CN111933522B - Jig and annealing device - Google Patents
Jig and annealing device Download PDFInfo
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- CN111933522B CN111933522B CN202010825247.2A CN202010825247A CN111933522B CN 111933522 B CN111933522 B CN 111933522B CN 202010825247 A CN202010825247 A CN 202010825247A CN 111933522 B CN111933522 B CN 111933522B
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- jig
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a jig and an annealing device. This tool includes: a first clamping block; the second clamping block is arranged opposite to the first clamping block and comprises a conductive body and a conducting part, the conducting part is arranged on one side of the conductive body, which faces the first clamping block, the conducting part comprises a plurality of conductors arranged at intervals, and a heat flow channel is formed between the conductors; and a drive assembly for driving the second clamp block and the first clamp block to move relatively. According to the jig, in the annealing process, high-temperature gas can enter the heat flow channel between the conductors, so that the area, shielded by the jig, of the panel is fully contacted with the high-temperature gas, and the temperature rising and reducing processes of the area, shielded by the jig, of the panel and the area, not shielded by the jig, are kept consistent. After the annealing treatment is finished, the crystallization states of the transparent conductive films positioned in different areas of the panel are consistent, and the color of the surface of the panel subjected to the annealing treatment by adopting the jig is uniform.
Description
Technical Field
The invention relates to the technical field of panel preparation, in particular to a jig and an annealing device.
Background
To eliminate the charge accumulated during the panel manufacturing process, an Annealing process (SBK) is added after the panel dicing process (scibe and Break). The specific contents of the annealing process are as follows: the output end (Source) signal line of the panel and the transparent conductive film (ITO, indium Tin Oxides, indium tin oxide) attached to the color filter are connected by using conductive cloth, and the temperature is raised to improve the mobility of electrons, so that the residual charges in the panel can be transmitted to the transparent conductive film, and the residual charges in the panel can be eliminated.
In order to avoid the liquid crystal in the panel from being affected by high temperature, the transparent conductive film on the panel is formed by adopting a low-temperature coating process. However, the transparent conductive film formed by the low temperature coating process is amorphous, and the transparent conductive film is changed from amorphous to polycrystalline state under the influence of temperature rise in the annealing process. The areas of the panel covered by the conductive cloth are heated differently during the annealing process than the areas not covered by the conductive cloth, and thus the crystalline state is different, resulting in localized color non-uniformity (CF surface dirt) of the panel.
Disclosure of Invention
Accordingly, it is necessary to provide a jig and an annealing apparatus for solving the problem of uneven color of the panel due to uneven heating during the annealing process.
A jig, comprising:
a first clamping block;
the second clamping block is arranged opposite to the first clamping block and comprises a conductive body and a conducting part, the conducting part is arranged on one side of the conductive body, which faces the first clamping block, the conducting part comprises a plurality of conductors arranged at intervals, and a heat flow channel is formed between the conductors; and
and the driving assembly is used for driving the second clamping block and the first clamping block to move relatively.
In one embodiment, the conductive body is made of conductive silica gel or conductive foam.
In one embodiment, the conductive portion includes a first conductive portion and a second conductive portion, and the thickness of the first conductive portion is greater than the thickness of the second conductive portion.
In one embodiment, the electrical conductor of the second conductive portion takes the shape of a barb having a convex tip with the barb facing the first conductive portion.
In one embodiment, the first conductive portion is set to be directed to the second conductive portion in a first direction, the second direction is perpendicular to the first direction, and the heat flow channels are formed between the plurality of conductors of the first conductive portion and the second conductive portion along the first direction and/or the second direction.
In one embodiment, the electric conductors are in a strip shape, the heat flow channels are formed between two adjacent electric conductors,
and/or the electric conductors are in a block shape and are scattered on the electric conductor body, and the heat flow channels can be formed between the electric conductors.
In one embodiment, the jig further comprises a mounting seat, the first clamping block is fixedly connected to the mounting seat, the second clamping block is movably arranged on the mounting seat, and the driving assembly can drive the second clamping block to be close to the first clamping block so as to clamp a panel placed on the jig.
In one embodiment, the second clamping block forms a gap with the mounting block from which air flow can enter the heat flow channel.
