CN111961430A - Sulfur-free flame-retardant adhesive - Google Patents
Sulfur-free flame-retardant adhesive Download PDFInfo
- Publication number
- CN111961430A CN111961430A CN202010660454.7A CN202010660454A CN111961430A CN 111961430 A CN111961430 A CN 111961430A CN 202010660454 A CN202010660454 A CN 202010660454A CN 111961430 A CN111961430 A CN 111961430A
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- CN
- China
- Prior art keywords
- parts
- free
- sulfur
- halogen
- epoxy resin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention relates to a sulfur-free flame retardant adhesive, which comprises, by weight, 30-80 parts of halogen-free epoxy resin, 15-35 parts of halogen-free macromolecular epoxy resin in the halogen-free epoxy resin; 0.1-8 parts of a curing agent; 5-60 parts of a flame retardant; 0.1-5 parts of an auxiliary agent. According to the scheme, the sulfur-free halogen-free macromolecular epoxy resin is adopted, vulcanized rubber is omitted, so that the adhesive does not contain harmful substance elements such as sulfur elements and antimonide, the environment pollution is avoided, the service life of lamp beads in the LED lamp tube is prevented from being reduced due to the influence of the sulfur elements, the sulfur-free flame-retardant adhesive has good flame retardance, peeling strength, electrical property and welding heat resistance, the flame retardance grade of the flexible copper-clad plate prepared by using the composition reaches UL-94V0 grade, the heat resistance and the peeling strength are good, the soldering resistance is high, and the flexible copper-clad plate is not layered and does not foam after being subjected to tin immersion at 288 ℃ for 30 seconds.
Description
Technical Field
The invention belongs to the technical field of flexible copper clad plates, and particularly relates to a sulfur-free flame retardant adhesive.
Background
The flexible copper clad laminate is also called as a Flexible Printed Circuit (FPC), can be used for an LED lamp tube plate, and needs an adhesive in the process of manufacturing the FPC. However, the existing adhesive adopts synthetic vulcanized rubber, and sulfur element reduces the service life of lamp beads in the LED lamp tube.
Disclosure of Invention
The main object of the present invention is to provide a sulfur-free flame retardant adhesive which can eliminate the sulfur element.
In order to achieve the above-mentioned primary object, the present invention provides a sulfur-free flame retardant adhesive comprising, in parts by weight,
30-80 parts of halogen-free epoxy resin, wherein the halogen-free macromolecular epoxy resin in the halogen-free epoxy resin is 15-35 parts;
0.1-8 parts of a curing agent;
5-60 parts of a flame retardant;
0.1-5 parts of an auxiliary agent.
According to the scheme, the sulfur-free halogen-free macromolecular epoxy resin is adopted, vulcanized rubber is omitted, so that the adhesive does not contain harmful substance elements such as sulfur elements and antimonide, the environment pollution is avoided, the service life of lamp beads in the LED lamp tube is prevented from being reduced due to the influence of the sulfur elements, the sulfur-free flame-retardant adhesive has good flame retardance, peeling strength, electrical property and welding heat resistance, the flame retardance grade of the flexible copper-clad plate prepared by using the composition reaches UL-94V0 grade, the heat resistance and the peeling strength are good, the soldering resistance is high, and the flexible copper-clad plate is not layered and does not foam after being subjected to tin immersion at 288 ℃ for 30 seconds.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
First embodiment
The sulfur-free flame-retardant adhesive provided by the invention comprises the following components in parts by weight,
30-80 parts of halogen-free epoxy resin, 15-35 parts of halogen-free macromolecular epoxy resin in the halogen-free epoxy resin, and 15-45 parts of halogen-free micromolecular epoxy resin in the halogen-free epoxy resin;
0.1-8 parts of curing agent, wherein the curing agent comprises imidazole curing agent and dicyandiamide curing agent;
5-60 parts of a phosphorus-containing composite flame retardant, wherein the flame retardant is a phosphorus-containing composite flame retardant;
0.1-5 parts of an auxiliary agent.
