CN111936401A

CN111936401A - Turnover unit

Info

Publication number: CN111936401A
Application number: CN201980024547.6A
Authority: CN
Inventors: 大场一矢
Original assignee: Ueno Seiki Co Ltd
Current assignee: Ueno Seiki Co Ltd
Priority date: 2018-10-16
Filing date: 2019-10-16
Publication date: 2020-11-13
Also published as: TWI722600B; JP6727568B2; WO2020080430A1; TW202023931A; SG11202008812UA; JP2020063118A

Abstract

The invention relates to a part conveying device which receives an electronic part, overturns the electronic part and delivers the electronic part to the outside. The electronic part has a first face and a second face parallel to each other. The first suction holding member sucks the second surface of the electronic component having the first surface sucked by the component transfer device, and obtains the electronic component from the component transfer device. The second suction holding member sucks the first surface of the electronic component sucked by the first suction holding member, thereby obtaining the electronic component.

Description

Turnover unit

Technical Field

The present invention relates to a flipping unit that flips an electronic part.

Background

In an apparatus for conveying electronic parts, it is often necessary to turn the electronic parts over depending on the configuration of a mechanism for supplying the electronic parts, processing (for example, appearance inspection) performed on the electronic parts. As the reversing unit for reversing the electronic component, for example, the reversing unit disclosed in

patent documents

1 and 2 can be used.

However, the inverting unit disclosed in patent document 1 needs to match the size of the slot formed in the rotary suction nozzle with the size of the electronic component. Further, the reversing unit disclosed in patent document 2 needs to make the length of the pair of suction arms capable of respectively sucking the electronic components coincide with the thickness of the electronic components. Therefore, when switching the electronic component to be flipped to an electronic component having a different size and thickness, the flip unit of patent document 1 requires replacement of the rotary suction nozzle, and the flip unit of patent document 2 requires replacement of the suction arm, which complicates the switching operation of the electronic component.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 6-115687

Patent document 2: japanese laid-open patent publication No. 10-129832

Disclosure of Invention

The present disclosure relates to a flipping unit capable of flipping electronic parts different in size without replacing a member.

According to one embodiment, a component transfer apparatus for receiving an electronic component having a surface P, Q arranged in parallel, inverting the electronic component, and delivering the electronic component to the outside includes: a component transfer unit L including an adsorption holding member J that adsorbs the surface Q of the electronic component, the surface P of which is adsorbed by the component conveying apparatus, to obtain the electronic component from the component conveying apparatus, and a moving mechanism K that moves the adsorption holding member J, which has obtained the electronic component, to a first position; and a component transfer unit T including a suction holding member R disposed to face the suction holding member J disposed at the first position and configured to suck the surface P of the electronic component sucked by the suction holding member J to obtain the electronic component, and a moving mechanism S configured to move the suction holding member R having obtained the electronic component to a second position where the electronic component turned upside down is transferred to the component transfer device, wherein the moving mechanism K brings the suction holding member J into proximity with the suction holding member R disposed to face the suction holding member J disposed at the first position and brings the surface P into contact with the suction holding member R.

According to this reversing unit, the moving mechanism K brings the suction holding member J close to the suction holding member R disposed opposite to the suction holding member J disposed at the first position, and brings the surface P into contact with the suction holding member R. Therefore, the electronic part is turned over with the electronic part sandwiched by the suction holding member J, R from the surface Q side and the surface P side, and the moving distance of the suction holding member J can be designed to be changeable according to the setting of the moving mechanism K.

Therefore, electronic components having different sizes (including thicknesses) can be turned over without replacing members or the like.

According to one embodiment, a component transfer apparatus for receiving an electronic component having a surface P, Q arranged in parallel, inverting the electronic component, and delivering the electronic component to the outside includes: a component transfer unit L including an adsorption holding member J that adsorbs the surface Q of the electronic component, the surface P of which is adsorbed by the component conveying apparatus, to obtain the electronic component from the component conveying apparatus, and a moving mechanism K that moves the adsorption holding member J, which has obtained the electronic component, to a first position; and a component transfer unit T including a suction holding member R disposed to face the suction holding member J disposed at the first position and configured to suck the surface P of the electronic component sucked by the suction holding member J to obtain the electronic component, and a moving mechanism S configured to move the suction holding member R having obtained the electronic component to a second position where the electronic component turned upside down is transferred to the component transfer device, wherein the moving mechanism S brings the suction holding member R disposed to face the suction holding member J disposed at the first position close to the suction holding member J and brings the suction holding member R into contact with the surface P.

