CN111969000A - Image sensor packaging method, auxiliary die and image sensor - Google Patents
Image sensor packaging method, auxiliary die and image sensor Download PDFInfo
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- CN111969000A CN111969000A CN202011142445.5A CN202011142445A CN111969000A CN 111969000 A CN111969000 A CN 111969000A CN 202011142445 A CN202011142445 A CN 202011142445A CN 111969000 A CN111969000 A CN 111969000A
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
The invention provides an image sensor packaging method, an auxiliary die and an image sensor. The method comprises the following steps: mounting the bare chip of the image sensor on a temporary carrier plate; bonding a bonding pad of the bare chip of the image sensor and the metal circuit layer on the temporary carrier plate by using a bonding wire; the method comprises the following steps that an auxiliary die is used for pressing an image sensor bare chip, so that a light sensing area of the image sensor bare chip is located in a first space, a bonding pad of the image sensor bare chip and a metal circuit layer are located in a second space, and the first space and the second space are not communicated with each other; filling a plastic packaging material into the second space to realize plastic packaging molding; releasing the auxiliary mold to form an image sensor plastic package body; removing the temporary carrier plate at the bottom of the image sensor plastic package body; and attaching the filter glass to the upper surface of the plastic package body to obtain the packaged image sensor. The image sensor packaging method with small appearance, high reliability, flash prevention and small warpage is provided, wherein the bonding wire is embedded in the packaging body.
Description
Technical Field
The invention relates to the technical field of image sensors, in particular to an image sensor packaging method, an image sensor packaging auxiliary die and an image sensor.
Background
At present, the packages for image sensors mainly include COB (Chip On Board), MOB (Molding On Board), MOC (Molding On Chip), and CSP (Chip Scale Packaging). Image sensors with higher pixels are packaged, basically using COB, MOB and MOC packages, while CSP is mainly applied to low-pixel image sensor packages.
COB packaging has the advantages of simple process, low cost, convenience in rear-end SMT installation and the like. However, for the package of the image sensor, the COB cannot easily satisfy a higher pin count, and cannot satisfy a small and thin package; in addition, in the COB packaged image sensor, the bonding wire is exposed in the COB cavity, and the anti-vibration performance is poor. Along with the gradual improvement of image sensor performance, the sensitization region is bigger and bigger to and the increase of camera module quantity, make image sensor size bigger and bigger, put forward higher requirement to miniaturization, the high reliability of image sensor encapsulation.
The packaging technology for packaging the image sensor is developed in recent years, the packaging in the MOB simultaneously packages passive devices (such as capacitors and resistors) in a plastic mode, the pollution risk of the passive devices to a bare chip photosensitive area of the image sensor can be reduced, and in the MOC packaging technology, bonding wires are also simultaneously packaged in a plastic mode, so that the reliability of the image sensor is improved. However, the MOB and MOC packaged image sensors have large thickness and cannot realize miniaturized packaging; and plastic package is carried out through dispensing, so that flash is easy to occur, and the photosensitive area of the bare chip of the image sensor is polluted. Meanwhile, the MOB and MOC are packaged in a plastic packaging process, and the risk of reducing the precision of the image sensor due to overlarge warping is easy to occur.
The CSP package has the advantages of small package size, excellent electrical performance and the like. But the cost is high due to the reasons of high manufacturing difficulty, complex process and the like. Wafer Level Package (WLP) and 3D packages, which are rapidly developed in recent years, have smaller Package sizes and better electrical characteristics. However, the technology difficulty is high and the packaging yield is low because the technology mainly relates to the TSV (Through Silicon Via) technology, and the method is not suitable for mass production. In summary, the current packaging method of the image sensor cannot well meet the rapid development of the image sensor.
Disclosure of Invention
The invention provides an image sensor packaging method, an auxiliary die and an image sensor, aiming at the defects existing in the aspect of the current image sensor packaging, in particular to the defects of COB (chip on Board), MOB (Metal oxide semiconductor) and MOC (Metal oxide semiconductor) packaging, and providing the image sensor packaging method with small appearance, high reliability, flash prevention and small warpage of a bonding wire embedded in a packaging body, wherein the method is very suitable for the mass production of the image sensor. The auxiliary die assists in realizing the encapsulation of the image sensor, effectively prevents flash and realizes the batch production of the image sensor.
