CN111987404B

CN111987404B - Substrate integrated waveguide antenna

Info

Publication number: CN111987404B
Application number: CN202010812486.4A
Authority: CN
Inventors: 尹桂芳; 任中华; 陶平
Original assignee: Anhui Lanyu Electronic Technology Co ltd
Current assignee: Anhui Lanxun Communication Technology Co ltd
Priority date: 2020-08-13
Filing date: 2020-08-13
Publication date: 2021-06-29
Anticipated expiration: 2040-08-13
Also published as: CN111987404A

Abstract

The invention discloses a substrate integrated waveguide antenna, and particularly relates to the technical field of waveguide antennas, which comprises an outer cover, an inner plate and a chip arranged in the outer cover and the inner plate, wherein the outer cover and the inner plate are provided with welding seams for integrating the outer cover and the inner plate, the outer cover is formed by nesting the first outer cover and the second outer cover at intervals, a first buffer laminate is arranged in a cavity between the first outer cover and the second outer cover, a second buffer laminate which is not in contact with the first inner plate and the second inner plate is sleeved at the middle part of a partition plate, and a first deformation gap is arranged between the second buffer laminate and the opposite surface. According to the invention, under the composition action of the first inner plate, the second inner plate, the first partition plate, the first outer cover, the second outer cover and the first buffer laminate, a certain connection effect is achieved except that the partition plate and the buffer laminate perform shock absorption and buffering on the whole structure, in addition, the chip is positioned in the middle of the protection inner cavity and is not in contact with the first outer cover and the second outer cover, and the protection performance and the stability are stronger.

Description

Substrate integrated waveguide antenna

Technical Field

The invention relates to the technical field of waveguide antennas, in particular to a substrate integrated waveguide antenna.

Background

Substrate integrated waveguide is a hot gate studied in academia in recent years, which has the dual advantages of waveguide and microstrip line.

Although the patent designs the traditional horn antenna by utilizing the substrate integrated waveguide, integrates the advantages of the waveguide and the microstrip line, greatly reduces the volume and the weight, and is only one twentieth of the traditional horn antenna, in the actual work, the antenna is difficult to avoid being dragged or collided by external force, and the damage of the antenna shell directly causes the instable installation of a chip in the antenna and influences the normal work of the antenna.

Disclosure of Invention

In order to solve the technical problems, the invention provides a substrate integrated waveguide antenna, which comprises an outer cover, an inner plate and a chip arranged in the outer cover and the inner plate, wherein a welding seam for integrating the outer cover and the inner plate is arranged on an assembly of the outer cover and the inner plate, the outer cover is formed by nesting the first outer cover and the second outer cover at intervals, a first buffer laminate is arranged in an interval cavity between the outer cover and comprises the outer cover, the inner plate and the chip arranged in the outer cover and the inner plate, the welding seam for integrating the outer cover and the inner plate is arranged on the assembly of the outer cover, the first buffer laminate is arranged in the interval cavity between the outer cover and the outer cover, a second buffer laminate which is not in contact with the first inner plate and the second inner plate is sleeved in the middle of a first deformation gap is arranged between the second buffer laminate and the opposite surface of, buffer plywood three is equipped with the deformation clearance two that supplies buffer plywood three, buffer plywood two or division board deformation between the inner chamber wall of buffer plywood two, the equipartition has the interval board of recoverable deformation in deformation clearance one or the deformation clearance two, contactless between per two interval boards, the size of division board and the size looks adaptation of enclosing cover inner chamber, and the whole inner panel of projection cladding of division board on inner panel one, inner panel two, the chip is close to one side and the enclosing cover two contactless of enclosing cover one.

In a preferred embodiment, the middle part of the partition plate is sleeved with a buffer layer plate II which is not in contact with the inner plate I and the inner plate II, and a deformation gap I is arranged between the buffer layer plate II and the opposite surface of the partition plate.

In a preferred embodiment, a solid buffer layer plate III is sleeved in the middle of the buffer layer plate II, and a deformation gap II for deformation of the buffer layer plate III, the buffer layer plate II or the partition plate is arranged between the buffer layer plate III and the inner cavity wall of the buffer layer plate II.

In a preferred embodiment, the deformation gap I or the deformation gap II is respectively provided with a spacing plate capable of restoring deformation, and every two spacing plates are not in contact with each other.

In a preferred embodiment, an annular protective cover is arranged on the mounting surface of the chip, the chip is located in the middle of the protective cover, and one end, far away from the chip, of the protective cover is connected with the inner cavity surface of the outer cover II.

The invention has the technical effects and advantages that:

under the composition effect of inner panel one, inner panel two, division board and enclosing cover one, enclosing cover two, buffering plywood one, except that division board and a pair of overall structure of buffering plywood carry out the shock attenuation, the buffering still plays certain connection effect, in addition, the chip is located the centre position of protection inner chamber, and is contactless with enclosing cover one, enclosing cover two, protectiveness and stability are stronger.

Drawings

FIG. 1 is a schematic left view of the present invention;

FIG. 2 is a schematic diagram of the right view structure of the present invention;

FIG. 3 is a schematic view of the first inner plate and the second inner plate in the present invention;

FIG. 4 is a schematic diagram of the first inner plate, the second inner plate and the internal structure thereof according to the present invention;

FIG. 5 is a partial sectional view of the first cover of the present invention;

FIG. 6 is a schematic view of the structure at A in FIG. 4 according to the present invention.

Description of reference numerals: the welding line comprises a first outer cover 11, a second outer cover 12, a first inner plate 21, a second inner plate 22, a partition plate 31, a second buffer laminate 32, a third buffer laminate 33, a 4-space plate, a chip 5, a protective cover 6, a first buffer laminate 7 and a welding line 8.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

1-6, the substrate integrated waveguide antenna comprises an outer cover, an inner plate and a chip 5 arranged inside the outer cover and the inner plate, wherein a welding seam 8 enabling the outer cover and the inner plate to be integrated is arranged on a component of the outer cover and the inner plate, the outer cover is formed by nesting the first outer cover 11 and the second outer cover 12 at intervals, a first buffer laminate 7 is arranged in an interval cavity between the first outer cover and the second outer cover, the inner plate comprises a first inner plate 21, a second inner plate 22 and a partition plate 31, the first inner plate 21, the second inner plate 22 and the partition plate 31 form an I-shaped structure, the size of the partition plate 31 is matched with the size of an inner cavity of the first outer cover 11, the projection of the partition plate 31 on the first inner plate 21 and the second inner plate 22 covers the whole first inner plate; when the passive force is applied, the integral structure is damped and buffered by the first partition plate 31 and the first buffer laminate 7, the first inner plate 21, the second inner plate 22, the first outer cover 11 and the second outer cover 12 are prevented from being damaged by external force, the first partition plate 31 and the first buffer laminate 7 respectively damp and buffer the first outer cover 11, the second outer cover 12, the first inner plate 12 and the second inner plate 21, and the second inner plate 22, the chip 5 is located in the middle of the protective inner cavity and does not contact with the first outer cover 11 and the second outer cover 12, and the protective performance and stability are higher.

A second buffer laminate 32 which is not in contact with the first inner plate 21 and the second inner plate 22 is sleeved in the middle of the partition plate 31, and a first deformation gap is formed between the second buffer laminate 32 and the opposite surface of the partition plate 31; a solid buffer laminate plate III 33 is sleeved in the middle of the buffer laminate plate II 32, and a deformation gap II for deforming the buffer laminate plate III 33, the buffer laminate plate II 32 or the partition plate 31 is arranged between the buffer laminate plate III 33 and the inner cavity wall of the buffer laminate plate II 32; deformation clearance one and deformation clearance two make the whole passive force effect of receiving of antenna lead to division board 31, two 32 of buffering plywood and buffering plywood three 33 down, during collision, the extrusion, have certain deformation, deformation recovery and buffering space, and deformation clearance one, deformation clearance two's size is certain simultaneously, and under extrusion force, elastic deformation and the effect of deformation recovery, the effectual steadiness of guaranteeing chip 5 installation.

The interval plates 4 capable of restoring deformation are uniformly distributed in the deformation gap I or the deformation gap II, every two interval plates 4 are not in contact, and when the deformation gap I and the deformation gap II are subjected to horizontal or longitudinal or annular extrusion, the interval plates 4 effectively transmit passive force, so that better buffering and shock absorption effects are achieved.

An annular protective cover 6 is arranged on the mounting surface of the chip 5, the chip 5 is located in the center of the protective cover 6, one end, far away from the chip 5, of the protective cover 6 is connected with the inner cavity surface of the outer cover II 12, the chip 5 is not directly contacted with the outer cover I11 or the outer cover II 12, the chip 5 does not directly collide with the outer cover I11 or the outer cover II 12 under the action of passive force, meanwhile, the protective cover 6 which is abutted against the outer cover I11 or the outer cover II 12 conducts force between the inner plate I21 and the inner plate II 22 and between the outer cover I11 and the outer cover II 12, and the chip 5 is located in the center of the protective cavity with.

It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by one of ordinary skill in the art and related arts based on the embodiments of the present invention without any creative effort, shall fall within the protection scope of the present invention. Structures, devices, and methods of operation not specifically described or illustrated herein are generally practiced in the art without specific recitation or limitation.

Claims

1. The utility model provides an integrated waveguide antenna of substrate, includes enclosing cover, inner panel and installs the chip in the two inside, be equipped with on enclosing cover and the inner panel component and make the two welding seam as an organic whole, characterized in that: the outer cover is formed by nesting an outer cover I and an outer cover at a certain distance, a buffer laminate I is arranged in a cavity between the outer cover I and the outer cover, a buffer laminate II which is not in contact with the inner plate I and the inner plate II is sleeved in the middle of the partition plate, a deformation gap I is arranged between the buffer laminate II and the opposite surface of the partition plate, a solid buffer laminate plate III is sleeved in the middle of the buffer laminate plate II, a deformation gap II for the buffer laminate plate III, the buffer laminate plate II or the partition plate to deform is arranged between the buffer laminate plate III and the inner cavity wall of the buffer laminate plate II, the first deformation gap or the second deformation gap is uniformly provided with spacing plates capable of restoring deformation, every two spacing plates are not contacted, the size of the separating plate is matched with the size of the inner cavity of the outer cover, and the projections of the partition plate on the first inner plate and the second inner plate coat the whole first inner plate and the whole second inner plate, and one side of the chip close to the first outer cover is not contacted with the second outer cover.

2. The substrate integrated waveguide antenna of claim 1, wherein: the middle part of the partition plate is sleeved with a buffer laminate II which is not in contact with the inner plate I and the inner plate II, and a deformation gap I is arranged between the buffer laminate II and the opposite surface of the partition plate.

3. The substrate integrated waveguide antenna of claim 2, wherein: and a solid buffer laminate plate III is sleeved in the middle of the buffer laminate plate II, and a deformation gap II for deformation of the buffer laminate plate III, the buffer laminate plate II or the partition plate is arranged between the buffer laminate plate III and the inner cavity wall of the buffer laminate plate II.

4. The substrate integrated waveguide antenna of claim 3, wherein: and the deformation clearance I or the deformation clearance II is uniformly provided with spacing plates capable of restoring deformation, and every two spacing plates are not in contact.

5. The substrate integrated waveguide antenna of claim 1, wherein: and an annular protective cover is arranged on the mounting surface of the chip, the chip is positioned in the middle of the protective cover, and one end, far away from the chip, of the protective cover is connected with the inner cavity surface of the outer cover II.