According to this reversing unit, the moving mechanism S brings the suction holding member R disposed opposite the suction holding member J disposed at the first position close to the suction holding member J and brings it into contact with the surface P. Therefore, the electronic part is turned over with the electronic part sandwiched by the suction holding member J, R from the face Q side and the face P side, and the moving distance of the suction holding member R can be designed to be changeable according to the setting of the moving mechanism S.

Drawings

Fig. 1 is an explanatory diagram of the reversing unit of the first embodiment.

Fig. 2 is an explanatory diagram showing the arrangement of the reversing unit and the component conveying apparatus according to the first embodiment.

Fig. 3 is an explanatory view of the rotation mechanism.

Fig. 4 (a) and 4 (B) are explanatory views each showing a state in which the reversing unit of the first embodiment reverses the electronic component.

Fig. 5 (a) and 5 (B) are explanatory views each showing a state in which the reversing unit of the first embodiment reverses the electronic component.

Fig. 6 is an explanatory diagram of the reversing unit of the second embodiment.

Fig. 7 is an explanatory diagram of a modification in which the rotation angle of the rotation mechanism is an angle other than 90 degrees.

Fig. 8 is an explanatory diagram of a modification in which each of the rotating mechanisms has a plurality of suction nozzles.

Detailed Description

Embodiments are described with reference to the drawings.

As shown in fig. 1 and 2, the reversing unit 10 according to the first embodiment is a device that receives an electronic component W having a surface P, Q arranged in parallel, reverses the electronic component W, and delivers the electronic component W to an external component feeder 11. As will be described in detail below.

In the present embodiment, the electronic component W has a rectangular plate shape, and the surfaces P, Q are the front surface and the back surface, respectively.

As shown in fig. 1 and 2, the component conveying apparatus 11 includes: a motor 13 fixed to the horizontally arranged substrate 12; a disc-shaped rotor (rotor)15 that can rotate about a rotation shaft 14 connected to the motor 13; and a plurality of nozzle (nozzle) mechanisms 16 provided at equal intervals on the outer periphery of the rotor 15.

In the present embodiment, eight nozzle mechanisms 16 are attached to the outer periphery of the horizontally arranged rotor 15 so as to be movable up and down at 45-degree intervals. Each nozzle mechanism 16 is vertically long, and can suck any one of the surface P and the surface Q of the electronic component W by suction at the lower end portion, and release the sucked electronic component W by stopping suction or blowing air.

The motor 13 is repeatedly operated and stopped, and by one operation, the rotary shaft 14 and the rotor 15 are rotated by 45 degrees to move each nozzle mechanism 16. Therefore, temporary stop positions (hereinafter, also referred to as "nozzle stop positions") of the eight nozzle mechanisms 16 are present on the outer periphery of the rotor 15.

A drive mechanism 17 for lowering the nozzle mechanism 16 is fixed to the upper side of each nozzle stop position by a support member not shown. The driving mechanism 17 has a motor 18 and a lifting body 19, and the lifting body 19 is lowered by the operation of the motor 18 to press down the nozzle mechanism 16. A coil spring, not shown, for applying an upward force to the nozzle mechanism 16 is connected to each nozzle mechanism 16. The nozzle mechanism 16 that is lowered is raised by the force from the coil spring as the vertically movable body 19 is raised.

The electronic component W is conveyed by the component conveyor 11 and subjected to predetermined processing such as appearance inspection. In order to perform predetermined processing on the electronic component W, the electronic component W needs to be turned upside down from a state in which the surface P is sucked by the nozzle mechanism 16 to a state in which the surface Q is sucked by the nozzle mechanism 16. In the present embodiment, the electronic component W is turned over using the turning unit 10.

As shown in fig. 1 and 2, the reversing unit 10 includes: a base 21 fixed to the base plate 12 and having a rail (rail)20 attached thereto from above; a plate-shaped base block 23 fixed to the base 21 and having the support 22 attached thereto; and long (long)

rotating mechanisms

24 and 25 supported by the support body 22. The rotating mechanism 24 is disposed below one nozzle stop position, and the rotating mechanism 25 is disposed below the nozzle stop position adjacent to the nozzle stop position. In fig. 2, the description of the

rotation mechanisms

24 and 25 is omitted. Although the

rotating mechanisms

24 and 25 are provided below the adjacent nozzle stop positions, respectively, this is not essential, and for example, two rotating mechanisms may be arranged: one nozzle stop position exists between a nozzle stop position provided above one of the rotating mechanisms and a nozzle stop position provided above the other rotating mechanism.

The guide rail 20 is linear and is positioned such that the rotation shaft 14 is positioned on an extension line of the guide rail 20 in a plan view.