In order to achieve the above object, a first aspect of the present invention provides an image sensor packaging method, the method comprising:
mounting the bare chip of the image sensor on a temporary carrier plate;
bonding a bonding pad of the bare chip of the image sensor and a metal circuit layer corresponding to the bonding pad on the temporary carrier plate by using a bonding wire;
pressing the image sensor bare chip by using an auxiliary die to enable a photosensitive area of the image sensor bare chip to be located in a first space, enabling a bonding pad of the image sensor bare chip and a metal circuit layer on the temporary carrier plate to be located in a second space, and enabling the first space and the second space not to be communicated with each other;
filling a plastic packaging material into the second space to realize plastic packaging molding;
releasing the auxiliary mold to form an image sensor plastic package body;
removing the temporary carrier plate at the bottom of the image sensor plastic package body;
and attaching filter glass to the upper surface of the plastic package body to obtain the packaged image sensor.
According to the image sensor packaging method, the bonding wire of the image sensor is embedded into the packaging body by means of the auxiliary die, the small shape can be realized, material overflow can be effectively prevented, meanwhile, the packaging heights of the bonding pads in all directions of the same image sensor are effectively guaranteed to be the same, and the finally mounted filter glass and the image sensor light-sensitive area have higher parallelism. The temporary carrier plate is used for assisting in filling the plastic package material, so that the warping of the image sensor caused by the temperature rise in the process of filling the plastic package material is effectively avoided.
Furthermore, the bearing surface of the temporary carrier plate is coated with temporary bonding glue, and the surface of the temporary bonding glue is provided with a metal circuit layer corresponding to the bonding pad of the bare chip of the image sensor. The temporary bonding glue has the strength similar to that of the patch glue and can provide the adhesion force for adhering the bare chip of the image sensor. And a chip mounting space for processing the bare chip of the sensor is reserved between the metal circuit layers, so that the bare chip of the sensor can be conveniently mounted.
Further, the mounting of the bare chip of the image sensor on the temporary carrier board includes:
and attaching the image sensor bare chip on the temporary bonding adhesive, enabling the photosensitive area of the image sensor bare chip to be far away from the temporary bonding adhesive, and enabling the bonding pads of the image sensor bare chip to be in one-to-one correspondence with the metal circuit layers on the surface of the temporary bonding adhesive. The image sensor bare chip is pasted in the paster space, and the bonding pads of the pasted sensor bare chip can correspond to the metal circuit layer one by one, so that bonding is facilitated.
Further, the compressing the image sensor bare chip using an auxiliary mold includes:
placing the bonded bare chip of the image sensor on a first auxiliary film in auxiliary plastic packaging equipment, so that the temporary carrier plate is in contact with the first auxiliary film;
placing a lower mold of the auxiliary mold on a lower portion of the first auxiliary film, placing a second auxiliary film on an upper portion of the image sensor bare chip, and placing an upper mold of the auxiliary mold on an upper portion of the second auxiliary film;
closing the upper die and the lower die;
and the negative pressure adsorption enables the upper die and the first auxiliary film to be tightly absorbed, and the lower die and the second auxiliary film to be tightly absorbed and tightly press the bare chip of the image sensor. With the help of auxiliary film plastic envelope equipment, can realize mass production, can counterpoint through numerical control equipment simultaneously in process of production, carry out the negative pressure and adsorb the messenger go up the mould with first auxiliary film is inhaled tightly, the lower mould with the second auxiliary film is inhaled tightly and is compressed tightly image sensor bare chip reduces the flash risk of plastic envelope material.
