CN112004333A - Automatic bonding repair equipment for pins of circuit board - Google Patents
Automatic bonding repair equipment for pins of circuit board Download PDFInfo
- Publication number
- CN112004333A CN112004333A CN202010804684.6A CN202010804684A CN112004333A CN 112004333 A CN112004333 A CN 112004333A CN 202010804684 A CN202010804684 A CN 202010804684A CN 112004333 A CN112004333 A CN 112004333A
- Authority
- CN
- China
- Prior art keywords
- pins
- movably connected
- liquid storage
- storage bag
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to the technical field of circuit board pin repair, and discloses automatic bonding repair equipment for circuit board pins, which comprises a shell, wherein a bearing is movably connected inside the shell, a telescopic rod is movably connected to the surface of the bearing, one end, far away from the bearing, of the telescopic rod is movably connected with a limiting plate, a placing groove is formed inside the limiting plate, a liquid storage bag is fixedly connected to the surface of the placing groove, penetrating blocks are fixedly connected to two sides of the liquid storage bag, one end, far away from the liquid storage bag, of each penetrating block is fixedly connected with a rubber delivery pipe, a compression spring is movably connected to the surface of the liquid storage bag, one end, far away from the liquid storage bag, of each compression spring. When the pins are placed on the surface of the clamping plate, a certain inclination angle is formed between the pins and the clamping plate, so that the pins can be under the action of centrifugal force when the shell rotates, and the effects of gluing and detecting the quality of the pins by utilizing centrifugal force and colloid mobility are achieved.
Description
Technical Field
The invention relates to the technical field of circuit board pin repair, in particular to automatic bonding repair equipment for circuit board pins.
Background
The circuit board has the name: the chip comprises a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board and the like, wherein no matter which circuit board needs pins, the pins are called pins, namely, the pins are led out from an internal circuit of the integrated circuit to be connected with a peripheral circuit, and all the pins form an interface of the chip.
After understanding the manufacturing process of the circuit board, it is found that the pins belong to bent metal articles, and in the installation process, the distance between the two metal rods of the pins is changed due to the working error of mechanical equipment, and the change of the distance can influence the working effect of the pins, so that the automatic bonding and repairing equipment for the pins of the circuit board is produced.
Disclosure of Invention
In order to realize the purposes of centrifugal force gluing, pin quality detection and pin metal rod distance adjustment and repair, the invention provides the following technical scheme: the utility model provides an automatic repair equipment that bonds of circuit board pin, which comprises a housin, the inside swing joint of casing has the bearing, the surperficial swing joint of bearing has the telescopic link, the one end swing joint that the bearing was kept away from to the telescopic link has the limiting plate, the standing groove has been seted up to the inside of limiting plate, the fixed surface of standing groove is connected with the reservoir, the equal fixedly connected with infiltration piece in both sides of reservoir, the one end fixedly connected with rubber delivery pipe of reservoir is kept away from to the infiltration piece, the surperficial swing joint of reservoir has compression spring, compression spring keeps away from the one end swing joint of reservoir has the regulating spindle, the surperficial swing joint of regulating spindle has the connecting rod, the one end swing joint that the regulating spindle was kept away from to the connecting rod.
The invention has the beneficial effects that:
1. the pin to be glued is placed on the surface of the clamping plate, the bearing is rotated by starting the drive, the bearing rotates to drive the shell to rotate, the shell rotates to generate centrifugal force, the rear telescopic rod moves towards the direction far away from the bearing under the action of the centrifugal force, the telescopic rod moves to act on the surface of the liquid storage bag with certain pressure, the colloid inside the rear liquid storage bag under the pressure flows into the rubber delivery pipe from the infiltration block, because the colloid has certain fluidity, the colloid flows in the rubber conveying pipe under the action of centrifugal force and then flows to the surface of the clamping plate through the correcting plate, and meanwhile, when the pins are placed on the surface of the clamping plate, it can form certain inclination with between the grip block, so the casing is at the rotatory in-process, and the pin can receive the effect of centrifugal force, so reached utilize centrifugal force and colloid mobility to carry out the rubber coating and detect the effect of pin quality.
2. The telescopic rod is influenced by centrifugal force and acts on certain force on the surface of the liquid storage bag, the liquid storage bag is pushed while acting on certain force on the surface of the compression spring, the compression spring is stressed and can be changed into an extension state from an original compressed force storage state, the compression spring extends to push the adjusting shaft to move close to the direction of the correcting plate, meanwhile, the adjusting shaft moves to push the connecting rod to move, the back connecting rod drives the two clamping plates to move oppositely on the surface of the sliding rail through the reciprocating rod, the clamping plates move to drive the two metal rods of the pins to deflect, when the metal rods are in a vertical state, included angles do not exist between the metal rods and the clamping plates, the pins can leave the clamping plates under the action of the centrifugal force, and therefore the effect of adjusting and repairing the distances between the metal rods of the pins is achieved.
Preferably, the inside of casing just is located the back of grip block and has seted up the slide rail, and the width of slide rail is the same with the width of reciprocating plate.
Preferably, the interior of the correction plate is provided with a storage groove, and the storage groove is designed in a shape of a Chinese character 'hui'.
Preferably, the surface of the adjusting shaft is movably connected with an elastic shaft, and the elastic shaft is movably connected with the compression spring.
Preferably, the surface of the reciprocating plate is fixedly connected with a bearing plate, and the bearing plate is designed to be arc-shaped.
Preferably, colloid is placed in the liquid storage bag and is in a flowing state.
Drawings
FIG. 1 is a top cross-sectional view of the housing construction of the present invention;
FIG. 2 is a schematic diagram of a clamping plate structure according to the present invention;
FIG. 3 is an enlarged view of a portion A of FIG. 2;
FIG. 4 is a schematic view of a slide rail structure according to the present invention;
fig. 5 is a schematic view of the elastic shaft structure of the present invention.
In the figure: 1. a housing; 2. a bearing; 3. a telescopic rod; 4. a limiting plate; 5. a placement groove; 6. a reservoir; 7. a infiltration block; 8. a rubber delivery pipe; 9. a compression spring; 10. an adjustment shaft; 11. a connecting rod; 12. straightening a plate; 13. a reciprocating plate; 14. a clamping plate; 15. a slide rail; 16. a storage tank; 17. an elastic shaft; 18. a bearing plate;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, an automatic bonding and repairing device for circuit board pins comprises a housing 1, a bearing 2 is movably connected inside the housing 1, a telescopic rod 3 is movably connected to the surface of the bearing 2, a limiting plate 4 is movably connected to one end, away from the bearing 2, of the telescopic rod 3, a placing groove 5 is formed inside the limiting plate 4, a liquid storage bag 6 is fixedly connected to the surface of the placing groove 5, colloid is placed inside the liquid storage bag 6, and the colloid is in a flowing state; the pin to be glued is placed on the surface of the clamping plate 14, then the driving is started to make the bearing 2 rotate, the bearing 2 rotates to drive the shell 1 to rotate, the shell 1 rotates to generate centrifugal force, the rear telescopic rod 3 moves towards the direction far away from the bearing 2 under the action of the centrifugal force, the telescopic rod 3 moves to act on the surface of the liquid storage bag 6 with certain pressure, the colloid inside the rear liquid storage bag 6 under the pressure flows into the rubber delivery pipe 8 from the infiltration block 7, because the colloid has certain fluidity, the colloid flows in the rubber conveying pipe 8 under the action of centrifugal force, then flows to the surface of the clamping plate 14 through the correcting plate 12, and meanwhile, when pins are placed on the surface of the clamping plate 14, which forms a certain angle of inclination with the clamping plate 14, so that during rotation of the housing 1, the pin can receive the effect of centrifugal force, so reached and utilized centrifugal force and colloid mobility to carry out the rubber coating and detect the effect of pin quality.
The two sides of the liquid storage bag 6 are fixedly connected with infiltration blocks 7, one end of each infiltration block 7, which is far away from the liquid storage bag 6, is fixedly connected with a rubber delivery pipe 8, the surface of the liquid storage bag 6 is movably connected with a compression spring 9, a certain force acts on the surface of the liquid storage bag 6 under the influence of centrifugal force through the telescopic rod 3, the liquid storage bag 6 is pushed and simultaneously acts on the surface of the compression spring 9 with a certain force, the compression spring 9 is stressed and can be changed from an original compressed force storage state into an extended state, the compression spring 9 is extended to push the adjusting shaft 10 to move towards the direction close to the correction plate 12, meanwhile, the adjusting shaft 10 moves to push the connecting rod 11 to move, the back connecting rod 11 drives the two clamping plates 14 to move towards each other on the surface of the slide rail 15 through the reciprocating rod 13, the movement of the clamping plates 14 can drive the two metal rods of the pins to deflect, when the metal rods are, therefore, the pins will leave the clamping plate 14 under the action of centrifugal force, thereby achieving the effect of adjusting and repairing the distance of the metal rod of the pins.
One end of the compression spring 9, which is far away from the liquid storage bag 6, is movably connected with an adjusting shaft 10, the surface of the adjusting shaft 10 is movably connected with an elastic shaft 17, and the elastic shaft 17 is movably connected with the compression spring 9; the surface of the adjusting shaft 10 is movably connected with a connecting rod 11, one end of the connecting rod 11, which is far away from the adjusting shaft 10, is movably connected with a correcting plate 12, a storage groove 16 is formed in the correcting plate 12, and the storage groove 16 is designed in a shape of a Chinese character hui; the top of the straightening plate 12 is movably connected with a reciprocating rod 13, and one end of the reciprocating rod 13, which is far away from the straightening plate 12, is movably connected with a clamping plate 14; a slide rail 15 is arranged in the shell 1 and at the back of the clamping plate 14, and the width of the slide rail 15 is the same as that of the reciprocating plate 13; the surface of the reciprocating plate 13 is fixedly connected with a bearing plate 18, and the bearing plate 18 is designed to be arc-shaped.
When the glue applying device is used, pins to be coated with glue are placed on the surface of the clamping plate 14, the bearing 2 is driven to rotate by the rear starting drive, the bearing 2 rotates to drive the shell 1 to rotate, the shell 1 rotates to generate centrifugal force, the rear telescopic rod 3 moves in the direction far away from the bearing 2 under the action of the centrifugal force, the telescopic rod 3 moves to act on the surface of the liquid storage bag 6 under certain pressure, the glue inside the rear liquid storage bag 6 under the pressure flows into the glue conveying pipe 8 from the infiltration block 7, because the colloid has certain fluidity, the colloid flows in the rubber conveying pipe 8 under the action of centrifugal force, then flows to the surface of the clamping plate 14 through the correcting plate 12, and meanwhile, when pins are placed on the surface of the clamping plate 14, which forms a certain angle of inclination with the clamping plate 14, so that during rotation of the housing 1, the pin can receive the effect of centrifugal force, so reached and utilized centrifugal force and colloid mobility to carry out the rubber coating and detect the effect of pin quality.
The telescopic rod 3 is influenced by centrifugal force to act on certain force on the surface of the liquid storage bag 6, the liquid storage bag 6 is pushed while acting on certain force on the surface of the compression spring 9, the compression spring 9 is stressed and can be changed from an original compressed force storage state to an extended state, the compression spring 9 is extended to push the adjusting shaft 10 to move towards the direction close to the correcting plate 12, meanwhile, the adjusting shaft 10 moves to push the connecting rod 11 to move, the back connecting rod 11 drives the two clamping plates 14 to move towards each other on the surface of the sliding rail 15 through the reciprocating rod 13, the clamping plates 14 move to drive the two metal rods of the pins to deflect, when the metal rods are in a vertical state, an included angle does not exist between the metal rods and the clamping plates 14, so that the pins can leave the clamping plates 14 under the action of centrifugal force, and therefore the effect of adjusting and repairing the distances of the metal rods of the pins.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (6)
1. The utility model provides an automatic repair equipment that bonds of circuit board pin, includes casing (1), its characterized in that: the inner part of the shell (1) is movably connected with a bearing (2), the surface of the bearing (2) is movably connected with a telescopic rod (3), one end of the telescopic rod (3) far away from the bearing (2) is movably connected with a limiting plate (4), a placing groove (5) is formed in the limiting plate (4), the surface of the placing groove (5) is fixedly connected with a liquid storage bag (6), two sides of the liquid storage bag (6) are fixedly connected with a penetration block (7), one end of the penetration block (7) far away from the liquid storage bag (6) is fixedly connected with a rubber delivery pipe (8), the surface of the liquid storage bag (6) is movably connected with a compression spring (9), one end of the compression spring (9) far away from the liquid storage bag (6) is movably connected with an adjusting shaft (10), the surface of the adjusting shaft (10) is movably connected with a connecting rod (11), one end of the, the top of the straightening plate (12) is movably connected with a reciprocating rod (13), and one end of the reciprocating rod (13) far away from the straightening plate (12) is movably connected with a clamping plate (14).
2. The automatic bonding repair equipment for the pins of the circuit board according to claim 1, wherein: the inside of casing (1) just is located the back of grip block (14) and has seted up slide rail (15), and the width of slide rail (15) is the same with the width of reciprocating plate (13).
3. The automatic bonding repair equipment for the pins of the circuit board according to claim 1, wherein: a storage groove (16) is formed in the straightening plate (12), and the storage groove (16) is designed in a shape of a Chinese character 'hui'.
4. The automatic bonding repair equipment for the pins of the circuit board according to claim 1, wherein: the surface of the adjusting shaft (10) is movably connected with an elastic shaft (17), and the elastic shaft (17) is movably connected with the compression spring (9).
5. The automatic bonding repair equipment for the pins of the circuit board according to claim 1, wherein: the surface of the reciprocating plate (13) is fixedly connected with a bearing plate (18), and the bearing plate (18) is designed to be arc-shaped.
6. The automatic bonding repair equipment for the pins of the circuit board according to claim 1, wherein: colloid is placed in the liquid storage bag (6), and the colloid is in a flowing state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010804684.6A CN112004333A (en) | 2020-08-12 | 2020-08-12 | Automatic bonding repair equipment for pins of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010804684.6A CN112004333A (en) | 2020-08-12 | 2020-08-12 | Automatic bonding repair equipment for pins of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112004333A true CN112004333A (en) | 2020-11-27 |
Family
ID=73464074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010804684.6A Pending CN112004333A (en) | 2020-08-12 | 2020-08-12 | Automatic bonding repair equipment for pins of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112004333A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112936628A (en) * | 2021-02-18 | 2021-06-11 | 广州缇舒贸易有限公司 | Wafer coating amount and wafer volume adapting equipment for manufacturing environment-friendly chips |
-
2020
- 2020-08-12 CN CN202010804684.6A patent/CN112004333A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112936628A (en) * | 2021-02-18 | 2021-06-11 | 广州缇舒贸易有限公司 | Wafer coating amount and wafer volume adapting equipment for manufacturing environment-friendly chips |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201127 |
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| WD01 | Invention patent application deemed withdrawn after publication |