The base block 23 is formed with a groove 26 into which the guide rail 20 is fitted. The base block 23 can advance and retreat along the guide rail 20 together with the support body 22 and the

rotation mechanisms

24 and 25 in a state of not being fixed to the base 21. The base block 23 is fixed to the base 21 by a lock mechanism (not shown) such as a snap lock (draw latch), a nut, and a bolt.

In the present embodiment, as shown in fig. 1, the support 22 is a T-shaped metal plate, and is disposed vertically with its lower portion connected to the base block 23. As shown in fig. 1 and 2,

motors

27 and 28 are mounted on the rear surface (one surface) of the support body 22 on the upper left side and the upper right side, respectively. A rotary shaft 29 rotationally driven by the operation of the motor 27 and a rotary shaft 30 rotationally driven by the operation of the motor 28 are connected to the

motors

27 and 28, respectively. The

rotary shafts

29 and 30 are provided at the same height, horizontally penetrate the support body 22, and are connected to the

rotary mechanisms

24 and 25, respectively.

The rotation mechanism 24 provided on the front surface (the other surface) side of the support body 22 includes: a bracket (blacket) (an example of a holding member support) 31 to which a rotation shaft 29 is coupled; a long-sized slide member 32 movably attached to the bracket 31; and a suction nozzle J1 (an example of a first suction holding member J) fixed to one end of the slide member 32.

The rotation mechanism 24 is rotated by 90 degrees clockwise or counterclockwise about the rotation shaft 29 by one operation of the motor 27. The slide member 32 is inserted through the bracket 31. A coil spring 34 (an example of an elastic body) is attached to the slide member 32 with both ends thereof in contact with the bracket 31 and the other end of the slide member 32, which is enlarged in diameter, respectively. The carriage 31 supports the slide member 32 movably, whereby the suction nozzle J1 fitted to the slide member 32 is movable.

On the upper right side of the front face of the support 22, a movable member 36 is movably attached to a horizontally arranged guide rail 35. The movable member 36 includes a protrusion 37 protruding leftward at the same height as the rotary shaft 29, and a force is applied to the movable member 36 from a motor 38 attached to the support 22 via a known cam, cam follower, or the like, and a force is applied to the movable member 36 rightward from a coil spring not shown. By the two forces different in orientation, the movable member 36 is moved to the left or right.

As shown in fig. 1 and 3, the rotation mechanism 25 provided on the front side of the support 22 includes: a long guide member 39 to which the rotation shaft 30 is connected; a suction nozzle R1 (an example of a second suction holding member R) movably attached to the guide member 39; and a coil spring 41 connecting the suction nozzle R1 and the guide member 39. The rotation mechanism 25 is rotated by 90 degrees clockwise or counterclockwise about the rotation shaft 30 by one operation of the motor 28.

The suction nozzles J1 and R1 can suck the electronic component W by suction and release the sucked electronic component W by stopping suction or blowing air.

In the present embodiment, the moving mechanism K1 (an example of the first moving mechanism K) that moves the suction nozzle J1 is configured to include

motors

27 and 38, a rotary shaft 29, a bracket 31, a slide member 32, a guide rail 35, and a movable member 36. The component transfer section L1 (an example of the first component transfer section L) is configured to have a nozzle J1 and a moving mechanism K1. The moving mechanism S1 (an example of the second moving mechanism S) that moves the suction nozzle R1 is configured to include the motor 28, the rotary shaft 30, and the guide member 39. The component transfer unit T1 (an example of a second component transfer unit T) is configured to have a nozzle R1 and a moving mechanism S1.

Next, the operation of the reversing unit 10 for reversing the electronic component W with the surface Q being sucked by the nozzle mechanism 16 will be described.

As shown in fig. 1, the suction nozzle J1 is disposed above the slide member 32 disposed in the vertical direction and directly below the electronic component W having the plane P sucked by the suction nozzle mechanism 16. The suction nozzle R1 is disposed above the guide member 39 disposed in the vertical direction and directly below the suction nozzle mechanism 16 which does not suck the electronic component W, in a state where the surface P of the electronic component W is sucked.

As shown in fig. 4 (a), the nozzle J1 sucks the surface Q of the electronic component W sucked by the nozzle mechanism 16 from below by lowering the nozzle mechanism 16 disposed above the rotation mechanism 24, and picks up the electronic component W from the nozzle mechanism 16. At this time, the nozzle mechanism 16 above the rotation mechanism 25 sucks the surface Q of the electronic component W sucked by the nozzle R1 from above and picks up the electronic component W from the stem R1. Since the nozzle mechanism 16 and the nozzle J1 deliver and receive the electronic component W while holding the electronic component W from above and below, the electronic component W can be delivered and received while holding the electronic component W at a predetermined position with respect to the nozzle mechanism 16 and the nozzle J1.