The utility model provides an annealing device, includes the heating furnace with the tool, be formed with the cavity in the heating furnace and can produce the high temperature gas that upwards flows, the tool is arranged in the cavity, high temperature gas flows through when arranging in panel surface on the tool can pass the heat flow channel.
In one embodiment, the annealing device further comprises a bracket and a plurality of groove plates, the groove plates are arranged on the bracket in parallel, the jig is arranged between two adjacent groove plates, clamping grooves are formed in corresponding positions of the two adjacent groove plates, and the clamping grooves are used for placing two opposite side edges of the panel.
According to the jig, in the annealing process, high-temperature gas can enter the heat flow channel between the conductors, so that the area, shielded by the jig, of the panel is fully contacted with the high-temperature gas, and the temperature rising process of the area, shielded by the jig, of the panel is kept consistent with that of the area, not shielded by the jig. Correspondingly, when the panel is taken out from the heating furnace to be cooled, the cooling process of the area, which is shielded by the jig, on the panel is kept consistent with that of the area, which is not shielded by the jig. In summary, the heating and cooling processes of the area, which is covered by the jig, and the area, which is not covered by the jig, of the panel are kept consistent, so that after the annealing treatment is finished, the crystallization states of the transparent conductive films located in different areas of the panel are consistent, and the color of the surface of the panel annealed by the jig is uniform.
Drawings
FIG. 1 is a schematic view of a panel;
FIG. 2 is a schematic diagram of an annealing apparatus according to an embodiment;
FIG. 3 is a schematic view of a fixture for clamping a panel in the annealing apparatus shown in FIG. 2;
FIG. 4 is a schematic view of a part of the fixture in the annealing device shown in FIG. 2;
FIG. 5 is an enlarged view of FIG. 4 at A;
FIG. 6 is a front view of a second clamping block of the jig shown in FIG. 4;
FIG. 7 is a side view of the second clamp block of FIG. 6;
FIG. 8 is a schematic view showing the structure of a rack and a trough plate in an annealing apparatus according to an embodiment;
fig. 9 is an enlarged view of D in fig. 8.
Description of the main reference signs
100: jig, 10: first clamp splice, 20: second clamp block, 20a: gap, 21: conductive body, 22: conduction unit, 22a: first conduction portion, 22b: second conduction unit, 221: electrical conductor, 2211: tip, 30: drive assembly, 40: the mounting seat is provided with a plurality of mounting holes,
200: heating furnace, 210: furnace body, 211: hollow cavity, 220: heater, 230: a fan B: first region, C: a second region of the substrate is provided with a second region,
300: panel, 310: thin film crystal layer, 311: annealing the terminal, 320: color filter, 330: a transparent conductive film is provided which,
the invention will be further described with reference to the following detailed description taken in conjunction with the above-described drawings.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
The present invention provides an annealing apparatus for annealing various types of panels to remove charges accumulated during the manufacturing process of the panels.
In one embodiment, the panel is of an IPS type (IPS, in-Plane-Switching Liquid Crystal, transverse electric field effect display technology), and the IPS type panel includes a lower polarizing plate (Bottom Polarizer), a lower glass substrate, a thin film crystal layer (TFT, thin Film Transistor), a liquid crystal layer (LC layer, liquid Crystal layer), an alignment film, a Color Filter (CF), an upper glass substrate, a transparent conductive film, and an upper polarizing plate (Top Polarizer) stacked. The preparation process of the IPS type panel comprises the following steps: (1) The Array process comprises the steps of cleaning a lower glass substrate, performing five steps of depositing a conductive film, applying a photoresist, irradiating an ultraviolet pattern, exposing, developing, etching and removing the photoresist on the upper surface of the lower glass substrate to form a thin film crystal layer, and depositing a transparent conductive film on the upper surface of the upper glass substrate; (2) The method comprises the steps of a Cell manufacturing process, bonding the lower surface of an upper glass substrate with a color filter, printing an alignment film on the surface of the color filter of the upper glass substrate, performing alignment treatment on the alignment film, spraying spacers for controlling the thickness of a liquid crystal layer and supporting the space of the upper glass substrate and the space of the lower glass substrate on the surface of the alignment film, printing the alignment film on the surface of a thin film crystal layer of the lower glass substrate obtained in an Array manufacturing process, performing alignment treatment, then coating a sealing material which enables the color filter of the upper glass substrate and a TFT (thin film transistor) of the lower glass substrate to be tightly bonded together, forming a closed space by the upper glass substrate, the lower glass substrate and the sealing material, injecting liquid crystal into the closed space, tightly bonding the upper glass substrate and the lower glass substrate, combining and hot pressing, and cutting a large-size panel into a panel with a target size; and (3) bonding the upper polarizing plate and the lower polarizing plate.
