

Background

With the rapid development of science and technology, mobile phones have become indispensable electronic products in people's lives. The operation of the mobile phone mainly depends on a mainboard, and the mainboard is a core component of the mobile phone. The mobile phone mainboard is at the working process, and the electron device on it can produce a large amount of heats, and mobile phone battery, baseband chip and treater chip are the main heating element of mobile phone mainboard, if the heat can not in time derive, can lead to the mobile phone mainboard overheated, not only influences the comfort that uses the cell-phone, still can influence the performance of cell-phone, excessively generates heat and can burn out mobile phone hardware even. The existing mobile phone mainboard is mainly used for carrying out passive heat dissipation through heat dissipation holes, the heat dissipation efficiency is low, the heat dissipation effect is poor, and when a user calls for a long time or operates a mobile phone at a high frequency to play games, the situation that the part of the mobile phone is hot easily occurs, so that the user experience is poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an active heat radiation structure of mobile phone motherboard, it utilizes miniature inlet fan cooperation metal covering to realize realizing alone the heat dissipation of blowing to the treater mainboard, simultaneously, sets up the gas vent into venturi, utilizes, and venturi's characteristic drives, and the outside heat dissipation of metal covering is strengthened to supplementary intake pipe air-out, improves the radiating efficiency of cell-phone.

The embodiment of the utility model discloses a realize through following technical scheme: the utility model provides an active heat radiation structure of mobile phone motherboard, includes miniature air intake fan and metal covering, and miniature air intake fan's air outlet communicates the metal covering through the pipeline on, and the metal covering wraps up in the treater mainboard of cell-phone entirely, is connected through at least one venturi between metal covering and the cell-phone shell, and venturi's exit end is equipped with the dust cover, and venturi's throat play is equipped with supplementary intake pipe, and supplementary intake pipe setting is in the outside of metal covering.

Furthermore, one side of the metal cover, which is far away from the processor mainboard, is provided with a plurality of cooling holes, the cooling holes are perpendicular to the processor mainboard, and the diameter of one end, which is far away from the processor mainboard, of each cooling hole is larger than that of one end, which is close to the processor mainboard.

Furthermore, a heat dissipation plate is arranged in the metal cover and connected with the processor mainboard through heat dissipation materials.

Furthermore, one end of the pipeline is completely wrapped at one end of the metal cover, and the horizontal projection surface of the end is completely covered on the cooling hole.

Furthermore, an air inlet is formed in one side, close to the processor main board, of the mobile phone shell.

Furthermore, a micro air outlet fan is further arranged and is arranged at the bottom of the mobile phone shell and far away from the processor mainboard.

Furthermore, the miniature air outlet fan is arranged at one end of the mobile phone battery, which is far away from the metal cover.

The utility model discloses technical scheme has following advantage and beneficial effect at least: it utilizes miniature inlet fan cooperation metal covering to realize realizing alone the heat dissipation of blowing to the treater mainboard, simultaneously, sets up the gas vent into venturi, utilizes, and venturi's characteristic drives, and the outside heat dissipation of metal covering is strengthened to supplementary intake pipe air-out, improves the radiating efficiency of cell-phone.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of an active heat dissipation structure of a mobile phone motherboard according to the present invention;

fig. 2 is a schematic view of an installation structure of a micro intake fan in an active heat dissipation structure of a mobile phone motherboard according to the present invention;

FIG. 3 is an enlarged view of A in FIG. 1;

icon: 10-mobile phone shell, 20-miniature air inlet fan, 30-metal cover, 31-cooling hole, 32-heat dissipation plate, 33-pipeline, 40-processor mainboard, 50-Venturi tube, 51-auxiliary air inlet tube, 52-dustproof measure, 60-air inlet, 70-battery and 80-miniature air outlet fan.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, the description is only for convenience of description and simplification, but the indication or suggestion that the device or element to be referred must have a specific position, be constructed and operated in a specific position, and thus, cannot be understood as a limitation of the present invention.

In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

As shown in fig. 1-3, an active heat dissipation structure for a mobile phone motherboard includes a micro air intake fan 20 and a metal cover 30, wherein an air outlet of the micro air intake fan 20 is communicated to the metal cover 30 through a pipeline 33, where it is to be noted that the micro air intake fan 20 is used to draw outside air into the mobile phone and into the metal cover 30 through the pipeline 33, the metal cover 30 is completely wrapped around a processor motherboard 40 of the mobile phone, and the processor motherboard 40 is blown by wind energy to reduce the temperature thereof; two venturi tubes 50 are arranged between the metal cover 30 and the mobile phone shell 10, dust covers are arranged at outlet ends of the venturi tubes 50, and air pumped into the metal cover 30 by the micro air inlet fan 20 is exhausted through the venturi tubes 50, so that the exchange of internal air and external air is ensured; further, the throat of the venturi tube 50 is provided with an auxiliary air inlet pipe 51, the auxiliary air inlet pipe 51 is arranged outside the metal cover 30, and here, because the metal cover 30 is totally enclosed and wrapped on the processor main board 40 of the mobile phone, there are two heat dissipation modes, first: the micro air inlet fan 20 draws air to directly blow the processor main board 40, so that the air flow on the surface of the processor main board is accelerated, and the heat dissipation is enhanced; secondly, the method comprises the following steps: the processor main board 40 transfers heat to the metal cover 30, the metal cover 30 naturally dissipates heat, and the venturi tube 50 is provided to exhaust air outside the metal cover 30 through the venturi characteristic that a narrow high-speed airflow drives one of the fast and low-speed airflows, and the auxiliary air intake pipe 51 is driven by the throat to exhaust the air outside the metal cover 30, so that the air is exhausted outside the mobile phone shell 10, thereby enhancing heat dissipation.

