CN213680960U

CN213680960U - Temperature control type electroplating equipment

Info

Publication number: CN213680960U
Application number: CN202022323229.2U
Authority: CN
Inventors: 梁业富
Original assignee: Qingdao Guangye Surface Treatment Co ltd
Current assignee: Qingdao Guangye Surface Treatment Co ltd
Priority date: 2020-10-16
Filing date: 2020-10-16
Publication date: 2021-07-13
Anticipated expiration: 2030-10-16

Abstract

The utility model discloses a control by temperature change formula electroplating device, comprises an operation bench, two backup pads of lateral wall fixedly connected with on the operation panel, two the common fixedly connected with diaphragm of the relative lateral wall of backup pad, two risers of lateral wall fixedly connected with under the diaphragm, the common fixedly connected with fixed plate of lateral wall under two risers, head is electroplated to lateral wall fixedly connected with under the fixed plate, the lateral wall is equipped with the temperature control mechanism that can control the plating solution on the diaphragm. The utility model discloses guaranteed the temperature equilibrium of plating solution to guaranteed the electroplating effect, can also control the circulation of plating solution by oneself according to the temperature of electrolyte, avoided the error that manual operation brought, further guaranteed the electroplating effect.

Description

Temperature control type electroplating equipment

Technical Field

The utility model relates to a hardware fitting electroplating treatment technical field especially relates to a control by temperature change formula electroplating device.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.

The current electroplating mode is placed the heating pipe into the electroplating solution, if not in time change the heating pipe, the plating solution can corrode the heating pipe, thereby cause the damage of heating pipe, still can influence the quality of plating solution, moreover, before the plating solution uses, need heat the plating solution to certain temperature and just can use, current electroplating device is when heating the plating solution, generally through the circulation of manual control plating solution, and there is certain error again in the manual operation, make the plating solution flow when the temperature is higher than or is less than appropriate temperature, and then influence the electroplating effect, in order to solve above-mentioned problem, need design a control by temperature change formula electroplating device.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a temperature control type electroplating device.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a control by temperature change formula electroplating device, includes the operation panel, two backup pads of lateral wall fixedly connected with on the operation panel, two the common fixedly connected with diaphragm of the relative lateral wall of backup pad, two risers of lateral wall fixedly connected with under the diaphragm, the common fixedly connected with fixed plate of lateral wall under two risers, head is electroplated to lateral wall fixedly connected with under the fixed plate, the lateral wall is equipped with the temperature-controlled mechanism that can control the plating solution on the diaphragm.

Preferably, the temperature control mechanism includes the heating cabinet of fixed connection lateral wall on the diaphragm, the heating cabinet lateral wall is equipped with places the chamber, it is equipped with the heating pipe to place the intracavity, lateral wall fixedly connected with motor on the heating cabinet, the output shaft fixedly connected with bull stick of motor, the lower extreme fixedly connected with commentaries on classics board of bull stick, change two round bars of lower lateral wall fixedly connected with of board, two a plurality of drums of round bar lateral wall fixedly connected with, it is a plurality of the equal fixedly connected with stirring leaf of drum lateral wall, the case is placed to heating cabinet inner wall fixedly connected with, it has the kickboard to place incasement wall sealing sliding connection, the kickboard is with the equal fixedly connected with conducting strip of the relative lateral wall of placing the case, lateral wall fixedly connected with power on the heating.

Preferably, the bottom in the heating box is communicated with a discharge pipe, the discharge pipe is provided with an electromagnetic valve, and the discharge pipe is communicated with the electroplating head.

Preferably, mercury is filled in the space, located at the lower end of the floating plate, in the placing box, and the two conducting strips are arranged oppositely.

Preferably, the two conducting strips are not in contact, and the power supply and the electromagnetic valve are electrically connected with the two conducting strips.

Preferably, the placing cavity is of an annular structure, and the heating pipe is spirally arranged.

Preferably, lateral wall intercommunication is equipped with the inlet pipe on the heating cabinet, the inlet pipe upper end is equipped with the shield.

The utility model discloses in have following beneficial effect:

1. the device heats the electrolyte through the heating pipe, and then the motor is started to rotate the stirring blades, so that the electroplating solution rolls in the heating box, and the temperature balance of the electroplating solution is ensured, thereby ensuring the electroplating effect;

2. this device makes mercury inflation through the temperature rising of plating solution to drive two conducting strips contacts, make the closed circuit intercommunication of power, conducting strip, solenoid valve, thereby open the solenoid valve, can control the circulation of plating solution by oneself according to the temperature of electrolyte, avoided the error that manual operation brought, further guaranteed the electroplating effect.

Drawings

FIG. 1 is a schematic structural view of a temperature-controlled electroplating apparatus according to the present invention;

FIG. 2 is an enlarged view of the A-site structure of the temperature controlled electroplating apparatus of the present invention.

In the figure: the device comprises an operation table 1, a supporting plate 2, a transverse plate 3, a vertical plate 4, a fixing plate 5, an electroplating head 6, a discharging pipe 7, a heating box 8, a placing cavity 9, a heating pipe 10, a power supply 11, a motor 12, a rotating rod 13, a rotating plate 14, a round rod 15, a stirring blade 16, a placing box 17, a conducting strip 18 and a floating plate 19.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a control by temperature change formula electroplating device, includes operation panel 1, and lateral wall fixedly connected with two backup pads 2 on operation panel 1, the common fixedly connected with diaphragm 3 of the relative lateral wall of two backup pads 2, and lateral wall fixedly connected with two risers 4 under diaphragm 3, and the common fixedly connected with fixed plate 5 of lateral wall under two risers 4, and lateral wall fixedly connected with electroplates head 6 under fixed plate 5.

