CN111923519A - 一种mpi高频高速柔性基材及制备方法及其应用 - Google Patents

一种mpi高频高速柔性基材及制备方法及其应用 Download PDF

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CN111923519A
CN111923519A CN202010844886.3A CN202010844886A CN111923519A CN 111923519 A CN111923519 A CN 111923519A CN 202010844886 A CN202010844886 A CN 202010844886A CN 111923519 A CN111923519 A CN 111923519A
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刘河洲
余光明
吴飞龙
刘国重
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Abstract

本发明公开了一种MPI高频高速柔性基材，三层结构为高频PI层、MPI层以及低轮廓铜箔层，其特征在于，所述MPI层为由如下重量分数的组分制备的胶粘剂：MPI胶液50‑95％；饱和聚酯树脂1‑10％；阻燃剂5‑30％；固化剂2‑10％，所述MPI胶液为采用二铵和酸酐在15‑50℃之间合成的MPI胶液。本发明还公开了其制备方法和应用。本发明的MPI高频高速柔性基材成品除满足一般挠性覆铜板IPC标准外，具有低Dk值、Df值的要求，其中特征值Dk值低于2.80，Df值低于0.005，符合5G高频信号传输的需要。

Description

一种MPI高频高速柔性基材及制备方法及其应用
技术领域
本发明涉及无线通信制造领域，具体涉及一种MPI高频高速柔性基材及制备方法及其应用。
背景技术
随5G信息时代的到来，无线通信从3G/4G到目前的5G，信号传输的速度和质量提高了十几倍，对材料特性要求也需革新，目前的电子材料只适合3G/4G的无线传输，对5G的高频高速是不合适的。
高频挠性覆铜板是起到线路信号传输，在低Dk值、Df值的环境下，具有信号超高速传输、低延时特点，满足5G信息传输要求。
而现有材料采用饱和聚酯树脂，其Dk值在3.0-4.0，Df小于0.004，信号干扰大，传输速度相对慢，容易出现延时现象。
发明内容
为了克服现有技术的上述缺陷，本发明的目的在于提供一种MPI高频高速柔性基材及制备方法及其应用。
为了实现发明的目的，所采用的技术方案是：
一种MPI高频高速柔性基材，三层结构为高频PI层、MPI层以及低轮廓铜箔层，其中，
所述MPI层为由如下重量分数的组分制备的胶粘剂：
MPI胶液50-95％；
饱和聚酯树脂1-10％；
阻燃剂5-30％；
固化剂2-10％，所述MPI胶液为采用二铵和酸酐在15-50℃之间合成的MPI胶液。
在本发明的一个优选实施例中，所述MPI胶液的添加量为80％；
在本发明的一个优选实施例中，所述固化剂的添加量为5％。
在本发明的一个优选实施例中，所述饱和聚酯树脂的添加量为1-10％，所述饱和聚酯树脂优选为日本东洋纺673或韩国SK200。
在本发明的一个优选实施例中，所述阻燃剂的添加量为5-30％，所述阻燃剂包括但不限于有机含磷阻燃剂、有机含氮阻燃剂、无机含磷阻燃剂如次磷酸盐中的任意一种或多种。
在本发明的一个优选实施例中，所述高频PI层为杜邦高频PI。
在本发明的一个优选实施例中，所述低轮廓铜箔层优选为三井VLP铜箔。
一种MPI高频高速柔性基材的制备方法，包括如下步骤：
将所述采用二铵和酸酐在15-50℃之间合成的MPI胶液当中加入所述饱和聚酯树脂和阻燃剂及固化剂，得MPI层；
在高频PI层上涂布压合所述MPI层后覆合所述低轮廓铜箔层得半成品基材；
将所述半成品基材烘烤固化得成品基材。
在本发明的一个优选实施例中，所述涂布压合的温度不超过130℃。
在本发明的一个优选实施例中，所述覆合的温度范围为110-120℃。
在本发明的一个优选实施例中，所述烘烤固化的温度不超过220℃。
一种MPI高频高速柔性基材的应用，其中，所述应用为制备5G无线通信材料。
本发明的有益效果在于：
本发明的MPI高频高速柔性基材成品除满足一般挠性覆铜板IPC标准外，具有低Dk值、Df值的要求，其中特征值Dk值低于2.80，Df值低于0.005，符合5G高频信号传输的需要。
具体实施方式
本发明的主要原理在于：
1.二胺和酸酐合成MPI高频胶，再加入小量饱和聚酯和阻燃剂、固化剂，配制成胶黏剂。
2.在高频PI上涂布配制胶黏剂，并覆合低轮廓铜箔。
3.半成品在特定温度下烘烤固化，完成后出成品。
本发明的高频PI胶由如下方式合成：
合成高频PI胶，采用二胺和酸酐在15-50℃之间合成，优选30-40℃，在合成改性PI胶里添加2-10％的饱和聚酯树脂，优选2-5％，在添加5-30％的阻燃剂，优选10-15％以及2-10％固化剂。
具体的实施例如下：
合成例1见表1
表1
MPI胶液 80g
饱和聚酯树脂 5g
阻燃剂 10g
固化剂 5g
合成例2见表2
表2
MPI胶液 76g
饱和聚酯树脂 7.2g
阻燃剂 12g
固化剂 4.8g
对比例的胶粘剂由如下方式合成：
橡胶添加量20-30％，饱和聚酯树脂添加量40-60％，阻燃剂添加量15-30％，固化剂添加量2-10％。
对比合成例1见表3
表3
Figure BDA0002642700570000031
Figure BDA0002642700570000041
对比合成例1中采用的是橡胶与其他组分进行复配。
实施例1
将合成例1胶黏剂涂覆在高频PI上，厚度20微米，最高压合温度130℃，优选在110℃的温度下，覆合低轮廓铜箔后，在烘箱烘烤固化，最高固化温度为220℃。
成品主要特征见表4
表4
性能参数 数值 测试标准
剥离强度(kgf/cm2) 0.85 IPC-TM-6502.4.9
Dk(10GHz) 2.76 IEC61189-2-721
Df(10GHz) 0.0046 IEC61189-2-721
吸水率(％) 0.95 IPC-TM-6502.6.2
实施例2
将合成例1胶黏剂涂覆在高频PI上，厚度20微米，最高压合温度130℃，优选在110℃的温度下，覆合低轮廓铜箔后在烘箱烘烤固化，最高固化温度为200℃。
成品主要特征见表5
表5
性能参数 数值 测试标准
剥离强度(kgf/cm2) 0.85 IPC-TM-6502.4.9
Dk(10GHz) 2.80 IEC61189-2-721
Df(10GHz) 0.005 IEC61189-2-721
吸水率(％) 1.05 IPC-TM-6502.6.2
实施例3
将合成例2黏剂涂覆在高频PI上，厚度20微米，最高压合温度130℃，优选在110℃的温度下，覆合低轮廓铜箔后在烘箱烘烤固化，最高固化温度为180℃。
成品主要特征见表6
表6
性能参数 数值 测试标准
剥离强度(kgf/cm2) 0.9 IPC-TM-6502.4.9
Dk(10GHz) 2.9 IEC61189-2-721
Df(10GHz) 0.006 IEC61189-2-721
吸水率(％) 1.08 IPC-TM-6502.6.2
比较例1
将对比合成例1的胶黏剂涂覆在高频PI上，厚度20微米，最高压合温度100℃，在80℃的温度下，覆合低轮廓铜箔后在烘箱烘烤固化，最高固化温度为170℃。
成品主要特征见表7
表7
性能参数 数值 测试标准
剥离强度(kgf/cm2) 1.3 IPC-TM-6502.4.9
Dk(10GHz) 3.40 IEC61189-2-721
Df(10GHz) 0.045 IEC61189-2-721
吸水率(％) 1.2 IPC-TM-6502.6.2
对比表4、5、6、7可知：
本发明的MPI高频高速柔性基材成品除满足一般挠性覆铜板IPC标准外，具有低Dk值、Df值的要求，其中特征值Dk值低于2.80，Df值低于0.005，符合5G高频信号传输的需要。
而现有技术采用传统橡胶加环氧树脂进行复配，覆合基材的Dk值为3.4，Df值是本发明的MPI高频高速柔性基材的9倍。明显不能满足5G高频信号传输的需要。

Claims (9)

1.一种MPI高频高速柔性基材，从内到位为高频PI层、MPI层以及低轮廓铜箔层，其特征在于，
所述MPI层为由如下重量分数的组分制备的胶粘剂：
MPI胶液50-95％；
饱和聚酯树脂1-10％；
阻燃剂5-20％；
固化剂2-10％，所述MPI胶液为采用二铵和酸酐在15-50℃之间合成的MPI胶液。
2.如权利要求1所述的一种MPI高频高速柔性基材，其特征在于，所述MPI胶液的添加量为80％；
所述固化剂的添加量为5％。
3.如权利要求1所述的一种MPI高频高速柔性基材，其特征在于，所述饱和聚酯树脂的添加量为1-10％。
4.如权利要求1所述的一种MPI高频高速柔性基材，其特征在于，所述阻燃剂的添加量为5-30％，所述阻燃剂包括但不限于有机含磷阻燃剂、有机含氮阻燃剂、无机含磷阻燃剂中的任意一种或多种。
5.如权利要求1所述的一种MPI高频高速柔性基材，其特征在于，所述高频PI层为杜邦高频PI。
6.如权利要求1所述的一种MPI高频高速柔性基材，其特征在于，所述低轮廓铜箔层优选为三井VLP铜箔。
7.如权利要求1-6当中任意一项所述的一种MPI高频高速柔性基材的制备方法，其特征在于，包括如下步骤：
将所述采用二铵和酸酐在15-50℃之间合成的MPI胶液当中加入所述饱和聚酯树脂和阻燃剂及固化剂，得MPI层；
在高频PI层上涂布压合所述MPI层后覆合所述低轮廓铜箔层得半成品基材；
将所述半成品基材烘烤固化得成品基材。
8.如权利要求7所述的一种MPI高频高速柔性基材的制备方法，其特征在于，所述涂布压合的温度不超过130℃；所述覆合的温度范围为110-120℃；所述烘烤固化的温度不超过220℃。
9.如权利要求1-6当中任意一项所述的一种MPI高频高速柔性基材的应用，其特征在于，所述应用为制备5G无线通信材料。
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