CN111988922A - Flexible circuit board surface treatment device and treatment method thereof - Google Patents

Flexible circuit board surface treatment device and treatment method thereof Download PDF

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Publication number
CN111988922A
CN111988922A CN202010803290.9A CN202010803290A CN111988922A CN 111988922 A CN111988922 A CN 111988922A CN 202010803290 A CN202010803290 A CN 202010803290A CN 111988922 A CN111988922 A CN 111988922A
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China
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plate
circuit board
groove
leaching
wall
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CN202010803290.9A
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CN111988922B (en
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孙治国
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention discloses a surface treatment device of a flexible circuit board, and simultaneously discloses a treatment method of the surface treatment device of the flexible circuit board, wherein a chute matching slide block and an L-shaped connecting rod fixing support plate are arranged on the side wall of a vertical plate of an L-shaped vertical plate, after a storage groove matching fixing mechanism is arranged at the upper end of the support plate for fixing the circuit board, the support plate is controlled by a fixing plate, a rotating handle and a gear matching rack to move up and down in an extraction liquid in the extraction groove for vibration extraction, the vibration extraction liquid promotes the circuit board to be fully contacted with the circuit board, the extraction efficiency is accelerated, the fixing mechanism is arranged at the edge of the port at the two sides of the upper end of the storage groove, a limit plate is arranged by the matching of a shell, an installation groove, a spring, a movable block and a connecting rod, the circuit board is fixed in the storage groove, and the push-pull rod is used for controlling the movable block to realize the fixation and the release of the limiting plate on the circuit board, so that the operation is simple.

Description

Flexible circuit board surface treatment device and treatment method thereof
Technical Field
The invention relates to the technical field of circuit board processing equipment, in particular to a surface treatment device and a surface treatment method for a flexible circuit board.
Background
Flexible printed circuit boards, also called flexible printed circuit boards and flexible printed circuit boards, are preferred for their excellent characteristics such as light weight, thin thickness and free flexibility. The flexible circuit (FPC) is a technology developed in the United states in the last 70 th century for developing the technology of space rocket, and is a printed circuit which is made of mylar or polyimide as a base material and has high reliability and excellent flexibility. The circuit can be bent at will, is folded, has light weight, small volume, good heat dissipation and convenient installation, and breaks through the traditional interconnection technology. In the structure of the flexible circuit, the constituent materials are an insulating film, a conductor, and an adhesive.
Silver immersion is one of the surface treatment procedures of the circuit board, and submicron-grade pure silver coating is realized through a displacement reaction, so that silver corrosion is prevented, and the problem of silver migration is solved. However, in the conventional apparatus, the circuit board is directly placed in the reaction tank, and the circuit board is taken out from the reaction tank after the surface of the circuit board is coated with silver. The device takes longer time for immersion silver, and the immersion silver efficiency is slower; and the thickness of the silver on the surface of the circuit board is not uniform, which affects the production quality of the circuit board.
Therefore, we propose a surface treatment device for flexible circuit board and a treatment method thereof.
Disclosure of Invention
The invention aims to provide a surface treatment device and a surface treatment method of a flexible circuit board, wherein a sliding groove matching sliding block and an L-shaped connecting rod fixing support plate are arranged on the side wall of a vertical plate of an L-shaped vertical plate, after an object placing groove matching fixing mechanism is arranged at the upper end of the support plate to fix the circuit board, the support plate is controlled to move up and down in leaching liquid in the leaching groove through a fixing plate, a rotating handle and a gear matching rack to carry out vibration leaching, and a motor matching screw rod and a leveling mechanism which rotate forward and backward are arranged at the top of the L-shaped vertical plate to level the leached circuit board, so that the problems in the background are solved.
In order to achieve the purpose, the invention provides the following technical scheme: a surface treatment device for a flexible circuit board comprises a leaching device and a fixing device, wherein the fixing device is arranged at the upper end of the leaching device, the leaching device comprises a base, a leaching groove, a liquid discharge pipe, an L-shaped vertical plate, an air pump, a hanging plate, a guide sliding rod, a leveling mechanism and a sliding groove, the leaching groove is formed in the upper end of the base, a silver ion solution is contained in the leaching groove, the liquid discharge pipe is arranged on the outer wall of one side of the leaching groove and close to the bottom, a manual control valve is arranged at the outlet end of the liquid discharge pipe, the L-shaped vertical plate is arranged at the upper end of the base and close to the edge of a back plate of the base and is arranged adjacent to the leaching groove, the air pump is arranged at the top end of the L-shaped vertical plate, the hanging plate is respectively and fixedly connected to the edges of the two sides of the bottom of the transverse plate of the L-shaped vertical, the inside of the chute is movably connected with a fixing device;
fixing device includes the backup pad, L type connecting rod, the slider, put the thing groove, the small opening, fixed establishment and through-hole, the backplate both ends of backup pad correspond the different fixedly connected with L type connecting rod of spout punishment, the one end that the backup pad was kept away from to L type connecting rod is provided with the slider respectively, and the backup pad passes through the cooperation activity block of L type connecting rod and slider in the spout, and the backup pad suspension is in leaching the inslot, the top of backup pad has evenly been seted up respectively and has been put the thing groove, put the bottom in thing groove and evenly seted up the small opening respectively, fixed establishment symmetry respectively sets up in the port border department of putting thing groove upper end both sides, and the through-hole has.