Then, as shown in fig. 4 (B), the rotation mechanism 24 is rotated counterclockwise by 90 degrees by the operation of the motor 27, and the rotation mechanism 25 is rotated clockwise by 90 degrees by the operation of the motor 28. Thereby, the nozzles J1 and R1 move, the nozzle R1 is disposed opposite to the nozzle J1, and one end (right end) of the slide member 32 is disposed on the left side of the protrusion 37 and at the same height as the protrusion 37. In the present embodiment, the position of the suction nozzle J1 at this time is set as the first position. Therefore, the motor 27 (i.e., the moving mechanism K1) moves the suction nozzle J1 that has picked up the electronic part W to the first position.

As shown in fig. 5 (a), the motor 38 is operated to move the movable member 36 in the left direction, and the protrusion 37 is brought into contact with one end of the slide member 32 to move the slide member 32 and the suction nozzle J1 in the left direction. The slide member 32 and the nozzle J1 move leftward until the surface P of the electronic component W sucked by the nozzle J1 on the surface Q contacts the nozzle R1, and the electronic component W is sandwiched between the nozzles R1 and J1 from the left and right. Thereby, the motor 38 (i.e., the moving mechanism K1) brings the nozzle J1 close to the nozzle R1 disposed opposite to the nozzle J1 disposed at the first position, and the plane P is brought into contact with the nozzle R1.

When the electronic component W contacts the nozzle R1 by the movement of the nozzle J1, a load is generated on the electronic component W, but the load is alleviated by the coil spring 41. Further, since the leftward movement distance of the nozzle J1 can be adjusted by the rotation angle of the motor 38, the electronic component W having different thicknesses can be transferred between the nozzles J1 and R1 by adjusting the rotation angle of the motor 38. Further, since the

rotation mechanisms

24 and 25 are rotatably mounted on the support body 22 (i.e., one member), the relative positional relationship between the

rotation mechanisms

24 and 25 can be maintained in a predetermined relationship with high accuracy, as compared with a case where the

rotation mechanisms

24 and 25 are rotatably mounted on different members.

Next, the suction nozzle R1 in contact with the surface P of the electronic component W starts suction to suck the surface P of the electronic component W, and then the suction nozzle J1 stops suction. Thereby, the electronic component W is delivered from the nozzle J1 to the nozzle R1. Since the nozzle J1 and the nozzle R1 transfer the electronic component W while holding the electronic component W from the left and right, the electronic component W can be transferred while being held at a predetermined position with respect to the nozzle J1 and the nozzle R1.

Then, the motor 38 is operated, the movable member 36 is moved to the right by the spring force of a coil spring, not shown, the slide member 32 and the suction nozzle J1 are moved to the right by the spring force of the coil spring 34, the suction nozzle J1 is separated from the electronic component W, and the protrusion 37 of the movable member 36 is separated from the slide member 32.

In the present embodiment, during the period from the start of the leftward movement of the slide member 32, the suction nozzle J1, and the movable member 36 to the end of the rightward movement of the above members, the suction nozzle mechanism 16 disposed above the rotation mechanism 24 moves above the rotation mechanism 25 by the rotation of the rotor 15 caused by the operation of the motor 13, as shown in fig. 5 (a) and 5 (B).

Then, by the operation of the

motors

27 and 28, the rotation mechanism 24 is rotated 90 degrees clockwise, and the nozzle J1 is arranged directly below the nozzle mechanism 16 that has sucked the plane P of the electronic component W, and the rotation mechanism 25 is rotated 90 degrees counterclockwise, and the nozzle R1 that has sucked the plane P of the electronic component W is arranged directly below the nozzle mechanism 16 that has not sucked the electronic component W (the nozzle mechanism 16 that has moved from above the rotation mechanism 24 to above the rotation mechanism 25). Next, the nozzle mechanism 16 disposed above the nozzle R1 is lowered to suck the surface Q of the electronic component W sucked by the nozzle R1 on the surface P, and the electronic component W is picked up from the nozzle R1. This completes the reversing process of the electronic component W.

The nozzle mechanism 16 and the nozzle R1 can deliver and receive the electronic component W while holding the electronic component W at a predetermined position with respect to the nozzle mechanism 16 and the nozzle R1 by delivering and receiving the electronic component W while vertically sandwiching the electronic component W.

In the present embodiment, the position directly below the nozzle mechanism 16 disposed above the rotation mechanism 25, that is, the position where the electronic component W turned upside down by the

rotation mechanisms

24 and 25 is delivered to the nozzle mechanism 16 (component transfer device 11) is set as the second position. Therefore, the motor 28, the rotary shaft 30, and the guide member 39, i.e., the moving mechanism S1 move the nozzle R1 that has acquired the electronic component W to the second position.