The bare chip of the image sensor is attached to the temporary carrier plate, so that the temporary carrier plate needs to meet the requirement that the bare chip of the image sensor is not deformed due to warping, thermal expansion and the like in the production process of the image sensor, and the deformation of the temporary carrier plate is avoided. Optionally, the temporary carrier plate is a rigid carrier plate, and the thermal expansion coefficient and young's modulus of the temporary carrier plate are matched with the bare chip of the image sensor, the temporary bonding adhesive and the plastic package material, so that warpage can be effectively controlled. The temporary carrier plate can not deform at the temperature of more than 175 ℃ and can bear the corrosion of chemicals.
Optionally, the temporary carrier plate is a steel plate, a glass plate or a silicon wafer.
Optionally, the temporary bonding glue is debonding glue; get rid of the interim support plate of image sensor plastic-sealed body bottom includes: and removing the temporary carrier plate at the bottom of the image sensor plastic package body by bonding and debonding the temporary bonding glue. Optionally, the debonding glue is a high temperature debonding glue, a photolytic bonding glue, a chemical corrosion debonding glue, or a regional debonding glue. The bonding glue can be separated through separation bonding treatment, the separation bonding treatment is simple, safe and easy to achieve, the traditional bonding glue such as the patch glue can provide adhesion force, but the removal mode is complex, the damage cannot be removed, and the method is not suitable for being used in the batch production process.
Optionally, the metal circuit layer is plated or etched on the temporary bonding glue.
The invention provides an auxiliary die for packaging an image sensor, which comprises an upper die and a lower die, wherein the upper die and the lower die are tightly attached to an image sensor bare chip which is arranged on a temporary carrier plate through die pressing and is bonded with a bonding pad through a metal circuit layer, a photosensitive area of the image sensor bare chip is positioned in a first space, the metal circuit layer and the bonding pad of the image sensor bare chip are positioned in a second space, and the first space and the second space are not communicated with each other. The auxiliary die separates the photosensitive area of the bare chip of the image sensor from the bonding pad, and can effectively prevent glue overflow.
Furthermore, the lower die is a horizontal plate, the upper die is provided with a first cavity and a second cavity, the first cavity is used for accommodating a photosensitive area of the image sensor bare chip, the second cavity is used for accommodating the metal circuit layer and a bonding pad of the image sensor bare chip, after the upper die and the lower die are closed and tightly press the image sensor bare chip, the first cavity and the image sensor bare chip form the first space, and the second cavity and the image sensor bare chip form the second space. The upper die can be provided with a plurality of first cavities and second cavities and is used for mass production of the image sensor modules.
Furthermore, the upper die is provided with a filling port communicated with the second cavity, and a plastic package material is filled into the second space through the filling port in the packaging process of the image sensor so as to realize plastic package molding;
and the upper die and the lower die are provided with negative pressure holes for sucking the auxiliary film tightly through negative pressure during vacuumizing.
In another aspect, the invention provides an image sensor, which is manufactured by the image sensor packaging method.
According to the technical scheme, for COB packaging commonly used for the image sensor, the auxiliary die is adopted for auxiliary packaging, so that the chip packaging structure has a thinner packaging size and is easy to realize miniaturized packaging; after the temporary carrier plate is removed, the back surface of the bare chip of the image sensor is directly exposed, so that the bare chip of the image sensor has excellent heat dissipation performance; in the process, the lead is wrapped by the plastic package material through the molding and sealing process, so that the vibration resistance of the image sensor is improved, and the reliability is improved. Compared with the MOB and MOC packaging, the packaging structure has a thinner packaging appearance and reduces the flash risk, thereby being beneficial to mass production. By means of the temporary carrier plate and the temporary bonding glue, the matching degree of the thermal expansion coefficient of the material in the plastic packaging process is higher, and the warping is reduced. Compared with CSP, WLP and 3D packaging, the invention utilizes the existing mature process and equipment, and has lower manufacturing cost.