Further, the cavity has been seted up to the base inside of leaching tank bottom, is close to leaching tank bottom department between the both sides inner wall of cavity and evenly is provided with constant temperature heating pipe respectively, and constant temperature heating pipe presses close to leaching tank bottom and sets up, and is provided with temperature sensor on the leaching tank is close to one side inner wall of bottom department, and temperature sensor and constant temperature heating pipe all pass through electric connection between the controller terminal that sets up on wire and the positive outer wall of base.
Further, leveling mechanism includes flow equalizing plate, mounting panel, mounting hole, screw hole and gas hose, and the upper end fixedly connected with mounting panel that flows equalizing plate, the mounting hole has been seted up respectively at the lateral wall both ends of mounting panel, and the mounting panel cup joints on the outer wall of direction slide bar through the mounting hole activity, sets up screw hole on the mounting panel lateral wall between the mounting hole, and the screw hole is located the lateral wall middle part department of mounting panel, and gas hose's one end is linked together with flow equalizing plate, and the other end is fixed with the output end of air pump and links to each other.
Furthermore, the flow equalizing plate is of a hollow structure, air outlets are respectively and evenly arranged on the outer wall of one side of the flow equalizing plate close to the bottom at intervals, the air outlets correspond to the storage grooves respectively and are obliquely and downwardly inclined, an L-shaped scraper is arranged on the side wall of the flow equalizing plate at the upper end of the air outlets, and the lower end face of the L-shaped scraper extends to the lower end of the flow equalizing plate and is flush with the lower end face of the port of the air outlets.
Furthermore, a motor is installed on the outer wall of one side of the hanging plate corresponding to the threaded hole, the motor is a forward-reverse rotation asynchronous motor with the model number of 5RK60GU-CF, a transmission shaft of the motor penetrates through the side wall of the hanging plate and extends to the other side of the hanging plate, the tail end of the transmission shaft is fixedly connected with one end of the screw rod through a coupler, and the other end of the screw rod is in threaded sleeve connection with the inside of the threaded hole in the side wall of the installing plate.
Furthermore, a fixing plate is arranged at the edge of the upper end of the base on one side of the leaching groove, the fixing plate is arranged at a corner of the leaching groove close to one side of the L-shaped vertical plate, a rotating handle penetrates through the side wall of the fixing plate, and a gear is arranged at the tail end of one end, close to the leaching groove, of the rotating handle.
Furthermore, an electromagnet is embedded in the side wall of the vertical plate of the L-shaped vertical plate, a series circuit is formed between the electromagnet and the controller terminal through a lead, an external power supply of the series circuit is connected with the electromagnet, the controller terminal controls the magnetic force of the electromagnet by controlling the on-off of a circuit of the electromagnet, and the electromagnet attracts and fixes the support plate through the magnetic force.
Furthermore, a metal block is embedded at the position, corresponding to the electromagnet, of the back plate of the supporting plate, the metal block is matched with the electromagnet to attract and fix the supporting plate, an integrated rack is arranged on one side, close to the fixing plate, of the back plate of the supporting plate, and the rack is meshed with the gear.
Further, fixed establishment includes the casing, the mounting groove, a spring, the movable block, the connecting rod, the limiting plate, intercommunicating pore and push-and-pull rod, the mounting groove has been seted up to the inside of casing, the mounting groove is kept away from and is put the inner wall of thing groove one end and the one end stationary phase of spring and link to each other, the other end fixed connection movable block of spring, movable block and mounting groove inner chamber, and the movable block is kept away from and is provided with the connecting rod on the one end outer wall of spring respectively, the one end that the movable block was kept away from to the connecting rod all runs through the lateral wall of mounting groove and extends to its outside, and terminal fixedly connected with limiting plate, the intercommunicating pore is seted up and is.
The invention provides another technical scheme that: a processing method of a surface processing device of a flexible circuit board comprises the following steps:
s1: placing the circuit board to be processed in the object placing groove at the upper end of the supporting plate in sequence, shifting the push-pull rod to compress the spring by using the movable block, and after the circuit board is placed in the object placing groove, loosening the push-pull rod to push the limiting plates to the edges of the two sides of the upper end of the circuit board respectively by using the elastic force of the spring to match the movable block and the connecting rod to fix;
s2: rotating the rotating handle, and driving the supporting plate to move by matching a gear at the tail end of the rotating handle with a rack on a back plate of the supporting plate, so that a circuit board in the storage groove at the upper end of the supporting plate moves up and down in the silver ion solution in the leaching groove, and the silver ion solution is driven to vibrate;
s3: after a layer of silver is plated on the surface of the circuit board, the rotating handle is rotated to drive the supporting plate to move upwards to the upper end of the liquid level of the silver ion solution in the leaching groove, and the supporting plate is continuously moved upwards to the electromagnet on the side wall of the L-shaped vertical plate after the solution on the circuit board is dripped at a constant speed;
s4, controlling the electromagnet to be electrified through the controller terminal to obtain magnetic force, fixing the electromagnet by adsorbing metal blocks embedded on the back plate of the supporting plate through the magnetic force, and respectively starting the air pump and the motor in sequence after the supporting plate is fixed;
s5: the air pump conveys air into the flow equalizing plate through the air conveying hose, blows out the air from the air outlet and blows the silver layer on the surface of the circuit board to be leveled, meanwhile, the motor rotates in the forward and reverse directions, and the flow equalizing plate and the mounting plate are driven by the screw rod to slide left and right on the outer wall of the guide slide rod to scrape the silver layer on the surface of the circuit board;
s6: after the silver layer on the surface of the circuit board is strickleed off, the air pump and the motor are closed, the supporting plate is lowered, and the circuit board in the article placing groove at the upper end of the supporting plate is taken down.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention provides a surface treatment device and a surface treatment method of a flexible circuit board.
2. The invention provides a surface treatment device and a surface treatment method for a flexible circuit board.
3. The invention provides a surface treatment device and a treatment method of a flexible circuit board, wherein a positive and negative rotating motor is arranged on one side of the top of an L-shaped vertical plate and matched with a screw rod and a leveling mechanism to level the leached circuit board, a flow equalizing plate slides left and right on the outer wall of a guide slide rod under the drive of a mounting plate, a mounting hole, a threaded hole, the motor and the screw rod, the flow equalizing plate is communicated with an air pump through an air conveying hose to supply air and blow the surface of the leached circuit board through an air outlet, and an L-shaped scraper blade outside the air outlet scrapes the surface of the circuit board, so that the flatness and the uniformity of the surface of the circuit board are fully ensured, and the production quality of products.
Drawings
FIG. 1 is a schematic view of the overall structure of a surface treatment apparatus for a flexible circuit board according to the present invention;
FIG. 2 is a view showing a state in which a fixing device of the surface treatment apparatus for a flexible circuit board according to the present invention is lifted;
FIG. 3 is a schematic diagram of the leaching apparatus of the surface treatment apparatus for flexible circuit boards according to the present invention;
FIG. 4 is a cross-sectional view of a base of the flexible circuit board surface treatment apparatus of the present invention;
FIG. 5 is a schematic view of a leveling mechanism of the surface treatment apparatus for a flexible printed circuit board according to the present invention;
FIG. 6 is a schematic view of a fixing device of the surface treatment device for a flexible circuit board according to the present invention;
FIG. 7 is an enlarged view of the fixture A of the surface treatment apparatus for a flexible circuit board according to the present invention;
FIG. 8 is a schematic structural view of a fixing mechanism of the surface treatment apparatus for a flexible circuit board according to the present invention;
fig. 9 is a sectional view of a fixing mechanism of the surface treatment apparatus for a flexible circuit board of the present invention.
In the figure: 1. leaching device; 11. a base; 12. leaching tank; 13. a liquid discharge pipe; 14. an L-shaped vertical plate; 15. an air pump; 16. a hanger plate; 17. a guide slide bar; 18. a leveling mechanism; 181. a flow equalizing plate; 182. mounting a plate; 183. mounting holes; 184. a threaded hole; 185. a gas hose; 186. an air outlet; 187. an L-shaped scraper plate; 19. a chute; 110. a cavity; 111. a constant temperature heating pipe; 112. a temperature sensor; 113. a controller terminal; 114. a motor; 115. a screw; 116. a fixing plate; 117. rotating the handle; 118. a gear; 119. an electromagnet; 2. a fixing device; 21. a support plate; 22. an L-shaped connecting rod; 23. a slider; 24. a storage groove; 25. a leak hole; 26. a fixing mechanism; 261. a housing; 262. mounting grooves; 263. a spring; 264. a movable block; 265. a connecting rod; 266. a limiting plate; 267. a communicating hole; 268. a push-pull rod; 27. a through hole; 28. a rack.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1-4, a surface treatment device for a flexible circuit board comprises a leaching device 1 and a fixing device 2, wherein the fixing device 2 is installed at the upper end of the leaching device 1, the leaching device 1 comprises a base 11, a leaching tank 12, a liquid discharge pipe 13, an L-shaped vertical plate 14, an air pump 15, a hanging plate 16, a guide slide bar 17, a leveling mechanism 18 and a chute 19, the leaching tank 12 is opened at the upper end of the base 11, a silver ion solution is contained in the leaching tank 12, the liquid discharge pipe 13 is arranged on the outer wall of one side of the leaching tank 12 near the bottom, a manual control valve is arranged at the outlet end of the liquid discharge pipe 13, the L-shaped vertical plate 14 is arranged at the upper end of the base 11 near the edge of the back plate and is adjacent to the leaching tank 12, the air pump 15 is installed at the top end of the L-shaped vertical plate 14, the hanging plates 16 are respectively and fixedly connected to the edges of, the leveling mechanism 18 is movably sleeved on the outer wall of the guide slide bar 17, the sliding grooves 19 are respectively arranged on the side walls of the vertical plates of the L-shaped vertical plate 14 in parallel, and the sliding grooves 19 are internally and movably connected with the fixing device 2.
A cavity 110 is formed in the base 11 at the bottom of the leaching tank 12, constant temperature heating pipes 111 are respectively and uniformly arranged between the inner walls of the two sides of the cavity 110 and close to the bottom of the leaching tank 12, the constant temperature heating pipes 111 are arranged close to the bottom of the leaching tank 12, a temperature sensor 112 is arranged on the inner wall of one side of the leaching tank 12 close to the bottom, and the temperature sensor 112 and the constant temperature heating pipes 111 are electrically connected with a controller terminal 113 arranged on the outer wall of the front side of the base 11 through leads; the edge of the upper end of the base 11 on one side of the leaching tank 12 is provided with a fixing plate 116, the fixing plate 116 is arranged at the corner of the leaching tank 12 close to one side of the L-shaped vertical plate 14, the side wall of the fixing plate 116 is provided with a rotating handle 117 in a penetrating manner, the tail end of one end of the rotating handle 117 close to the leaching tank 12 is provided with a gear 118, the fixing plate 116, the rotating handle 117 and the gear 118 are matched with the rack 28 to control the support plate 21 to move up and down in leaching solution in the leaching tank 12 for vibration leaching, the leaching solution is vibrated to promote full contact with a circuit board, and the leaching; an electromagnet 119 is embedded and mounted on the vertical plate side wall of the L-shaped vertical plate 14, a series circuit is formed between the electromagnet 119 and the controller terminal 113 through a lead, an external power supply of the series circuit is connected, the controller terminal 113 controls the magnetic force of the electromagnet 119 through controlling the on-off of the circuit, and the electromagnet 119 attracts and fixes the supporting plate 21 through the magnetic force, so that the stability of the leveling mechanism 18 in leveling the surface of the circuit board is ensured.
Example two
Referring to fig. 3 and 5, a flexible circuit board surface processing apparatus, a leveling mechanism 18 includes a flow equalizing plate 181, mounting plates 182, mounting holes 183, threaded holes 184 and a gas hose 185, the upper end of the flow equalizing plate 181 is fixedly connected with the mounting plate 182, two ends of a side wall of the mounting plate 182 are respectively provided with the mounting holes 183, the mounting plate 182 is movably sleeved on an outer wall of a guide slide bar 17 through the mounting holes 183, the side wall of the mounting plate 182 between the mounting holes 183 is provided with the threaded holes 184, the threaded holes 184 are located at a middle portion of the side wall of the mounting plate 182, one end of the gas hose 185 is communicated with the flow equalizing plate 181, the other end is fixedly connected with an output end of an air pump 15, the flow equalizing plate 181 is of a hollow structure, and air outlets 186 are respectively uniformly spaced on an outer wall of one side of the flow equalizing plate 181 near a bottom portion, the air outlets 186 are respectively corresponding to the object placing, the lower end surface of the L-shaped scraper 187 extends to the lower end of the flow equalizing plate 181 and is flush with the lower end surface at the port of the air outlet 186.
The outer wall of one side of the hanging plate 16 is provided with a motor 114 corresponding to the threaded hole 184, the motor 114 is a positive and negative rotation asynchronous motor, which is 5RK60GU-CF, and the driving shaft of the motor 114 penetrates the side wall of the hanger plate 16 and extends to the other side thereof, the tail end of the screw 115 is fixedly connected with one end of the screw 115 through a coupler, the other end of the screw 115 is in threaded sleeve connection with the inside of a threaded hole 184 on the side wall of the mounting plate 182, the flow equalizing plate 181 slides left and right on the outer wall of the guide slide bar 17 under the driving of the mounting plate 182, the mounting hole 183, the threaded hole 184, the motor 114 and the screw 115, the flow equalizing plate 181 is communicated with an air pump 15 through an air conveying hose 185 to supply air, and blows the surface of the leached circuit board flat through an air outlet 186, meanwhile, the L-shaped scraper 187 outside the air outlet 186 scrapes the surface of the circuit board, so that the flatness and the uniformity of the surface of the circuit board are fully ensured, and the production quality of the product is improved.
