CN207290577U - A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device - Google Patents
A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device Download PDFInfo
- Publication number
- CN207290577U CN207290577U CN201721305622.0U CN201721305622U CN207290577U CN 207290577 U CN207290577 U CN 207290577U CN 201721305622 U CN201721305622 U CN 201721305622U CN 207290577 U CN207290577 U CN 207290577U
- Authority
- CN
- China
- Prior art keywords
- slurry tank
- liquid level
- silicon wafer
- sensing device
- diamond wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device is the utility model is related to, belongs to cutting off machine technical field.The silicon wafer cut by diamond wire machine with liquid level sensing device includes slurry tank, shaft, agitating paddle, motor and liquid level sensor with slurry tank, shaft is set through slurry tank lower end vertically, agitating paddle is arranged on the part in slurry tank in shaft, motor is arranged on the lower end of slurry tank, the output shaft of motor is connected by bearing with shaft, and liquid level sensor is arranged on the inner upper end of slurry tank；The upper end side wall of slurry tank is provided with purified water inlet and cutting liquid import, and the bottom side of the wall of slurry tank is provided with discharge port.The silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device of the utility model, since slurry tank is mounted with liquid level sensor, can more accurately grasp the proportioning of pure water and cutting liquid, moreover it is possible to understand the storing situation in slurry tank in real time.
Description
Technical field
A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device is the utility model is related to, belongs to cutting
Machine tool technology field.
Background technology
Diamond wire saw machine makes diamond wire and quilt by the way of diamond wire one-way circulation or reciprocation cycle movement
Opposite grinding motion is formed between cutting object, so as to fulfill the purpose of cutting.
The development trend of Buddha's warrior attendant wire cutting is getting faster, and contrast traditional mortar cutting, has TTV smaller, silicon chip surface damages
Consume small, the advantages such as silicon chip fragment rate is low.Difference lies in golden steel wire cutting is to pass through with mortar cutting maximum for diamond wire wire cutting
Main body of the steel wire as cutting, cutting liquid play cooling and lubricating.And the main body of mortar cutting is mortar, it is impossible to there is water.So in gold
Cutting liquid proportioning in firm wire cutting is more important, and rational pure water content plays the role of vital.Machine on Wuxi
The defects of WSK027BL types are the professional types for Buddha's warrior attendant wire cutting, but it is maximum is exactly no liquid level sensor,
It is very inconvenient during cutting liquid to match.
Utility model content
The technical problems to be solved in the utility model is, in view of the shortcomings of the prior art, proposing that a kind of proportioning cutting liquid is convenient
Efficiently there is the silicon wafer cut by diamond wire machine slurry tank of liquid level sensing device.
The utility model is to solve the technical solution that above-mentioned technical problem proposes to be：A kind of gold with liquid level sensing device
Firm wire cutting silicon chip machine slurry tank, including slurry tank, shaft, agitating paddle, motor and liquid level sensor, shaft is vertically through slurry
Batch can lower end is set, and agitating paddle is arranged on the part in slurry tank, motor in shaft and is arranged on the lower end of slurry tank, motor
Output shaft be connected by bearing with shaft, liquid level sensor is arranged on the inner upper end of slurry tank；The upper end side wall of slurry tank
Purified water inlet and cutting liquid import are provided with, the bottom side of the wall of slurry tank is provided with discharge port.
The improvement of above-mentioned technical proposal is：First flowmeter is provided with purified water inlet, cutting liquid entrance is provided with
Two flowmeters.
The improvement of above-mentioned technical proposal is：Inlet valve is additionally provided with purified water inlet, cutting liquid entrance is provided with charging
Valve.
The improvement of above-mentioned technical proposal is：Discharge outlet is provided with outlet valve, and outlet valve is communicated with booster pump.
The improvement of above-mentioned technical proposal is：Slurry tank upper end is provided with end socket, and end socket upper end is provided with content gauge, content gauge
Signal input part pass through the signal output part of circuit and liquid level sensor connect.
The improvement of above-mentioned technical proposal is：The lower end of slurry tank is additionally provided with safety relief valve, and safety relief valve passes through pipe
Road is communicated with blow-tank.
The improvement of above-mentioned technical proposal is：The lower end of slurry tank is connected with supporting rack.
