CN112034647A - Backlight module with good heat dissipation effect - Google Patents
Backlight module with good heat dissipation effect Download PDFInfo
- Publication number
- CN112034647A CN112034647A CN202011128724.6A CN202011128724A CN112034647A CN 112034647 A CN112034647 A CN 112034647A CN 202011128724 A CN202011128724 A CN 202011128724A CN 112034647 A CN112034647 A CN 112034647A
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- China
- Prior art keywords
- backlight module
- heat dissipation
- dissipation effect
- good heat
- protective shell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a backlight module with a good heat dissipation effect, which comprises a protective shell, wherein the inner walls of four sides of the protective shell are respectively provided with a symmetrically-distributed clamping groove, the inner walls of the clamping grooves are respectively clamped with a clamping block, the clamping blocks are respectively connected with the same backlight module, the outer walls of two sides of the protective shell are respectively provided with an air inlet distributed equidistantly, the outer walls of two sides of the protective shell are respectively bonded with symmetrically-distributed guide rails, the inner walls of the two guide rails are respectively embedded with a guide block, the two guide blocks are respectively bonded with the same filter screen, and the outer wall of one side of the backlight module is fixedly provided with a heat conduction. According to the invention, the filter screen is arranged at the air inlet, so that impurities in the air can be filtered, and the damage of dust to electronic elements of the backlight module is avoided.
Description
Technical Field
The invention relates to the technical field of backlight modules, in particular to a backlight module with a good heat dissipation effect.
Background
Because of its light weight, small volume and thin thickness, the lcd device is widely used in various terminal display devices with different sizes, and because the liquid crystal does not emit light in the lcd panel, a single light source is required to achieve the display function, such as a backlight module, which can be divided into a side light module and a direct-down module backlight module according to the result. The backlight module in the prior art has poor heat dissipation performance, so that the service life of the backlight module is short.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a backlight module with a good heat dissipation effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
a backlight module with good heat dissipation effect comprises a protective shell, wherein the inner walls of four sides of the protective shell are provided with symmetrically distributed clamping grooves, the inner walls of the clamping grooves are clamped with clamping blocks, the clamping blocks are connected with the same backlight module respectively, the outer walls of two sides of the protective shell are provided with air inlets distributed equidistantly, the outer walls of two sides of the protective shell are bonded with symmetrically distributed guide rails, the inner walls of the two guide rails are embedded with guide blocks, the two guide blocks are bonded with the same filter screen respectively, the outer wall of one side of the backlight module is fixed with heat-conducting fins through screws, the backlight module is provided with a turbofan at the central position of the outer wall of one side of the heat-conducting fins, the turbofan is arranged in an air collecting hopper, one end of the air collecting hopper, far away from the turbofan, is connected with an exhaust pipe, the outer walls of two sides of the exhaust pipe, which are positioned, and the rectangular sealing shell is inserted at the back of the protective shell, and semiconductor refrigeration chips which are distributed equidistantly are fixed at two ends of the back of the protective shell.
Preferably, the heat absorption surface of the semiconductor refrigeration chip faces the backlight module, and the heat dissipation surface of the semiconductor refrigeration chip faces the rectangular sealing shell.
Preferably, the backlight module, the turbofan and the semiconductor refrigeration chip are all connected with a switch through wires, and the switch is connected with an external power supply.
Preferably, the size of the inner wall of the guide rail is matched with the size of the guide block, and the guide rail and the guide block form a sliding fit.
Preferably, the size of the inner wall of the protective shell is matched with the size of the backlight module, and the protective shell and the backlight module form a tight fit.
Preferably, the exhaust pipe is of an inverted L-shaped structure, one end of the exhaust pipe, which is far away from the turbofan, is provided with an inclined air outlet, and the inclined surface faces the back of the protective shell.
Preferably, the semiconductor refrigeration chips are distributed at equal intervals along the width direction of the protective shell, and the length of the rectangular sealing shell is matched with the total length of the sum of the semiconductor refrigeration chips.
Preferably, arc-shaped metal sheets are welded on the surface of the heat conduction fin and distributed equidistantly.