Fig. 1 shows a schematic diagram of a semi-finished product of a panel 300, and for convenience of understanding, fig. 1 does not show a lower glass substrate, a liquid crystal layer (Liquid Crystal layer), an alignment film, and an upper glass substrate, but only shows a thin film crystal layer 310, a color filter 320, and a transparent conductive film 330, and the thin film crystal layer 310 is formed with an annealing terminal 311.
In the Array process and the Cell process, charges are inevitably accumulated on the panel, and thus an annealing process is required to be added between the steps (2) and (3), i.e., annealing treatment is performed on the cut panel semi-finished product, so that charges remaining in the panel are conducted out to the transparent conductive film. Specifically, the panel may be annealed using the aforementioned annealing apparatus.
Referring to fig. 2, an annealing apparatus according to an embodiment of the invention includes a heating furnace 200 and a jig 100. The heating furnace 200 has a hollow cavity 211 formed therein and is capable of generating upward flowing high temperature gas, and the jig 100 is placed in the hollow cavity 211. The temperature range of the high-temperature gas was 130±3℃. The process of annealing the panel 300 using the annealing apparatus described above is as follows: placing the panel 300 on the jig 100 and into the heating furnace 200, and allowing high-temperature gas to flow through the surface of the panel 300 so that the temperature of the panel 300 is increased; the panel 300 and the jig 100 are taken out of the heating furnace 200, and the panel 300 is cooled to room temperature for the next process.
Specifically, the heating furnace 200 includes a furnace body 210, a heater 220, and a fan 230. The heater 220 is used to heat the gas in the furnace 200 to raise the temperature of the gas to a proper range. The furnace body 210 is provided with an air inlet and an air outlet, the fan 230 is arranged at the air inlet, the fan 230 can send the air outside the furnace body 210 into the furnace body 210 to promote the air flow in the furnace body 210, and the heated high-temperature air is fully contacted with the panel 300 to shorten the heating time. It will be appreciated that the fan 230 is located between the air intake and the heater 220. It will be appreciated that the gas may be air or nitrogen, etc. The air inlet may be provided at the top or bottom of the furnace body 210, and the installation position of the fan 230 may be adjusted accordingly. When the temperature of the gas increases, the density of the gas decreases, and the density of the high-temperature gas is smaller, so that the high-temperature gas has a tendency to flow upwards, and contacts the surface of the panel 300 during the rising process of the high-temperature gas, so that the temperature of the panel 300 increases.
Referring to fig. 3, the jig 100 is partially contacted with the panel 300 to be processed, and is used for conducting the annealing terminal 311 of the thin film transistor layer 310 on the panel 300 to the transparent conductive film 330, so that the residual charges inside the panel 300 are transferred to the transparent conductive film 330. Further, the transparent conductive film 330 may form a capacitance with the ground object, and the charge on the transparent conductive film 330 is discharged to the ground by capacitive coupling. The region where the jig 100 contacts the panel 300 is formed with a heat flow channel, and high temperature gas can enter the heat flow channel between the jig 100 and the panel 300, so that the region where the panel 300 is shielded by the jig 100 is ensured to be fully contacted with the high temperature gas, and the temperature rising process of the region where the panel 300 is shielded by the jig 100 is consistent with the temperature rising process of the region where the panel 300 is not shielded by the jig 100. Since the temperature rising process of the area of the panel 300 blocked by the jig 100 is consistent with that of the area not blocked by the jig 100, the crystallization state of the transparent conductive film 330 positioned at different areas of the panel 300 is consistent after the annealing process is finished, and the surface color of the panel 300 annealed by the annealing device of the present invention is uniform.
Specifically, the annealing terminal 311 is a metal wire block connected to the thin film crystal layer 310, and is used for conducting between the thin film crystal layer 310 and other components. For example, the annealing terminal 311 may be used to connect an external test circuit when performing a screen inspection of the panel 300.
Referring to fig. 4 and 5, the jig 100 includes a first clamping block 10, a second clamping block 20 and a driving assembly 30. The second clamping block 20 is arranged opposite to the first clamping block 10, and the driving assembly 30 is used for driving the second clamping block 20 and the first clamping block 10 to move relatively. When the jig 100 is in use, the first clamping block 10 and the second clamping block 20 move towards each other to clamp the panel 300. The second clamping block 20 is in contact with the panel 300 to be processed, and is used for conducting the annealing terminal 311 of the thin film crystal layer 310 on the panel 300 with the transparent conductive film 330, so that charges remained in the panel 300 are transferred to the transparent conductive film 330. It can be appreciated that the first clamping block 10 mainly plays a role of auxiliary positioning, so that the second clamping block 20 and the panel 300 keep a mutually abutting state in the annealing process, and the second clamping block 20 is prevented from being separated from the panel 300.
Referring to fig. 4 again, the jig 100 further includes a mounting base 40, the first clamping block 10 is fixedly connected to the mounting base 40, and the second clamping block 20 is movably disposed relative to the mounting base 40. The driving assembly 30 can drive the second clamping block 20 to approach the first clamping block 10 so as to clamp the panel 300. In an embodiment, the number of the first clamping blocks 10 and the second clamping blocks 20 is multiple, the first clamping blocks 10 and the second clamping blocks 20 are arranged in a one-to-one correspondence, and the first clamping blocks 10 and the second clamping blocks 20 are alternately arranged. The plurality of first clamping blocks 10 are fixed to the mounting base 40 at equal intervals. The second clamping blocks 20 are arranged on the connecting plate 31 of the driving assembly 30 and can synchronously move towards or away from the corresponding first clamping blocks 10 under the driving of the driving assembly 30.
Referring to fig. 5 and 6, the second clamping block 20 is provided with a relief opening 20b, the mount 40 is partially accommodated in the escape opening 20 b. The mount 40 can support the panel 300 placed between the first and second clamp blocks 10 and 20. Further, the second clamping block 20 and the mounting seat 40 are formed with a gap 20a, and air flow can enter between the first clamping block 10 and the second clamping block 20 through the gap 20a, so that air can flow through the surface of the panel 300 clamped between the first clamping block 10 and the second clamping block 20 to heat the panel 300.
In this embodiment, the drive assembly 30 is operated manually. In other embodiments, a cylinder or motor may be used as a power source to automatically control the drive assembly 30.
Referring to fig. 6, the second clamping block 20 includes a conductive body 21 and a conductive portion 22, the conductive portion 22 is disposed on a side of the conductive body 21 facing the first clamping block 10, the conductive portion 22 includes a plurality of conductive bodies 221 disposed at intervals, and a heat flow channel is formed between the conductive bodies 221. The surface of the conductive body 21 is divided into a first region B and a second region C. When the jig 100 is in the use state, the first and second clamping blocks 10 and 20 are mutually closed, and the panel 300 is clamped between the first and second clamping blocks 10 and 20. At this time, the conductive portion 22 of the second clamp block 20 contacts the panel 300. Further, referring to fig. 3, the conductive portion 22 in the first region B is in contact with the annealing terminal 311 of the thin film transistor layer 310 and is electrically conductive, the conductive portion 22 in the second region C is in contact with the transparent conductive film 330 covering the CF and is electrically conductive, and the conductive portions 22 in the first region B and the second region C are both in contact with the conductive body 21 and are electrically conductive, so that the annealing terminal of the TFT on the panel 300 is electrically conductive with the transparent conductive film 330 covering the CF. In the annealing process, the high temperature gas can enter the heat flow channel between the conductors 221, so that the area of the panel 300 shielded by the jig 100 is ensured to be fully contacted with the high temperature gas, and the temperature rising process of the area of the panel 300 shielded by the jig 100 is kept consistent with that of the area not shielded by the jig 100. In summary, the temperature rising process of the area, which is blocked by the jig 100, of the panel 300 is consistent with that of the area, which is not blocked by the jig 100, so that after the annealing treatment is finished, the crystallization states of the transparent conductive films 330 located in different areas of the panel 300 are consistent, and the surface color of the panel 300 annealed by the jig 100 of the invention is uniform.
It will be appreciated that the conductive body 21 may be made of a metal plate by numerical control machining, and the metal plate may be aluminum or copper. A conductive film may be coated on the non-metal plate to form the conductive body 21. The side of the plurality of second clamping blocks 20 provided with the conducting parts 22 faces uniformly.
In one embodiment, the electrical conductor 221 is made of a flexible material. The flexible material can deform to a certain extent in the thickness direction, the distance between the first clamping block 10 and the second clamping block 20 is adjusted, the conductor 221 can be tightly attached to the panel 300, the contact between the conductor 221 and the annealing terminal 311 and the transparent conductive film 330 on the panel 300 is good, and the phenomenon that charges cannot be released due to poor contact between the conductor 221 and the annealing terminal 311 or the transparent conductive film 330 is avoided. The flexible material can be conductive silica gel or conductive foam. When the conductive body 221 is made of different materials, a corresponding molding method may be selected. For example, when the conductive body 221 is made of conductive silica gel, the conductive body 21 may be formed with conductive bodies 221 arranged in a regular manner by injection molding, and the conductive bodies 221 may constitute the conductive portion 22. When the conductive body 221 is made of conductive foam, the conductive body 221 may be fixed on the conductive body 21 by using an adhesive manner.
In other embodiments, the conductor 221 may be made of other conductive materials, such as graphene.
In the first embodiment, referring to fig. 6 and 7, the conducting portion 22 includes a first conducting portion 22a and a second conducting portion 22B, the first conducting portion 22a is located in the first area B of the conductive body 21, and the second conducting portion 22B is located in the second area C of the conductive body 21. The thickness of the first conductive portion 22a is greater than the thickness of the second conductive portion 22 b. The annealing terminal 311 and the transparent conductive film are positioned on different planes, the first conductive part 22a and the second conductive part 22b form a height difference, so that the first conductive part 22a is connected with the transparent conductive film and is electrically conducted, and the second conductive part 22b is connected with the annealing terminal 311 and is electrically conducted.
The electrical conductor 221 of the second conductive portion 22b takes the shape of a barb having a protruding tip 2211, the tip 2211 facing the first conductive portion 22a, that is, the tip 2211 of the barb pointing towards the first conductive portion 22a. Referring specifically to fig. 7, the tips 2211 of the barbs are directed downwardly and to the left. The annealing terminal 311 is located at an edge of the panel 300, and when the jig 100 is in a use state, the first conductive portion 22a connected to the annealing terminal 311 is located below the jig 100, and the second conductive portion 22b is located above the jig 100. The direction of the barbs is opposite to the direction of pulling out the panel 300 from the jig 100, that is, the direction of the barbs is opposite to the direction of the relative movement trend of the panel 300 and the jig 100, so that the panel 300 can be better fixed in the jig 100. In addition, the contact area between the barb-shaped conductor 221 and the panel 300 is smaller, the area of the panel 300 shielded is reduced, and the heat exchange between the panel 300 and the high-temperature gas is facilitated.
In one embodiment, the number of conductors 221 is at least 4 to ensure that the force of conductors 221 against panel 300 is sufficiently large.
Referring to fig. 6, the first conductive portion 22a is set to be directed to the second conductive portion 22b along a first direction, the second direction is perpendicular to the first direction, and a heat flow channel is formed between the plurality of conductors 221 of the first conductive portion 22a and the second conductive portion 22b along the first direction and/or the second direction. In one embodiment, the first direction is the Y direction in the figure and the second direction is the X direction in the figure. In the rising process of the high-temperature gas in the heating furnace 200, the bottom of the jig 100 sequentially enters the heat flow channels of the first conducting part 22a and then enters the heat flow channels of the second conducting part 22b, and the heat flow channels distributed along the first direction and the second direction can play a role in guiding the high-temperature gas, so that the high-temperature gas can be in full contact with different areas of the panel 300, the temperature of the different areas of the panel 300 shielded by the jig 100 can be ensured to be kept consistent, and the color unevenness caused by the temperature difference can be avoided.
In the second embodiment, the annealing terminal 311 is located in the same plane as the transparent conductive film 330. The conductors 221 are elongated, and a heat flow channel is formed between two adjacent conductors 221. Alternatively, the conductors 221 may be in a block shape and spread on the conductive body 21, and heat flow channels may be formed between the conductors 221.
Referring to fig. 8, the annealing apparatus further includes a holder 410 and a plurality of slot plates 420. The plurality of groove plates 420 are arranged on the bracket 410 in parallel, and the jig 100 is arranged between two adjacent groove plates 420. Referring to fig. 9, the slot plate 420 is provided with a plurality of slots 421, and the slots 421 are used for limiting the panel 300 in the thickness direction of the panel 300. The thickness direction of the panel 300 refers to the Z direction shown in fig. 1. In actual production, the panel 300 is lifted above the bracket 410, so that two sides of the panel 300 are aligned with the clamping grooves 421 of the two groove plates 420, and then the panel 300 slides down along the clamping grooves 421 step by step until the bottom end of the panel 300 enters the jig 100. It can be appreciated that the slot plate 420 can be provided with a plurality of slots 421, so that a plurality of panels 300 can be placed, which is beneficial to realizing mass production. It should be noted that the slots 421 on the slot plate 420 should be arranged so that a certain distance is kept between every two adjacent panels 300 for the air flow to pass through. A plurality of jigs 100 are correspondingly arranged along the arrangement direction of the panels 300, each panel 300 is correspondingly provided with one jig 100, and the jigs 100 can clamp from the bottom end of the panel 300.
In one embodiment, the working procedure of the annealing device is as follows:
(1) The two sides of the panel 300 are aligned to the clamping groove 421 of the groove plate 420, and the panel 300 slides down the clamping groove 421 to be abutted against the mounting seat 40 of the jig 100 under the action of gravity, wherein the jig 100 is placed under the groove plate 420.
(2) The driving assembly 30 is pulled to enable the first clamping block 10 and the second clamping block 20 to be mutually combined to clamp the panel 300, and the conducting part 22 on the second clamping block 20 is attached to the panel 300. Since the conductors 221 on the conducting portion 22 are disposed at intervals, a heat flow channel is still provided between the second clamping block 20 and the panel 300 when the conducting portion 22 is attached to the panel 300.
(3) The supporter 410, the chute 420, and the panel 300 are moved into the heating furnace 200, the heater 220 and the fan 230 are turned on, and a high temperature air flow is formed in the furnace body 210 to heat the panel 300. The high-temperature air flow passes through the heat flow channel between the second clamping block 20 and the panel 300, so that the temperature of the area of the panel 300 blocked by the jig 100 and the area of the panel 300 exposed outside the jig 100 rise synchronously.
(4) The heater 220 is turned off to gradually cool the panel 300, thereby completing the annealing process. Then, the jig 100 is opened, and the panel 300 is taken out.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The fixture is characterized in that the fixture is used for an annealing process of a panel, the panel comprises a thin film crystal layer and a transparent conductive film arranged on one side of the thin film crystal layer, and an annealing terminal is arranged on the thin film crystal layer;
the jig comprises:
a first clamping block;
the second clamping block is arranged opposite to the first clamping block and comprises a conductive body and a conducting part, the conducting part is arranged on one side of the conductive body, which faces the first clamping block, the conducting part comprises a plurality of conductors arranged at intervals, and a heat flow channel is formed between the conductors; the surface of the conductive body is divided into a first area and a second area, and the conducting part positioned in the first area and the conducting part positioned in the second area are connected with the conductive body and electrically conducted; and
and the driving assembly is used for driving the second clamping block and the first clamping block to move relatively so that the second clamping block and the first clamping block can be mutually close to clamp the panel, the conducting part positioned in the first area is connected with the annealing terminal and is electrically conducted, and the conducting part positioned in the second area is connected with the transparent conductive film and is electrically conducted.
