CN106147637A - A kind of cover layer and its preparation method and the adhesive being used in cover layer - Google Patents
A kind of cover layer and its preparation method and the adhesive being used in cover layer Download PDFInfo
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- CN106147637A CN106147637A CN201510154030.2A CN201510154030A CN106147637A CN 106147637 A CN106147637 A CN 106147637A CN 201510154030 A CN201510154030 A CN 201510154030A CN 106147637 A CN106147637 A CN 106147637A
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Abstract
The present invention provides a kind of cover layer, and by ink layer, macromolecule membrane layer, viscose glue oxidant layer is compound successively from top to bottom with separated type material layer constitutes.The method preparing above-mentioned cover layer, comprising: by selected Ink Application on macromolecule membrane, and through being dried and curing, to form the ink layer of thickness 17 μm；Accurate slot die coating machine is not covered with in macromolecule membrane epoxy resin coating adhesive on the another side of ink layer, and makes adhesive reach 15 μm at the thickness of solidification；After the drying tunnel of design temperature is dried, the compound and rolling at 60 DEG C with separated type material, and product linear velocity is set as 10m/min；At 50 DEG C, glue overflow amount is controlled to the value needing and become the cover layer finished product that can cut packaging shipment.Cover layer in the present invention, in addition to halogen-free stibium-free, does not also contain element sulphur, after being applied to LED field, LED can be avoided in use to cause because of sulfation dead lamp phenomenon to occur, be greatly promoted the life-span of LED.
Description
Technical field
The present invention relates to a kind of cover layer, especially a kind of cover layer and its preparation method and be used for covering
Adhesive in epiphragma.
Background technology
With China's economic society development, people's living standard improves constantly, and people are natural to energy-conservation
The requirement of environmental protection is more and more higher, science and technology constantly meet play in the growing demand of people decisive
Effect.With popularizing of electronic product, circuit board is used widely, domestic at present circuit on the market
Plate equal sulfur-bearing element, it not only affects people's quality of life, also affects the service life of electronic equipment.As
The LED electricity-saving lamp gradually popularized in recent years, with being continuously increased of consumption, to the research of LED also more
Deeply, through showing the inefficacy of LED research, lamp batten supporting on current market is in use deposited
At sulfation, ultimately result in dead lamp, the serious service life reducing LED.
Content of the invention
For weak point present in the problems referred to above, the present invention provides one that LED can be avoided to use
During cause dead lamp phenomenon to occur because of sulfation, to improve a kind of covering in LED service life
Film and its preparation method.
In addition, the present invention also provide a kind of reduce cover layer penetrance for the adhesive in cover layer.
For achieving the above object, the present invention provides a kind of cover layer, by ink layer, macromolecule membrane layer,
Viscose glue oxidant layer and separated type material layer are from top to bottom combined successively and constitute.
Above-mentioned a kind of cover layer, wherein, described ink layer is polyester system, epoxy systems or other glue
The thermosetting ink of system, its thickness is 12-25 μm；
The color of described ink layer is white, black or the color in addition to white with black.
Above-mentioned a kind of cover layer, wherein, described macromolecule membrane layer is polyimide film layer, polyethers
Imide membrane layer or poly (ether ether ketone) film layer, its thickness is 8-50 μm.
Above-mentioned a kind of cover layer, wherein, described gluing oxidant layer be Halogen, without antimony and do not contain sulphur unit
The thermosetting epoxy resin adhesive of element, its thickness is 10-50 μm.
Above-mentioned a kind of cover layer, wherein, described separated type material layer is for by siliceous or non-siliceous mould release system
The release liners becoming or mould release membrance.
The present invention provides the preparation method of a kind of cover layer, comprises the following steps:
By selected Ink Application on macromolecule membrane, and through being dried and curing, to form thickness 17
μm ink layer；
Accurate slot die coating machine is not covered with on the another side of ink layer in macromolecule membrane
Epoxy resin coating adhesive, and make adhesive reach 15 μm at the thickness of solidification；
After the drying tunnel of design temperature is dried, the compound and rolling at 60 DEG C with separated type material, and will produce
Linear velocity is set as 10m/min；
At 50 DEG C, glue overflow amount is controlled to the value needing and become the cover layer finished product that can cut packaging shipment.
The present invention provides a kind of for the adhesive in cover layer, and this adhesive is not Halogen, without antimony and not
Thermosetting epoxy resin adhesive containing element sulphur, is prepared from by the raw material of following parts by weight scope:
Epoxy resin 100 parts；Curing agent 5-15 part；Rubber 40-90 part；Filler 50-80 part；Add
Agent 0.1-1 part；Solvent 150-250 part.
Above-mentioned for the adhesive in cover layer, wherein, described epoxy resin is selected from bisphenol A-type, double
At least one in phenol F type, biphenyl phenol type, dicyclopentadiene phenol type etc., and select suitable solvent
In dissolved solution, Weight control is at 50-80%；
Described curing agent is at least one in amine, anhydrides and polyamide-based synthetic resin etc., and
Selecting suitable solvent in dissolved solution, Weight control is at 20-50%；
Described rubber is selected from nitrile rubber or other rubber, can be Amino End Group, end carboxyl, epoxy terminated
Nitrile rubber simultaneously selects suitable solvent with dissolving under normal temperature, and Weight control is at 10-30%；
Described filler selected from metal oxide, nonmetal oxide, metal hydroxides, phosphate/salt,
At least one in secondary phosphine phosphate etc.；
Described additive is selected from antioxidant, levelling agent or coupling agent；
Described solvent is selected from ketone, esters, amide-type, arene etc. one or more, is used for molten
Solve above-mentioned substance and regulation viscosity.
Above-mentioned for the adhesive in cover layer, wherein, this adhesive is Halogen, without antimony and do not contain
There is the thermosetting epoxy resin adhesive of element sulphur, be prepared from by the raw material of following weight portion numerical value:
Bisphenol A type epoxy resin 100 parts；Amine curing agent 10 parts；Nbr carboxyl terminal 70 parts；
Filler 60 parts；Additive 0.3 part；Solvent 190 parts.
Above-mentioned for the adhesive in cover layer, wherein, this adhesive is Halogen, without antimony and do not contain
There is the thermosetting epoxy resin adhesive of element sulphur, be prepared from by the raw material of following weight portion numerical value:
Bisphenol A type epoxy resin 70 parts；Bisphenol f type epoxy resin 15 parts；Dicyclopentadiene type epoxy
Resin 15 parts；Amine curing agent 8 parts；Polyamide-based synthetic resin 0.3 part；Nbr carboxyl terminal 80
Part；Filler 80 parts；Additive 0.3 part；Solvent 190 parts.
Compared with prior art, the invention have the advantages that
Owing to the cover layer in the present invention is in addition to halogen-free stibium-free, does not also contain element sulphur, be applied to
After LED field, LED can be avoided because of sulfation in use to cause dead lamp phenomenon to occur,
It is greatly promoted the life-span of LED.
After being coated on epoxyn on the macromolecule membrane in cover layer, it is possible to decrease cover
The penetrance of film, and make cover layer have more preferably glossiness and reflectivity.
Brief description
Fig. 1 is the sectional view of cover layer in the present invention.
Main Reference Numerals is described as follows:
1-ink layer；2-macromolecule membrane layer；3-adhesive；4-separated type material layer
Detailed description of the invention
As it is shown in figure 1, the present invention provides a kind of cover layer, the 2nd, glued by ink layer the 1st, macromolecule membrane layer
Glue agent layer 3 and separated type material layer 4 are from top to bottom combined successively and constitute.
Ink layer 1 is the thermosetting ink of polyester system, epoxy systems or other glue systems, and its thickness is 12-25
μm.Wherein, the color of ink layer is white, black or the color in addition to white with black.
Furthermore it is also possible to change to ink layer without ink layer.
