CN111974662A - Module-spliced phased array transducer - Google Patents
Module-spliced phased array transducer Download PDFInfo
- Publication number
- CN111974662A CN111974662A CN202010784927.4A CN202010784927A CN111974662A CN 111974662 A CN111974662 A CN 111974662A CN 202010784927 A CN202010784927 A CN 202010784927A CN 111974662 A CN111974662 A CN 111974662A
- Authority
- CN
- China
- Prior art keywords
- transducer
- electrode layer
- circuit board
- printed circuit
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000012806 monitoring device Methods 0.000 claims abstract description 17
- 239000013078 crystal Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 40
- 239000007788 liquid Substances 0.000 claims description 34
- 238000012545 processing Methods 0.000 claims description 25
- 239000011241 protective layer Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003682 fluorination reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention relates to the technical field of transducers, in particular to a module splicing type phased array transducer, which comprises a shell, a printed circuit board, a substrate, a transducer array and a monitoring device, wherein the printed circuit board, the substrate, the transducer array and the monitoring device are arranged in the shell; the printed circuit board comprises a positive electrode layer and a negative electrode layer, the substrate is fixedly covered on the negative electrode layer of the printed circuit board, a plurality of through holes are formed in the substrate, the transducer array is covered on the substrate and comprises a plurality of transducer elements, each transducer element comprises a crystal, a positive electrode pin and a negative electrode pin, the positive electrode pin penetrates through the through holes to be connected with the positive electrode layer, the negative electrode pin penetrates through the through holes to be electrically connected with the negative electrode layer, and the monitoring device is connected with the transducer array; the transducer array element is detachably connected with the substrate through the through hole. The transducer array element is directly inserted into the printed circuit board through the anode pin and the cathode pin of the transducer array element, and the transducer array element is directly pulled out of the printed circuit board when being damaged, so that the replacement of a single transducer array element is realized.
Description
Technical Field
The invention relates to the technical field of transducers, in particular to a module splicing type phased array transducer.
Background
The existing phased array transducer is manufactured at one time, packaged uniformly and mainly used for manufacturing array elements with different quantities according to different requirements. The production efficiency advantage can be embodied only in mass production, but the production process is more, and if the integral performance cannot meet the working requirement due to the fact that local array elements are damaged, the whole transducer needs to be replaced, and the later maintenance cost is too high.
In order to solve the above problems, chinese patent No. cn201711386554.x provides a spliced ultrasonic transducer and a method for manufacturing the same, including at least two ultrasonic transducer modules, where the ultrasonic transducer modules include a housing and a wafer disposed in the housing, the wafer includes a plurality of arrays of array elements, the ultrasonic transducer modules have a cut surface for removing material from at least one side surface of the ultrasonic transducer modules, the cut surface removes material to a position close to the edge of one array element in the wafer, and the ultrasonic transducer modules are spliced into a whole through the cut surface. This kind of modular setting regards a plurality of array elements as a concatenation module, if single array element is bad then only need change the module at this array element place, has reduced the later maintenance cost to a certain extent, but does not solve the too big problem of individual array element to the holistic influence of transducer completely, and it can not pinpoint the array element that falls bad, and the maintenance process is comparatively loaded down with trivial details.
Disclosure of Invention
The invention provides a modular splicing type phased array transducer which can realize accurate positioning and real-time monitoring of a single array element and is easy to replace, and aims to overcome the defect that the damaged single array element cannot be positioned and replaced in the prior art.
In the technical scheme, the module splicing type phased array transducer comprises a shell, a printed circuit board, a substrate, a transducer array and a monitoring device, wherein the printed circuit board, the substrate, the transducer array and the monitoring device are arranged in the shell; the printed circuit board comprises a positive electrode layer and a negative electrode layer, the substrate is fixedly covered on the negative electrode layer of the printed circuit board, a plurality of through holes are formed in the substrate, the transducer array is covered on the substrate and comprises a plurality of transducer elements, each transducer element comprises a crystal, a positive electrode pin and a negative electrode pin, the positive electrode pin penetrates through the through holes to be connected with the positive electrode layer, the negative electrode pin penetrates through the through holes to be electrically connected with the negative electrode layer, and the monitoring device is connected with the transducer array; each transducer array element is detachably connected with the substrate through the through hole.
