CN112041149A - 增材制造 - Google Patents
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Abstract
在一个示例中,一种用于增材制造机器的控制过程包括:将平台移位、测量平台的实际位移、确定实际位移相对于标称位移发生变化,以及基于确定的变化来确定要被施加到构建材料的制剂的量,该构建材料在移位后的平台上成层。
Description
背景技术
增材制造机器通过对材料层进行构建来产生三维物体。一些增材制造机器通常被称为“3D打印机”。3D打印机和其他增材制造机器将物体的数字表示转换为物理物体。可以将数字表示处理成切片,每个切片定义将形成到物体中的构建材料的层或多个层。
附图说明
图1是图示出包括控制器的增材制造机器的一个示例的框图,该控制器被编程为基于实际的平台位移来调整制剂量。
图2至图13呈现图示出实施基于平台位移的制剂调制的一个示例的增材制造机器的一系列正视图和平面图。
图14是来自图2的细节视图。
图15图示出诸如可以被实施在图2至图13中示出的增材制造机器中的平台升降和编码器的一个示例。
图16是来自图15的细节视图。
图17是图示出用于增材制造的控制过程的一个示例的流程图。
贯穿附图,相同的部分数字指定相同的或相似的部分。
具体实施方式
在一些增材制造机器中,使用粉末构建材料来形成固体物体。多个连续的层的每个层中的构建材料被利用液体熔剂处理,并且然后被辐射,从而以与每个数字物体切片相对应的图案来熔融构建材料。因此,根据数字切片来逐层地制造物体。构建材料的每个层的实际厚度可以不同于标称厚度,例如,由于构建平台升降系统中的不准确性。层厚度与标称厚度的偏差能够导致不正确的熔剂浓度。薄的构建材料层的的溶剂的浓度可以太高,并且厚的构建材料层的溶剂的浓度可以太低。熔剂的不正确的浓度能够造成制造的物体中的缺陷。一些增材制造过程中所使用的细化剂(detailing agent)、着色剂和其他液体制剂的浓度可以类似地受层厚度的变化的影响。
已经开发了新技术来帮助补偿构建材料层的厚度变化。示例使用编码器或其他测量设备来测量针对构建材料的每个层将构建平台降低的实际距离。对于其中下一层构建材料填满平台被降低时所形成的空白的那些增材制造机器,平台被降低的实际距离对应于下一层构建材料的实际厚度。因此,可以基于测量的平台的位移来实时地调整要被施加到每个层的熔剂的量以补偿实际层厚度与标称厚度的任何变化。机器控制器可以被编程为在每一次平台被降低时确定测量的平台位移是否不同于标称位移。在一个示例中,如果测量到的位移与标称位移相比较太高或太低,然后控制器调整要被施加到下一层中的构建材料的熔剂的量,以使得构建材料层中的每个构建材料层的每单位体积的构建材料被施加的制剂的量保持恒定。
可以类似地调整要被施加到下一层的细化剂、着色剂和任何其他制剂的量。而且,示例不局限于液体制剂或粉末构建材料,而是可以用于调制施加到其他可熔构建材料的其他形式的制剂。
在本文描述的这些和其他示例说明但是不限制专利的范围,专利的范围在该说明书之后的权利要求中被限定。
如在本文档中使用的,“和/或”意指连接的物品中的一个或多个;“熔”意指引起或帮助引起构建材料烧结、熔化、粘结、固化或以另外方式熔融的物质;“细化剂”意指例如通过修改熔剂的效果和/或冷却构建材料来禁止或阻止或增强将构建材料熔融的物质;并且“存储器”意指能够体现、包含、存储或维持供处理器使用的信息和指令的并且例如可以包括电路、集成电路、ASIC(专用集成电路)、硬盘驱动器、随机存取存储器(RAM)、只读存储器(ROM)以及闪速存储器等的任何非暂时性有形介质。