The invention has the beneficial effects that:
1. according to the backlight module with the good heat dissipation effect, the air inlets are formed in the outer walls of the two sides of the protective shell in an equidistant distribution mode, and the exhaust pipe is arranged on the back of the protective shell, so that more air enters the interior of the protective shell and less air exits the interior of the protective shell, the internal pressure of the protective shell is higher than the external pressure, air exhaust is facilitated, and heat dissipation is accelerated;
2. the good backlight unit of radiating effect of this design, through setting up the filter screen in air inlet department, can filter the impurity in the air, avoid the dust to cause the damage to backlight unit's electronic component, and be equipped with semiconductor refrigeration chip at protective housing's back, when the air from the outside when inside circulation, turbofan can circulate with the air behind the semiconductor refrigeration chip refrigeration with higher speed, thereby increase the radiating effect of device, and the radiating surface process of semiconductor refrigeration chip can be followed to exhaust air, accelerate the circulation of air of radiating surface, thereby accelerate the heat dissipation of semiconductor refrigeration chip, protect semiconductor refrigeration chip.
Drawings
Fig. 1 is a cross-sectional view of an overall structure of a backlight module with a good heat dissipation effect according to the present invention;
FIG. 2 is a schematic cross-sectional view of an overall structure of a backlight module with a good heat dissipation effect according to the present invention;
fig. 3 is an enlarged schematic view of a part of the structure of a backlight module with a good heat dissipation effect according to the present invention;
fig. 4 is a schematic structural view of a turbofan of a backlight module with a good heat dissipation effect according to the present invention.
In the figure: the structure comprises a protective shell 1, a clamping groove 2, a clamping block 3, a backlight module 4, an air inlet 5, a guide rail 6, a guide block 7, a filter screen 8, heat-conducting fins 9, a turbofan 10, an air collecting hopper 11, an exhaust pipe 12, a connecting pipe 13, a rectangular sealing shell 14 and a semiconductor refrigeration chip 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a backlight module with good heat dissipation effect comprises a protective housing 1, wherein the inner walls of four sides of the protective housing 1 are provided with symmetrically distributed slots 2, the inner walls of the slots 2 are clamped with clamping blocks 3, the clamping blocks 3 are connected with the same backlight module 4, the outer walls of two sides of the protective housing 1 are provided with air inlets 5 distributed equidistantly, the size of the inner wall of the protective housing 1 is matched with the size of the backlight module 4, the protective housing 1 and the backlight module 4 are tightly matched, the outer walls of two sides of the protective housing 1 are bonded with symmetrically distributed guide rails 6, the inner walls of the two guide rails 6 are embedded with guide blocks 7, the size of the inner wall of each guide rail 6 is matched with the size of each guide block 7, the guide rails 6 and the guide blocks 7 form sliding fit, the two guide blocks 7 are bonded with the same filter screen 8, and the outer wall of one side of the backlight module 4, arc-shaped metal sheets distributed at equal intervals are welded on the surface of the heat conducting fin 9, a turbofan 10 is arranged at the central position of the outer wall of one side of the heat conducting fin 9 of the backlight module 4, the turbofan 10 is installed in an air collecting hopper 11, one end, far away from the turbofan 10, of the air collecting hopper 11 is connected with an exhaust pipe 12, the outer walls of two sides, located outside the protective shell 1, of the exhaust pipe 12 are communicated with connecting pipes 13, air inlets 5 distributed at equal intervals are formed in the outer walls of two sides of the protective shell 1, and the exhaust pipe 12 is arranged at the back of the protective shell 1, so that more air is supplied into the protective shell 1 and less air is supplied out from the protective shell 1, the internal pressure of the protective shell 1;
the exhaust pipe 12 is of an inverted L-shaped structure, one end of the exhaust pipe 12, which is far away from the turbofan 10, is provided with an inclined air outlet, the inclined surface faces the back of the protective shell 1, two connecting pipes 13 are connected with rectangular sealing shells 14, the rectangular sealing shells 14 are inserted at the back of the protective shell 1, the heat absorbing surfaces of the semiconductor refrigeration chips 15 face the backlight module 4, the heat radiating surfaces of the semiconductor refrigeration chips 15 face the rectangular sealing shells 14, the semiconductor refrigeration chips 15 are distributed at equal intervals along the width direction of the protective shell 1, the length of each rectangular sealing shell 14 is matched with the total length of the sum of the semiconductor refrigeration chips 15, the semiconductor refrigeration chips 15 distributed at equal intervals are fixed at two ends of the back of the protective shell 1, the backlight module 4, the turbofan 10 and the semiconductor refrigeration chips 15 are all connected with switches through conducting wires, the switches are connected with an external power, can filter the impurity in the air, avoid the dust to cause the damage to backlight unit 4's electronic component, and be equipped with semiconductor refrigeration chip 15 at the back of protective housing 1, when the air from the outside when inside circulation, turbofan 10 can circulate the air behind the refrigeration of semiconductor refrigeration chip 15 with higher speed, thereby increase the radiating effect of device, and exhaust air can follow the cooling surface process of semiconductor refrigeration chip 15, accelerate the circulation of air of cooling surface, thereby accelerate the heat dissipation of semiconductor refrigeration chip 15.
