CN112008903A - Cutting fluid supply device and silicon wafer cutting equipment - Google Patents
Cutting fluid supply device and silicon wafer cutting equipment Download PDFInfo
- Publication number
- CN112008903A CN112008903A CN202010914356.1A CN202010914356A CN112008903A CN 112008903 A CN112008903 A CN 112008903A CN 202010914356 A CN202010914356 A CN 202010914356A CN 112008903 A CN112008903 A CN 112008903A
- Authority
- CN
- China
- Prior art keywords
- liquid
- cutting
- mortar
- fluid supply
- cutting fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a cutting fluid supply device and silicon wafer cutting equipment, which are used for supplying cutting fluid when a gold steel wire is sliced, and are characterized by comprising the following components: the mortar jar is used for containing cutting mixed liquid, and an overflow hole is formed in the side face of the mortar jar; the liquid adding barrel is connected with the mortar cylinder and is used for containing supplementary cutting liquid so as to provide the cutting liquid for the mortar cylinder; the liquid feeding control device comprises a liquid inlet pipe and a liquid outlet pipe, wherein the free end of the liquid inlet pipe is communicated with the liquid feeding barrel, and the free end of the liquid outlet pipe is adjacent to the bottom of the mortar jar. The cutting fluid supply device provided by the embodiment of the invention can ensure the consistency of the concentration of the cutting mixed fluid in the mortar cylinder, and avoid the problem of excessive abrasion of diamond particles caused by the reduction of the concentration of the cutting mixed fluid, so that the cutting force of a gold steel wire can be improved.
Description
Technical Field
The invention relates to the technical field of gold steel wire slicing, in particular to a cutting fluid supply device and silicon wafer cutting equipment with the same.
Background
The photovoltaic section industry develops to the present, the outer diameter of the diamond wire is reduced to 47 mu m from the original 120 mu m, 45 mu m wires are also gradually promoted, and the wear resistance of the diamond particles is synchronously reduced due to the fact that the number of particles per unit area and the appearance size of diamond on the gold steel wire are greatly reduced. In order to improve the cutting capability of the gold-steel wire, besides the improvement of the self performance of the gold-steel wire, the action of the cutting fluid is also very important.
The cutting fluid has the main functions of wetting, cooling and dispersing, the cutting fluid is generally used by a method of directly adding the cutting fluid before cutting, in the process of thinning and propelling, stable cutting can be achieved by matching with a large circulation, the large circulation can reduce the wrapping of silicon powder and impurities on diamond particles, and therefore the diamond particles on the diamond wires can fully participate in cutting, the cutting force is improved, but the method only solves the problem of fully utilizing the diamond, the cutting force is reduced due to the fact that the abrasion resistance of the diamond particles is not weakened, the wire breakage rate is improved, and the fine-line work cannot be smoothly propelled, so that the improvement in the aspect is achieved from the angle of the cutting fluid adding mode.
Disclosure of Invention
In view of this, the invention provides a cutting fluid providing device, which improves a liquid adding mode and a liquid adding method, thereby improving a mortar cylinder and improving the overall cutting force.
The invention also provides silicon wafer cutting equipment with the cutting fluid supply device.
In order to solve the technical problems, the invention adopts the following technical scheme:
the cutting fluid supply device according to the embodiment of the invention is used for supplying cutting fluid when a gold steel wire is sliced, and comprises:
the mortar jar is used for containing cutting mixed liquid, and an overflow hole is formed in the side face of the mortar jar;
the liquid adding barrel is connected with the mortar cylinder and is used for containing supplementary cutting liquid so as to provide the pure cutting liquid for the mortar cylinder;
the liquid feeding control device comprises a liquid inlet pipe and a liquid outlet pipe, wherein the free end of the liquid inlet pipe is communicated with the liquid feeding barrel, and the free end of the liquid outlet pipe is adjacent to the bottom of the mortar jar.
Further, the cutting fluid supply device according to the embodiment of the present invention further includes:
the cover body covers one side end of the mortar jar, and the liquid adding barrel is arranged on the cover body.
Further, the liquid feeding control device further comprises:
one end of the liquid feeding pump is connected with the liquid inlet pipe, and the other end of the liquid feeding pump is connected with the liquid outlet pipe;
and the motor is connected with the liquid adding pump and is used for driving the liquid adding pump to operate.
Still further, the liquid feeding control device further comprises:
and the liquid adding control part is connected with the liquid adding pump and is used for controlling the liquid adding frequency of the liquid adding pump.