图1是图示出包括控制器的增材制造机器的一个示例的框图,该控制器被编程为基于实际的平台位移来调整制剂量。参考图1,增材制造机器10包括:用于在制造期间支承构建材料的平台12,用于渐进地降低平台12以容纳连续的构建材料层的降低设备14,用于将构建材料成层到平台12上的成层设备16,用于测量平台降低的实际距离的测量设备18,用于选择性地向平台12上的构建材料施加制剂的施加器20,用于向平台12上的利用熔剂处理的构建材料施加熔融能量的熔融能量源21,以及控制器22。控制器22表示控制机器10的操作组件所需要的处理和存储器资源、编程和电子电路和组件,并且可以包括用于独立的机器组件的不同的控制元件。具体地,控制器22包括具有制剂控制指令26的存储器24以及执行指令26的处理器28,以使施加器20向多个连续构建材料层中的每个构建材料层施加一定量的制剂,以使得形成在平台12上的构建材料层中的每个构建材料层的每单位体积的构建材料被施加的制剂的量保持恒定。
在一个示例中,其中控制器22接收表示物体的每个切片的数字数据(其包括基于标称层厚度要被施加的制剂的标称量),执行指令26的控制器22基于测量到的平台位移将制剂的标称量改变为调整量,使得每个构建材料层的每单位体积的构建材料被施加的制剂的量保持恒定。在另一个示例中,其中由控制器22接收的物体数据还没有包括将对于每个切片被施加的制剂的标称量,执行指令26的控制器22基于测量到的平台位移来确定要被施加到构建材料的每个层的制剂的量,使得每个构建材料层的每单位体积的构建材料被施加的制剂的量保持恒定。
在一个示例中,对于其中利用喷墨类型施加器将液体熔剂施加到粉末构建材料,并且然后利用熔融能量来辐射液体熔剂的增材制造过程,测试显示,对于±25%的厚度变化,实现期望熔融的熔剂变化量大约是构建材料层的厚度的百分比变化的1.25倍。因此,例如如果由平台位移所测量的构建材料的层的厚度比标称厚度小10%,则将熔剂的量减少12.5%。尽管层厚度的变化与对熔剂的量的对应的调整之间的关系可以根据特定处理参数而变化,但预期到,在该示例制造处理的多个应用中,对于±25%的厚度变化,熔剂的量的调整在构建材料层的厚度的百分比变化的1.2至1.3倍范围内将足以实现期望的熔融。
控制器22可以例如通过基于平台位移和制剂的对应量之间的关系来计算制剂量、或者通过参考合并了平台位移和对应的制剂量之间的关系的查找表来计算制剂量,以确定要被施加的制剂的量。
图2至图13呈现示出用于基于平台位移来实施制剂调制的增材制造机器10的制造过程的一个示例的一系列正视图和平面图。图14是来自图2的细节视图。参考图2和图3,机器10包括第一“定影器”托架30和第二“施加器”托架32。托架30、32在控制器22的方向在平台12之上反复移动。控制器22表示用于控制机器10的操作元件所需要的处理和存储器资源和指令、电子电路和组件。具体地,如在图1中所示的,控制器22包括具有制剂控制指令26的存储器24和执行指令26的处理器28。在示出运动中的托架的随后的正视图中省略控制器22。
定影器托架30运送辊或其它适当的成层设备16,以将多个构建材料34的薄层中的每个薄层连续地成层到平台12上。在图中仅仅示出了构建材料的两个层,并且大大地夸大每个层的厚度以更好地图示出所示出和描述的示例。在增材制造中常常使用构建材料的数百或数以千计的十分之几毫米厚度的或更薄的层以完成物体。定影器托架30还运载对未熔融的构建材料34进行加热的加热灯或其它适当的加热器36,以及向利用熔剂处理的构建材料34施加熔融能量的熔融灯或其它适当的能量源21的阵列。施加器托架32运送向平台12上的构建材料34施加熔剂的喷墨打印头组件或其它适当的制剂施加器20。在示出的示例中,施加器20包括施加熔剂的第一施加器20A和施加例如细化剂的另一种制剂的第二施加器20B。在一些增材制造过程中使用其他制剂,例如包括着色剂。
增材制造机器10还包括降低和提升平台12的升降器14以及测量平台12的位移的编码器或其他测量设备18。控制器22指示升降器14对于构建材料34的每个层将平台12降低标称距离。编码器18感测降低的平台12的实际位置作为平台12从其在先的位置移位的实际距离的测量。图14的细节视图示出在图2中指示DN升降器14对于下一层将平台12降低的标称距离DN与由编码器18所测量的实际距离DA之间的差值ΔD。控制器22基于位移偏差ΔD来确定要被施加到下一层的溶剂和细化剂的量并且指示施加器20以确定的量施加制剂。在图14中示出的示例中,正偏差ΔD意味着下一层将比标称厚度厚,并且因此控制器22将确定将向下一层施加更大量的制剂。
在确定将施加的每个制剂的量之前、在其期间或在其之后,控制器22指示定影器托架30向右侧移动,其中辊16被部署为将构建材料34成层到下一层38中的降低的平台上,如图4和图5中所示。在图4和图5中通过运动箭头40来指示托架30的方向。在图6和图7中,施加器托架32在定影器托架30后面向左侧移动,如由运动箭头42所指示的,以便以由控制器22所确定的量按照对应于物体切片的图案将溶剂和细化剂施加到构建材料上。在图中通过稠密的点彩来描绘利用制剂处置的构建材料34。
在图8和图9中,托架30、32移动回右侧,其中施加器20以确定的量继续施加溶剂和细化剂,继其之后,灯21利用熔融能量辐射构建材料以将利用熔剂处置的构建材料熔融。在图中通过影线来描绘熔融的构建材料。在图10和图11中,托架30、32已经到达平台12的右侧。在该示例中,定影器托架30返回到平台12的左侧以为下一层作准备,如图12和图13中所示,并且操作的序列可以逐切片地继续用于构建材料的每个后续的层,以完成物体。
图2至图13图示出仅仅增材制造机器10和制造过程的一个示例。其它适当的机器和过程是可能的。
图15和图16图示出具有诸如可以被实施在图2至图13中示出的机器10中的平台12、升降器14和编码器18的构建单元44的一个示例。参考图15,构建单元44包括连接到升降器14的平台12以及围绕平台12以在制造期间将构建材料容纳在平台12上的容器46。容器46被附加或集成到固定机箱48中,该固定机箱48支承增材制造机器中的升降器组件。省略容器46和机箱48的前面板以便示出否则将看不见的部分。平台12坐落于框架50顶上,该框架50相对于机箱48随导杆52上下移动。通过驱动组件56中的从机箱48悬吊下来的驱动螺母54来降低和提升导杆52(以及因此框架50和平台12)。驱动组件56包括马达58来转动螺母54。
在操作中,在控制器22的方向(图2)为马达58功能以渐进地转动螺母54并且对于下一层构建材料将运送平台12的导杆52往下驱动标称距离。线性编码器18包括编码条60,其随着框架50以及因此附接到框架50的平台12上下移动。安装到机箱48的光读取器62读取条60上的刻度标记64以测量平台12的实际位移。在另一个示例中,编码器18包括磁性读取器来读取条上的磁性刻度。编码器18仅仅是测量平台12降低的距离的一个示例测量设备18。可以使用其它适当的测量设备。
图17是图示出用于增材制造的控制过程100的一个示例的流程图。可以例如通过在图1以及图2至图13中的机器10上执行制剂控制指令26的增材制造机器控制器22来实施过程100。参考图17,控制过程100包括:将平台移位(框102)、测量平台的实际位移(框104)、确定实际位移相对于标称位移发生变化(框106)以及基于确定的变化来确定要被施加到构建材料的制剂的量,该构建材料在移位后的平台上成层(框108)。在一个示例中,在框108确定要被施加的制剂的量包括:将制剂的量从用于要施加制剂的构建材料的每个单位体积的标称量改变为用于要施加制剂的单位体积中的每个单位体积的调整量。过程100还包括:将一定体积的构建材料成层在移位后的平台上(框110)、向成层在移位后的平台上的构建材料施加确定的量的熔剂(框112)以及向移位后的平台上的已施加了熔剂的构建材料施加熔融能量(框114)。