In the present embodiment, only the rotation mechanism 24 rotates together with the rotation shaft 29 by the operation of the motor 27, but the present invention is not limited to this. A rotating body to which the rotating shaft 29 is connected may be rotatably attached to the support 22, the rotating mechanism 24, the motor 38, the movable member 36, and the guide rail 35 may be attached to the rotating body, and the rotating body, the rotating mechanism 24, the motor 38, the movable member 36, and the guide rail 35 may be integrally rotated together with the rotating shaft 29 by the operation of the motor 27. In this case, the nozzle J1 can be raised from a position directly below the electronic component W sucked by the nozzle mechanism 16 by the operation of the motor 38, and the electronic component W can be picked up from the nozzle mechanism 16.

In addition, in order to stably transfer the electronic component W between the nozzle mechanism 16 and the nozzle J1 or the nozzle R1, the positional relationship between the reversing unit 10 and the component transfer device 11 is important, but in this respect, the present embodiment is designed such that: since the rotary shaft 14 is located on the extension line of the guide rail 20 in a plan view and the support body 22 to which the rotating

mechanisms

24 and 25 are attached can be moved and positioned along the guide rail 20, the positioning of the reversing unit 10 and the component conveying apparatus 11 can be easily performed. It should be noted that the base block 23 and the guide rail 20 having the groove 26 formed therein are not necessarily used, and for example, a groove may be provided in the base, and the guide rail fitted into the groove may be attached to the base block, thereby facilitating alignment between the reversing unit 10 and the parts conveyor 11.

In the above-described reversing unit 10, the nozzle J1 (suction holding member J) which has acquired the electronic component W from the component transfer device 11 is brought close to the nozzle R1 (suction holding member R), and the electronic component W is transferred from the nozzle J1 to the nozzle R1.

Next, the inverting unit 50 according to the second embodiment that performs transfer of the electronic component W by bringing the suction holding member R close to the suction holding member J will be described with reference to fig. 6. In the reversing unit 50, the same components as those of the reversing unit 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in fig. 6, the reversing unit 50 includes, on the upper left side of the support body 22: a long rotation mechanism 52 rotatably supported by the rotation shaft 51; a motor 53 that rotates the rotating mechanism 52 clockwise or counterclockwise together with the rotating shaft 51; and a movable member 55 that is guided by the guide rail 54 by the rotation of the motor 53 and moves horizontally. Further, on the upper right side of the support body 22 are provided: a long rotation mechanism 57 rotatably supported by the rotation shaft 56; and a motor 58 that rotates the rotating mechanism 57 clockwise or counterclockwise together with the rotating shaft 56.

The rotation mechanism 52 includes: a bracket (an example of a holding member support) 59 coupled to the rotary shaft 51; a long-sized slide member 60 movably attached to the bracket 59; and a suction nozzle R2 (an example of a suction holding member R) fixed to one end of the slide member 60. The rotation mechanism 57 includes, similarly to the rotation mechanism 25: a long-sized guide member 62; a suction nozzle J2 (an example of a suction holding member J) movably attached to the guide member 62; and a coil spring (an example of an elastic body), not shown, that connects the suction nozzle J2 and the guide member 62.

The reversing process of the electronic component W by the reversing unit 50 is performed as follows.

In a state where the rotation mechanism 57 is vertically arranged, the electronic component W is picked up from the component transfer device 11 by sucking the surface Q of the electronic component W sucked by the nozzle mechanism 16 to the surface P by the nozzle J2, and the nozzle J2 is moved to the first position by rotating the rotation mechanism 57 counterclockwise by 90 degrees. In accordance with the operation of the nozzle J2, the rotating mechanism 52 rotates clockwise by 90 degrees from the upright position, and the nozzle R2 is disposed corresponding to the nozzle J2 disposed at the first position.

Next, by the rightward movement of the movable member 55 by the operation of the motor 64 provided below the motor 53, the protrusion 65 of the movable member 55 comes into contact with the slide member 60, the nozzle R2 and the slide member 60 move rightward, the nozzle R2 comes into contact with and sucks the surface P of the electronic component W having the surface Q sucked by the nozzle J2, and the electronic component W is picked up from the nozzle J2. A load generated on the electronic component W when the nozzle R2 comes into contact with the electronic component W is absorbed by the coil spring connecting the nozzle J2 and the guide member 62.

