CN111983897B - 曝光装置及物品的制造方法 - Google Patents

曝光装置及物品的制造方法 Download PDF

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Publication number
CN111983897B
CN111983897B CN202010417810.2A CN202010417810A CN111983897B CN 111983897 B CN111983897 B CN 111983897B CN 202010417810 A CN202010417810 A CN 202010417810A CN 111983897 B CN111983897 B CN 111983897B
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CN
China
Prior art keywords
pattern
optical system
projection optical
light
measurement pattern
Prior art date
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Active
Application number
CN202010417810.2A
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English (en)
Chinese (zh)
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CN111983897A (zh
Inventor
桥本明人
赤松昭郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to CN202410527133.8A priority Critical patent/CN118244574A/zh
Publication of CN111983897A publication Critical patent/CN111983897A/zh
Application granted granted Critical
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70133—Measurement of illumination distribution, in pupil plane or field plane
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CN202010417810.2A 2019-05-22 2020-05-18 曝光装置及物品的制造方法 Active CN111983897B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410527133.8A CN118244574A (zh) 2019-05-22 2020-05-18 曝光装置及物品的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019096252A JP7320986B2 (ja) 2019-05-22 2019-05-22 露光装置及び物品の製造方法
JP2019-096252 2019-05-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202410527133.8A Division CN118244574A (zh) 2019-05-22 2020-05-18 曝光装置及物品的制造方法

Publications (2)

Publication Number Publication Date
CN111983897A CN111983897A (zh) 2020-11-24
CN111983897B true CN111983897B (zh) 2024-04-23

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CN202010417810.2A Active CN111983897B (zh) 2019-05-22 2020-05-18 曝光装置及物品的制造方法
CN202410527133.8A Pending CN118244574A (zh) 2019-05-22 2020-05-18 曝光装置及物品的制造方法

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CN202410527133.8A Pending CN118244574A (zh) 2019-05-22 2020-05-18 曝光装置及物品的制造方法

Country Status (5)

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US (1) US11181825B2 (enExample)
JP (1) JP7320986B2 (enExample)
KR (1) KR102739326B1 (enExample)
CN (2) CN111983897B (enExample)
TW (3) TWI879485B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023136106A (ja) * 2022-03-16 2023-09-29 キヤノン株式会社 計測装置、露光装置、及び物品の製造方法
US12461041B2 (en) * 2022-04-20 2025-11-04 Kla Corporation Measurement of thick films and high aspect ratio structures

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035785A (ja) * 1999-06-24 2001-02-09 Svg Lithography Syst Inc 光学系の特性を測定する方法及び装置
JP2008140911A (ja) * 2006-11-30 2008-06-19 Toshiba Corp フォーカスモニタ方法
CN101226299A (zh) * 2007-01-18 2008-07-23 瀚宇彩晶股份有限公司 制作具有光散射效果的彩色滤光层的方法
JP2008199034A (ja) * 1999-03-08 2008-08-28 Asml Netherlands Bv リソグラフィ投影装置のオフアクシスレベリング
CN102034732A (zh) * 2009-09-30 2011-04-27 京瓷株式会社 吸附用构件、使用其的吸附装置及带电粒子线装置
JP2013186425A (ja) * 2012-03-09 2013-09-19 Nikon Corp 焦点位置検出方法、露光方法、デバイス製造方法及び露光装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3013463B2 (ja) 1991-02-01 2000-02-28 株式会社ニコン 焦点位置検出装置及び投影露光装置
JP2938187B2 (ja) * 1991-09-20 1999-08-23 株式会社日立製作所 パターン形成方法及び同方法を実施するための装置
JP4323608B2 (ja) * 1999-03-12 2009-09-02 キヤノン株式会社 露光装置およびデバイス製造方法
US6885429B2 (en) * 2002-06-28 2005-04-26 Asml Holding N.V. System and method for automated focus measuring of a lithography tool
TWI383273B (zh) * 2007-11-20 2013-01-21 Asml Netherlands Bv 微影投射裝置之焦點測量方法及微影投射裝置之校準方法
JP5209946B2 (ja) * 2007-12-12 2013-06-12 株式会社オーク製作所 焦点位置検出方法および描画装置
JP6003272B2 (ja) * 2012-06-15 2016-10-05 富士通セミコンダクター株式会社 露光方法および露光装置
TWI671796B (zh) * 2014-12-05 2019-09-11 日商奧克製作所股份有限公司 曝光裝置
JP6818501B2 (ja) * 2016-10-19 2021-01-20 キヤノン株式会社 リソグラフィ装置、および物品製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008199034A (ja) * 1999-03-08 2008-08-28 Asml Netherlands Bv リソグラフィ投影装置のオフアクシスレベリング
JP2001035785A (ja) * 1999-06-24 2001-02-09 Svg Lithography Syst Inc 光学系の特性を測定する方法及び装置
JP2008140911A (ja) * 2006-11-30 2008-06-19 Toshiba Corp フォーカスモニタ方法
CN101226299A (zh) * 2007-01-18 2008-07-23 瀚宇彩晶股份有限公司 制作具有光散射效果的彩色滤光层的方法
CN102034732A (zh) * 2009-09-30 2011-04-27 京瓷株式会社 吸附用构件、使用其的吸附装置及带电粒子线装置
JP2013186425A (ja) * 2012-03-09 2013-09-19 Nikon Corp 焦点位置検出方法、露光方法、デバイス製造方法及び露光装置

Also Published As

Publication number Publication date
CN118244574A (zh) 2024-06-25
TWI879485B (zh) 2025-04-01
US20200371443A1 (en) 2020-11-26
TW202314402A (zh) 2023-04-01
JP2020190654A (ja) 2020-11-26
KR20200135174A (ko) 2020-12-02
TWI790433B (zh) 2023-01-21
US11181825B2 (en) 2021-11-23
CN111983897A (zh) 2020-11-24
TW202424663A (zh) 2024-06-16
KR102739326B1 (ko) 2024-12-09
JP7320986B2 (ja) 2023-08-04
TWI836797B (zh) 2024-03-21
TW202043939A (zh) 2020-12-01

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