When the backlight module with good heat dissipation effect is used, firstly, the backlight module 4 connected with the fixture block 3 is clamped and fixed inside the protective shell 1, then the guide block 7 connected with the filter screen 8 is inserted into the guide rail 6, then the turbofan 10 and the semiconductor refrigeration chip 15 are started, the semiconductor refrigeration chip 15 can refrigerate air inside the protective shell 1, then the turbofan 10 can suck the refrigerated air into the protective shell 1, the backlight module 4 is cooled, the heated air can be discharged from the exhaust pipe 12, one part of the air discharged from the exhaust pipe 12 can be directly discharged to the outside, the other part of the air can flow into the rectangular sealing shell 14 from the connecting pipe 13, and the heat dissipation of the heat dissipation surface of the semiconductor refrigeration chip 15 is accelerated.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A backlight module with good heat dissipation effect comprises a protective shell (1) and is characterized in that clamping grooves (2) which are symmetrically distributed are formed in the inner walls of four sides of the protective shell (1), clamping blocks (3) are clamped on the inner walls of the clamping grooves (2), the clamping blocks (3) are connected with the same backlight module (4), air inlets (5) which are equidistantly distributed are formed in the outer walls of two sides of the protective shell (1), symmetrically distributed guide rails (6) are bonded on the outer walls of two sides of the protective shell (1), guide blocks (7) are embedded in the inner walls of the two guide rails (6), the two guide blocks (7) are bonded with the same filter screen (8), heat-conducting fins (9) are fixed on the outer wall of one side of the backlight module (4) through screws, and a turbofan (10) is arranged at the central position of the outer wall of one side of each heat-conducting fin (9) of the backlight module, and turbofan (10) are installed in air collecting hopper (11), the one end that turbofan (10) were kept away from in air collecting hopper (11) is connected with blast pipe (12), and blast pipe (12) are located outside both sides outer wall of protecting sheathing (1) and all communicate there are connecting pipe (13), two connecting pipe (13) all are connected with rectangle sealed shell (14), and rectangle sealed shell (14) peg graft at protecting sheathing (1) back, protecting sheathing (1) back both ends all are fixed with semiconductor refrigeration chip (15) that the equidistance distributes.
2. A backlight module with good heat dissipation effect as recited in claim 1, wherein the heat absorbing surface of the semiconductor cooling chip (15) faces the backlight module (4), and the heat dissipating surface of the semiconductor cooling chip (15) faces the rectangular sealing case (14).
3. The backlight module with good heat dissipation effect as defined in claim 1, wherein the backlight module (4), the turbofan (10) and the semiconductor refrigeration chip (15) are all connected with a switch through wires, and the switch is connected with an external power supply.
4. The backlight module with good heat dissipation effect as claimed in claim 1, wherein the inner wall of the guide rail (6) has a size matched with that of the guide block (7), and the guide rail (6) and the guide block (7) form a sliding fit.
5. The backlight module with good heat dissipation effect as claimed in claim 1, wherein the size of the inner wall of the protective housing (1) is matched with the size of the backlight module (4), and the protective housing (1) and the backlight module (4) form a tight fit.
6. The backlight module with good heat dissipation effect as claimed in claim 1, wherein the exhaust pipe (12) is of an inverted "L" shape, and an inclined air outlet is disposed at an end of the exhaust pipe (12) away from the turbofan (10), and the inclined surface faces the back of the protective casing (1).
7. The backlight module with good heat dissipation effect as claimed in claim 1, wherein the semiconductor cooling chips (15) are equidistantly distributed along the width direction of the protective housing (1), and the length of the rectangular sealing housing (14) is adapted to the total length of the sum of the semiconductor cooling chips (15).
8. The backlight module with good heat dissipation effect as claimed in claim 1, wherein the heat-conducting fins (9) have arc-shaped metal sheets welded on the surface thereof and distributed equidistantly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011128724.6A CN112034647A (en) | 2020-10-21 | 2020-10-21 | Backlight module with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011128724.6A CN112034647A (en) | 2020-10-21 | 2020-10-21 | Backlight module with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112034647A true CN112034647A (en) | 2020-12-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011128724.6A Pending CN112034647A (en) | 2020-10-21 | 2020-10-21 | Backlight module with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112034647A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113093893A (en) * | 2021-05-10 | 2021-07-09 | 桐庐新纪计算机有限公司 | Intelligent heat dissipation equipment of computer mainframe box |
| CN113138641A (en) * | 2021-05-10 | 2021-07-20 | 桐庐新纪计算机有限公司 | Novel temperature-sensing automatic ventilation type computer hardware box |
| CN115574303A (en) * | 2022-09-26 | 2023-01-06 | 深圳市瀚达美电子有限公司 | Large-size LED backlight source with high heat dissipation performance |
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| CN2641676Y (en) * | 2003-08-13 | 2004-09-15 | 矽连科技股份有限公司 | Radiator for LCD |
| TW200624021A (en) * | 2004-12-30 | 2006-07-01 | Coretronic Corp | Heat dissipation structure of backlight module |
| TW200734757A (en) * | 2006-03-08 | 2007-09-16 | Coretronic Corp | Backlight module and display device |
| CN204029311U (en) * | 2014-06-13 | 2014-12-17 | 卓钢 | A kind of outdoor LCD screen cooling system |
| CN107589592A (en) * | 2017-09-08 | 2018-01-16 | 深圳市华星光电技术有限公司 | Radiator structure and backlight module for backlight module |
| CN109407394A (en) * | 2018-09-25 | 2019-03-01 | 广东华悦美照明科技有限公司 | A kind of LED backlight mould group and display |
| CN209327726U (en) * | 2018-12-25 | 2019-08-30 | 苏州三都光学电子有限公司 | A kind of heat dissipation component of backlight light source |
-
2020
- 2020-10-21 CN CN202011128724.6A patent/CN112034647A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2641676Y (en) * | 2003-08-13 | 2004-09-15 | 矽连科技股份有限公司 | Radiator for LCD |
| TW200624021A (en) * | 2004-12-30 | 2006-07-01 | Coretronic Corp | Heat dissipation structure of backlight module |
| TW200734757A (en) * | 2006-03-08 | 2007-09-16 | Coretronic Corp | Backlight module and display device |
| CN204029311U (en) * | 2014-06-13 | 2014-12-17 | 卓钢 | A kind of outdoor LCD screen cooling system |
| CN107589592A (en) * | 2017-09-08 | 2018-01-16 | 深圳市华星光电技术有限公司 | Radiator structure and backlight module for backlight module |
| CN109407394A (en) * | 2018-09-25 | 2019-03-01 | 广东华悦美照明科技有限公司 | A kind of LED backlight mould group and display |
| CN209327726U (en) * | 2018-12-25 | 2019-08-30 | 苏州三都光学电子有限公司 | A kind of heat dissipation component of backlight light source |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113093893A (en) * | 2021-05-10 | 2021-07-09 | 桐庐新纪计算机有限公司 | Intelligent heat dissipation equipment of computer mainframe box |
| CN113138641A (en) * | 2021-05-10 | 2021-07-20 | 桐庐新纪计算机有限公司 | Novel temperature-sensing automatic ventilation type computer hardware box |
| CN115574303A (en) * | 2022-09-26 | 2023-01-06 | 深圳市瀚达美电子有限公司 | Large-size LED backlight source with high heat dissipation performance |
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Application publication date: 20201204 |