The molecular weight of the halogen-free macromolecular epoxy resin is 4-6 ten thousand, and the molecular weight of the halogen-free micromolecular epoxy resin is less than 1 ten thousand.
In this example, by weight, 30 parts of halogen-free small molecule epoxy resin, 15 parts of halogen-free large molecule epoxy resin, 2.5 parts of imidazole curing agent, 2.5 parts of dicyandiamide curing agent, 48 parts of flame retardant and 2 parts of auxiliary agent.
The materials are mixed and fully stirred to obtain the sulfur-free flame-retardant adhesive provided by the invention, the stirring device can adopt a known stirring device, the sulfur-free flame-retardant adhesive provided by the invention adopts sulfur-free halogen-free macromolecular epoxy resin, vulcanized rubber is omitted, an imidazole curing agent is used for curing together with dicyandiamide, so that the adhesive does not contain harmful substance elements such as sulfur element, antimonide and the like, avoids polluting the environment, prevents the service life of the lamp bead in the LED lamp tube from being reduced due to the influence of the sulfur element, moreover, the sulfur-free flame-retardant adhesive has good flame retardance, peeling strength, electrical property and welding heat resistance, the flame retardant grade of the flexible copper clad laminate prepared by using the composition reaches UL-94V0 grade, the sulfur-free flame-retardant adhesive also has good heat resistance, high peeling strength and soldering resistance, and the sulfur-free flame-retardant adhesive does not delaminate and foam after being dipped in tin for 30 seconds at 288 ℃.
The peel strength, heat resistance and flame retardancy of the sulfur-free flame retardant adhesive provided in this example are shown in table 1.
TABLE 1
Second embodiment
In this example, by weight, 43 parts of halogen-free small molecule epoxy resin, 25 parts of halogen-free large molecule epoxy resin, 5 parts of imidazole curing agent, 2.5 parts of dicyandiamide curing agent, 22.5 parts of flame retardant and 2 parts of auxiliary agent.
The peel strength, heat resistance and flame retardancy of the sulfur-free flame retardant adhesive provided in this example are shown in table 2.
TABLE 2
Third embodiment
In this example, by weight, 40 parts of halogen-free small molecule epoxy resin, 25 parts of halogen-free large molecule epoxy resin, 3 parts of imidazole curing agent, 4 parts of dicyandiamide curing agent, 26 parts of flame retardant and 2 parts of auxiliary agent.
The peel strength, heat resistance and flame retardancy of the sulfur-free flame retardant adhesive provided in this example are shown in table 3.
TABLE 3
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the invention have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A sulfur-free flame retardant adhesive characterized by: the sulfur-free flame retardant adhesive comprises, by weight,
30-80 parts of halogen-free epoxy resin, wherein the halogen-free macromolecular epoxy resin in the halogen-free epoxy resin accounts for 15-35 parts;
0.1-8 parts of a curing agent;
5-60 parts of a phosphorus-containing composite flame retardant;
0.1-5 parts of an auxiliary agent.
2. A sulfur-free flame retardant adhesive according to claim 1, wherein:
the halogen-free small molecular epoxy resin in the halogen-free epoxy resin accounts for 15-45 parts by weight.
3. A sulfur-free flame retardant adhesive according to claim 2, wherein:
the curing agent comprises an imidazole curing agent and a dicyandiamide curing agent.
4. A sulfur-free flame retardant adhesive according to claim 3, wherein:
the sulfur-free flame retardant adhesive comprises, by weight,
30 parts of halogen-free micromolecular epoxy resin;
15 parts of halogen-free macromolecular epoxy resin;
2.5 parts of an imidazole curing agent;
2.5 parts of dicyandiamide curing agent;
48 parts of a flame retardant;
and 2 parts of an auxiliary agent.