Still further, the cutting fluid supply apparatus according to an embodiment of the present invention further includes:
a concentration detection part arranged in the mortar cylinder and used for detecting the concentration of the cutting mixed liquid in the mortar cylinder and feeding the concentration back to the liquid feeding control part,
when the concentration is lower than the preset value, the liquid adding control part increases the liquid adding frequency of the liquid adding pump.
Furthermore, four corners of the bottom of the mortar cylinder are respectively provided with a slidable caster.
Further, a handle is arranged at one side end of the mortar cylinder close to the liquid feeding barrel.
Furthermore, a water inlet hole for adding water is formed in the side surface of the mortar jar.
In addition, the invention also provides silicon wafer cutting equipment which is characterized by comprising the cutting fluid supply device provided by the embodiment of the invention.
The technical scheme of the invention at least has one of the following beneficial effects:
according to the cutting fluid supply device provided by the embodiment of the invention, the consistency of the concentration of the cutting mixed fluid in the mortar cylinder can be ensured, the problem that the diamond particles are excessively abraded due to the reduction of the concentration of the cutting mixed fluid during overflow is avoided, and thus the cutting force of a gold steel wire can be improved.
Drawings
Fig. 1 is a schematic structural view of a cutting fluid supply device according to an embodiment of the present invention.
Reference numerals:
1. a liquid feeding control part; 2. a liquid outlet pipe; 3. a liquid adding pump; 4. a motor; 5. a liquid inlet pipe; 6. a liquid adding barrel; 7. a mortar jar; 8. a cover body; 9. a caster wheel; 10. a handle.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
First, a cutting fluid supply device and a silicon wafer cutting apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, the silicon wafer cutting apparatus according to the embodiment of the present invention includes a cutting fluid supply device.
Hereinafter, the cutting fluid supply apparatus will be described in detail with reference to the accompanying drawings.
Cutting fluid provides device for provide cutting fluid when golden steel wire section, including mortar jar 7, liquid feeding bucket 6, liquid feeding controlling means. The mortar jar 7 is used for containing cutting mixed liquid, and the side surface of the mortar jar 7 is provided with an overflow hole (not shown); the liquid adding barrel 6 is connected with the mortar cylinder 7 and is used for containing supplementary cutting liquid to provide the cutting liquid for the mortar cylinder 7; the liquid feeding control device comprises a liquid feeding pipe 5 and a liquid discharging pipe 2, the free end of the liquid feeding pipe 5 is communicated with a liquid feeding barrel 6, and the free end of the liquid discharging pipe 2 is adjacent to the bottom of the mortar jar 7.
That is, the supplementary cutting fluid in the fluid charging barrel 6 enters the fluid charging control device through the fluid inlet pipe 5 and then flows into the bottom of the mortar jar 7 through the fluid outlet pipe 2. The cutting mixed liquid in the mortar jar 7 flows out through the overflow hole, and the liquid outlet pipe 2 is sunk to the bottom of the mortar jar instead of floating on the surface of the mortar jar 7, so that the cutting liquid can be prevented from being taken away due to water overflow, and the concentration of the cutting mixed liquid is reduced. Meanwhile, the design of the liquid feeding control device can ensure the stability of the supply of the cutting liquid in the mortar cylinder 7, so that the cutting force of the gold steel wire can be improved.
The cutting fluid supply device according to the embodiment of the invention, as shown in fig. 1, further comprises a cover body 8, the cover body 8 covers one side end of the mortar cylinder 7, and the charging barrel 6 is arranged on the cover body 8. So design makes liquid feeding bucket 6 can set up in the top of mortar jar 7, has improved operating personnel's operation liquid feeding controlling means's convenience.
Further, according to the cutting fluid supply device of the embodiment of the present invention, as shown in fig. 1, the fluid charging control device further includes a fluid charging pump 3 and a motor 4. One end of the liquid feeding pump 3 is connected with the liquid inlet pipe 5, and the other end is connected with the liquid outlet pipe 2; the motor 4 is connected with the liquid feeding pump 3 and used for driving the liquid feeding pump 3 to operate. That is to say, motor 4 provides drive power for filling pump 3 for the cutting fluid in the liquid feeding bucket 6 gets into filling pump 3 from feed liquor pipe 5, again flows into mortar jar 7 through drain pipe 2.