EXAMPLE III
Referring to fig. 6-7, a flexible circuit board surface treatment device, the fixing device 2 includes a supporting plate 21, L-shaped connecting rods 22, sliders 23, object placing grooves 24, leaking holes 25, fixing mechanisms 26 and through holes 27, the two ends of the back plate of the supporting plate 21 are respectively and fixedly connected with the L-shaped connecting rods 22 corresponding to the sliding grooves 19, the ends of the L-shaped connecting rods 22 far away from the supporting plate 21 are respectively provided with the sliders 23, the supporting plate 21 is movably clamped in the sliding grooves 19 through the matching of the L-shaped connecting rods 22 and the sliders 23, the supporting plate 21 is suspended in the leaching groove 12, the top of the supporting plate 21 is respectively and uniformly provided with the object placing grooves 24, the bottom of the object placing grooves 24 is respectively and uniformly provided with the leaking holes 25, the fixing mechanisms 26 are respectively and symmetrically arranged at the edge of the two sides of the upper end of the object placing.
A metal block is embedded in the position, corresponding to the electromagnet 119, of the back plate of the support plate 21, the metal block is matched with the electromagnet 119 to attract and fix the support plate 21, an integrated rack 28 is arranged on one side, close to the fixing plate 116, of the back plate of the support plate 21, and the rack 28 is meshed with the gear 118.
Example four
Referring to fig. 7, 8 and 9, a flexible circuit board surface processing apparatus includes a housing 261, a mounting groove 262, a spring 263, a movable block 264, a connecting rod 265, a limiting plate 266, a communicating hole 267 and a push-pull rod 268, wherein the housing 261 is provided with the mounting groove 262 therein, an inner wall of the mounting groove 262 far from one end of the object placing groove 24 is fixedly connected with one end of the spring 263, the other end of the spring 263 is fixedly connected with the movable block 264, the movable block 264 is engaged with an inner cavity of the mounting groove 262, the outer walls of the movable block 264 far from one end of the spring 263 are respectively provided with the connecting rod 265, one end of the connecting rod 265 far from the movable block 264 penetrates through the side wall of the mounting groove 262 and extends to the outside thereof, the end is fixedly connected with the limiting plate 266, the communicating hole 267 is formed at the upper end of the housing 261 corresponding to the movable block 264, the upper end of the movable, the circuit board is fixed in the storage groove 24 by the limiting plate 266, so that the circuit board is prevented from being separated from the storage groove 24 during vibration leaching, the fixing stability of the circuit board is ensured, the upper end of the shell 261 is provided with the communication hole 267, the upper end of the movable block 264 is provided with the push-pull rod 268, the movable block 264 is controlled by the push-pull rod 268, the fixing and the releasing of the limiting plate 266 on the circuit board are realized, and the operation is simple.
In order to better show the surface treatment device of the flexible circuit board, the embodiment now proposes a treatment method of the surface treatment device of the flexible circuit board, which comprises the following steps:
the method comprises the following steps: the circuit boards to be processed are sequentially placed in the object placing groove 24 at the upper end of the supporting plate 21, the push-pull rod 268 is pulled to compress the spring 263 through the movable block 264, and after the circuit boards are placed in the object placing groove 24, the push-pull rod 268 is loosened to push the limiting plates 266 to the edges of the two sides of the upper end of the circuit boards respectively to be fixed through the cooperation of the elastic force of the spring 263 and the movable block 264 and the connecting rod 265;
step two: the handle 117 is rotated and rotated, the gear 118 at the tail end of the handle cooperates with the rack 28 on the back plate of the support plate 21 to drive the support plate 21 to move, so that the circuit board in the storage groove 24 at the upper end of the support plate 21 moves up and down in the silver ion solution in the leaching groove 12, and the silver ion solution is driven to vibrate;
step three: after a layer of silver is plated on the surface of the circuit board, the rotating handle 117 is rotated to drive the support plate 21 to move upwards to the upper end of the liquid level of the silver ion solution in the leaching tank 12, and the support plate 21 is continuously moved upwards to the electromagnet 119 on the side wall of the L-shaped vertical plate 14 after the solution on the circuit board is dripped at a constant speed;
step four: the electromagnet 119 is controlled to be electrified through the controller terminal 113 to obtain magnetic force, the electromagnet 119 adsorbs metal blocks embedded on the back plate of the supporting plate 21 by utilizing the magnetic force to fix the metal blocks, and after the supporting plate 21 is fixed, the air pump 15 and the motor 114 are respectively and sequentially started;
step five: the air pump 15 delivers air into the flow equalizing plate 181 through the air delivery hose 185, blows out the air through the air outlet 186 and blows out the silver layer on the surface of the circuit board to be leveled, meanwhile, the motor 114 rotates in the forward and reverse directions, and the screw 115 is matched to drive the flow equalizing plate 181 and the mounting plate 182 to slide left and right on the outer wall of the guide slide bar 17, so as to scrape the silver layer on the surface of the circuit board;
step six: after the silver layer on the surface of the circuit board is scraped, the air pump 15 and the motor 114 are closed, the support plate 21 is lowered, and the circuit board in the storage groove 24 at the upper end of the support plate 21 is taken down.