Macromolecule membrane layer 2 is polyimide film layer, PEI film layer or poly (ether ether ketone) film
Layer, its thickness is 8-50 μm.
Gluing oxidant layer 3 is Halogen, without antimony and the thermosetting epoxy resin adhesive not containing element sulphur,
Its thickness is 10-50 μm.
Separated type material layer 4 is the release liners or mould release membrance being made up of siliceous or non-siliceous mould release.
The present invention provides the preparation method of a kind of cover layer, comprises the following steps:
By selected Ink Application on macromolecule membrane, and through being dried and curing, to form thickness 17
μm ink layer；
Accurate slot die coating machine is not covered with on the another side of ink layer in macromolecule membrane
Epoxy resin coating adhesive, and make adhesive reach 15 μm at the thickness of solidification；
After the drying tunnel of design temperature is dried, the compound and rolling at 60 DEG C with separated type material, and will produce
Linear velocity is set as 10m/min.Wherein, design temperature be 60 DEG C, 80 DEG C, 120 DEG C, 140 DEG C, 160 DEG C,
160℃、160℃、120℃。
At 50 DEG C, glue overflow amount is controlled to the value needing and become the cover layer finished product that can cut packaging shipment.
The present invention also provides a kind of for the adhesive in cover layer, this adhesive is Halogen, without antimony and
Do not contain the thermosetting epoxy resin adhesive of element sulphur, by the raw material preparation of following parts by weight scope
Become:
Epoxy resin 100 parts；Curing agent 5-15 part；Rubber 40-90 part；Filler 50-80 part；Add
Agent 0.1-1 part；Solvent 150-250 part.
Wherein, epoxy resin is selected from bisphenol A-type, bisphenol-f type, biphenyl phenol type, dicyclopentadiene benzene
At least one in phenolic etc., and select suitable solvent in dissolved solution, Weight control is at 50-80%；
Curing agent is at least one in amine, anhydrides and polyamide-based synthetic resin etc., and selects
Suitable solvent is in dissolved solution, and Weight control is at 20-50%；
Rubber is selected from nitrile rubber or other rubber, can be Amino End Group, end carboxyl, epoxy terminated butyronitrile
Rubber simultaneously selects suitable solvent with dissolving under normal temperature, and Weight control is at 10-30%；
Filler is selected from metal oxide, nonmetal oxide, metal hydroxides, phosphate/salt, secondary phosphine
At least one in phosphate etc.；
Additive is selected from antioxidant, levelling agent or coupling agent；
Solvent is selected from ketone, esters, amide-type, arene etc. one or more, for dissolving
State material and regulation viscosity.
Embodiment 1
The present invention also provides a kind of for the adhesive in cover layer, this adhesive is Halogen, without antimony and
Do not contain the thermosetting epoxy resin adhesive of element sulphur, be prepared from by the raw material of following parts by weight:
Take bisphenol A type epoxy resin 100 parts, amine curing agent 10 parts, nbr carboxyl terminal 70 parts,
Filler 60 parts, additive 0.3 part, solvent 190 parts is for dissolving and adjusting viscous using.After dissolving, disperseing
Make epoxyn.
Embodiment 2
The present invention also provides a kind of for the adhesive in cover layer, this adhesive is Halogen, without antimony and
Do not contain the thermosetting epoxy resin adhesive of element sulphur, be prepared from by the raw material of following parts by weight:
Bisphenol A type epoxy resin 70 parts, bisphenol f type epoxy resin 15 parts, dicyclopentadiene type epoxy
Resin 15 parts, amine curing agent 8 parts, polyamide-based synthetic resin 0.3 part, nbr carboxyl terminal 80
Part, filler 80 parts, additive 0.3 part, solvent 190 parts is for dissolving and adjusting viscous using.Through dissolving, dividing
Epoxyn is made after Saning.
Embodiment 3
The present invention also provides a kind of for the adhesive in cover layer, this adhesive is Halogen, without antimony and
Do not contain the thermosetting epoxy resin adhesive of element sulphur, be prepared from by the raw material of following parts by weight:
Bisphenol A type epoxy resin 70 parts, dicyclopentadiene type epoxy resin 30 parts, amine curing agent 8
Part, polyamide-based synthetic resin 0.2 part, nbr carboxyl terminal 80 parts, filler 70 parts, additive
0.3 part, solvent 190 parts is for dissolving and adjusting viscous using.Make epoxyn after dissolving, disperseing.
Embodiment 4
The present invention also provides a kind of for the adhesive in cover layer, this adhesive is Halogen, without antimony and
Do not contain the thermosetting epoxy resin adhesive of element sulphur, be prepared from by the raw material of following parts by weight:
Bisphenol A type epoxy resin 60 parts, bisphenol f type epoxy resin 20 parts, dicyclopentadiene type epoxy
Resin 20 parts, acid anhydride type curing agent 9 parts, nbr carboxyl terminal 70 parts, filler 60 parts, additive
0.3 part, solvent 190 parts is for dissolving and adjusting viscous using.Make epoxyn after dissolving, disperseing.
Comparative example 1
Take 70 parts of bisphenol A type epoxy resins with weight fraction respectively, 10 parts of bisphenol f type epoxy resins,
20 parts of dicyclopentadiene type epoxy resins, 3,0.3 part of polyamide-based synthetic resin of 8 parts of amine curing agents,
70 parts of nbr carboxyl terminals, 60 parts of fillers, 0.3 part of additive, dissolves with 190 parts of solvents and adjusts viscous
With.Make epoxyn after dissolving, disperseing.
Comparative example 2
Take 80 parts of bisphenol A type epoxy resins with weight fraction respectively, 10 parts of bisphenol f type epoxy resins,
10 parts of dicyclopentadiene type epoxy resins, 10 parts of acid anhydride type curing agents, 0.3 part of polyamide-based synthetic resin,
70 parts of nbr carboxyl terminals, 60 parts of fillers, 0.3 part of additive, dissolves with 190 parts of solvents and adjusts viscous
With.Make epoxyn after dissolving, disperseing.
These are only presently preferred embodiments of the present invention, be merely illustrative for invention, and unrestricted
Property.Those skilled in the art understands, can be to it in the spirit and scope that invention claim is limited
Carry out many changes, modification, even equivalence, but fall within protection scope of the present invention.
Claims (10)
1. a cover layer, it is characterised in that by ink layer, macromolecule membrane layer, viscose glue oxidant layer with from
The section bar bed of material is from top to bottom combined successively and constitutes.
2. a kind of cover layer according to claim 1, it is characterised in that described ink layer is polyester
The thermosetting ink of system, epoxy systems or other glue systems, its thickness is 12-25 μm；
The color of described ink layer is white, black or the color in addition to white with black.
3. a kind of cover layer according to claim 2, it is characterised in that described macromolecule membrane layer
For polyimide film layer, PEI film layer or poly (ether ether ketone) film layer, its thickness is 8-50 μm.
4. a kind of cover layer according to claim 3, it is characterised in that described gluing oxidant layer is nothing
Halogen, without antimony and the thermosetting epoxy resin adhesive not containing element sulphur, its thickness is 10-50 μm.
5. a kind of cover layer according to claim 4, it is characterised in that described separated type material layer is
The release liners being made up of siliceous or non-siliceous mould release or mould release membrance.
6. the method preparing cover layer described in claim 5, comprises the following steps:
By selected Ink Application on macromolecule membrane, and through being dried and curing, to form thickness 17
μm ink layer；
Accurate slot die coating machine is not covered with on the another side of ink layer in macromolecule membrane
Epoxy resin coating adhesive, and make adhesive reach 15 μm at the thickness of solidification；
After the drying tunnel of design temperature is dried, the compound and rolling at 60 DEG C with separated type material, and will produce
Linear velocity is set as 10m/min；
At 50 DEG C, glue overflow amount is controlled to the value needing and become the cover layer finished product that can cut packaging shipment.