Further, according to the cutting fluid supply apparatus of the embodiment of the present invention, as shown in fig. 1, the liquid adding control apparatus further includes a liquid adding control part 1. The liquid adding control part 1 is connected with a liquid adding pump 3 and is used for controlling the liquid adding frequency of the liquid adding pump 3. The control of the liquid adding frequency of the liquid adding pump 3 is realized through the liquid adding control part 1, so that the integral control of the cutting liquid providing device can be realized.
Further, the cutting fluid supply apparatus according to the embodiment of the present invention, as shown in fig. 1, further includes a concentration detection portion (not shown). The concentration detection part is arranged in the mortar cylinder 7 and used for detecting the concentration of the cutting mixed liquid in the mortar cylinder 7 and feeding the concentration back to the liquid adding control part 1, and when the concentration is lower than a preset value, the liquid adding control part 1 improves the liquid adding frequency of the liquid adding pump 3. The concentration detection part is arranged in the mortar cylinder 7, so that the real-time concentration value can be detected, when the concentration of the cutting mixed liquid in the mortar cylinder 7 is lower than a preset value, the cutting liquid in the mortar cylinder 7 is too little, and the liquid adding frequency of the liquid adding pump 3 is improved through the liquid adding control part 1, so that the concentration of the cutting mixed liquid in the mortar cylinder 7 is always in a proper value. The setting of concentration detection portion has promoted the sensitivity and the degree of automation of the device greatly.
Furthermore, four corners of the bottom of the mortar cylinder 7 are respectively provided with a sliding caster 9. As shown in fig. 1, the arrangement of the caster wheels 9 at the bottom of the mortar cylinder 7 enhances the flexibility of the device and at the same time provides a certain shock absorption.
Further, a handle 10 is arranged at the end part of the mortar cylinder 7 close to one side of the liquid adding barrel 6. The cooperation of the handle 10 with the castor wheel 9 further enhances the flexibility of the device.
Further, a water inlet hole (not shown) is formed in the side surface of the mortar cylinder 7. The pure water is continuously injected into the mortar jar 7 through the water inlet hole, and simultaneously, the cutting mixed liquid in the mortar jar 7 flows out to the silicon to be cut through the overflow hole. The cutting liquid supply device is arranged in such a way that the concentration of the cutting mixed liquid can be kept constant, so that the cutting liquid supply device keeps dynamic balance.
The operation of the cutting fluid supply apparatus will be described in further detail with reference to fig. 1.
As a specific embodiment, firstly, a liquid adding barrel 6 is installed on a cover body 8 of a mortar jar 7, the volume of the liquid adding barrel is about 6L, and purified water flows into the mortar jar 7 through a water inlet; and (3) starting a motor 4, driving a liquid adding pump 3 to add the cutting liquid and the purified water into a mortar cylinder 7 according to the proportion of 1:4, adjusting the liquid adding frequency by using the liquid adding control part 1 according to the cutting time of the single-blade silicon rod according to the data fed back to the liquid adding control part 1 by the concentration detection part, and adjusting the concentration of the cutting mixed liquid to be constant. Meanwhile, the cutting mixed liquor flowing out of the overflow hole is converted into secondary waste liquor after being subjected to the silicon cutting by the gold steel wire, and the secondary waste liquor can be collected by the funnel and injected into the mortar jar 7 again, so that the repeated utilization is realized. Thus, the concentration value of the cutting mixture in the mortar cylinder 7 is kept constant by readjusting the charging frequency of the charging pump 3 by the charging control unit 1. Utilize this cutting fluid providing device to guarantee the constancy of cutting mixed liquid concentration in mortar jar 7, avoid cutting mixed liquid concentration reduction when because of the overflow and lead to diamond granule wearing and tearing too big to the cutting force of golden steel wire has been promoted.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. The utility model provides a cutting fluid provides device for provide cutting fluid when golden steel wire section, its characterized in that includes:
the mortar jar is used for containing cutting mixed liquid, and an overflow hole is formed in the side face of the mortar jar;
the liquid adding barrel is connected with the mortar cylinder and is used for containing supplementary cutting liquid so as to provide the cutting liquid for the mortar cylinder;
the liquid feeding control device comprises a liquid inlet pipe and a liquid outlet pipe, wherein the free end of the liquid inlet pipe is communicated with the liquid feeding barrel, and the free end of the liquid outlet pipe is adjacent to the bottom of the mortar jar.