In summary, the following steps: the invention provides a surface treatment device and a treatment method of a flexible circuit board, wherein a chute 19 matched with a slide block 23 and an L-shaped connecting rod 22 is arranged on the side wall of a vertical plate 14 of an L-shaped vertical plate to fix a support plate 21, an article placing groove 24 is arranged at the upper end of the support plate 21 matched with a fixing mechanism 26 to fix the circuit board, and the support plate 21 is controlled to move up and down in leaching solution in a leaching groove 12 by a fixing plate 116, a rotating handle 117 and a gear 118 matched with a rack 28 to carry out vibration leaching, and the leaching solution is vibrated to promote the full contact with the circuit board, thereby accelerating the leaching efficiency; the fixing mechanisms 26 are arranged at the edge of the end openings at two sides of the upper end of the object placing groove 24, the limit plates 266 are arranged by matching the shell 261, the mounting groove 262, the spring 263, the movable block 264 and the connecting rod 265, the circuit board is fixed in the object placing groove 24 by using the limit plates 266, the circuit board is prevented from being separated from the object placing groove 24 during vibration leaching, the fixing stability of the circuit board is ensured, the communication hole 267 is formed in the upper end of the shell 261, the push-pull rod 268 is arranged at the upper end of the movable block 264, the movable block 264 is controlled by using the push-pull rod 268 to fix and release the circuit; a motor 114 which rotates forwards and backwards is arranged on one side of the top of the L-shaped vertical plate 14 and matched with a screw 115 and a leveling mechanism 18 to level the leached circuit board, a flow equalizing plate 181 slides left and right on the outer wall of the guide slide bar 17 under the driving of the mounting plate 182, the mounting hole 183, the threaded hole 184, the motor 114 and the screw 115, the flow equalizing plate 181 is communicated with an air pump 15 through an air conveying hose 185 to supply air and blow the surface of the leached circuit board through an air outlet 186, and meanwhile, an L-shaped scraper 187 outside the air outlet 186 scrapes the surface of the circuit board, so that the flatness and the uniformity of the surface of the circuit board are fully ensured, and the production quality of products is.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. The surface treatment device for the flexible circuit board comprises a leaching device (1) and a fixing device (2), wherein the fixing device (2) is arranged at the upper end of the leaching device (1), and is characterized in that: the leaching device (1) comprises a base (11), a leaching groove (12), a liquid discharge pipe (13), an L-shaped vertical plate (14), an air pump (15), a hanging plate (16), a guide slide rod (17), a leveling mechanism (18) and a sliding groove (19), wherein the leaching groove (12) is formed in the upper end of the base (11), a silver ion solution is contained in the leaching groove (12), the liquid discharge pipe (13) is arranged on the outer wall of one side of the leaching groove (12) and close to the bottom, a manual control valve is arranged at the outlet end of the liquid discharge pipe (13), the L-shaped vertical plate (14) is arranged at the upper end of the base (11) and close to the edge of the back plate of the base and is adjacent to the leaching groove (12), the air pump (15) is installed at the top end of the L-shaped vertical plate (14), the hanging plate (16) is respectively and fixedly connected to the edges of two sides of the bottom of the transverse plate, the leveling mechanism (18) is movably sleeved on the outer wall of the guide sliding rod (17), the sliding chutes (19) are respectively arranged on the side walls of the vertical plates of the L-shaped vertical plate (14) in parallel, and the sliding chutes (19) are movably connected with the fixing devices (2);
the fixing device (2) comprises a supporting plate (21), L-shaped connecting rods (22), sliding blocks (23), storage grooves (24), leakage holes (25), a fixing mechanism (26) and through holes (27), the L-shaped connecting rods (22) are fixedly connected to the two ends of the back plate of the supporting plate (21) corresponding to the sliding grooves (19), the sliding blocks (23) are arranged at the ends, far away from the supporting plate (21), of the L-shaped connecting rods (22), and the supporting plate (21) is movably clamped in the sliding groove (19) through the matching of the L-shaped connecting rod (22) and the sliding block (23), the supporting plate (21) is suspended in the leaching tank (12), the top of the supporting plate (21) is respectively and uniformly provided with an article placing tank (24), the bottom of the article placing tank (24) is respectively and uniformly provided with a leak hole (25), the fixing mechanisms (26) are respectively and symmetrically arranged at the edge of the port at the two sides of the upper end of the article placing tank (24), and the upper ends of the supporting plates (21) among the fixing mechanisms (26) are respectively and uniformly provided with through holes (27).
2. A flexible circuit board surface treatment apparatus according to claim 1, wherein: the temperature control device is characterized in that a cavity (110) is formed in the base (11) at the bottom of the leaching groove (12), constant-temperature heating pipes (111) are uniformly arranged on the inner walls of the two sides of the cavity (110) close to the bottom of the leaching groove (12), the constant-temperature heating pipes (111) are arranged close to the bottom of the leaching groove (12), a temperature sensor (112) is arranged on the inner wall of one side of the leaching groove (12) close to the bottom, and the temperature sensor (112) and the constant-temperature heating pipes (111) are electrically connected with a controller terminal (113) arranged on the outer wall of the front side of the base (11) through leads.
3. A flexible circuit board surface treatment apparatus according to claim 1, wherein: leveling mechanism (18) are including flow equalizing plate (181), mounting panel (182), mounting hole (183), screw hole (184) and gas transmission hose (185), the upper end fixedly connected with mounting panel (182) of flow equalizing plate (181), mounting hole (183) have been seted up respectively to the lateral wall both ends of mounting panel (182), and mounting panel (182) through mounting hole (183) activity cup joint on the outer wall of direction slide bar (17), screw hole (184) have been seted up on mounting panel (182) lateral wall between mounting hole (183), screw hole (184) are located the lateral wall middle part department of mounting panel (182), the one end of gas transmission hose (185) is linked together with flow equalizing plate (181), the other end is fixed with the output end of air pump (15) and is linked to each other.
4. A flexible circuit board surface treatment apparatus according to claim 3, wherein: the flow equalizing plate (181) is of a hollow structure, air outlets (186) are respectively and evenly arranged on the outer wall of one side of the flow equalizing plate (181) close to the bottom at intervals, the air outlets (186) are respectively corresponding to the storage grooves (24) and are obliquely and downwardly inclined, L-shaped scrapers (187) are arranged on the side wall of the flow equalizing plate (181) at the upper end of the air outlets (186), and the lower end faces of the L-shaped scrapers (187) extend to the lower end of the flow equalizing plate (181) and are flush with the lower end faces of the ports of the air outlets (186).
5. A flexible circuit board surface treatment apparatus according to claim 1, wherein: the motor (114) is installed on the outer wall of one side of the hanging plate (16) corresponding to the threaded hole (184), the motor (114) is a forward-reverse rotation asynchronous motor with the model number of 5RK60GU-CF, a transmission shaft of the motor (114) penetrates through the side wall of the hanging plate (16) and extends to the other side of the hanging plate, the tail end of the transmission shaft is fixedly connected with one end of the screw rod (115) through a coupler, and the other end of the screw rod (115) is sleeved inside the threaded hole (184) in the side wall of the mounting plate (182).
6. A flexible circuit board surface treatment apparatus according to claim 1, wherein: the fixing plate (116) is arranged at the edge of the upper end of the base (11) on one side of the leaching groove (12), the fixing plate (116) is arranged at the corner of the leaching groove (12) close to one side of the L-shaped vertical plate (14), the side wall of the fixing plate (116) is provided with a rotating handle (117) in a penetrating mode, and the tail end of one end, close to the leaching groove (12), of the rotating handle (117) is provided with a gear (118).
7. A flexible circuit board surface treatment apparatus according to claim 1, wherein: an electromagnet (119) is embedded and installed on the side wall of the vertical plate of the L-shaped vertical plate (14), a series circuit is formed between the electromagnet (119) and the controller terminal (113) through a lead, an external power supply of the series circuit is connected, the controller terminal (113) controls the magnetic force of the electromagnet (119) through controlling the on-off of the circuit, and the electromagnet (119) attracts and fixes the support plate (21) through the magnetic force.
8. A flexible circuit board surface treatment apparatus according to claim 1, wherein: the metal block is embedded in the position, corresponding to the electromagnet (119), of the back plate of the supporting plate (21), the metal block is matched with the electromagnet (119) to attract and fix the supporting plate (21), an integrated rack (28) is arranged on one side, close to the fixing plate (116), of the back plate of the supporting plate (21), and the rack (28) is meshed with the gear (118).
