CN111987890A - Embedded single-power-supply-powered multi-level SiC MOSFET (Metal-oxide-semiconductor field Effect transistor) driving circuit - Google Patents

Embedded single-power-supply-powered multi-level SiC MOSFET (Metal-oxide-semiconductor field Effect transistor) driving circuit Download PDF

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Publication number
CN111987890A
CN111987890A CN202010754391.1A CN202010754391A CN111987890A CN 111987890 A CN111987890 A CN 111987890A CN 202010754391 A CN202010754391 A CN 202010754391A CN 111987890 A CN111987890 A CN 111987890A
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China
Prior art keywords
resistor
diode
mos tube
sic
sic mosfet
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CN202010754391.1A
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Chinese (zh)
Inventor
吴旋律
吴小华
赵鑫
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Northwestern Polytechnical University
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Northwestern Polytechnical University
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Priority to CN202010754391.1A priority Critical patent/CN111987890A/en
Publication of CN111987890A publication Critical patent/CN111987890A/en
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/08Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • H02M1/083Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the ignition at the zero crossing of the voltage or the current
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/32Means for protecting converters other than automatic disconnection
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/38Means for preventing simultaneous conduction of switches
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electronic Switches (AREA)

Abstract

The invention discloses an embedded single-power-supply multi-level SiC MOSFET driving circuit which comprises a driven SiC MOS tube, a driving chip, a resistor Rg, a diode D, a resistor Rc, a capacitor Cz, a diode Dz, an MOS tube M and a resistor Rm. The driving circuit adopts quasi-4 level driving, and avoids the condition of false conduction caused by the turn-on of another SiC MOSFET of a bridge arm by adopting negative pressure at the start of turn-off; by adopting zero voltage after the turn-off is finished, the problem of SiC MOSFET failure caused by negative voltage spike is avoided. In addition, higher switching speeds can be achieved when switching on and off.

Description

Embedded single-power-supply-powered multi-level SiC MOSFET (Metal-oxide-semiconductor field Effect transistor) driving circuit
Technical Field
The invention belongs to the technical field of electronic driving, and particularly relates to a multi-level SiC MOSFET driving circuit.
Background
SiC MOSFETs can achieve very high switching speeds relative to Si MOSFETs. However, the drive voltage threshold of the SiC MOSFET is low, and the gate-to-gate voltage tolerance is poor. In conventional bridge-arm circuit configurations, the fast switching action of one switching device can cause a very significant voltage spike to cross-talk at the gate voltage of another switching device. The positive voltage spike is likely to cause false turn-on, and the negative voltage spike is likely to cause failure of the SiC MOSFET.
At present, most of common SiC MOSFET driving circuits adopt negative voltage turn-off to suppress false turn-on, however, the negative voltage turn-off increases the probability of device failure caused by negative voltage spike, and it is necessary to suppress crosstalk. However, the driving circuits with the crosstalk suppression function in the prior art are mostly complex and require multiple power supplies, and a simple circuit for suppressing crosstalk is urgently needed to exert potential performance of the SiC MOSFET.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides an embedded single-power-supply multi-level SiC MOSFET driving circuit which adopts quasi 4-level driving. By adopting negative pressure at the beginning of turn-off, the condition of false turn-on caused by turning on of the other SiC MOSFET of the bridge arm is avoided; by adopting zero voltage after the turn-off is finished, the problem of SiC MOSFET failure caused by negative voltage spike is avoided. In addition, higher switching speeds can be achieved when switching on and off.
The technical scheme adopted by the invention for solving the technical problem comprises the following steps:
an embedded single-power-supply-powered multi-level SiC MOSFET driving circuit comprises a driven SiC MOS tube, a driving chip, a resistor Rg, a diode D, a resistor Rc, a capacitor Cz, a diode Dz, an MOS tube M and a resistor Rm;
one end of the resistor Rg is connected with the OUT end of the driving chip, and the other end of the resistor Rg is connected with a Gate of the driven SiC MOS tube;
the positive electrode of the diode D is connected with the OUT end of the driving chip, the negative electrode of the diode D is connected with one end of the resistor Rc, and the other end of the resistor Rc is connected with the Source electrode of the driven SiC MOS tube;
one end of the capacitor Cz is connected with the GND end of the driving chip, and the other end of the capacitor Cz is connected with the Source electrode of the driven SiC MOS tube;
the anode of the diode Dz is connected with the GND end of the driving chip, and the cathode of the diode Dz is connected with the Source of the driven SiC MOS tube;
the Source electrode of the MOS tube M is connected with the GND of the driving chip, the Drain electrode of the MOS tube M is connected with one end of the resistor Rm, and the other end of the resistor Rm is connected with the Source electrode of the driven SiC MOS tube.
Preferably, the diode Dz is a zener diode.
Preferably, the diode D is a fast recovery diode.
The invention has the beneficial effects that:
1. the invention can enable the drive circuit to realize the output of the quasi-4 level drive signal under the condition of single power supply.
2. According to the invention, the negative pressure is adopted at the switching-on moment of the other switching tube of the bridge arm to avoid misconduction;
3. according to the invention, zero voltage is adopted at the turn-off moment of the other switching tube of the bridge arm to avoid failure;
4. the circuit provided by the invention is simple and easy to implement and has lower cost;
5. according to the invention, the maximum voltage is adopted for driving at the moment of switching on and off of the driven SiC MOS transistor, so that the switching speed can be maximally increased;
6. the circuit provided by the invention can be conveniently embedded into the existing circuit design scheme.
Drawings
Fig. 1 is a circuit diagram of the present invention.
Fig. 2 is a timing diagram of driving signals according to the present invention.
Fig. 3 is a graph showing the effect of suppressing the bridge arm crosstalk according to the present invention.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
As shown in fig. 1, the present invention provides an embedded single-power-supply multi-level SiC MOSFET driving circuit, which includes a driven SiC MOS transistor, a driving chip, a resistor Rg, a diode D, a resistor Rc, a capacitor Cz, a diode Dz, a MOS transistor M, and a resistor Rm;
one end of the resistor Rg is connected with the OUT end of the driving chip, and the other end of the resistor Rg is connected with a Gate of the driven SiC MOS tube;
the positive electrode of the diode D is connected with the OUT end of the driving chip, the negative electrode of the diode D is connected with one end of the resistor Rc, and the other end of the resistor Rc is connected with the Source electrode of the driven SiC MOS tube;
one end of the capacitor Cz is connected with the GND end of the driving chip, and the other end of the capacitor Cz is connected with the Source electrode of the driven SiC MOS tube;
the anode of the diode Dz is connected with the GND end of the driving chip, and the cathode of the diode Dz is connected with the Source of the driven SiC MOS tube;
the Source electrode of the MOS tube M is connected with the GND of the driving chip, the Drain electrode of the MOS tube M is connected with one end of the resistor Rm, and the other end of the resistor Rm is connected with the Source electrode of the driven SiC MOS tube.
Example (b):
fig. 2 is a waveform timing diagram of the driving circuit of the present invention.
At the time t0, the MOS transistor M keeps the on state, and the driving chip turns on the driven SiC MOS transistor through the resistor Rg.
At the time t1, the MOS transistor M is turned off, Cgs discharges, the driving chip OUT end charges the capacitor Cz through the diode D and the resistor Rc, when the voltage at the two ends of the capacitor Cz reaches the regulated voltage value of the voltage-stabilizing diode Dz, the voltage at the two ends of the capacitor Cz is clamped, and meanwhile, the voltage at the two ends of Cgs is also clamped.
At time t2, the driving chip starts to turn off the driven SiC MOS transistor, and the negative voltage is turned off by the voltage of the capacitor Cz.
At time t3, the MOS transistor M is turned on, the capacitor Cz is discharged through the MOS transistor M and the resistor Rm, the gate voltage of the driven SiC MOS transistor rises to 0, and the zero-voltage off state is maintained.
Fig. 3 is a diagram of the bridge arm crosstalk suppression effect of the driving circuit of the present invention, in which one SiC MOSFET in the same bridge arm is turned off, and after passing through a dead zone, the other SiC MOSFET is turned on, so that the forward disturbance caused by the negative voltage driving exists, and the situation of false turn-on is avoided. And negative disturbance caused by the turn-off of the other SiC MOSFET is turned off due to zero voltage, so that the failure of the SiC MOSFET is avoided.

Claims (3)

1. An embedded single-power-supply-powered multi-level SiC MOSFET drive circuit is characterized by comprising a driven SiC MOS tube, a drive chip, a resistor Rg, a diode D, a resistor Rc, a capacitor Cz, a diode Dz, an MOS tube M and a resistor Rm;
one end of the resistor Rg is connected with the OUT end of the driving chip, and the other end of the resistor Rg is connected with a Gate of the driven SiC MOS tube;
the positive electrode of the diode D is connected with the OUT end of the driving chip, the negative electrode of the diode D is connected with one end of the resistor Rc, and the other end of the resistor Rc is connected with the Source electrode of the driven SiC MOS tube;
one end of the capacitor Cz is connected with the GND end of the driving chip, and the other end of the capacitor Cz is connected with the Source electrode of the driven SiC MOS tube;
the anode of the diode Dz is connected with the GND end of the driving chip, and the cathode of the diode Dz is connected with the Source of the driven SiC MOS tube;
the Source electrode of the MOS tube M is connected with the GND of the driving chip, the Drain electrode of the MOS tube M is connected with one end of the resistor Rm, and the other end of the resistor Rm is connected with the Source electrode of the driven SiC MOS tube.
2. The single power supply multi-level SiC MOSFET driver circuit of claim 1 in which the diode Dz is a zener diode.
3. The single power supply multi-level SiC MOSFET driver circuit of claim 1 in which the diode D is a fast recovery diode.
CN202010754391.1A 2020-07-30 2020-07-30 Embedded single-power-supply-powered multi-level SiC MOSFET (Metal-oxide-semiconductor field Effect transistor) driving circuit Pending CN111987890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010754391.1A CN111987890A (en) 2020-07-30 2020-07-30 Embedded single-power-supply-powered multi-level SiC MOSFET (Metal-oxide-semiconductor field Effect transistor) driving circuit

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CN202010754391.1A CN111987890A (en) 2020-07-30 2020-07-30 Embedded single-power-supply-powered multi-level SiC MOSFET (Metal-oxide-semiconductor field Effect transistor) driving circuit

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114884333A (en) * 2022-07-08 2022-08-09 深圳芯能半导体技术有限公司 Drive circuit, intelligent power module and electronic equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108667444A (en) * 2018-07-26 2018-10-16 深圳市蓝德汽车电源技术有限公司 A kind of silicon carbide MOSFET driving circuit
CN109004813A (en) * 2018-07-27 2018-12-14 深圳英飞源技术有限公司 A kind of metal-oxide-semiconductor driving circuit inhibiting driving voltage spike
CN109167511A (en) * 2018-11-05 2019-01-08 宁波市北仑临宇电子科技有限公司 Lossless synchronous absorbing circuit, boosting and step-down switching power supply circuit
CN208623641U (en) * 2018-07-27 2019-03-19 深圳英飞源技术有限公司 A kind of metal-oxide-semiconductor driving circuit inhibiting negative drive voltage spike
CN110830014A (en) * 2019-11-14 2020-02-21 西北工业大学 SiC MOSFET drive circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108667444A (en) * 2018-07-26 2018-10-16 深圳市蓝德汽车电源技术有限公司 A kind of silicon carbide MOSFET driving circuit
CN109004813A (en) * 2018-07-27 2018-12-14 深圳英飞源技术有限公司 A kind of metal-oxide-semiconductor driving circuit inhibiting driving voltage spike
CN208623641U (en) * 2018-07-27 2019-03-19 深圳英飞源技术有限公司 A kind of metal-oxide-semiconductor driving circuit inhibiting negative drive voltage spike
CN109167511A (en) * 2018-11-05 2019-01-08 宁波市北仑临宇电子科技有限公司 Lossless synchronous absorbing circuit, boosting and step-down switching power supply circuit
CN110830014A (en) * 2019-11-14 2020-02-21 西北工业大学 SiC MOSFET drive circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114884333A (en) * 2022-07-08 2022-08-09 深圳芯能半导体技术有限公司 Drive circuit, intelligent power module and electronic equipment

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