2. The cutting fluid supply apparatus according to claim 1, further comprising:
the cover body covers one side end of the mortar jar, and the liquid adding barrel is arranged on the cover body.
3. The cutting fluid supply apparatus according to claim 1, wherein the fluid charging control device further comprises:
one end of the liquid feeding pump is connected with the liquid inlet pipe, and the other end of the liquid feeding pump is connected with the liquid outlet pipe;
and the motor is connected with the liquid adding pump and is used for driving the liquid adding pump to operate.
4. The cutting fluid supply apparatus according to claim 3, wherein the fluid charging control device further comprises:
and the liquid adding control part is connected with the liquid adding pump and is used for controlling the liquid adding frequency of the liquid adding pump.
5. The cutting fluid supply apparatus according to claim 4, further comprising:
a concentration detection part arranged in the mortar cylinder and used for detecting the concentration of the cutting mixed liquid in the mortar cylinder and feeding the concentration back to the liquid feeding control part,
when the concentration is lower than the preset value, the liquid adding control part increases the liquid adding frequency of the liquid adding pump.
6. The cutting fluid supply apparatus according to claim 1, wherein four corners of the bottom of the mortar cylinder are respectively provided with a slidable caster.
7. The cutting fluid supply apparatus according to claim 1, wherein a handle is provided at an end of the mortar cylinder near the charging barrel.
8. The cutting fluid supply device according to claim 1, wherein a water inlet hole for adding water is formed in a side surface of the mortar cylinder.
9. An apparatus for cutting a silicon wafer, comprising the cutting fluid supply device according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010914356.1A CN112008903B (en) | 2020-09-03 | 2020-09-03 | Cutting fluid supply device and silicon wafer cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010914356.1A CN112008903B (en) | 2020-09-03 | 2020-09-03 | Cutting fluid supply device and silicon wafer cutting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112008903A true CN112008903A (en) | 2020-12-01 |
| CN112008903B CN112008903B (en) | 2022-07-15 |
Family
ID=73515903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010914356.1A Active CN112008903B (en) | 2020-09-03 | 2020-09-03 | Cutting fluid supply device and silicon wafer cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112008903B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1110511A (en) * | 1997-06-20 | 1999-01-19 | Nippei Toyama Corp | Slurry circulation device, wire saw and recording medium |
| CN102059751A (en) * | 2011-01-17 | 2011-05-18 | 西安华晶电子技术有限公司 | System and method for recycling and supplying mortar to multi-wire cutting machines |
| CN201959745U (en) * | 2011-01-06 | 2011-09-07 | 浙江精功新能源有限公司 | Stirring device for photovoltaic mortar cylinder |
| CN102189611A (en) * | 2011-04-15 | 2011-09-21 | 浙江德圣龙新材料科技有限公司 | Equidensity mortar cutting method and device for linear cutting of solar wafer |
| CN203792546U (en) * | 2014-03-13 | 2014-08-27 | 常州兆晶光能有限公司 | Efficient sand pulp circulating device of multi-wire cutting machine |
| CN104791005A (en) * | 2015-04-29 | 2015-07-22 | 北京科技大学 | Storage device and method for improving discharging concentration stability of vertical sand silo |
| CN204997840U (en) * | 2015-10-09 | 2016-01-27 | 浙江瑞翌新材料科技股份有限公司 | Buddha's warrior attendant line cutting equipment |
| CN205058326U (en) * | 2015-10-23 | 2016-03-02 | 阿特斯(中国)投资有限公司 | Mortar jar and have mortar transfer car(buggy) of this mortar jar |
| CN206139072U (en) * | 2016-09-23 | 2017-05-03 | 江苏美科硅能源有限公司 | Wafer slicer mortar agitating unit |
| CN206731698U (en) * | 2017-04-25 | 2017-12-12 | 东莞市华升真空镀膜科技有限公司 | Workpiece cleaner |
| CN207300960U (en) * | 2017-10-18 | 2018-05-01 | 东莞市循美环保科技有限公司 | Cutting fluid concentration online testing device |
| CN207290577U (en) * | 2017-10-10 | 2018-05-01 | 镇江环太硅科技有限公司 | A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device |