9. A flexible circuit board surface treatment apparatus according to claim 1, wherein: the fixing mechanism (26) comprises a shell (261), a mounting groove (262), a spring (263), a movable block (264), a connecting rod (265), a limiting plate (266), a communication hole (267) and a push-pull rod (268), wherein the mounting groove (262) is formed in the shell (261), the inner wall of one end, away from the object placing groove (24), of the mounting groove (262) is fixedly connected with one end of the spring (263), the other end of the spring (263) is fixedly connected with the movable block (264), the movable block (264) is clamped with the inner cavity of the mounting groove (262), the outer wall of one end, away from the spring (263), of the movable block (264) is respectively provided with the connecting rod (265), one end, away from the movable block (264), of the connecting rod (265) penetrates through the side wall of the mounting groove (262) and extends to the outside of the mounting groove, the tail end of the connecting rod (264) is fixedly connected with, and the upper end of the movable block (264) is fixedly connected with a push-pull rod (268), and the push-pull rod (268) extends to the outside through the communication hole (267).
10. A method of processing the surface treatment device of the flexible circuit board according to any one of claims 1 to 9, comprising the steps of:
s1: the circuit boards to be processed are sequentially placed in the object placing groove (24) at the upper end of the supporting plate (21), the push-pull rod (268) is pulled to compress the spring (263) through the movable block (264), and after the circuit boards are placed in the object placing groove (24), the limit plate (266) is pushed to the edges of the two sides of the upper end of the circuit boards to be fixed respectively by loosening the push-pull rod (268) and utilizing the elastic force of the spring (263) to match the movable block (264) and the connecting rod (265);
s2: the handle (117) is rotated, and the gear (118) at the tail end of the handle is matched with the rack (28) on the back plate of the support plate (21) to drive the support plate (21) to move, so that the circuit board in the storage groove (24) at the upper end of the support plate (21) moves up and down in the silver ion solution in the leaching groove (12) to drive the silver ion solution to vibrate;
s3: after a layer of silver is plated on the surface of the circuit board, the rotating handle (117) rotates to drive the support plate (21) to move upwards to the upper end of the liquid level of the silver ion solution in the leaching tank (12), and after the solution on the circuit board drops at a constant speed, the support plate (21) is continuously moved upwards to the electromagnet (119) on the side wall of the L-shaped vertical plate (14);
s4: the electromagnet (119) is controlled to be electrified through the controller terminal (113) to obtain magnetic force, the electromagnet (119) adsorbs a metal block embedded on the back plate of the supporting plate (21) by utilizing the magnetic force to fix the metal block, and after the supporting plate (21) is fixed, the air pump (15) and the motor (114) are respectively and sequentially started;
s5: the air pump (15) conveys air into the flow equalizing plate (181) through the air conveying hose (185), the air is blown out through the air outlet (186) and then blown flat on the silver layer on the surface of the circuit board to be treated, meanwhile, the motor (114) rotates in the forward and reverse directions, the flow equalizing plate (181) and the mounting plate (182) are driven by the matching screw rod (115) to slide left and right on the outer wall of the guide slide rod (17), and the silver layer on the surface of the circuit board is scraped flat;
s6: after the silver layer on the surface of the circuit board is strickleed off, the air pump (15) and the motor (114) are closed, the supporting plate (21) is lowered, and the circuit board in the storage groove (24) at the upper end of the supporting plate (21) is taken down.
CN202010803290.9A 2020-08-11 2020-08-11 Flexible circuit board surface treatment device and treatment method thereof Active CN111988922B (en)

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Publication number Priority date Publication date Assignee Title
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
CN204069515U (en) * 2014-09-22 2014-12-31 国茂(浙江)科技有限公司 A kind of pcb board sinks copper equipment
CN207193414U (en) * 2017-07-21 2018-04-06 何起峰 A kind of device for preparing porous anodic aluminium oxide
CN110408979A (en) * 2019-07-15 2019-11-05 安徽中运智能科技有限公司 A kind of auto parts and components electroplating mold
CN210711810U (en) * 2019-09-10 2020-06-09 扬州市景杨表面工程有限公司 Auxiliary positioning device for electroplating of aluminum alloy product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
CN204069515U (en) * 2014-09-22 2014-12-31 国茂(浙江)科技有限公司 A kind of pcb board sinks copper equipment
CN207193414U (en) * 2017-07-21 2018-04-06 何起峰 A kind of device for preparing porous anodic aluminium oxide
CN110408979A (en) * 2019-07-15 2019-11-05 安徽中运智能科技有限公司 A kind of auto parts and components electroplating mold
CN210711810U (en) * 2019-09-10 2020-06-09 扬州市景杨表面工程有限公司 Auxiliary positioning device for electroplating of aluminum alloy product

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