In addition, as the movable member 55 moves leftward by the operation of the motor 64, the suction nozzle R2 moves leftward by the elastic force of the coil spring 66, and both ends of the coil spring 66 are respectively in contact with the bracket 59 and the other end of the slide member 60, which is expanded in diameter. Then, the suction nozzle R2 is moved to the second position where the reversed electronic component W is delivered to the suction nozzle mechanism 16 by the counterclockwise rotation of 90 degrees of the rotation mechanism 52 by the operation of the motor 53. The suction nozzle mechanism 16, which has lowered the electronic component W having the surface P sucked by the nozzle R2, sucks the surface Q, stops sucking by the nozzle R2, and transfers the electronic component W from the nozzle R2 to the nozzle mechanism 16.

In the present embodiment, the moving mechanism K2 (an example of the first moving mechanism K) that moves the nozzle J2 that has acquired the electronic component W from the component transfer device 11 to the first position is configured to include the rotary shaft 56, the motor 58, and the guide member 62, and the component transfer section L2 (an example of the first component transfer section L) is configured to include the nozzle J2 and the moving mechanism K2. The moving mechanism S2 (an example of the second moving mechanism S) that moves the nozzle R2 that has acquired the electronic component W to the second position is configured to include the rotary shaft 51, the

motors

53 and 64, the bracket 59, the slide member 60, the guide rail 54, and the movable member 55, and the component transfer portion T2 (an example of the second component transfer portion T) is configured to include the nozzle R2 and the moving mechanism S2.

Therefore, the moving mechanism S2 brings the nozzle R2 disposed opposite to the nozzle J2 disposed at the first position close to the nozzle J2 and brings the nozzle R2 into contact with the surface P.

In the present embodiment, the carriage 59 is a member that movably supports the nozzle R2, and the movement mechanism S2 rotates the carriage 59 by a predetermined angle about the rotation shaft 51 to move the nozzle R2 to the second position.

The embodiments have been described above, but the present invention is not limited to the above-described embodiments, and modifications and the like without departing from the gist thereof are all applicable ranges of the present invention.

For example, an elastic body for relaxing a load applied to the electronic component may not be provided. In the case where the elastic body is provided, the elastic body is not limited to a coil spring (for example, a cylinder or a urethane may be used as the elastic body), and the elastic body may be provided only on one of the first component transfer unit L and the second component transfer unit T or may be provided on both of the first component transfer unit L and the second component transfer unit T.

Further, the first suction-holding member J or the second suction-holding member R may be directly movably attached to the holding member support body.

Further, the rotation mechanism having the first suction holding member J and the rotation mechanism having the second suction holding member R do not necessarily have to be rotated by 90 degrees in order to turn the electronic part upside down. For example, as shown in fig. 7, in the component transfer apparatus 75, eight nozzle mechanisms 72 are provided at equal intervals on the outer periphery of a disk-shaped rotating body 71 that rotates about a rotating shaft 70, and in the component transfer apparatus 75, when the longitudinal direction (suction direction) of each nozzle mechanism 72 is arranged in the radial direction of the rotating body 71, a rotating mechanism 73 having a first suction holding member J and a rotating mechanism 74 having a second suction holding member R each rotate by 67.5 degrees, thereby reversing the electronic component.

Further, the flipping unit may be designed to: when one of the first suction-holding member J disposed at the first position and the second suction-holding member R disposed to face the first suction-holding member J is brought close to the other, and the other is brought close to the other, the first suction-holding member J and the second suction-holding member R are brought into contact with the surface P, Q of the electronic component W, respectively.

The component transfer device does not necessarily have to be a rotary transfer type in which the nozzle mechanism is moved by the rotation of the rotor, and may be, for example, a horizontal transfer type in which the nozzle mechanism is sequentially moved horizontally in one direction.

As shown in fig. 8, the electronic component W may be inverted by an inverting unit 80, and in the inverting unit 80, one of the pair of rotating mechanisms 81 and 82 includes a plurality of (four in the example of fig. 8) suction nozzles J3 (an example of the first suction holding member J), and the other rotating mechanism 82 includes a plurality of (four in the example of fig. 8) suction nozzles R3. In the reversing unit 80, the same components as those of the reversing unit 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

The rotating mechanism 81 in which the nozzles J3 are radially arranged and the rotating mechanism 82 in which the nozzles R3 are radially arranged are rotatably mounted on the right and left sides of the support body 22, respectively. The rotation mechanism 81 includes a holding member support 87, the holding member support 87 is connected to a rotation shaft 86 that is rotationally driven by the operation of the motor 85, and a plurality of arm portions provided in the holding member support 87 movably support the suction nozzle J3. The rotation mechanism 82 includes a holding member support 90, the holding member support 90 is connected to a rotation shaft 89 that is rotationally driven by operation of the motor 88, and a plurality of arm portions provided in the holding member support 90 movably support the suction nozzles R3, respectively.