如在该说明书的开始指出的,在图中示出的并且如上所述的示例说明但是不限制在以下权利要求中被限定的专利的范围。
如在权利要求中使用的“一”意指一个或多个。
Claims (14)
1.一种增材制造机器,包括:
降低设备,用于渐进地降低平台以容纳连续的构建材料层;
成层设备,用于将构建材料成层到所述平台上;
测量设备,用于测量所述平台被降低的实际距离;
施加器,用于向所述平台上的构建材料选择性地施加制剂;以及
控制器,所述控制器被编程为:
指示所述降低设备将所述平台降低标称距离;
从所述测量设备确定所述平台被降低的实际距离;
指示所述成层设备将构建材料成层到被降低的所述平台上;以及
指示所述施加器向所述平台上的构建材料施加所述制剂,所述制剂的量与由所述测量设备测量的所述实际距离相对应。
2.根据权利要求1所述的机器,其中:
所述施加器用于向所述平台上的构建材料选择性地施加熔剂;并且
所述控制器被编程为指示所述施加器将所述熔剂施加到所述平台上的构建材料上,所述熔剂的量与由所述测量设备测量的所述实际距离相对应。
3.根据权利要求1所述的机器,其中所述控制器被编程为针对多个连续的构建材料层中的每个构建材料层重复所述指示、确定、指示和指示。
4.根据权利要求1所述的机器,其中所述测量设备包括线性编码器,所述线性编码器包括:指示所述平台的垂直位置的条,所述条上具有刻度;以及读取所述刻度的读取器。
5.一种存储器,所述存储器上具有指令,所述指令在被执行时使增材制造机器向多个连续的构建材料层中的每个构建材料层施加一定量的制剂,以使得所述构建材料层中的每个构建材料层的每单位体积的构建材料被施加的制剂的量保持恒定。
6.根据权利要求5所述的存储器,所述存储器上具有用于以下操作的指令:
将平台移位;
确定所述平台的实际位移;以及
基于测量到的位移来确定要被施加到构建材料的制剂的量,所述构建材料在移位后的所述平台上成层。
7.根据权利要求6所述的存储器,其中确定制剂的量的指令包括用于以下操作的指令:将所述制剂的量从用于要施加所述制剂的构建材料的每个单位体积的标称量改变为用于要施加所述制剂的单位体积中的每个单位体积的调整量。
8.根据权利要求7所述的存储器,其中改变熔剂的量的指令包括用于以下操作的指令:以所述平台的所述实际位移与所述平台的标称位移之间的百分比差的1.2倍至1.3倍来改变用于每个单位体积的制剂的量。
9.一种实施根据权利要求5所述的存储器的增材制造机器控制器。
10.一种用于增材制造机器的控制过程,包括:
将平台移位;
测量所述平台的实际位移;
确定所述实际位移相对于标称位移发生变化;以及
基于确定的所述变化来确定要被施加到构建材料的制剂的量,所述构建材料在移位后的所述平台上成层。
11.根据权利要求10所述的过程,其中确定要被施加的所述制剂的量包括:将所述制剂的量从用于要施加所述制剂的构建材料的每个单位体积的标称量改变为用于要施加所述制剂的单位体积中的每个单位体积的调整量。
12.根据权利要求11所述的过程,其中改变所述制剂的量包括:以所述平台的所述实际位移与所述平台的标称位移之间的百分比差的1.2倍至1.3倍来改变用于每个单位体积的制剂的量。
13.根据权利要求9所述的过程,其中所述制剂包括熔剂,并且所述过程包括:
将一定体积的构建材料成层在移位后的所述平台上;
向成层在移位后的所述平台上的构建材料施加确定的量的熔剂;以及
向移位后的所述平台上的已施加了所述熔剂的构建材料施加熔融能量。
14.根据权利要求13所述的过程,包括针对多个连续的平台位移来重复所述移位、测量、确定、确定、成层、施加和施加。
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