Additional features and advantages of embodiments of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention without limiting the embodiments of the invention. In the drawings:
FIG. 1 is a flow chart of an image sensor packaging method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an auxiliary mold for packaging an image sensor according to an embodiment of the present invention;
FIG. 3 is a schematic top view of an auxiliary mold for packaging an image sensor according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a temporary carrier for single-chip/single-column bare chip package according to the present invention;
FIG. 5 is a schematic diagram illustrating the effect of the present invention after a single image sensor die is mounted on a single image sensor die package;
FIG. 6 is a diagram illustrating the effects of the single image sensor die packaging bonding pad and metal circuit layer;
FIG. 7 is a schematic diagram showing the effects of the single/single-row bare chip packaging auxiliary mold of the present invention after mold closing and plastic package material filling;
FIG. 8 is a schematic diagram showing the effect of the single/single row image sensor die after the die is detached from the auxiliary mold;
FIG. 9 is a schematic diagram illustrating the effect of the single/single-row bare chip image sensor package with the temporary carrier removed according to the present invention;
fig. 10 is a schematic diagram of the effect of the single-chip/single-column image sensor bare chip package after being attached with filter glass according to the present invention.
Description of the reference numerals
The manufacturing method comprises the following steps of 1-a temporary carrier plate, 2-a temporary bonding adhesive, 3-a metal circuit layer, 4-an image sensor bare chip, 5-a bonding pad, 6-a photosensitive area, 7-a bonding wire, 8-a lower die, 9-an upper die, 10-a first space, 11-a second space, 12-a plastic package material, 13-a first auxiliary film, 14-filter glass, 15-a first cavity, 16-a second cavity and 17-a second auxiliary film.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
Fig. 1 is a flowchart of an image sensor packaging method according to an embodiment of the present invention. As shown in fig. 1, the method includes:
1) the bare chip of the image sensor is mounted on the temporary carrier plate, and the method specifically comprises the following steps:
and attaching the image sensor bare chip on the temporary bonding adhesive, enabling the photosensitive area of the image sensor bare chip to be far away from the temporary bonding adhesive, and enabling the bonding pads of the image sensor bare chip to be in one-to-one correspondence with the metal circuit layers on the surface of the temporary bonding adhesive. That is, the photosensitive area of the bare chip of the image sensor faces upward. The image sensor bare chip is pasted in the paster space, and the bonding pads of the pasted sensor bare chip can correspond to the metal circuit layer one by one, so that bonding is facilitated.
2) Bonding a bonding pad of the image sensor bare chip and a metal circuit layer corresponding to the bonding pad on the temporary carrier plate by using a bonding wire, wherein the material of the bonding wire can be gold, silver alloy, copper, aluminum and the like;
3) pressing the image sensor bare chip by using an auxiliary die to enable a photosensitive area of the image sensor bare chip to be located in a first space, enabling a bonding pad of the image sensor bare chip and a metal circuit layer on the temporary carrier plate to be located in a second space, and enabling the first space and the second space not to be communicated with each other;
4) filling a plastic packaging material into the second space to realize plastic packaging molding;
5) releasing the auxiliary mold to form an image sensor plastic package body;
6) removing the temporary carrier plate at the bottom of the image sensor plastic package body;
7) and attaching filter glass to the upper surface of the plastic package body to obtain the packaged image sensor.
According to the image sensor packaging method, the bonding wire of the image sensor is embedded into the packaging body by means of the auxiliary die, the small shape can be realized, material overflow can be effectively prevented, meanwhile, the packaging heights of the bonding pads in all directions of the same image sensor are effectively guaranteed to be the same, and the finally mounted filter glass and the image sensor light-sensitive area have higher parallelism. The temporary carrier plate is used for assisting in filling the plastic package material, so that the warping of the image sensor caused by the temperature rise in the process of filling the plastic package material is effectively avoided.
Furthermore, the bearing surface of the temporary carrier plate is coated with temporary bonding glue, and the surface of the temporary bonding glue is provided with a metal circuit layer corresponding to the bonding pad of the bare chip of the image sensor. The temporary bonding glue is debonding glue; get rid of the interim support plate of image sensor plastic-sealed body bottom includes: and removing the temporary carrier plate at the bottom of the image sensor plastic package body by bonding and debonding the temporary bonding glue. The temporary bonding glue has the strength similar to that of the patch glue and can provide the adhesion force for adhering the bare chip of the image sensor. And a chip mounting space for processing the bare chip of the sensor is reserved between the metal circuit layers, so that the bare chip of the sensor can be conveniently mounted.
The bare chip of the image sensor is attached to the temporary carrier plate, so that the temporary carrier plate needs to meet the requirement that the bare chip of the image sensor is not deformed due to warping, thermal expansion and the like in the production process of the image sensor, and the deformation of the temporary carrier plate is avoided. Optionally, the temporary carrier plate is a rigid carrier plate, and the thermal expansion coefficient and young's modulus of the temporary carrier plate are matched with the bare chip of the image sensor, the temporary bonding adhesive and the plastic package material, so that warpage can be effectively controlled. The temporary carrier plate can not deform at the temperature higher than 175 ℃ and can bear the corrosion of chemicals, such as a carrier plate made of steel, silicon and the like.
Optionally, the temporary carrier plate is a steel plate, a glass plate or a silicon wafer, and in some embodiments of the present invention, the temporary carrier plate is transparent, for example, a glass carrier plate.
Optionally, the debonding glue is a high temperature debonding glue, a photolytic bonding glue, a chemical corrosion debonding glue, or a regional debonding glue. The bonding glue can be separated through separation bonding treatment, the separation bonding treatment is simple, safe and easy to achieve, the traditional bonding glue such as the patch glue can provide adhesion force, but the removal mode is complex, the damage cannot be removed, and the method is not suitable for being used in the batch production process. It should be noted that the high-temperature debonding glue needs to be a debonding glue with a debonding temperature greater than the thermosetting temperature of the molding compound.
The metal circuit layer is arranged on the temporary bonding glue through electroplating or etching and other processes. According to different packaging modes of the image sensor bare chip, different metal circuit layers exist, and when the image sensor bare chip is in a packaging form such as a square flat non-lead package (QFN), a double-side flat non-lead package (DFN) or a plastic chip carrier Package (PLCC) with a lead, the metal circuit layer can be a QFN or DFN frame; when the image sensor bare chip is a Land Grid Array (LGA) package or a Ball Grid Array (BGA) package, the metal wiring layer may be a multi-layered stereoscopic wiring layer.
Further, the compressing the image sensor bare chip using an auxiliary mold includes:
placing the bonded bare chip of the image sensor on a first auxiliary film in auxiliary plastic packaging equipment, so that the temporary carrier plate is in contact with the first auxiliary film;
placing a lower mold of the auxiliary mold on a lower portion of the first auxiliary film, placing a second auxiliary film on an upper portion of the image sensor bare chip, and placing an upper mold of the auxiliary mold on an upper portion of the second auxiliary film;
closing the upper die and the lower die;
and the negative pressure adsorption enables the upper die and the first auxiliary film to be tightly absorbed, and the lower die and the second auxiliary film to be tightly absorbed and tightly press the bare chip of the image sensor. With the help of auxiliary film plastic envelope equipment, can realize mass production, can counterpoint through numerical control equipment simultaneously in process of production, carry out the negative pressure and adsorb the messenger go up the mould with first auxiliary film is inhaled tightly, the lower mould with the second auxiliary film is inhaled tightly and is compressed tightly image sensor bare chip reduces the flash risk of plastic envelope material.
Optionally, the molding compound is a thermosetting molding compound. The molding compound may be transparent, black, etc.
Alternatively, the filter glass may be UV glass.
Fig. 2 is a schematic diagram of an auxiliary mold for image sensor packaging according to an embodiment of the present invention, the auxiliary mold for image sensor packaging includes an upper mold 9 and a lower mold 8, the upper mold 9 and the lower mold 8 are tightly attached to an image sensor die 4 mounted on a temporary carrier 1 by die pressing, and bonding between a metal wiring layer 3 and a pad 5 is completed, such that a light sensing region 6 of the image sensor die 4 is located in a first space 10, the metal wiring layer 3 and the pad 5 of the image sensor die 4 are located in a second space 11, and the first space 10 and the second space 11 are not communicated with each other. The auxiliary mold separates the photosensitive area 6 of the image sensor bare chip 4 from the bonding pad 5, and can effectively prevent glue overflow.