2. The jig of claim 1, wherein the conductive body is made of conductive silica gel or conductive foam.
3. The jig of claim 1, wherein the conductive portion comprises a first conductive portion and a second conductive portion, the first conductive portion having a thickness greater than a thickness of the second conductive portion.
4. A jig according to claim 3, wherein the electrical conductor of the second conducting portion takes the shape of a barb having a convex tip facing the first conducting portion.
5. A jig according to claim 3, wherein the first conduction portion is set to be directed to the second conduction portion in a first direction, a second direction is perpendicular to the first direction, and the heat flow channels are formed between the plurality of conductors of the first and second conduction portions in the first and/or second directions.
6. The jig according to claim 1, wherein the conductors are elongated, the heat flow channels are formed between two adjacent conductors,
and/or the electric conductors are in a block shape and are scattered on the electric conductor body, and the heat flow channels can be formed between the electric conductors.
7. The jig of claim 1, further comprising a mounting base, wherein the first clamping block is fixedly connected to the mounting base, the second clamping block is movably disposed on the mounting base, and the driving assembly is capable of driving the second clamping block to approach the first clamping block so as to clamp a panel disposed on the jig.
8. The jig of claim 7, wherein the second clamp block forms a gap with the mount, the gap being capable of allowing air flow into the heat flow channel.
9. An annealing device, characterized by comprising a heating furnace and the jig according to any one of claims 1-8, wherein a hollow cavity is formed in the heating furnace and can generate upward flowing high-temperature gas, the jig is arranged in the hollow cavity, and the high-temperature gas can pass through the heat flow channel when flowing through the surface of a panel arranged on the jig.
10. The annealing device according to claim 9, further comprising a bracket and a plurality of groove plates, wherein a plurality of groove plates are arranged on the bracket in parallel, the jig is arranged between two adjacent groove plates, and clamping grooves are formed in corresponding positions of the two adjacent groove plates, and are used for placing two opposite sides of the panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010825247.2A CN111933522B (en) | 2020-08-17 | 2020-08-17 | Jig and annealing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010825247.2A CN111933522B (en) | 2020-08-17 | 2020-08-17 | Jig and annealing device |
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| CN111933522A CN111933522A (en) | 2020-11-13 |
| CN111933522B true CN111933522B (en) | 2023-07-18 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201486A (en) * | 1993-12-28 | 1995-08-04 | Alps Electric Co Ltd | Static eliminating method and device |
| JP2004126452A (en) * | 2002-10-07 | 2004-04-22 | Matsushita Electric Ind Co Ltd | Method of manufacturing plasma display device |
| JP2007162063A (en) * | 2005-12-13 | 2007-06-28 | Dainippon Printing Co Ltd | Sputtering apparatus and carrier for transporting substrate |
| CN105121368A (en) * | 2013-04-10 | 2015-12-02 | 日本电气硝子株式会社 | Glass substrate with holding part, method for heat treating glass substrate, and glass substrate supporting unit |
| CN209417461U (en) * | 2019-01-02 | 2019-09-20 | 南京中电熊猫平板显示科技有限公司 | A kind of panel jig |
-
2020
- 2020-08-17 CN CN202010825247.2A patent/CN111933522B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201486A (en) * | 1993-12-28 | 1995-08-04 | Alps Electric Co Ltd | Static eliminating method and device |
| JP2004126452A (en) * | 2002-10-07 | 2004-04-22 | Matsushita Electric Ind Co Ltd | Method of manufacturing plasma display device |
| JP2007162063A (en) * | 2005-12-13 | 2007-06-28 | Dainippon Printing Co Ltd | Sputtering apparatus and carrier for transporting substrate |
| CN105121368A (en) * | 2013-04-10 | 2015-12-02 | 日本电气硝子株式会社 | Glass substrate with holding part, method for heat treating glass substrate, and glass substrate supporting unit |
| CN209417461U (en) * | 2019-01-02 | 2019-09-20 | 南京中电熊猫平板显示科技有限公司 | A kind of panel jig |
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| Publication number | Publication date |
|---|---|
| CN111933522A (en) | 2020-11-13 |
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