7., for the adhesive in cover layer described in claim 4, this adhesive is Halogen, nothing
Antimony and the thermosetting epoxy resin adhesive not containing element sulphur, by the raw material of following parts by weight scope
It is prepared from:
Epoxy resin 100 parts；Curing agent 5-15 part；Rubber 40-90 part；Filler 50-80 part；Add
Agent 0.1-1 part；Solvent 150-250 part.
8. the adhesive being used in cover layer according to claim 7, it is characterised in that described
Epoxy resin is selected from bisphenol A-type, bisphenol-f type, biphenyl phenol type, dicyclopentadiene phenol type etc. extremely
Few one, and select suitable solvent in dissolved solution, Weight control is at 50-80%；
Described curing agent is at least one in amine, anhydrides and polyamide-based synthetic resin etc., and
Selecting suitable solvent in dissolved solution, Weight control is at 20-50%；
Described rubber is selected from nitrile rubber or other rubber, can be Amino End Group, end carboxyl, epoxy terminated
Nitrile rubber simultaneously selects suitable solvent with dissolving under normal temperature, and Weight control is at 10-30%；
Described filler selected from metal oxide, nonmetal oxide, metal hydroxides, phosphate/salt,
At least one in secondary phosphine phosphate etc.；
Described additive is selected from antioxidant, levelling agent or coupling agent；
Described solvent is selected from ketone, esters, amide-type, arene etc. one or more, is used for molten
Solve above-mentioned substance and regulation viscosity.
9. according to Claim 8 described in for the adhesive in cover layer, it is characterised in that this glue
Stick is Halogen, without antimony and the thermosetting epoxy resin adhesive not containing element sulphur, by following weight
The raw material of number value is prepared from:
Bisphenol A type epoxy resin 100 parts；Amine curing agent 10 parts；Nbr carboxyl terminal 70 parts；
Filler 60 parts；Additive 0.3 part；Solvent 190 parts.
10. according to Claim 8 described in for the adhesive in cover layer, it is characterised in that should
Adhesive is Halogen, without antimony and the thermosetting epoxy resin adhesive not containing element sulphur, by following heavy
The raw material of amount number value is prepared from:
Bisphenol A type epoxy resin 70 parts；Bisphenol f type epoxy resin 15 parts；Dicyclopentadiene type epoxy
Resin 15 parts；Amine curing agent 8 parts；Polyamide-based synthetic resin 0.3 part；Nbr carboxyl terminal 80
Part；Filler 80 parts；Additive 0.3 part；Solvent 190 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510154030.2A CN106147637A (en) | 2015-04-03 | 2015-04-03 | A kind of cover layer and its preparation method and the adhesive being used in cover layer |
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|---|---|---|---|
| CN201510154030.2A CN106147637A (en) | 2015-04-03 | 2015-04-03 | A kind of cover layer and its preparation method and the adhesive being used in cover layer |
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Cited By (5)
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| CN106584988A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Composite metal-clad plate for flexible printed circuit board and preparation method of composite cover film |
| CN108753226A (en) * | 2018-05-31 | 2018-11-06 | 深圳科诺桥科技股份有限公司 | A kind of photomask and FPC |
| CN108913094A (en) * | 2018-05-31 | 2018-11-30 | 深圳科诺桥科技股份有限公司 | A kind of adhesive, preparation method, its application method, screen light film and FPC |
| CN111961430A (en) * | 2020-07-10 | 2020-11-20 | 广东欣兴旺软板技术有限公司 | Sulfur-free flame-retardant adhesive |
| CN113801596A (en) * | 2021-10-15 | 2021-12-17 | 广东东溢新材料科技有限公司 | Ultrathin antistatic white cover film and preparation method thereof |
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| CN113801596A (en) * | 2021-10-15 | 2021-12-17 | 广东东溢新材料科技有限公司 | Ultrathin antistatic white cover film and preparation method thereof |
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