Further, the lower mold 8 is a horizontal plate, the upper mold 9 is provided with a first cavity 15 and a second cavity 16, the first cavity 15 is used for accommodating the photosensitive area 6 of the image sensor bare chip 4, the second cavity 16 is used for accommodating the metal circuit layer 3 and the bonding pad 5 of the image sensor bare chip 4, after the upper mold 9 and the lower mold 8 are closed and press the image sensor bare chip 4, the first cavity 15 and the image sensor bare chip 4 form the first space 10, the second cavity 16 and the image sensor bare chip 4 form the second space 11, and the cavity wall of the first cavity 15 effectively blocks the first space and the second space from communicating with each other, as shown in fig. 7. When the image sensor module is produced in batch, the upper die 9 is provided with a plurality of first cavities 15, the cavity walls of the first cavities 15 and the outer wall of the upper die 9 form a second cavity 16, and the opening positions of the first cavities 15 are designed according to the array mode of the image sensor module. As shown in fig. 3, a schematic diagram of an upper mold used for packaging two image sensors is shown, and the upper mold is configured with a plurality of first cavities 15 according to an arrangement rule of image sensor modules in an actual production process to meet production requirements. The sizes of the upper die 9 and the lower die 8 can also be designed according to the sizes of the image sensor bare chip 4 and the image sensor module.
Further, the upper die 9 is provided with a filling port communicated with the second cavity 16, and a plastic package material 12 is filled into the second space 11 through the filling port in the packaging process of the image sensor, so as to realize plastic package molding;
and the upper die 9 and the lower die 8 are provided with negative pressure holes for sucking the auxiliary film tightly through negative pressure during vacuumizing. The filling opening can be arranged on the side surface or the upper surface.
In another aspect, the invention provides an image sensor, which is manufactured by the image sensor packaging method.
An example of a package for a small-profile, high-reliability image sensor is described in detail below with reference to fig. 4-10.
1) Paving a temporary bonding adhesive 2 on a temporary carrier plate 1, reserving a chip mounting space of a bare chip 4 of an image sensor, generating a metal circuit layer 3 by etching and the like, and fixing the metal circuit layer 4 on the temporary carrier plate 1 through the temporary bonding adhesive 2, as shown in fig. 3; in this example, the temporary carrier 1 is a silicon Wafer, and the temporary bonding glue 2 is Wafer Bond HT1010 from Brewer Sciences. The metal circuit layer 3 is a single-layer circuit, and the packaging shape is QFN packaging.
2) An image sensor bare chip 4 is pasted on a temporary carrier plate 1, the front surface of a photosensitive area 6 of the image sensor bare chip 4 faces upwards, and bonding pads 5 of the image sensor bare chip 4 are distributed around the image sensor bare chip 4;
3) wire bonding between the bonding pad 5 of the image sensor bare chip 4 and the metal circuit layer 3 is realized by using a bonding wire 7; the wire bonding material used in this example was gold.
4) Placing an image sensor bare chip 4 subjected to wire bonding into an auxiliary film plastic package device, wherein the image sensor bare chip 4 is positioned on a first auxiliary film 13, a temporary carrier plate 1 is contacted with the first auxiliary film 13, a lower die 8 of the auxiliary die is placed at the lower part of the first auxiliary film 13, a second auxiliary film 17 is placed at the upper part of the image sensor bare chip 4, an upper die 9 of the auxiliary die is placed at the upper part of the second auxiliary film 17, the upper die 9 is attached to the lower die 8, the upper die 9 is tightly absorbed by the first auxiliary film 13 through negative pressure absorption, the lower die 8 is tightly absorbed by the second auxiliary film 17, the upper die 9 and the lower die 8 tightly press a region between a photosensitive region 6 and a bonding pad 5 of the image sensor bare chip 4 without damaging the photosensitive region 6 and a bonding wire 7 of the image sensor bare chip 4, so that the photosensitive region 6 of the image sensor bare chip 5 is positioned in a first space 10, the metal circuit layer 3 and the pad 5 of the image sensor bare chip 4 are located in a second space 11, and the first space 10 and the second space 11 are not communicated with each other. And filling a plastic package material 12 into the second space 11 to realize plastic package molding. The plastic encapsulation device selected in this example is an auxiliary film plastic encapsulation device, and the shapes of the upper mold 9 and the lower mold 8 are shown in fig. 2 and 3, where it is necessary to protect the photosensitive area 6 of the bare chip 4 of the image sensor.
5) The upper die 9 and the lower die 8 are separated; the molding compound 12 used in this example was EME-G750N, which was a black molding compound.
6) Removing the temporary carrier plate 1 and the temporary bonding glue 2; the temporary carrier plate 1 separation method selected in the embodiment is high-temperature separation, and when the temperature is 180 ℃, the viscosity of the temporary bonding glue 2 Wafer Bond HT1010 disappears, so that the temporary carrier plate 1 silicon Wafer is separated from the image sensor packaging body. The image sensor bare chip 4 is embedded in a molding compound 12.
7) And attaching a filter glass 14 on the upper surface of the molding compound 12 to form an image sensor, wherein in the embodiment, the filter glass is UV glass.
It should be noted that, in the drawings, only a schematic illustration of a single or single column of bare chips of an image sensor is shown for packaging, and multiple columns of bare chips of the image sensor can be extended and packaged simultaneously in an actual production process.
Compared with the traditional COB packaging, MOB packaging and MOC packaging, the image sensor packaged by the method provided by the invention reduces the number of substrates, effectively reduces the volume of the image sensor, and increases the stability by packaging the bonding wire in the plastic packaging material; compared with CSP packaging, the packaging method is simpler and easier to realize.
While the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the embodiments of the present invention are not limited to the details of the above embodiments, and various simple modifications can be made to the technical solution of the embodiments of the present invention within the technical idea of the embodiments of the present invention, and the simple modifications are within the scope of the embodiments of the present invention. It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention will not be described separately for the various possible combinations.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as disclosed in the embodiments of the present invention as long as it does not depart from the spirit of the embodiments of the present invention.
Claims (13)
1. An image sensor packaging method, the method comprising:
mounting the bare chip of the image sensor on a temporary carrier plate;
bonding a bonding pad of the bare chip of the image sensor and a metal circuit layer corresponding to the bonding pad on the temporary carrier plate by using a bonding wire;
pressing the image sensor bare chip by using an auxiliary die to enable a photosensitive area of the image sensor bare chip to be located in a first space, enabling a bonding pad of the image sensor bare chip and a metal circuit layer on the temporary carrier plate to be located in a second space, and enabling the first space and the second space not to be communicated with each other;
filling a plastic packaging material into the second space to realize plastic packaging molding;
releasing the auxiliary mold to form an image sensor plastic package body;
removing the temporary carrier plate at the bottom of the image sensor plastic package body;
and attaching filter glass to the upper surface of the plastic package body to obtain the packaged image sensor.
2. The method for packaging an image sensor as claimed in claim 1, wherein a carrying surface of the temporary carrier board is coated with a temporary bonding glue, and a metal circuit layer corresponding to the bonding pad of the bare image sensor chip is disposed on the surface of the temporary bonding glue.
3. The method of claim 2, wherein the step of mounting the bare chip of the image sensor on the temporary carrier comprises:
and attaching the image sensor bare chip on the temporary bonding adhesive, enabling the photosensitive area of the image sensor bare chip to be far away from the temporary bonding adhesive, and enabling the bonding pads of the image sensor bare chip to be in one-to-one correspondence with the metal circuit layers on the surface of the temporary bonding adhesive.
4. The method of claim 3, wherein the compressing the image sensor die using an auxiliary mold comprises:
placing the bonded bare chip of the image sensor on a first auxiliary film in auxiliary plastic packaging equipment, so that the temporary carrier plate is in contact with the first auxiliary film;
placing a lower mold of the auxiliary mold on a lower portion of the first auxiliary film, placing a second auxiliary film on an upper portion of the image sensor bare chip, and placing an upper mold of the auxiliary mold on an upper portion of the second auxiliary film;
closing the upper die and the lower die;
and the negative pressure adsorption enables the upper die and the first auxiliary film to be tightly absorbed, and the lower die and the second auxiliary film to be tightly absorbed and tightly press the bare chip of the image sensor.
5. The method for packaging an image sensor as claimed in claim 2, wherein the temporary carrier is a rigid carrier, and the thermal expansion coefficient and young's modulus of the temporary carrier are matched with those of the bare image sensor chip, the temporary bonding adhesive and the molding compound.
6. The image sensor packaging method of claim 5, wherein the temporary carrier is a steel plate, a glass plate, or a silicon wafer.
7. The image sensor packaging method of claim 2, wherein the temporary bonding paste is a debonding paste; get rid of the interim support plate of image sensor plastic-sealed body bottom includes:
and removing the temporary carrier plate at the bottom of the image sensor plastic package body by bonding and debonding the temporary bonding glue.
8. The method of claim 7, wherein the debonding glue is a high temperature debonding glue, a photolytic bonding glue, a chemical etching debonding glue, or a regional debonding glue.
9. The image sensor packaging method of claim 2, wherein the metal line layer is plated or etched on the temporary bonding glue.
10. An auxiliary mold for image sensor packaging, comprising: the upper die and the lower die are tightly attached to the image sensor bare chip which is arranged on the temporary carrier plate through die pressing and is bonded with the bonding pad through the metal circuit layer, the photosensitive area of the image sensor bare chip is located in a first space, the metal circuit layer and the bonding pad of the image sensor bare chip are located in a second space, and the first space and the second space are not communicated with each other.
11. The auxiliary mold for packaging an image sensor as claimed in claim 10, wherein the lower mold is a horizontal plate, the upper mold defines a first cavity and a second cavity, the first cavity is configured to receive a photosensitive region of the image sensor die, the second cavity is configured to receive the metal wiring layer and a bonding pad of the image sensor die, the first cavity and the image sensor die form the first space, and the second cavity and the image sensor die form the second space after the upper mold and the lower mold are clamped to press the image sensor die.
12. The auxiliary mold for packaging an image sensor as claimed in claim 11, wherein the upper mold is provided with a filling port communicated with the second cavity, and a plastic package material is filled into the second space through the filling port in the packaging process of the image sensor to realize plastic package molding;
and the upper die and the lower die are provided with negative pressure holes for sucking the auxiliary film tightly through negative pressure during vacuumizing.
13. An image sensor fabricated using the image sensor packaging method of any one of claims 1-9.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112645279A (en) * | 2020-12-23 | 2021-04-13 | 东南大学 | Packaging method of MEMS wind speed and direction sensor |
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| JP2003332542A (en) * | 2002-05-09 | 2003-11-21 | Shinko Electric Ind Co Ltd | Semiconductor device and method of manufacturing the same |
| CN101667546A (en) * | 2008-09-02 | 2010-03-10 | 恩益禧电子股份有限公司 | Method of manufacturing semiconductor device in which functional portion of element is exposed |
| EP2490250A1 (en) * | 2011-02-18 | 2012-08-22 | Robert Bosch GmbH | Mould module with sensor element |
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| JP2003332542A (en) * | 2002-05-09 | 2003-11-21 | Shinko Electric Ind Co Ltd | Semiconductor device and method of manufacturing the same |
| CN101667546A (en) * | 2008-09-02 | 2010-03-10 | 恩益禧电子股份有限公司 | Method of manufacturing semiconductor device in which functional portion of element is exposed |
| EP2490250A1 (en) * | 2011-02-18 | 2012-08-22 | Robert Bosch GmbH | Mould module with sensor element |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112645279A (en) * | 2020-12-23 | 2021-04-13 | 东南大学 | Packaging method of MEMS wind speed and direction sensor |
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