CN111621250A - Halogen-free flame-retardant adhesive - Google Patents
Halogen-free flame-retardant adhesive Download PDFInfo
- Publication number
- CN111621250A CN111621250A CN202010314592.XA CN202010314592A CN111621250A CN 111621250 A CN111621250 A CN 111621250A CN 202010314592 A CN202010314592 A CN 202010314592A CN 111621250 A CN111621250 A CN 111621250A
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- CN
- China
- Prior art keywords
- halogen
- parts
- flame retardant
- free
- retardant adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a halogen-free flame retardant adhesive, which comprises, by weight, 15-45 parts of halogen-free epoxy resin; 15-60 parts of thermoplastic resin and/or synthetic rubber; 0.1-8 parts of a curing agent; 5-60 parts of phosphorus-containing composite flame retardant. The halogen-free flame-retardant adhesive has good flame retardance, peeling strength, electrical property and welding heat resistance, does not contain harmful substance elements such as halogen, antimonide and the like, and does not pollute the environment. The flame retardant grade of the flexible copper clad laminate prepared by the composition reaches UL-94V0 grade, and the flexible copper clad laminate also has good heat resistance, high peel strength and soldering resistance, and does not delaminate and foam after being dipped in tin for 1min at 310 ℃. The halogen-free flame-retardant adhesive has good covering performance, so that the production line speed can be increased and the production efficiency can be improved.
Description
Technical Field
The invention belongs to the technical field of flexible copper clad laminates, and particularly relates to a halogen-free flame retardant adhesive.
Background
A flexible copper clad laminate, also called a Flexible Printed Circuit (FPC), requires an adhesive in the process of manufacturing the FPC. However, existing adhesives do not have good flame retardancy.
Disclosure of Invention
The main object of the present invention is to provide a halogen-free flame retardant adhesive having good flame retardancy.
To achieve the above-mentioned primary object, the present invention provides a halogen-free flame retardant adhesive comprising, in parts by weight,
15-45 parts of halogen-free epoxy resin;
15-60 parts of thermoplastic resin and/or synthetic rubber;
0.1-8 parts of a curing agent;
5-60 parts of phosphorus-containing composite flame retardant.
The halogen-free flame-retardant adhesive has good flame retardance, peeling strength, electrical property and welding heat resistance, does not contain harmful elements such as halogen, antimonide and the like, and does not pollute the environment. The flame retardant grade of the flexible copper clad laminate prepared by the composition reaches UL-94V0 grade, and the flexible copper clad laminate also has good heat resistance, high peel strength and soldering resistance, and does not delaminate and foam after being dipped in tin for 1min at 310 ℃. The halogen-free flame-retardant adhesive has good covering performance, so that the production line speed can be increased and the production efficiency can be improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
First embodiment
The halogen-free flame retardant adhesive of this example comprises, in parts by weight,
15-45 parts of halogen-free epoxy resin;
15-60 parts of thermoplastic resin and/or synthetic rubber;
0.1-8 parts of a curing agent;
5-60 parts of phosphorus-containing composite flame retardant.
The halogen-free flame-retardant adhesive provided by the invention has good flame retardance, peeling strength, electrical property and welding heat resistance, does not contain harmful substance elements such as halogen, antimonide and the like, and does not pollute the environment. The flame retardant grade of the flexible copper clad laminate prepared by the composition reaches UL-94V0 grade, and the flexible copper clad laminate also has good heat resistance, high peel strength and soldering resistance, and does not delaminate and foam after being dipped in tin for 1min at 310 ℃. The halogen-free flame-retardant adhesive has good covering performance, so that the production line speed can be increased and the production efficiency can be improved.
The properties of the halogen-free flame retardant adhesive provided in this example before cure, after rapid press cure, and after reflow soldering are shown in table 1.
TABLE 1
The halogen-free flame retardant adhesive comprises, by weight, 20 parts of halogen-free epoxy resin, 15 parts of synthetic rubber, 5 parts of curing agent and 60 parts of phosphorus-containing composite flame retardant, and the test performance of the halogen-free flame retardant adhesive comprising the materials in parts by weight is shown in Table 2.
TABLE 2
| Peel Strength (kgf/cm) | 1.62 |
| Heat resistance (immersion tin 10 seconds no blistering) | 310℃ |
| Flame-retardant V-0 | Flame-retardant |
Second embodiment
The halogen-free flame retardant adhesive comprises, by weight, 30 parts of halogen-free epoxy resin, 40 parts of synthetic rubber, 7.5 parts of curing agent and 22.5 parts of phosphorus-containing composite flame retardant, and the test performance of the halogen-free flame retardant adhesive comprising the materials in parts by weight is shown in Table 3.
TABLE 3
| Peel Strength (kgf/cm) | 1.95 |
| Heat resistance (immersion tin 10 seconds no blistering) | 340℃ |
| Flame-retardant V-0 | Flame-retardant |
The properties of the halogen-free flame retardant adhesive provided in this example before cure, after rapid press cure, and after reflow soldering are shown in table 1.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the invention have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A halogen-free flame retardant adhesive characterized by: the halogen-free flame retardant adhesive comprises, by weight,
15-45 parts of halogen-free epoxy resin;
15-60 parts of thermoplastic resin and/or synthetic rubber;
0.1-8 parts of a curing agent;
5-60 parts of phosphorus-containing composite flame retardant.
2. The halogen-free ignition resistant adhesive of claim 1 wherein:
the halogen-free flame retardant adhesive comprises, by weight,
20 parts of halogen-free epoxy resin;
15 parts of synthetic rubber;
5 parts of a curing agent;
60 parts of phosphorus-containing composite flame retardant.
3. The halogen-free ignition resistant adhesive of claim 1 wherein:
the halogen-free flame retardant adhesive comprises, by weight,
30 parts of halogen-free epoxy resin;
40 parts of synthetic rubber;
7.5 parts of a curing agent;
22.5 parts of phosphorus-containing composite flame retardant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019110150031 | 2019-10-23 | ||
| CN201911015003 | 2019-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111621250A true CN111621250A (en) | 2020-09-04 |
Family
ID=72270267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010314592.XA Pending CN111621250A (en) | 2019-10-23 | 2020-04-20 | Halogen-free flame-retardant adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111621250A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113308212A (en) * | 2021-04-23 | 2021-08-27 | 广东高特高新材料有限公司 | Adhesive for LED lamp tube plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100048766A1 (en) * | 2006-02-23 | 2010-02-25 | Yu Hsain Cheng | Halogen-free phosphorous epoxy resin composition |
| CN101875825A (en) * | 2010-04-20 | 2010-11-03 | 新高电子材料（中山）有限公司 | Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same |
| CN101921557A (en) * | 2010-08-30 | 2010-12-22 | 新高电子材料（中山）有限公司 | Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same |
-
2020
- 2020-04-20 CN CN202010314592.XA patent/CN111621250A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100048766A1 (en) * | 2006-02-23 | 2010-02-25 | Yu Hsain Cheng | Halogen-free phosphorous epoxy resin composition |
| CN101875825A (en) * | 2010-04-20 | 2010-11-03 | 新高电子材料（中山）有限公司 | Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same |
| CN101921557A (en) * | 2010-08-30 | 2010-12-22 | 新高电子材料（中山）有限公司 | Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113308212A (en) * | 2021-04-23 | 2021-08-27 | 广东高特高新材料有限公司 | Adhesive for LED lamp tube plate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200904 |
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| RJ01 | Rejection of invention patent application after publication |