CN206139072U - Wafer slicer mortar agitating unit - Google Patents
Wafer slicer mortar agitating unit Download PDFInfo
- Publication number
- CN206139072U CN206139072U CN201621074991.9U CN201621074991U CN206139072U CN 206139072 U CN206139072 U CN 206139072U CN 201621074991 U CN201621074991 U CN 201621074991U CN 206139072 U CN206139072 U CN 206139072U
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- Prior art keywords
- shaft
- mixing bowl
- stirring
- silicon chip
- mortar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
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Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621074991.9U CN206139072U (en) | 2016-09-23 | 2016-09-23 | Wafer slicer mortar agitating unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621074991.9U CN206139072U (en) | 2016-09-23 | 2016-09-23 | Wafer slicer mortar agitating unit |
Publications (1)
Publication Number | Publication Date |
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CN206139072U true CN206139072U (en) | 2017-05-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201621074991.9U Active CN206139072U (en) | 2016-09-23 | 2016-09-23 | Wafer slicer mortar agitating unit |
Country Status (1)
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CN (1) | CN206139072U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112008903A (en) * | 2020-09-03 | 2020-12-01 | 晶海洋半导体材料(东海)有限公司 | Cutting fluid supply device and silicon wafer cutting equipment |
-
2016
- 2016-09-23 CN CN201621074991.9U patent/CN206139072U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112008903A (en) * | 2020-09-03 | 2020-12-01 | 晶海洋半导体材料(东海)有限公司 | Cutting fluid supply device and silicon wafer cutting equipment |
CN112008903B (en) * | 2020-09-03 | 2022-07-15 | 晶海洋半导体材料(东海)有限公司 | Cutting fluid supply device and silicon wafer cutting equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201218 Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: GANGLONG Road, Yanjiang Industrial Park, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU MEIKE SILICON ENERGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co.,Ltd. |