The upper side wall of the transverse plate 3 is provided with a temperature control mechanism capable of controlling electroplating solution, the temperature control mechanism comprises a heating box 8 fixedly connected with the upper side wall of the transverse plate 3, the upper side wall of the heating box 8 is communicated with a feeding pipe, the upper end of the feeding pipe is provided with a dustproof cover to prevent the electroplating solution in the heating box 8 from being oxidized due to long-time contact with air, so that the quality of the electroplating solution is reduced and the electroplating effect is influenced, the bottom in the heating box 8 is communicated with a discharging pipe 7, the discharging pipe 7 is provided with an electromagnetic valve, the discharging pipe 7 is communicated with an electroplating head 6, the side wall of the heating box 8 is provided with a placing cavity 9, the placing cavity 9 is of an annular structure, a heating pipe 10 is arranged in the placing cavity 9, the heating pipe 10 is of a spiral arrangement, the upper side wall of the heating box 8 is fixedly connected with a motor 12, two 15 lateral wall fixedly connected with a plurality of drums of round bar, the equal fixedly connected with stirring leaf 16 of a plurality of drum lateral walls, the crisscross placing of a plurality of stirring leaf 16, the stirring area has been increased, the temperature equilibrium of plating solution has been guaranteed, 8 inner wall fixedly connected with of heating cabinet place case 17, place the sealed sliding connection of case 17 inner wall and have kickboard 19, it has mercury to place the space packing that is located 19 lower extreme of kickboard in the case 17, mercury can be along with the temperature rise of plating solution and expand, kickboard 19 and the equal fixedly connected with conducting strip 18 of the relative lateral wall of placing case 17, two conducting strips 18 are just to setting up, two conducting strips 18 contactless, when mercury inflation, two conducting strips 18 can contact, form closed circuit, thereby the electric valve is opened, 8 lateral wall fixedly connected with power 11 on the heating cabinet, power 11, solenoid valve and two conducting.

When needing to electroplate hardware fitting, pour the plating solution into heating cabinet 8 from the inlet pipe in, cover the shield, open heating pipe 10, through the heat transfer, make the plating solution temperature rise in the heating cabinet 8, restart motor 12, the electronic bull stick 13 of motor 12 rotates to drive commentaries on classics board 14 and rotate, thereby drive round bar 15 and rotate, and then drive stirring leaf 16 and rotate, make the temperature of plating solution balanced.

When the temperature of the electroplating solution rises, mercury in the placing box 17 expands along with the temperature rise, so that the floating plate 19 is driven to move upwards, when the temperature of the electroplating solution reaches a specified value, the two conducting strips 18 are in mutual contact, the electromagnetic valve is opened, the electroplating solution flows into the discharging pipe 7, the object to be processed is electroplated through the outflow of the electroplating head 6, the circulation of the electroplating solution is not required to be manually controlled, and the electroplating effect is ensured.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a control by temperature change formula electroplating device, includes operation panel (1), its characterized in that, two backup pads (2) of lateral wall fixedly connected with on operation panel (1), two the common fixedly connected with diaphragm (3) of the relative lateral wall of backup pad (2), two risers (4) of lateral wall fixedly connected with under diaphragm (3), the common fixedly connected with fixed plate (5) of lateral wall under two risers (4), first (6) are electroplated to fixed plate (5) lower lateral wall fixedly connected with, lateral wall is equipped with the temperature control mechanism that can control the plating solution on diaphragm (3).

2. The temperature-controlled electroplating device according to claim 1, wherein the temperature control mechanism comprises a heating box (8) fixedly connected to the upper side wall of the transverse plate (3), a placing cavity (9) is formed in the side wall of the heating box (8), a heating pipe (10) is arranged in the placing cavity (9), a motor (12) is fixedly connected to the upper side wall of the heating box (8), a rotating rod (13) is fixedly connected to an output shaft of the motor (12), a rotating plate (14) is fixedly connected to the lower end of the rotating rod (13), two round rods (15) are fixedly connected to the lower side wall of the rotating plate (14), a plurality of cylinders are fixedly connected to the side walls of the two round rods (15), stirring blades (16) are fixedly connected to the side walls of the cylinders, a placing box (17) is fixedly connected to the inner wall of the heating box (8), and a floating plate (19) is slidably connected to the inner wall of the placing box (17), the floating plate (19) and the opposite side wall of the placing box (17) are fixedly connected with conducting strips (18), and the side wall of the heating box (8) is fixedly connected with a power supply (11).

3. The temperature-controlled electroplating equipment according to claim 2, characterized in that a discharge pipe (7) is communicated with the bottom in the heating box (8), an electromagnetic valve is arranged on the discharge pipe (7), and the discharge pipe (7) is communicated with the electroplating head (6).

4. A temperature controlled plating apparatus according to claim 2, wherein the space in the tank (17) at the lower end of the float plate (19) is filled with mercury, and the two conductive sheets (18) are disposed opposite to each other.

5. The temperature-controlled electroplating apparatus according to claim 4, wherein the two conducting strips (18) are not in contact, and the power supply (11) and the electromagnetic valve are electrically connected with the two conducting strips (18).

6. A temperature controlled electroplating apparatus according to claim 2, wherein the placement chamber (9) is of annular configuration and the heating tube (10) is of spiral configuration.

7. The temperature-controlled electroplating equipment according to claim 3, wherein the heating box (8) is provided with a feed pipe on the upper side wall in a communication manner, and a dust cover is arranged at the upper end of the feed pipe.