According to the invention, the transducer array element can be directly inserted into the printed circuit board through the anode pin and the cathode pin as required, and if the transducer array element is damaged, the transducer array element can be directly pulled out of the printed circuit board, so that the replacement of a single transducer array element is realized, and the later maintenance cost of the transducer is greatly reduced; in addition, a monitoring device is connected with the positive pin, real-time current monitoring is carried out on the transducer array element, if the transducer array element is damaged, the damaged transducer array element can be conveniently found and replaced in time on the transducer array element can be fed back to the monitoring device through current.
Preferably, the positive electrode layer and the negative electrode layer of the printed circuit board are both provided with elastic contacts corresponding to the number of the positive pins and the number of the negative pins, the positive electrode layer is provided with a plurality of leads corresponding to the number of the positive pins, and the negative electrode layer is provided with a common lead connected with all the negative pins. When the positive pin or the negative pin is inserted into the printed circuit board, the elastic contact can give resistance feedback to prompt that the pin is inserted in place, and meanwhile, the positive pin or the negative pin can be well contacted with the positive electrode layer or the negative electrode layer.
Preferably, the monitoring device includes a data processing device and a plurality of detecting elements corresponding to the number of the transducer elements, the detecting elements are disposed on the positive electrode layer, the data processing device includes a processing element and a display device electrically connected to the processing element, and each detecting element is electrically connected to the processing element and a lead corresponding to each positive electrode pin. The detecting element can detect the current information passing through the anode pin and transmit the current information to the processing element, the processing element judges whether the current information is abnormal and transmits a judgment result to the display device, and the display device displays the judgment result for a worker to check the damaged transducer array element in time.
Preferably, the detecting element is a current sensor having a current detecting function, such as a hall current sensor or a rogowski current sensor, and is capable of sensing current information of the positive electrode pin, converting the current information into an electrical signal, and sending the electrical signal to the processing element.
Preferably, still include the winding displacement pipe, winding displacement pipe one end and printed circuit board fixed connection, the other end stretches out outside the casing, because whole device contains a plurality of transducer array elements, and every transducer array element's positive pole pin all has a detecting element through pin connection, and the wire can be too much like this, passes the winding displacement pipe with the wire in the printed circuit board and is connected with the data processing equipment that is in the casing outside, can make the lead wire of whole device orderly neat more, pleasing to the eye.
Preferably, the housing is further provided with a cavity and a protective layer, the printed circuit board, the substrate, the transducer array and the monitoring device are all disposed in the cavity, and the protective layer covers the transducer array. The cavity is filled with the electronic fluorinated liquid, the electronic fluorinated liquid is an electrical insulator, has good chemical inertia, cannot corrode electronic components when contacting with the electronic components, and has excellent thermal conductivity so as to cool the device; the protective layer can protect the transducer array from being damaged by external force and enable the cavity to form a closed space, and the cavity and the protective layer which are filled with the electronic fluorinated liquid can be used as acoustic matching layers to provide an acoustic matching function.
Preferably, the cavity is provided with a liquid inlet, a liquid outlet and a second through hole, and the inner wall of the second through hole is provided with a sealing body in a surrounding manner. The liquid inlet and the liquid outlet can be externally connected with connecting pipes communicated with the cavity, so that the electronic fluorinated liquid in the cavity is in a flowing state, and the cooling effect is improved; the seal is sealing silica gel, encircles the setting at the second through-hole inner wall, can improve the seal of cavity, prevents that the electron from fluoridizing the liquid and leaking.
Preferably, the wire arranging tube passes through the second through hole and extends out of the housing, and the wire arranging tube is tightly matched with the second through hole through the sealing body so that a lead in the printed circuit board can pass through the wire arranging tube and be connected with an external system, and meanwhile, the tightness of the cavity cannot be influenced.
Preferably, the protective layer is a polyimide film, and the acoustic parameters of the polyimide film are similar to those of the electronic fluoridizing liquid, and the polyimide film can also be used as an acoustic matching layer.
Preferably, the crystal is a piezoelectric material such as piezoelectric ceramic, single crystal quartz, composite piezoelectric material, etc. which has a piezoelectric effect and can convert an electrical signal into an acoustic signal or convert an acoustic signal into an electrical signal to realize a scanning function.
Compared with the prior art, the beneficial effects are:
the transducer array element can be directly inserted into the printed circuit board through the anode pin and the cathode pin according to needs, and if the transducer array element is damaged, the transducer array element can be directly pulled out of the printed circuit board, so that the replacement of the transducer array element is realized, and the later maintenance cost of the transducer is greatly reduced; secondly, a detection element is connected and arranged through the positive pin, real-time current monitoring is carried out on the transducer array element, and if the transducer array element is damaged, the damaged transducer array element can be found and replaced in time; in addition, a cavity is arranged on the shell of the transducer, the cavity is filled with the electric insulating liquid, the electric insulating liquid flows in the cavity through the liquid inlet and the liquid outlet, cooling and heat dissipation are achieved for the transducer, the transducer is prevented from being damaged due to overhigh working temperature for a long time, and the service life of the transducer is prolonged.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a modular-tiled phased-array transducer according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a transducer array of a modular tiled phased-array transducer according to an embodiment of the invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 2;
FIG. 5 is a partial enlarged view of the portion C of FIG. 3;
FIG. 6 is a schematic diagram of a substrate structure of a modular-tiled phased-array transducer according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a transducer array structure of a modular-tiled phased-array transducer according to an embodiment of the present invention;
fig. 8 is a schematic current sensing diagram of a modular tiled phased array transducer according to an embodiment of the invention.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", "long", "short", etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings, it is only for convenience of description and simplicity of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.
The technical scheme of the invention is further described in detail by the following specific embodiments in combination with the attached drawings:
examples
Fig. 1 to 8 show an embodiment of a modular split phased array transducer, which includes a housing 1, a printed circuit board 2 disposed in the housing 1, a substrate 3, a transducer array 4, and a monitoring device; the printed circuit board 2 comprises a positive electrode layer 21 and a negative electrode layer 22, the substrate 3 is fixedly covered on the negative electrode layer 22 of the printed circuit board 2, a plurality of through holes 31 are formed in the substrate 3, the transducer array 4 is covered on the substrate 3, the transducer array 4 comprises a plurality of transducer elements 41, each transducer element 41 comprises a crystal 411, a positive electrode pin 412 and a negative electrode pin 413, the positive electrode pin 412 penetrates through the through hole 31 to be connected with the positive electrode layer 21, the negative electrode pin 413 penetrates through the through hole 31 to be electrically connected with the negative electrode layer 22 of the printed circuit board 2, and the monitoring device is connected with the transducer array 4; each transducer element 41 is detachably connected to the substrate 3 through a through hole 31.
As shown in fig. 5, the positive electrode layer 21 and the negative electrode layer 22 of the printed circuit board 2 in the present embodiment are each provided with an elastic contact 5 therein corresponding to the number of the positive electrode pins 412 and the negative electrode pins 413, the positive electrode layer 21 is provided with a plurality of leads corresponding to the number of the positive electrode pins 412, and the negative electrode layer 22 is provided with a common lead connected to all the negative electrode pins 413. When the positive pin 412 or the negative pin 413 is inserted into the printed circuit board 2, the elastic contact 5 can give a resistance feedback to indicate that the positive pin 412 or the negative pin 413 is inserted in place, and simultaneously, the positive pin 412 or the negative pin 413 can be ensured to be in good contact with the positive electrode layer 21 or the negative electrode layer 22.
As shown in fig. 8, the monitoring device in this embodiment includes a data processing device, and a plurality of detection elements corresponding to the number of transducer elements 41, the detection elements are disposed on the positive electrode layer 21, the data processing device includes a processing element and a display device which are electrically connected, and each detection element is electrically connected to the processing element and a lead corresponding to each positive electrode pin 412. The detection element can detect the current information passing through the anode pin 412 and transmit the current information to the processing element, the processing element judges whether the current information is abnormal or not and transmits a judgment result to the display device, and the display device displays the judgment result for a worker to check so as to timely process the damaged array elements.
The detecting element in this embodiment is a current sensor having a current detecting function, such as a hall current sensor or a rogowski current sensor, and is capable of sensing current information of the positive electrode pin 412, converting the current information into an electrical signal, and sending the electrical signal to the processing element. It should be noted that, in this embodiment, the detection of the current information by using the hall current sensor or the rogowski current sensor is not understood as a limitation to this solution, and of course, other devices or methods may be used to detect the current, voltage, or resistance of the array element, and obtain a corresponding electrical signal for the processing element to determine.
The embodiment further comprises a wire arranging pipe 8, one end of the wire arranging pipe 8 is fixedly connected with the printed circuit board 2, the other end of the wire arranging pipe extends out of the shell 1, the whole device comprises a plurality of transducer elements 41, and the anode pin 412 of each transducer element 41 is connected with a detection element through a lead, so that the number of leads is too many, the leads in the printed circuit board 2 penetrate through the wire arranging pipe 8 to be connected with data processing equipment outside the shell 1, and the leads of the whole device can be more orderly, orderly and attractive.
As shown in fig. 3 and 4, the case 1 in this embodiment is further provided with a cavity 11 and a protective layer 12, the printed circuit board 2, the substrate 3, the transducer array 4, and the monitoring device are all disposed in the cavity 11, and the protective layer 12 covers the transducer array 4. The cavity 11 is filled with an electronic fluorinated liquid, which is an electrical insulator, has good chemical inertness, does not corrode electronic parts when in contact with the electronic parts, and has excellent thermal conductivity so as to cool the device; the protective layer 12 can protect the transducer array 4 from being damaged by external force and enable the cavity 11 to form a closed space, and in addition, the cavity 11 filled with the electronic fluorination liquid and the protective layer 12 can both be used as acoustic matching layers to provide an acoustic matching function. The electronic fluorination liquid may be FMD-50 electronic fluorination liquid or FMD-120 electronic fluorination liquid, and other electrical insulating liquids may be used, which is not limited herein.
As shown in fig. 3, the cavity 11 of this embodiment is provided with a liquid inlet 111, a liquid outlet 112, and a second through hole 113, and a sealing body 114 is disposed around an inner wall of the second through hole 113. The liquid inlet 111 and the liquid outlet 112 can be externally connected with connecting pipes communicated with the cavity 11, so that the electronic fluorinated liquid in the cavity 11 is in a flowing state, and the cooling effect is improved; the sealing body 114 is made of sealing silica gel and is disposed around the inner wall of the second through hole 113, so that the sealing performance of the cavity 11 can be improved, and leakage of the electronic fluorinated liquid can be prevented.
The wire arranging tube 8 in this embodiment passes through the second through hole 113 and extends out of the housing 1, and the wire arranging tube 8 is tightly fitted with the second through hole 113 through the sealing body 114, so that the lead wires in the printed circuit board 2 pass through the wire arranging tube 8 and are connected with an external system, and meanwhile, the sealing performance of the cavity 11 is not affected.
The protective layer 12 in this embodiment is a polyimide film, and the acoustic parameters of the polyimide film are similar to those of the electronic fluorinated liquid, and the polyimide film can also be used as an acoustic matching layer. It should be noted that the polyimide film is only one preferable solution, which is selected according to the acoustic parameters of the electronic fluorination liquid, and is not limited herein.
The crystal 411 in this embodiment is made of piezoelectric materials such as piezoelectric ceramics, single crystal quartz, and composite piezoelectric materials, and can convert an electrical signal into an acoustic signal, or convert an acoustic signal into an electrical signal, thereby implementing a scanning function.
In the invention, the anode pin 412 and the cathode pin 413 on the transducer array element 41 are made of hard conductive materials, the required transducer array element 41 can be directly fixed on the substrate 3 according to actual conditions, and then the anode pin 412 and the cathode pin 413 are inserted into the printed circuit board 2 to form the transducer array 4, the transducer array 4 can be in any required shape, if damaged, the transducer array element 41 can be directly pulled out of the printed circuit board 2, so that the replacement of a single transducer array element 41 is realized, and the later maintenance cost of the transducer is greatly reduced; secondly be connected with hall current sensor through anodal pin 412, convert the electric current information that flows through anodal pin 412 to the signal of telecommunication and transmit to processing element on, processing element handles the judgement to the signal of telecommunication to show the judgement result through display device, carry out real-time current monitoring to transducer array element 41, if transducer array element 41 damages, accessible display device observes, convenient in time discovery and the transducer array element 41 of changing the damage. The display device may be a conventional electronic device with a screen such as an independent computer, a display screen, a mobile phone, or a display screen directly integrated with the processing element; in addition, a cavity 11 is arranged on the shell 1 of the transducer, the cavity 11 is filled with the electric insulating liquid, the electric insulating liquid flows in the cavity 11 through the liquid inlet 111 and the liquid outlet 112, cooling and heat dissipation are achieved for the transducer, damage caused by overhigh working temperature of the transducer for a long time is avoided, and the service life of the transducer is prolonged.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A module splicing type phased array transducer is characterized by comprising a shell (1), a printed circuit board (2) arranged in the shell (1), a substrate (3), a transducer array (4) and a monitoring device; the printed circuit board (2) comprises a positive electrode layer (21) and a negative electrode layer (22), the substrate (3) is fixedly covered on the negative electrode layer (22) of the printed circuit board (2), a plurality of through holes (31) are formed in the substrate (3), the transducer array (4) is covered on the substrate (3), the transducer array (4) comprises a plurality of transducer elements (41), each transducer element (41) comprises a crystal (411), a positive electrode pin (412) and a negative electrode pin (413), the positive electrode pin (412) penetrates through the through hole (31) to be connected with the positive electrode layer (21), the negative electrode pin (413) penetrates through the through hole (31) to be electrically connected with the negative electrode layer (22), and the monitoring device is connected with the transducer array (4); each transducer element (41) is detachably connected with the substrate (3) through a through hole (31).
2. The modular split phased array transducer according to claim 1, wherein elastic contacts (5) corresponding to the number of the positive pins (412) and the negative pins (413) are arranged in the positive electrode layer (21) and the negative electrode layer (22) of the printed circuit board (2), the positive electrode layer (21) is provided with a plurality of leads corresponding to the number of the positive pins (412), and the negative electrode layer (22) is provided with a common lead connected with the negative pins (413).
3. A modular tiled phased-array transducer according to claim 1, characterized in that said monitoring means comprises a data processing device, a plurality of detecting elements corresponding to the number of said transducer elements (41), said detecting elements being arranged on said positive electrode layer (21), said data processing device comprising electrically connected processing elements and display means, each of said detecting elements being electrically connected to said processing elements and to a corresponding lead of each positive pin (412), respectively.
4. A modular split phased array transducer according to claim 3, wherein the sensing element is a hall current sensor or a rogowski current sensor.
5. A modular tiled phased-array transducer according to claim 1, characterized by further comprising a wire displacement pipe (8), said wire displacement pipe (8) having one end fixedly connected to said printed circuit board (2) and the other end extending outside the housing (1).
6. A modular tiled phased-array transducer according to claim 1, characterized in that the housing (1) is further provided with a cavity (11) and a protection layer (12), the printed circuit board (2), the substrate (3), the transducer array (4) and the monitoring device are all arranged in the cavity (11), and the protection layer (12) covers the transducer array (4).
7. The modular split phased array transducer according to claim 6, wherein the cavity (11) is provided with a liquid inlet (111), a liquid outlet (112) and a second through hole (113), and a sealing body (114) is arranged around the inner wall of the second through hole (113).
8. A modular tiled phased-array transducer according to claim 7, characterized in that the exhaust tube (8) protrudes out of the housing (1) through the second through hole (113), the exhaust tube (8) being tightly fitted with the second through hole (113) through the sealing body (114).
9. A modular tiled phased-array transducer according to claim 6, characterized in that the protective layer (12) is a polyimide film.
10. A modular tiled phased-array transducer according to any of claims 1 to 9, characterized in that the crystal (411) is one of a piezoelectric ceramic or a single crystal quartz or a composite piezoelectric substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010784927.4A CN111974662A (en) | 2020-08-06 | 2020-08-06 | Module-spliced phased array transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010784927.4A CN111974662A (en) | 2020-08-06 | 2020-08-06 | Module-spliced phased array transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111974662A true CN111974662A (en) | 2020-11-24 |
Family
ID=73445805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010784927.4A Pending CN111974662A (en) | 2020-08-06 | 2020-08-06 | Module-spliced phased array transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111974662A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114345826A (en) * | 2021-12-28 | 2022-04-15 | 北京东方金荣超声电器有限公司 | Megasonic transmitting device for wafer cleaning and sonic cleaning system |
-
2020
- 2020-08-06 CN CN202010784927.4A patent/CN111974662A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114345826A (en) * | 2021-12-28 | 2022-04-15 | 北京东方金荣超声电器有限公司 | Megasonic transmitting device for wafer cleaning and sonic cleaning system |
| CN114345826B (en) * | 2021-12-28 | 2023-01-03 | 北京东方金荣超声电器有限公司 | Megasonic transmitting device for cleaning wafer and sonic cleaning system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102460082B (en) | Flow meter with ultrasound transducer directly connected to and fixed to measurement circuit board | |
| CN215451513U (en) | Battery cell, battery system and electric automobile | |
| CN106461480A (en) | Differential pressure sensor | |
| CN111696303B (en) | Temperature sensing cable, temperature sensing fire detection system comprising same and temperature detection method | |
| CN106461481A (en) | Differential pressure sensing die | |
| CN111974662A (en) | Module-spliced phased array transducer | |
| JP2017520095A (en) | Battery module and battery module signal acquisition unit | |
| CN213103055U (en) | Module-spliced phased array transducer | |
| CN105393350A (en) | Power semiconductor module | |
| JP2008539397A (en) | Grid sensor | |
| US20230207913A1 (en) | Detection mesh, battery cell, battery module, and electric vehicle | |
| JP3983606B2 (en) | Pressure sensor | |
| CN211958245U (en) | Laser array unit and packaging assembly | |
| CN112599937B (en) | Battery collection method and battery collection system | |
| CN115917832A (en) | Flexible printed circuit board for measuring internal pressure of pouch battery cell and method of measuring internal pressure of pouch battery cell | |
| CN104364940B (en) | Purposes for the protective device of electronic structure element, circuit, electrochemical energy accumulator, the method for manufacturing circuit and flexible cap layer | |
| KR20040105486A (en) | Stack cell voltage detecting apparatus for fuel cell | |
| CN112067059A (en) | Temperature vibration composite sensor and manufacturing method thereof | |
| CN109827693A (en) | A kind of crimp type power semiconductor internal pressure distribution measurement system | |
| TWI483445B (en) | Battery, battery fabricating method and system | |
| JPH0979928A (en) | Semiconductor pressure sensor device | |
| WO2018016610A1 (en) | Pressure sensor | |
| CN218847435U (en) | Surface acoustic wave temperature sensor's packaging structure | |
| CN216846323U (en) | Multifunctional sensor | |
| CN216925840U (en) | Temperature acquisition structure and battery device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |