CN217017209U

CN217017209U - Automatic adhesive deposite device of SMT

Info

Publication number: CN217017209U
Application number: CN202220025502.XU
Authority: CN
Inventors: 王中权
Original assignee: Suzhou Xinming Electronic Technology Co ltd
Current assignee: Suzhou Xinming Electronic Technology Co ltd
Priority date: 2022-01-04
Filing date: 2022-01-04
Publication date: 2022-07-22
Anticipated expiration: 2032-01-04

Abstract

The utility model discloses an SMT automatic glue dispensing device which comprises a device main body, a device frame body, a glue dispenser, a glue dispensing head and a processing table, wherein the device frame body is fixed at the top end of the device main body, a second rotary driving piece is installed at the top end of the device frame body, the glue dispenser is arranged on one side of the device frame body, the glue dispensing head is installed at the bottom end of the glue dispenser, a heating sleeve is sleeved outside the glue dispensing head, a heating cavity is formed in the side wall of the heating sleeve, a heating wire is installed inside the heating cavity, the processing table is fixed at the top end of the device main body below the device main body, an air cavity is formed inside the processing table, and a glue storage barrel is installed on one side of the top end of the device main body. The utility model can prevent the glue solution in the dispensing head from condensing, ensure the normal dispensing operation, facilitate the positioning of the circuit board, effectively prevent the circuit board from deviating during dispensing and facilitate the adjustment of the height of the dispensing head.

Description

Automatic adhesive deposite device of SMT

Technical Field

The utility model relates to the technical field of glue dispensing devices, in particular to an SMT automatic glue dispensing device.

Background

SMT is a surface mount technology (surface mount technology), which is the most popular technology and process in the current electronic assembly industry, and is a circuit connection technology in which surface mount components without pins or short leads (SMC/SMD, chinese called chip components) are mounted on the surface of a printed circuit board or the surface of other substrates and soldered and assembled by means of reflow soldering or dip soldering, and a dispensing device is required to be used in the SMT patch processing process, and the dispensing device adheres SMT electronic components to an integrated circuit board.

The glue dispensing device on the market is various and can basically meet the use requirements of people, but certain shortages still exist, the glue solution in the glue dispensing head of the existing glue dispensing device is easy to condense due to temperature reduction when in use, the condensed glue solution can cause the blockage of the glue dispensing head, the normal operation of the glue dispensing work can be influenced, the work efficiency is reduced, and therefore improvement is needed urgently.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an SMT automatic glue dispensing device, which solves the problem that glue in a glue dispensing head of the glue dispensing device is easy to coagulate in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an automatic adhesive deposite device of SMT, includes device main part, device support body, point gum machine, dispensing head and processing platform, the top in the device main part is fixed to the device support body, just second rotary driving piece is installed on the top of device support body, the dispensing machine sets up the one side at the device support body, the bottom at the dispensing machine is installed to the dispensing head, the outside cover that the head was glued to the point is equipped with the heating jacket, just be provided with the heating chamber in the lateral wall of heating jacket, and the internally mounted in heating chamber has the heating wire, the processing platform is fixed on device main part top of device main part below, just the inside of processing platform is provided with the air cavity, the bucket is glued in storage is installed to one side on device main part top.

Preferably, the bottom of storing up gluey bucket is rotated and is installed the puddler, just all weld on the outer wall of puddler has equidistant stirring rake, is convenient for stir the glue solution, makes it difficult deposit.

Preferably, store up and glue the device main part top of bucket below and install first rotary driving spare, just first rotary driving spare's output extends to the inside of storing up gluey bucket and with the bottom fixed connection of puddler, be convenient for drive puddler and make its rotation.

Preferably, the suction pump is installed on the top of storage glue bucket, just the suction tube is installed to the input of suction pump, and the bottom of suction tube extends to the bottom of storage glue bucket, and the conveyer pipe is installed to the output of suction pump, and the one end and the gluey ware of gluing of conveyer pipe are connected, are convenient for pump the glue solution to the gluey ware of gluing in.

Preferably, one side of the device support body is rotated and is installed the lead screw, the top of lead screw and the output fixed connection of second rotary driving piece, just the cover is equipped with the slide on the outer wall of lead screw, and slide and lead screw threaded connection are convenient for drive point gluer and make it reciprocate.

Preferably, be provided with spacing spout on the outer wall of device support body one side, just the inside of spacing spout is provided with limiting slide block, limiting slide block and spacing spout sliding connection, and limiting slide block's one end and the outer wall fixed connection of slide are convenient for carry on spacingly to the home range of slide.

Preferably, the top end of the processing table is provided with round holes at equal intervals, the round holes are internally provided with suckers, and the suckers are communicated with the air cavity through pipelines so as to conveniently adsorb and position the circuit board.

Preferably, an air pump is installed inside the device body below the processing table, an air exhaust pipe is installed at the input end of the air pump, and the air exhaust pipe is communicated with the air cavity, so that the sucking disc can generate negative pressure suction force conveniently.

Preferably, the top of heating jacket all is fixed with the mounting panel, just the inside of mounting panel is provided with construction bolt, and during construction bolt's one end extended to the inside preformed hole of some glue ware, be convenient for fix the heating jacket.

Compared with the prior art, the utility model has the beneficial effects that: the SMT automatic glue dispensing device can prevent the glue solution in the glue dispensing head from condensing, ensure the normal operation of glue dispensing, facilitate the positioning of a circuit board, effectively prevent the circuit board from deviating during glue dispensing and facilitate the adjustment of the height of the glue dispensing head;

(1) by arranging the heating sleeve, the heating cavity, the heating wire, the mounting plate and the mounting bolt, when the environmental temperature is low, the heating sleeve is electrified, so that the heating wire in the heating cavity is electrified to generate heat and transmit the heat to the dispensing head, and the glue solution in the dispensing head is heated, so that the phenomenon that the glue solution in the dispensing head is condensed can be prevented, the normal dispensing operation is ensured, and the working efficiency is improved;

(2) the air pump is started to pump out air in the air cavity through the air pumping pipe by arranging the circular hole, the sucking disc, the air cavity, the air pump and the air pumping pipe, and negative pressure is formed in the air cavity to enable the sucking disc to tightly adsorb the circuit board, so that the circuit board is conveniently positioned, and the circuit board is effectively prevented from being deviated during dispensing;

(3) through being provided with second rotary driving spare, lead screw, slide, spacing spout, spacing slider, start second rotary driving spare and make its drive lead screw rotatory for the slide drives spacing slider at the inside synchronous motion of spacing spout, and simultaneously, the slide drives the ware of gluing upwards or the downstream, thereby is convenient for adjust the height of gluing the head.

Drawings

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a schematic view of the present invention in partial cross-section;

FIG. 3 is a front view of the processing table of the present invention;

FIG. 4 is a schematic top view of the processing table of the present invention;

fig. 5 is a schematic sectional structure view of the glue storage barrel of the utility model.

In the figure: 1. a device main body; 2. a first rotary drive member; 3. a glue storage barrel; 4. a suction tube; 5. a suction pump; 6. a delivery pipe; 7. a device frame body; 8. a limiting chute; 9. a limiting slide block; 10. a second rotary drive; 11. a screw rod; 12. a slide base; 13. a glue dispenser; 14. dispensing a glue head; 15. a processing table; 16. an air pump; 17. an exhaust pipe; 18. heating a jacket; 19. a heating cavity; 20. an electric heating wire; 21. mounting a plate; 22. installing a bolt; 23. an air cavity; 24. a circular hole; 25. a suction cup; 26. a stirring rod; 27. a stirring paddle.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and all other embodiments obtained by a person of ordinary skill in the art without making creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

Referring to fig. 1-5, an embodiment of the present invention is shown: an SMT automatic glue dispensing device comprises a device main body 1, a device frame body 7, a glue dispenser 13, a glue dispensing head 14 and a processing table 15, wherein the device frame body 7 is fixed at the top end of the device main body 1, and a second rotary driving piece 10 is installed at the top end of the device frame body 7;

a screw rod 11 is rotatably mounted on one side of the device frame body 7, the top end of the screw rod 11 is fixedly connected with the output end of the second rotary driving piece 10, a sliding seat 12 is sleeved on the outer wall of the screw rod 11, and the sliding seat 12 is in threaded connection with the screw rod 11, so that a glue dispenser 13 can be conveniently driven to move up and down;

a limiting sliding groove 8 is formed in the outer wall of one side of the device frame body 7, a limiting sliding block 9 is arranged inside the limiting sliding groove 8, the limiting sliding block 9 is connected with the limiting sliding groove 8 in a sliding mode, and one end of the limiting sliding block 9 is fixedly connected with the outer wall of the sliding seat 12, so that the moving range of the sliding seat 12 can be limited conveniently;

the glue dispenser 13 is arranged at one side of the device frame body 7, and the glue dispensing head 14 is arranged at the bottom end of the glue dispenser 13;

a heating sleeve 18 is sleeved outside the dispensing head 14, a heating cavity 19 is arranged in the side wall of the heating sleeve 18, and an electric heating wire 20 is arranged in the heating cavity 19;

the top end of the heating jacket 18 is fixed with a mounting plate 21, a mounting bolt 22 is arranged inside the mounting plate 21, and one end of the mounting bolt 22 extends into a preformed hole inside the dispenser 13, so that the heating jacket 18 is fixed conveniently;

the processing table 15 is fixed at the top end of the device main body 1 below the device main body 1, an air cavity 23 is arranged in the processing table 15, and a glue storage barrel 3 is arranged on one side of the top end of the device main body 1;

the bottom of the glue storage barrel 3 is rotatably provided with a stirring rod 26, and the outer walls of the stirring rod 26 are welded with stirring paddles 27 at equal intervals, so that glue solution is stirred conveniently and is not easy to deposit;

the top of the device main body 1 below the glue storage barrel 3 is provided with the first rotary driving piece 2, and the output end of the first rotary driving piece 2 extends into the glue storage barrel 3 and is fixedly connected with the bottom end of the stirring rod 26, so that the stirring rod 26 can be driven to rotate conveniently;

a suction pump 5 is installed at the top end of the glue storage barrel 3, a suction pipe 4 is installed at the input end of the suction pump 5, the bottom end of the suction pipe 4 extends to the bottom of the glue storage barrel 3, a delivery pipe 6 is installed at the output end of the suction pump 5, one end of the delivery pipe 6 is connected with a glue dispenser 13, and glue liquid is conveniently pumped into the glue dispenser 13;

the top end of the processing table 15 is provided with round holes 24 with equal intervals, the inside of the round holes 24 is provided with a sucking disc 25, and the sucking disc 25 is communicated with the air cavity 23 through a pipeline, so that the circuit board can be conveniently adsorbed and positioned;

an air pump 16 is arranged in the device body 1 below the processing table 15, an air exhaust pipe 17 is arranged at the input end of the air pump 16, and the air exhaust pipe 17 is communicated with the air cavity 23, so that the suction disc 25 can generate negative pressure suction.

When the embodiment of the application is used: firstly, the circuit board is placed on the surface of a processing platform 15, secondly, an air pump 16 is started to pump out air in an air cavity 23 through an air exhaust pipe 17, negative pressure is formed in the air cavity 23 to enable a sucking disc 25 to tightly suck the circuit board, so that the circuit board is convenient to position and is effectively prevented from shifting during glue dispensing, then, a suction pump 5 is started to enable glue liquid in a glue storage barrel 3 to be pumped out through a suction pipe 4 and to be conveyed into a glue dispenser 13 through a conveying pipe 6, the glue liquid is discharged through a glue dispensing head 14 to perform glue dispensing work, an SMT electronic component is adhered to the circuit board, meanwhile, a first rotary driving piece 2 drives a stirring rod 26 to rotate, the stirring rod 26 drives a stirring paddle 27 to rotate at the bottom of the glue storage barrel 3 to stir the glue liquid in the glue storage barrel 3 at a constant speed, so that the bottom glue liquid is prevented from being deposited and the uniformity of the texture is improved, and, can start the second rotary driving part 10 to make its drive lead screw 11 rotate, make the slide 12 drive the inside synchronous motion of the spacing slider 9 in the spacing spout 8, meanwhile, the slide 12 drives the glue dispenser 13 and moves upwards or downwards, thus it is convenient for adjust the height of the dispensing head 14, when the ambient temperature is lower, energize for the heating jacket 18, make the heating wire 20 inside the heating chamber 19 energize and generate heat and transmit for the dispensing head 14, heat the glue solution inside the dispensing head 14, thus can prevent the glue solution in the dispensing head 14 from appearing the phenomenon of condensing, guarantee the normal clear of the work of dispensing, raise the work efficiency, finish the work of SMT automatic glue-dropping device.

Claims

1. The SMT automatic dispensing device is characterized by comprising a device main body (1), a device frame body (7), a dispensing device (13), a dispensing head (14) and a processing table (15), wherein the device frame body (7) is fixed at the top end of the device main body (1), a second rotary driving piece (10) is installed at the top end of the device frame body (7), the dispensing device (13) is arranged on one side of the device frame body (7), the dispensing head (14) is installed at the bottom end of the dispensing device (13), a heating sleeve (18) is sleeved outside the dispensing head (14), a heating cavity (19) is formed in the side wall of the heating sleeve (18), an electric heating wire (20) is installed inside the heating cavity (19), the processing table (15) is fixed at the top end of the device main body (1) below the device main body (1), an air cavity (23) is formed inside the processing table (15), one side of the top end of the device main body (1) is provided with a glue storage barrel (3).

2. An SMT automatic dispensing device according to claim 1, wherein: store up the bottom of gluing bucket (3) and rotate and install puddler (26), just all weld on the outer wall of puddler (26) has equidistant stirring rake (27).

3. An SMT automatic dispensing device according to claim 2, wherein: store up and glue device main part (1) top of bucket (3) below and install first rotary driving piece (2), just the output of first rotary driving piece (2) extends to the inside of storing up gluey bucket (3) and with the bottom fixed connection of puddler (26).

4. An SMT automatic dispensing device according to claim 1, wherein: store up the top of gluing bucket (3) and install suction pump (5), just suction tube (4) are installed to the input of suction pump (5), and the bottom of suction tube (4) extends to the bottom of storage glue bucket (3), and conveyer pipe (6) are installed to the output of suction pump (5), and the one end and the some glue ware (13) of conveyer pipe (6) are connected.

5. An SMT automatic dispensing device according to claim 1, wherein: one side of the device frame body (7) is rotated to be provided with a screw rod (11), the top end of the screw rod (11) is fixedly connected with the output end of the second rotary driving part (10), a sliding seat (12) is sleeved on the outer wall of the screw rod (11), and the sliding seat (12) is in threaded connection with the screw rod (11).

6. An SMT automatic dispensing device according to claim 5, wherein: the device is characterized in that a limiting sliding groove (8) is formed in the outer wall of one side of the device frame body (7), a limiting sliding block (9) is arranged inside the limiting sliding groove (8), the limiting sliding block (9) is connected with the limiting sliding groove (8) in a sliding mode, and one end of the limiting sliding block (9) is fixedly connected with the outer wall of the sliding seat (12).

7. An SMT automatic dispensing device according to claim 1, wherein: the top end of the processing table (15) is provided with round holes (24) at equal intervals, a sucking disc (25) is arranged inside the round holes (24), and the sucking disc (25) is communicated with the air cavity (23) through a pipeline.

8. An SMT automatic dispensing device according to claim 1, wherein: an air pump (16) is installed inside the device main body (1) below the processing table (15), an air pumping pipe (17) is installed at the input end of the air pump (16), and the air pumping pipe (17) is communicated with the air cavity (23).

9. An SMT automatic dispensing device according to claim 1, wherein: the top of heating jacket (18) all is fixed with mounting panel (21), just the inside of mounting panel (21) is provided with construction bolt (22), and the one end of construction bolt (22) extends to in the inside preformed hole of some glue ware (13).