The utility model is using the beneficial effect of above-mentioned technical proposal：
（1）The silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device of the utility model, due to slurry tank
It is mounted with liquid level sensor, can more accurately grasps the proportioning of pure water and cutting liquid, moreover it is possible to understands the storing in slurry tank in real time
Situation；
（2）The silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device of the utility model, due to including turning
Axis, agitating paddle and motor, drive shaft and agitating paddle so that the mixing of pure water and cutting liquid is more uniform, also makes by motor
Obtain in use, the material in cutting liquid does not precipitate, and ensure that the working stability of silicon wafer cut by diamond wire machine；
（3）The silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device of the utility model, due to pure water into
First flowmeter is provided with mouthful, cutting liquid entrance is provided with second flowmeter, is further used cooperatively with liquid level sensor,
The proportioning of pure water and cutting liquid can more accurately be grasped；
（4）The silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device of the utility model, due to slurry tank
Lower end be additionally provided with safety relief valve, safety relief valve has blow-tank by pipeline connection, when due to the use of or temperature become
When change causes slurry pressure inside the tank excessive, safety relief valve is opened is discharged into blow-tank by material, prevents slurry tank from damaging and revealing,
Preventing from adding when adding water or adding cutting liquid at the same time causes to overflow slurry tank.
Brief description of the drawings
The utility model is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is the structure for the silicon wafer cut by diamond wire machine slurry tank that the utility model embodiment has liquid level sensing device
Schematic diagram；
Wherein：1- inlet valves, 2- purified water inlets, 3- liquid level sensors, 4- content gauges, 5- end sockets, 6- cutting liquid imports, 7-
Inlet valve, 8- second flowmeters, 9- first flowmeters, 10- slurry tanks, 11- safety relief valves, 12- blow-tanks, 13- agitating paddles,
14- shafts, 15- discharge ports, 16- outlet valves, 17- booster pumps, 18- bearings, 19- motors, 20- supporting racks.
Embodiment
Embodiment
The silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device of the present embodiment, as shown in Figure 1, including slurry
Batch can 10, shaft 14, agitating paddle 13, motor 19 and liquid level sensor 3, shaft 14 set through 10 lower end of slurry tank, stir vertically
Mix paddle 13 and be arranged on the part being located in shaft 14 in slurry tank 10, motor 19 is arranged on the lower end of slurry tank 10, motor 19
Output shaft is connected by bearing 18 with shaft 14, and liquid level sensor 3 is arranged on the inner upper end of slurry tank 10；Slurry tank 10 it is upper
Side wall is provided with purified water inlet 2 and cutting liquid import 6, and the bottom side of the wall of slurry tank 10 is provided with discharge port 15.
The silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device of the present embodiment, is set at purified water inlet 2
There is first flowmeter 9, second flowmeter 8 is provided with cutting liquid import 6.Inlet valve 1 is additionally provided with purified water inlet 2, is cut
Inlet valve 7 is provided with liquid import 6.Outlet valve 16 is provided with discharge port 15, outlet valve 16 is communicated with booster pump 17.Slurry tank
10 upper ends are provided with end socket 5, and 5 upper end of end socket is provided with content gauge 4, and the signal input part of content gauge 4 is passed by circuit and liquid level
The signal output part connection of sensor 3.The lower end of slurry tank 10 is additionally provided with safety relief valve 11, and safety relief valve 11 passes through pipeline
It is communicated with blow-tank 12.The lower end of slurry tank 10 is connected with supporting rack 20.
The silicon wafer cut by diamond wire machine with liquid level sensing device of the present embodiment with slurry tank when in use, due to slurry
Tank 10 is mounted with liquid level sensor 3, and first flowmeter 9 is provided with purified water inlet 2, second is provided with cutting liquid import 6
Gauge 8, can more accurately grasp the proportioning of pure water and cutting liquid, moreover it is possible to understand the storing situation in slurry tank in real time；Pass through electricity
Machine 19 drives shaft 14 and agitating paddle 13 so that the mixing of pure water and cutting liquid is more uniform, also so that in use, cutting
The material cut in liquid does not precipitate, and ensure that the working stability of silicon wafer cut by diamond wire machine；When due to the use of or temperature become
When change causes that pressure is excessive in slurry tank 10, safety relief valve 11 is opened is discharged into blow-tank 12 by material, prevents slurry tank 10 from damaging
Bad and leakage, while prevent from adding when adding water or adding cutting liquid and cause to overflow slurry tank 10.
The utility model is not limited to above-described embodiment.All technical solutions formed using equivalent substitution, all fall within this reality
With the protection domain of new requirement.
Claims (7)
- A kind of 1. silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device, it is characterised in that：Including slurry tank, turn Axis, agitating paddle, motor and liquid level sensor, the shaft are set through the slurry tank lower end vertically, and the agitating paddle is set Part in the shaft in the slurry tank, the motor are arranged on the lower end of the slurry tank, the motor Output shaft is connected by bearing with the shaft, and the liquid level sensor is arranged on the inner upper end of the slurry tank；The slurry The upper end side wall of batch can is provided with purified water inlet and cutting liquid import, and the bottom side of the wall of the slurry tank is provided with discharge port.
- 2. the silicon wafer cut by diamond wire machine slurry tank according to claim 1 with liquid level sensing device, its feature exist In：First flowmeter is provided with the purified water inlet, the cutting liquid entrance is provided with second flowmeter.
- 3. the silicon wafer cut by diamond wire machine slurry tank according to claim 2 with liquid level sensing device, its feature exist In：Inlet valve is additionally provided with the purified water inlet, the cutting liquid entrance is provided with inlet valve.
- 4. the silicon wafer cut by diamond wire machine slurry tank according to claim 3 with liquid level sensing device, its feature exist In：The discharge outlet is provided with outlet valve, and the outlet valve is communicated with booster pump.
- 5. the silicon wafer cut by diamond wire machine slurry tank according to claim 4 with liquid level sensing device, its feature exist In：The slurry tank upper end is provided with end socket, and the end socket upper end is provided with content gauge, and the signal input part of the content gauge leads to Oversampling circuit is connected with the signal output part of the liquid level sensor.
- 6. the silicon wafer cut by diamond wire machine slurry tank according to claim 5 with liquid level sensing device, its feature exist In：The lower end of the slurry tank is additionally provided with safety relief valve, and the safety relief valve has blow-tank by pipeline connection.
- 7. the silicon wafer cut by diamond wire machine slurry tank according to claim 6 with liquid level sensing device, its feature exist In：The lower end of the slurry tank is connected with supporting rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721305622.0U CN207290577U (en) | 2017-10-10 | 2017-10-10 | A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721305622.0U CN207290577U (en) | 2017-10-10 | 2017-10-10 | A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207290577U true CN207290577U (en) | 2018-05-01 |
Family
ID=62413814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721305622.0U Active CN207290577U (en) | 2017-10-10 | 2017-10-10 | A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207290577U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109012289A (en) * | 2018-09-10 | 2018-12-18 | 江苏天泽教育咨询有限公司 | A kind of water treatment agent material high pressure mixing device |
| CN112008903A (en) * | 2020-09-03 | 2020-12-01 | 晶海洋半导体材料（东海）有限公司 | Cutting fluid supply device and silicon wafer cutting equipment |
-
2017
- 2017-10-10 CN CN201721305622.0U patent/CN207290577U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109012289A (en) * | 2018-09-10 | 2018-12-18 | 江苏天泽教育咨询有限公司 | A kind of water treatment agent material high pressure mixing device |
| CN112008903A (en) * | 2020-09-03 | 2020-12-01 | 晶海洋半导体材料（东海）有限公司 | Cutting fluid supply device and silicon wafer cutting equipment |
| CN112008903B (en) * | 2020-09-03 | 2022-07-15 | 晶海洋半导体材料（东海）有限公司 | Cutting fluid supply device and silicon wafer cutting equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207290577U (en) | A kind of silicon wafer cut by diamond wire machine slurry tank with liquid level sensing device | |
| CN208895895U (en) | A kind of chemical-mechanical polisher polishing liquid supplying device | |
| CN101648365A (en) | CMP polishing solution supplying system | |
| CN108079397A (en) | A kind of novel digestive medical is clinical to use Bidirectional-pressure gastric lavage device | |
| CN201940184U (en) | Preparation system of acidizing fluid | |
| CN206033721U (en) | Medicine liqueur production is with wine liquid mixing arrangement | |
| CN207614695U (en) | A kind of diamond wire production sand supply automatically device | |
| CN210448850U (en) | Papermaking auxiliary agent filling device | |
| CN209519760U (en) | Reaction kettle is used in a kind of detection of Western medicine | |
| CN209724309U (en) | A kind of online filling apparatus of slippery water powder drag reducer | |
| CN102824870B (en) | A kind of hydraulic agitation device | |
| CN207748864U (en) | Vacuum jet chemicals dosing plant for urban wastewater treatment firm | |
| CN202012328U (en) | High efficient cement slurry mixing device | |
| CN210068453U (en) | Device for accurately detecting pump parameters | |
| CN207311888U (en) | A kind of pocket type bottle placer with auto spiral capping function | |
| CN207287332U (en) | A kind of integrated detection bulking system | |
| CN206270451U (en) | Movable submersible pump Insulation Test container | |
| CN203577659U (en) | Mixing type liquid blending equipment | |
| CN206199088U (en) | A kind of hydrazine hydrate precision proportioner for extracting palladium | |
| CN206772382U (en) | A kind of device of precisely liquid quantitative | |
| CN207537424U (en) | A kind of auxiliary material addition pump | |
| CN207745784U (en) | A kind of capsule injecting bucket with bottom inflow pipe | |
| CN206051649U (en) | A kind of novel flocculant chemicals dosing plant | |
| CN220116306U (en) | Complete set automatic control medicine adding equipment | |
| CN209502467U (en) | A kind of capillary viscometer cleaning plant |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201218 Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: New materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co., Ltd Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co., Ltd |
|
| CP01 | Change in the name or title of a patent holder |