5. A sulfur-free flame retardant adhesive according to claim 3, wherein:
the sulfur-free flame retardant adhesive comprises, by weight,
43 parts of halogen-free small molecular epoxy resin;
25 parts of halogen-free macromolecular epoxy resin;
5 parts of an imidazole curing agent;
2.5 parts of dicyandiamide curing agent;
22.5 parts of a flame retardant;
and 2 parts of an auxiliary agent.
6. A sulfur-free flame retardant adhesive according to claim 3, wherein:
the sulfur-free flame retardant adhesive comprises, by weight,
40 parts of halogen-free micromolecular epoxy resin;
25 parts of halogen-free macromolecular epoxy resin;
3 parts of an imidazole curing agent;
4 parts of dicyandiamide curing agent;
26 parts of a flame retardant;
and 2 parts of an auxiliary agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010660454.7A CN111961430A (en) | 2020-07-10 | 2020-07-10 | Sulfur-free flame-retardant adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010660454.7A CN111961430A (en) | 2020-07-10 | 2020-07-10 | Sulfur-free flame-retardant adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111961430A true CN111961430A (en) | 2020-11-20 |
Family
ID=73361658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010660454.7A Pending CN111961430A (en) | 2020-07-10 | 2020-07-10 | Sulfur-free flame-retardant adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111961430A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004059777A (en) * | 2002-07-30 | 2004-02-26 | Kyocera Chemical Corp | Flame-retardant adhesive composition, flexible copper clad laminate and its related product |
| CN101570674A (en) * | 2008-05-03 | 2009-11-04 | 新高电子材料（中山）有限公司 | Halogen-free flame retardant type bonding agent composition |
| CN101760161A (en) * | 2008-12-24 | 2010-06-30 | 深圳市道尔科技有限公司 | Environmental-protection low halogen-content surface mounting adhesive capable of quick solidification under low temperature |
| CN102181252A (en) * | 2011-05-30 | 2011-09-14 | 烟台德邦科技有限公司 | Low-halogen single-component flame-retardant epoxy adhesive |
| CN103074019A (en) * | 2013-01-22 | 2013-05-01 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and flexible copper-clad plate prepared from same |
| CN103146334A (en) * | 2013-03-29 | 2013-06-12 | 黑龙江省科学院石油化学研究院 | Flame-retardant intermediate-temperature cured epoxy film and preparation method thereof |
| CN106147637A (en) * | 2015-04-03 | 2016-11-23 | 湖北奥马电子科技有限公司 | A kind of cover layer and its preparation method and the adhesive being used in cover layer |
-
2020
- 2020-07-10 CN CN202010660454.7A patent/CN111961430A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004059777A (en) * | 2002-07-30 | 2004-02-26 | Kyocera Chemical Corp | Flame-retardant adhesive composition, flexible copper clad laminate and its related product |
| CN101570674A (en) * | 2008-05-03 | 2009-11-04 | 新高电子材料（中山）有限公司 | Halogen-free flame retardant type bonding agent composition |
| CN101760161A (en) * | 2008-12-24 | 2010-06-30 | 深圳市道尔科技有限公司 | Environmental-protection low halogen-content surface mounting adhesive capable of quick solidification under low temperature |
| CN102181252A (en) * | 2011-05-30 | 2011-09-14 | 烟台德邦科技有限公司 | Low-halogen single-component flame-retardant epoxy adhesive |
| CN103074019A (en) * | 2013-01-22 | 2013-05-01 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and flexible copper-clad plate prepared from same |
| CN103146334A (en) * | 2013-03-29 | 2013-06-12 | 黑龙江省科学院石油化学研究院 | Flame-retardant intermediate-temperature cured epoxy film and preparation method thereof |
| CN106147637A (en) * | 2015-04-03 | 2016-11-23 | 湖北奥马电子科技有限公司 | A kind of cover layer and its preparation method and the adhesive being used in cover layer |
Non-Patent Citations (1)
| Title |
|---|
| 许海文: "关于LED光源黑化和排查方法的研究", 《现代信息科技》 * |
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Application publication date: 20201120 |
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