In some embodiments, a plurality of cooling holes 31 are formed in a side of the metal cover 30 away from the processor main board 40, the cooling holes 31 are perpendicular to the processor main board 40, and a diameter of an end of the cooling holes 31 away from the processor main board 40 is larger than a diameter of an end of the cooling holes 31 close to the processor main board 40, the cooling holes 31 are formed to reduce a temperature of the gas passing through the cooling holes 31 a little by using a throttling expansion effect of the cooling holes 31, and the cooling process on the processor main board 40 is enhanced by matching with a high-speed airflow, wherein the temperature of the gas entering the metal cover 30 through the micro intake fan 20 may be affected by an external environment.

In some embodiments, in order to ensure the heat exchange efficiency of the processor main board 40 metal covers 30, a heat dissipation plate 32 is further disposed inside the metal cover 30, and the heat dissipation plate 32 is connected with the processor main board 40 through a heat dissipation material; here the heat dissipation material includes but not limited to heat dissipation silicone grease, heat dissipation plate 32 adopts the good material of heat conduction material such as copper or silver to make, collect the heat of treater through heat dissipation plate 32, then utilize wind to cool down heat dissipation plate 32, utilize heat dissipation plate 32 to give metal covering 30 with heat transfer simultaneously, the radiating efficiency is improved, heat dissipation plate 32 also can carry out certain protection to treater mainboard 40 certainly, avoid in the longer time, the gravel gets into in the metal covering 30 along with wind, then treater mainboard 40 causes the damage.

Further, in order to ensure the practical effect of the equipment, one end of the pipeline 33 is completely wrapped at one end of the metal cover 30, and the horizontal projection surface of the end is completely covered on the cooling hole 31; moreover, an air inlet 60 is formed in one side of the mobile phone shell close to the processor main board 40, and the air inlet 60 is separately formed to improve the efficiency of air convection, thereby facilitating the work of the auxiliary air inlet pipe 51, and certainly, a dustproof measure 52 should be arranged outside the air inlet 60.

In some embodiments, a micro air outlet fan 80 is further disposed inside the mobile phone, the micro air outlet fan 80 is disposed at the bottom of the mobile phone housing and is far from the processor main board 40, specifically, the micro air outlet fan 80 is disposed at one end of the mobile phone battery 70 far from the metal cover 30, and heat inside the mobile phone is taken out through the micro air outlet fan 80, at this time, the micro air outlet fan 80 and the air inlet 60 are disposed at two opposite sides of the mobile phone, so that it is ensured that gas can pass through the metal cover 30, the battery 70 and other mobile phone heating components, and the temperature inside the mobile phone is cooled, it should be noted that, since the most heat generated by the mobile phone is the processor, the metal cover 30 in this application is mainly responsible for cooling the processor, but in other embodiments, if necessary, the mobile phone can be completely wrapped around other electronic components for cooling, and it should be emphasized, the work of the micro air inlet fan and the micro air outlet fan is controlled by the CPU of the mobile phone.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. An active heat radiation structure of mobile phone motherboard which characterized in that: including miniature air intake fan (20) and metal covering (30), the air outlet of miniature air intake fan (20) communicates through pipeline (33) on metal covering (30), metal covering (30) wrap up in treater mainboard (40) of cell-phone entirely, be connected through at least one venturi tube (50) between metal covering (30) and cell-phone shell (10), the exit end of venturi tube (50) is equipped with the dust cover, the throat department of venturi tube (50) is equipped with supplementary intake pipe (51), supplementary intake pipe (51) set up the outside of metal covering (30).

2. An active heat dissipation structure as defined in claim 1, wherein: one side that treater mainboard (40) were kept away from in metal covering (30) is equipped with a plurality of cooling holes (31), cooling hole (31) perpendicular treater mainboard (40) set up, just the diameter that treater mainboard (40) were kept away from in cooling hole (31) one end is greater than the diameter that is close to the one end of treater mainboard (40).

3. An active heat dissipation structure as defined in claim 2, wherein: still be equipped with heating panel (32) in metal covering (30), heating panel (32) pass through heat dissipation material with treater mainboard (40) and are connected.

4. An active heat dissipation structure as defined in claim 2, wherein: one end of the pipeline (33) is completely wrapped at one end of the metal cover (30), and the horizontal projection surface of the end is completely covered on the cooling hole (31).

5. An active heat dissipation structure as defined in claim 1, wherein: an air inlet (60) is formed in one side, close to the processor main board (40), of the mobile phone shell.

6. An active heat dissipation structure as defined in claim 5, wherein: the mobile phone is further provided with a micro air outlet fan (80), wherein the micro air outlet fan (80) is arranged at the bottom of the mobile phone shell and is far away from the processor main board (40).

7. An active heat dissipation structure as defined in claim 6, wherein: the miniature air outlet fan (80) is arranged at one end of the mobile phone battery (70) far away from the metal cover (30).

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