The rotating mechanism 81 rotates counterclockwise by a predetermined angle (90 degrees in the example of fig. 8) by one operation of the motor 85, and the rotating mechanism 82 rotates counterclockwise by a predetermined angle (90 degrees in the example of fig. 8) by one operation of the motor 88. The support body 22 is equipped with a driving unit 91 that horizontally moves the suction nozzle J3 by applying a force to the suction nozzle J3 disposed at the first position.

When one nozzle J3 receives the electronic component W from the nozzle mechanism 16 temporarily stopped at the nozzle stop position above the rotation mechanism 81 in the state of sucking the surface Q, the rotation mechanism 81 rotates counterclockwise by a predetermined angle by the operation of the motor 85, and moves the nozzle J3 that has acquired the electronic component W from the nozzle mechanism 16 to the first position. One nozzle R3 is disposed to face the nozzle J3 disposed at the first position, and the nozzle J3 that has sucked the surface Q of the electronic component W is brought close to the nozzle R3 by the operation of the driving unit 91, and the surface P is brought into contact with the nozzle R3. The suction nozzle R3 sucks the surface P to pick up the electronic component W from the suction nozzle J3 disposed opposite to the suction nozzle R.

At the timing (timing) when the nozzle R3 receives the electronic component W from the nozzle J3, the other nozzle J3 picks up the electronic component W from the nozzle mechanism 16 temporarily stopped at the nozzle stop position. After the nozzle R3 has picked up the electronic component W from the nozzle J3, the

motors

85 and 88 are operated, the rotating mechanisms 81 and 82 are rotated counterclockwise by a predetermined angle, and the nozzle R3 which has picked up the electronic component W from the nozzle J3 is disposed at a second position below the nozzle mechanism 16 which is temporarily stopped at a nozzle stop position above the rotating mechanism 82. The nozzle mechanism 16 disposed above the nozzle R3 moves down until it comes into contact with the surface Q of the electronic component W sucked by the nozzle R3, sucks the surface Q, and picks up the electronic component W from the nozzle R3.

At the timing (timing) when the electronic component W is transferred from the nozzle R3 to the nozzle mechanism 16, the other nozzle R3 obtains the electronic component W from the nozzle J3. In the reversing unit 80, the transfer of the electronic component W from the component feeding device 11 to the rotating mechanism 81, the transfer of the electronic component W from the rotating mechanism 81 to the rotating mechanism 82, and the transfer of the electronic component W from the rotating mechanism 82 to the component feeding device 11 can be performed simultaneously, and therefore the reversing process of the electronic component W can be performed efficiently. That is, when the one nozzle J3 is disposed at the position where the electronic component W is picked up from the nozzle mechanism 16, the other nozzle J3 is disposed at the first position, the one nozzle R3 is disposed opposite to the nozzle J3 disposed at the first position, and the other nozzle R3 is disposed at the second position.

In the reversing unit 80, the moving mechanism K3 (an example of the first moving mechanism K) is mainly configured by the motor 85, the rotating shaft 86, and the holding member support 87, and the component transfer portion L3 (an example of the first component transfer portion L) is mainly configured by the plurality of suction nozzles J3 and the moving mechanism K3. The moving mechanism S3 (an example of a second moving mechanism S) is configured to include the motor 88, the rotary shaft 89, and the holding member support 90, and the component transfer unit T3 (an example of a second component transfer unit T) is configured mainly by the plurality of suction nozzles R3 (an example of a second suction holding member R) and the second moving mechanism S3.

Therefore, the reversing unit may be designed such that the two rotating mechanisms rotate in the same direction, and the first component transfer section L and the second component transfer section T may be provided with the plurality of first suction holding members J and the plurality of second suction holding members R, respectively.

When the nozzle J3 approaches the nozzle R3 and the electronic component W contacts the nozzle R3, a load is applied to the electronic component W, but the load is alleviated by an unillustrated elastic body attached to the rotation mechanism 82.

Instead of the driving unit 91 for horizontally moving the nozzle J3, a driving unit may be used in which the nozzle R3 is brought into contact with the surface P of the electronic component W near the nozzle J3 for sucking the surface Q of the electronic component W at the first position. In addition to the driving unit 91, a driving unit may be provided to bring the nozzle R3 close to the nozzle J3, and in this case, the nozzles J3 and R3 may be brought close to each other to bring the nozzle R3 into contact with the plane P of the electronic component W.

Further, a driving unit for raising the suction nozzle J3 disposed below the suction nozzle mechanism 16 to approach the suction nozzle mechanism 16 and/or a driving unit for raising the suction nozzle R3 disposed below the suction nozzle mechanism 16 to approach the suction nozzle mechanism 16 may be provided.

Although the present invention has been described in detail with reference to the specific embodiments, it is apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention.

The present application is based on japanese patent application 2018-195083, filed on 16.10.2018, the content of which is incorporated by reference into the present application.

Description of reference numerals:

10: a turning unit; 11: a part conveying device; 12: a substrate; 13: a motor; 14: a rotating shaft; 15: a rotor; 16: a suction nozzle mechanism; 17: a drive mechanism; 18: a motor; 19: a lifting body; 20: a guide rail; 21: a base; 22: a support; 23: a base block; 24. 25: a rotation mechanism; 26: a groove; 27. 28: a motor; 29. 30: a rotating shaft; 31: a bracket; 32: a sliding member; 34: a coil spring; 35: a guide rail; 36: a movable member; 37: a protrusion; 38: a motor; 39: a guide member; 41: a coil spring; 50: a turning unit; 51: a rotating shaft; 52: a rotation mechanism; 53: a motor; 54: a guide rail; 55: a movable member; 56: a rotating shaft; 57: a rotation mechanism; 58: a motor; 59: a bracket; 60: a sliding member; 62: a guide member; 64: a motor; 65: a protrusion; 66: a coil spring; 70: a rotating shaft; 71: a rotating body; 72: a suction nozzle mechanism; 73. 74: a rotation mechanism; 75: a part conveying device; 80: a turning unit; 81. 82: a rotation mechanism; 85: a motor; 86: a rotating shaft; 87: a holding member support body; 88: a motor; 89: a rotating shaft; 90: a holding member support body; 91: a drive section; j1, J2, J3: a suction nozzle; k1, K2, K3: a moving mechanism; l1, L2, L3: a component transfer section; p, Q: kneading; r1, R2, R3: a suction nozzle; s1, S2, S3: a moving mechanism; t1, T2, T3: a component transfer section; w: an electronic component.

Claims

1. A flipping unit configured to: a component conveying device that receives an electronic component having a first surface and a second surface parallel to the first surface, turns the electronic component over, and delivers the electronic component to the outside, the turning unit including:

a first component transfer section; and

a second component transfer part for transferring a second component,

wherein the first component transfer unit includes:

a first adsorption holding member configured to: sucking the second surface of the electronic component, the first surface of which is sucked by the component conveying device, so as to obtain the electronic component from the component conveying device; and

a first moving mechanism configured to: moving the first suction holding member which has acquired the electronic part to a first position,

the second component transfer unit includes:

a second adsorption and holding member configured to: a first suction holding member disposed to face the first suction holding member disposed at the first position, the first suction holding member sucking the first surface of the electronic component sucked by the first suction holding member to obtain the electronic component; and

a second moving mechanism configured to: moving the second suction holding member, which has acquired the electronic part, to a second position, which is a position where the electronic part that has been turned over is handed over to the part conveying device,

the first moving mechanism is configured to: the first surface is brought into contact with the second suction-holding member by bringing the first suction-holding member close to the second suction-holding member disposed opposite the first suction-holding member disposed at the first position.

2. The flipping unit of claim 1,

the first component transfer section includes a holding member support body that movably supports the first suction holding member,

the first component transfer unit is configured to: the first suction holding member is moved to the first position by rotating the holding member support body by a predetermined angle about a rotation shaft connected to the holding member support body.

3. The flipping unit of claim 1 or 2, wherein,

an elastic body that alleviates a load generated by the electronic component by the first surface being in contact with the second suction holding member is provided in at least one of the first component transfer unit and the second component transfer unit.

4. The flipping unit of any one of claims 1 to 3,

a plurality of the first and second suction-holding members are provided,

the turning unit is configured to: when one of the first suction-holding members is arranged at a position where the electronic component is taken out from the component transfer apparatus, the other of the first suction-holding members is arranged at the first position, one of the second suction-holding members is arranged to face the first suction-holding member arranged at the first position, and the other of the second suction-holding members is arranged at the second position.

5. A flipping unit configured to: a component conveying device that receives an electronic component having a first surface and a second surface parallel to the first surface, turns the electronic component over, and delivers the electronic component to the outside, the turning unit including:

a first component transfer section; and

a second component transfer part for transferring a second component,

wherein the first component transfer unit includes:

the second component transfer unit includes:

a second moving mechanism that moves the second suction holding member that has acquired the electronic part to a second position that is a position where the electronic part that has been turned over is handed over to the part conveying device,

the second moving mechanism is configured to: the second suction-holding member disposed to face the first suction-holding member disposed at the first position is brought close to the first suction-holding member, and the second suction-holding member is brought into contact with the first surface.