| CN110450293A (en) * | 2019-09-12 | 2019-11-15 | 内蒙古中环光伏材料有限公司 | A kind of large-sized silicon wafers cutting liquid silicon powder concentration detection apparatus and control method |
-
2020
- 2020-09-03 CN CN202010914356.1A patent/CN112008903B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1110511A (en) * | 1997-06-20 | 1999-01-19 | Nippei Toyama Corp | Slurry circulation device, wire saw and recording medium |
| CN201959745U (en) * | 2011-01-06 | 2011-09-07 | 浙江精功新能源有限公司 | Stirring device for photovoltaic mortar cylinder |
| CN102059751A (en) * | 2011-01-17 | 2011-05-18 | 西安华晶电子技术有限公司 | System and method for recycling and supplying mortar to multi-wire cutting machines |
| CN102189611A (en) * | 2011-04-15 | 2011-09-21 | 浙江德圣龙新材料科技有限公司 | Equidensity mortar cutting method and device for linear cutting of solar wafer |
| CN203792546U (en) * | 2014-03-13 | 2014-08-27 | 常州兆晶光能有限公司 | Efficient sand pulp circulating device of multi-wire cutting machine |
| CN104791005A (en) * | 2015-04-29 | 2015-07-22 | 北京科技大学 | Storage device and method for improving discharging concentration stability of vertical sand silo |
| CN204997840U (en) * | 2015-10-09 | 2016-01-27 | 浙江瑞翌新材料科技股份有限公司 | Buddha's warrior attendant line cutting equipment |
| CN205058326U (en) * | 2015-10-23 | 2016-03-02 | 阿特斯(中国)投资有限公司 | Mortar jar and have mortar transfer car(buggy) of this mortar jar |
| CN206139072U (en) * | 2016-09-23 | 2017-05-03 | 江苏美科硅能源有限公司 | Wafer slicer mortar agitating unit |
| CN206731698U (en) * | 2017-04-25 | 2017-12-12 | 东莞市华升真空镀膜科技有限公司 | Workpiece cleaner |
| CN207290577U (en) * | 2017-10-10 | 2018-05-01 | 镇江环太硅科技有限公司 | A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device |
| CN207300960U (en) * | 2017-10-18 | 2018-05-01 | 东莞市循美环保科技有限公司 | Cutting fluid concentration online testing device |
| CN110450293A (en) * | 2019-09-12 | 2019-11-15 | 内蒙古中环光伏材料有限公司 | A kind of large-sized silicon wafers cutting liquid silicon powder concentration detection apparatus and control method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112008903B (en) | 2022-07-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104858515B (en) | Method and device for preparing working solution of wire cut electrical discharge machine | |
| CN112008903B (en) | Cutting fluid supply device and silicon wafer cutting equipment | |
| CN206082663U (en) | Meticulous rice & peanut milk of corase grind clearance adjustable grinds device | |
| CN212476165U (en) | Environment engineering sewage treatment pond device | |
| CN201052478Y (en) | Bauxite pole type short flow path separation equipment | |
| CN211586865U (en) | Feeding concentration regulating and controlling device of ball mill | |
| CN217854673U (en) | Byproduct hydrochloric acid purification device | |
| CN209156003U (en) | It is a kind of be classified, grind, sizing mixing, conveying integrated machine | |
| CN204825349U (en) | Integration of dying material auxiliary agent delivery system | |
| CN201358743Y (en) | Fishing and milling integration tool | |
| CN215694425U (en) | Device for automatically stabilizing concentration of grinding slurry | |
| CN208245876U (en) | Drilling device is used in a kind of production and processing | |
| CN202278479U (en) | Polycrystalline diamond polishing clamp | |
| CN211726174U (en) | Device for directly feeding chemicals from hollow shaft of large flotation machine | |
| CN106269246A (en) | A kind of iron and steel production magnetic separator being automatically adjusted pulp density | |
| CN216799649U (en) | High-efficient thick liquid device of making of granule viscidity gold tailing filter cake | |
| CN210438613U (en) | Tailing sludge dewatering equipment | |
| CN217687999U (en) | Device for preventing hose of ore pulp sampler from being abraded | |
| CN110127644A (en) | A kind of low energy consumption wet grinding method preparing LiFePO4 precursor | |
| CN216465484U (en) | Silicon chip cutting cooling system | |
| CN220100013U (en) | Water conservancy channel dredging machine | |
| CN215541799U (en) | Antimony oxide ore flotation system | |
| CN209665815U (en) | A kind of refractory ceramics pug mill | |
| CN208183093U (en) | A kind of upper sand circulatory system | |
| CN205630326U (en) | Abrasive dropwise add device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |