CN111970829A - Application of via filling in thermal management of 5G optical module - Google Patents
Application of via filling in thermal management of 5G optical module Download PDFInfo
- Publication number
- CN111970829A CN111970829A CN202010790538.2A CN202010790538A CN111970829A CN 111970829 A CN111970829 A CN 111970829A CN 202010790538 A CN202010790538 A CN 202010790538A CN 111970829 A CN111970829 A CN 111970829A
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- CN
- China
- Prior art keywords
- optical module
- copper
- thermal management
- circuit board
- screen printing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
Abstract
The invention discloses an application of via hole filling in thermal management of a 5G optical module, which comprises the following steps: carrying out copper-clad plate, blanking, scrubbing, drying, screen printing circuit anti-etching graph, curing, checking and repairing plate, etching copper, removing corrosion-resistant material, drying, screen printing resistance welding and UV curing processing on the circuit board; the invention introduces the through hole filling technology on the design flow of the optical module PCB, so that a through copper heat conduction path is formed from the upper surface to the lower surface of the optical module PCB, and heat on the optical module chip is quickly and efficiently conducted and dissipated to the environment, thereby reducing the working temperature of an optical module transceiver laser and improving the light dispersion and wavelength drift.
Description
Technical Field
The invention belongs to the field of optical modules, and particularly relates to an application of via filling in the thermal management of a 5G optical module.
Background
The thickness of the existing optical module PCB is 1.0mm due to the limitation of interfaces, the 5G optical module has larger power due to large data transmission, the heat dissipation treatment effect directly influences the signal processing of the transceiver laser of the optical module, the existing heat dissipation technology of the copper-embedded PCB and the through hole filling technology are both carried out based on the characteristic of high heat conductivity coefficient of copper, the dimension of the optical module PCB is very small, the dimension of the embedded copper block is smaller than that of the PCB, the dimension of the copper block is 5-10mm, the processing is not facilitated, the reliability is deteriorated when the optical module PCB works under the condition of multiple thermal stress and long-time large temperature range, if the method of plugging copper paste is adopted, the copper paste is mainly resin, the heat conductivity coefficient is only 8-10 w/m.k, which is much lower than 480 w/m.k of pure copper 400-, the thermal conductivity is far inferior to that of pure copper, so a new technology is needed to solve the heat dissipation problem of the PCB.
The invention content is as follows:
the invention aims to solve the problems in the prior art by providing an application of via filling in the thermal management of a 5G optical module.
In order to solve the above problems, the present invention provides a technical solution:
the application of the via filling in the thermal management of the 5G optical module comprises the following steps:
s1, carrying out copper-clad plate, blanking, brushing, drying, screen printing circuit anti-etching pattern, curing, checking and repairing plate, etching copper, removing corrosion-resistant material, drying, screen printing solder mask and UV curing processing on the circuit board;
s2, filling through holes in the circuit board, applying the electroplating through hole filling technology to the 5G optical module PCB, and forming a through copper heat conduction path from the upper surface to the lower surface;
s3, preheating, punching, processing the shape, electrically testing, brushing, drying and processing the pre-coated solder resist antioxidant;
and S4, inspecting and packaging the circuit board, and then leaving the finished product out of the factory.
Preferably, the copper-clad plate is applied to the circuit board in the step S1, and the circuit board can be subjected to single-sided or double-sided copper-clad plate according to actual requirements.
Preferably, in the step S1, in etching copper, a necessary power circuit pattern is transferred to the copper surface layer of the copper clad laminate by a photochemical process, a wire-mesh screen printing process, or an electroplating process, and the pattern is made of a necessary resist material.
Preferably, in the step S1, the etching material is removed by using an organic chemical etching method to etch away an excess portion of the power circuit pattern, and leave all necessary power circuit patterns.
Preferably, in the step S1, the screen printing solder mask performs pattern screen printing solder mask on the circuit, and then screen printing character marking patterns.
Preferably, the preheating punching in step S3 is performed by using a PE punch.
Preferably, the electrical test in step S3 is to perform an open circuit or short circuit test on the circuit board.
Preferably, the solder resist antioxidant in step S3 is composed of dimethyl ketoxime, soybean oil, tert-butyl alcohol and liquid paraffin.
The invention has the beneficial effects that: according to the invention, through hole filling technology is introduced into the design process of the optical module PCB, a through copper heat conduction path is formed from the upper surface to the lower surface of the optical module PCB, and heat on the optical module chip is quickly and efficiently conducted and dissipated to the environment, so that the working temperature of the optical module transceiver laser is reduced, the optical dispersion and wavelength drift are improved, compared with the traditional copper block embedding and copper paste plugging technology, the heat conduction coefficient is greatly improved, the processing is facilitated, the mass production can be realized, and the reliability of the 5G optical module PCB is greatly improved.
Description of the drawings:
for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.
FIG. 1 is a schematic diagram of optical module PCB via filling and blind hole filling according to the present invention;
FIG. 2 is a schematic diagram of optical module PCB via filling according to the present invention;
FIG. 3 is a schematic diagram of a buried copper block of an optical module PCB according to the present invention;
FIG. 4 is a schematic diagram of an optical module PCB plug copper paste according to the present invention.
The specific implementation mode is as follows:
as shown in fig. 1 to 4, the following technical solutions are adopted in the present embodiment:
example (b):
the application of the via filling in the thermal management of the 5G optical module comprises the following steps:
s1, carrying out copper-clad plate, blanking, brushing, drying, screen printing circuit anti-etching pattern, curing, checking and repairing plate, etching copper, removing corrosion-resistant material, drying, screen printing solder mask and UV curing processing on the circuit board;
s2, filling through holes in the circuit board, applying the electroplating through hole filling technology to the 5G optical module PCB, and forming a through copper heat conduction path from the upper surface to the lower surface;
s3, preheating, punching, processing the shape, electrically testing, brushing, drying and processing the pre-coated solder resist antioxidant;
and S4, inspecting and packaging the circuit board, and then leaving the finished product out of the factory.
In the step S1, the circuit board can be subjected to single-sided or double-sided copper-clad plate according to actual requirements, so that different copper-clad plate modes can be selected better according to actual conditions.
In the step S1, during the etching of copper, a photo-chemical method, a wire mesh screen printing method or an electroplating method is added to the copper surface layer of the copper-clad plate, and the necessary power circuit patterns are transferred, and the patterns are all made of necessary anti-corrosion raw materials, so as to facilitate the copper etching operation of the circuit board.
In the step S1, the etching of the resist material is performed by using an organic chemical etching method to etch away an excess portion of the power circuit pattern, so as to leave all necessary power circuit patterns, thereby facilitating the removal of the resist material.
In step S1, the screen printing solder mask performs pattern screen printing solder mask on the circuit first, and then screen prints character marking patterns, so as to perform pattern, character and marking screen printing solder mask on the circuit board better.
In the step S3, the preheating punching is performed by using a PE punching machine, which is convenient for better punching the circuit board.
The electrical test in step S3 is to perform an open circuit or short circuit test on the circuit board, so as to better test the working performance of the circuit board.
The solder resist antioxidant in the step S3 is composed of dimethyl ketoxime, soybean oil, tert-butyl alcohol and liquid paraffin, so that the solder resist antioxidant performance of the circuit board is improved.
The using state of the invention is as follows:
the method comprises the following steps of firstly, carrying out copper-clad plate, blanking, scrubbing, drying, screen printing circuit anti-etching graph, curing, checking and repairing plate, etching copper, removing anti-corrosion material, drying, screen printing resistance welding and UV curing processing on a circuit board;
secondly, filling through holes in the circuit board, applying an electroplating through hole filling technology to the 5G optical module PCB, and forming a through copper heat conduction path from the upper surface to the lower surface;
thirdly, preheating punching and processing the appearance of the circuit board, electrically testing, brushing, drying and processing the pre-coated solder resist antioxidant;
and step four, inspecting and packaging the circuit board, and then delivering the finished product out of the factory.
The thickness of an optical module PCB is 1.0mm due to the limitation of an interface, the power of a 5G optical module is larger due to large data transmission, the heat dissipation treatment influences the signal processing of an optical module transceiver laser, a through copper heat conduction path is formed from the upper surface to the lower surface by applying an electroplating through-hole filling technology to the 5G optical module PCB, and the heat on an optical module chip is quickly and efficiently conducted and dissipated to the environment, so that the working temperature of the optical module transceiver laser is reduced, and the light dispersion and the wavelength drift are improved; the through hole filling is only mature from the technical point of view, but only has high cost and low efficiency, so the application range is not large, but for products with high added value, such as a 5G optical module, the cost is high no matter a copper block is embedded or copper paste is filled to solve the heat dissipation problem, the copper block is embedded to have the reliability problem, the processing is difficult to operate on a small size, and the heat conductivity of the copper paste is far inferior to that of pure copper, so the through hole filling has large advantages in comprehensive consideration.
While there have been shown and described what are at present considered to be the fundamental principles of the invention and its essential features and advantages, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (8)
1. The application of the via filling in the thermal management of the 5G optical module is characterized by comprising the following steps:
s1, carrying out copper-clad plate, blanking, brushing, drying, screen printing circuit anti-etching pattern, curing, checking and repairing plate, etching copper, removing corrosion-resistant material, drying, screen printing solder mask and UV curing processing on the circuit board;
s2, filling through holes in the circuit board, applying the electroplating through hole filling technology to the 5G optical module PCB, and forming a through copper heat conduction path from the upper surface to the lower surface;
s3, preheating, punching, processing the shape, electrically testing, brushing, drying and processing the pre-coated solder resist antioxidant;
and S4, inspecting and packaging the circuit board, and then leaving the finished product out of the factory.
2. The application of the via filling in the 5G optical module thermal management according to claim 1, wherein the copper-clad plate is applied to the circuit board in the step S1, and the circuit board can be subjected to single-sided or double-sided copper-clad plate according to actual requirements.
3. The use of via filling in 5G optical module thermal management as claimed in claim 1, wherein the step S1 is to etch copper by applying a photo-chemical method, a wire-mesh screen printing method or an electroplating method to the copper surface layer of the copper-clad laminate, and transferring the necessary power circuit pattern, which is made of the necessary resist material.
4. The use of via filling in 5G optical module thermal management according to claim 1, wherein the step S1 is performed by etching away an excess portion of the power circuit pattern by organic chemical etching in the etching-resistant material to leave all necessary power circuit patterns.
5. The application of the via filling in the 5G optical module for thermal management according to claim 1, wherein in the step S1, the wire is subjected to graphic screen printing solder resistance by the screen printing solder resistance, and then a character marking graphic is screen printed.
6. The use of via filling in 5G optical module thermal management according to claim 1, wherein the pre-heating punching in step S3 is performed by a PE punch.
7. The use of via filling in 5G optical module thermal management according to claim 1, wherein the electrical test in step S3 is an open circuit or short circuit test on a circuit board.
8. The use of the via filling of claim 1 for thermal management of a 5G optical module, wherein the solder resist antioxidant in step S3 is composed of dimethylketoxime, soybean oil, tert-butanol and liquid paraffin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010790538.2A CN111970829A (en) | 2020-08-07 | 2020-08-07 | Application of via filling in thermal management of 5G optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010790538.2A CN111970829A (en) | 2020-08-07 | 2020-08-07 | Application of via filling in thermal management of 5G optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111970829A true CN111970829A (en) | 2020-11-20 |
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ID=73365803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010790538.2A Pending CN111970829A (en) | 2020-08-07 | 2020-08-07 | Application of via filling in thermal management of 5G optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111970829A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110110048A1 (en) * | 2009-11-11 | 2011-05-12 | Lima David J | Thermal interface members for removable electronic devices |
| CN106961806A (en) * | 2017-04-21 | 2017-07-18 | 深圳崇达多层线路板有限公司 | The preparation method for burying copper billet is substituted in a kind of wiring board |
| CN109936916A (en) * | 2019-03-05 | 2019-06-25 | 惠州市特创电子科技有限公司 | A kind of hole internal plug copper billet 5G high frequency circuit board and preparation method thereof |
-
2020
- 2020-08-07 CN CN202010790538.2A patent/CN111970829A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110110048A1 (en) * | 2009-11-11 | 2011-05-12 | Lima David J | Thermal interface members for removable electronic devices |
| CN106961806A (en) * | 2017-04-21 | 2017-07-18 | 深圳崇达多层线路板有限公司 | The preparation method for burying copper billet is substituted in a kind of wiring board |
| CN109936916A (en) * | 2019-03-05 | 2019-06-25 | 惠州市特创电子科技有限公司 | A kind of hole internal plug copper billet 5G high frequency circuit board and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 任德齐: "《电子线路CAD项目化教程》", 31 January 2014 * |
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Application publication date: 20201120 |