CN111913019A - Circular probe of probe card device - Google Patents
Circular probe of probe card device Download PDFInfo
- Publication number
- CN111913019A CN111913019A CN202010777195.6A CN202010777195A CN111913019A CN 111913019 A CN111913019 A CN 111913019A CN 202010777195 A CN202010777195 A CN 202010777195A CN 111913019 A CN111913019 A CN 111913019A
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- Prior art keywords
- needle body
- probe
- circular
- insulating
- section
- Prior art date
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- 239000000523 sample Substances 0.000 title claims abstract description 98
- 239000002184 metal Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000010410 layer Substances 0.000 claims description 22
- 238000009413 insulation Methods 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 4
- 238000002513 implantation Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a circular probe of a probe card device, which comprises a metal needle body and an insulating clamping tenon. The metal needle body external diameter is not more than 40 microns and the metal needle body contains the interlude, respectively from the first linkage segment and the second linkage segment of the opposite both ends extension of interlude, from the first linkage segment towards keeping away from the first contact segment of interlude direction extension and from the second contact segment of second linkage segment towards keeping away from the second contact segment of interlude direction extension. The insulating clamping tenon is formed on the first contact section of the metal needle body, so that the tail end part of the first contact section protrudes out of the insulating clamping tenon. The maximum distance formed between the outer surface of the insulating clamping tenon and the adjacent outer surface of the metal needle body is not larger than the outer diameter of the metal needle body. Therefore, the circular probe can effectively prevent the circular probe from passing through the first through hole and falling outside the first guide plate and the second guide plate in the process of needle implantation.
Description
The present application is a divisional application of an invention patent application having an application number of 201710834758.9, an application date of 2017, 9, 15 and a name of "probe card apparatus and circular probe thereof".
Technical Field
The present invention relates to a probe, and more particularly, to a circular probe of a probe card apparatus.
Background
When the semiconductor chip is tested, the test equipment is electrically connected with the object to be tested through a probe card device, and the test result of the object to be tested is obtained through signal transmission and signal analysis. The conventional probe card device is provided with a plurality of probes arranged corresponding to the electrical contacts of the object to be tested, so that the probes can simultaneously contact the corresponding electrical contacts of the object to be tested.
In more detail, the probe of the conventional probe card apparatus includes a circular probe manufactured by a draw forming technique, and the outer diameter thereof may be controlled to be not more than 40 micrometers (μm). However, when the outer diameter of the conventional circular probe is controlled to be not more than 40 μm, the conventional circular probe easily slides out of the probe holder to cause difficulty in assembly.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
The embodiment of the invention provides a circular probe of a probe card device, which can effectively overcome the possible defects of the circular probe of the conventional probe card device.
The embodiment of the invention discloses a circular probe of a probe card device, which comprises: a metal pin body having an outer diameter of no greater than 40 microns, and comprising: a middle section; a first connecting section and a second connecting section which are respectively formed by extending from two opposite ends of the middle section; a first contact section extending from the first connection section in a direction away from the intermediate section; the second contact section is formed by extending from the second connecting section to the direction far away from the middle section; the insulating clamping tenon is formed on the first contact section of the metal needle body, so that the tail end part of the first contact section extends out of the insulating clamping tenon; the maximum distance formed between the outer surface of the insulating clamping tenon and the adjacent outer surface part of the metal needle body is not larger than the outer diameter of the metal needle body; wherein the circular probe comprises an insulating layer formed on the middle section; the metal needle body comprises an inner needle body and an outer needle body coated on the outer surface of the inner needle body, the central axes of the inner needle body and the outer needle body are overlapped, the Young modulus of the outer needle body is larger than that of the inner needle body, and the electric conductivity of the inner needle body is larger than that of the outer needle body.
Preferably, the insulating tenon is an annular insulating glue layer attached to the first contact section, or the insulating tenon comprises an annular metal coating plated on the first contact section and an insulating glue layer completely coated on the metal coating.
Preferably, the insulating tenon is a circular insulating glue layer attached to the first contact section.
Preferably, the insulating tenon comprises a circular metal coating plated on the first contact section and an insulating adhesive layer completely coated on the metal coating.
Preferably, the Young modulus of the inner needle body is between 40 and 100Gpa, and the conductivity of the inner needle body is 5.0 multiplied by 10-4Omega m or more, the Young's modulus of the outer needle body is 100Gpa or more, and the conductivity of the outer needle body is 4.6 x 10-4Omega m or more.
In summary, in the circular probe of the probe card apparatus disclosed in the embodiments of the present invention, the insulating tenon is formed on the local first contact section of the metal pin body with the outer diameter not greater than 40 μm, so that the circular probe can be effectively prevented from passing through the first through hole and falling outside the first guide plate and the second guide plate during the pin implantation process of the circular probe.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 is a perspective view of a probe card apparatus according to the present invention.
Fig. 2 is a partially exploded view of fig. 1 (omitting the dut and the adapter card).
Fig. 3 is a schematic cross-sectional view of fig. 1 along the sectional line iii-iii.
Fig. 4 is an exemplary schematic diagram (one) of a circular probe of the present invention.
Fig. 5 is an exemplary schematic diagram of a circular probe of the present invention (ii).
Fig. 6 is an exemplary schematic diagram (iii) of a circular probe of the present invention.
Detailed Description
Please refer to fig. 1 to 6, which are exemplary embodiments of the present invention, and it should be noted that, in the exemplary embodiments, related numbers and shapes mentioned in the accompanying drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate the understanding of the contents of the present invention, and not for limiting the scope of the present invention.
As shown in fig. 1 to 3, the present embodiment discloses a probe card apparatus 100, which includes a probe socket 10 and an interposer 20 abutting against one side (e.g., the top side of the probe socket 10 in fig. 1) of the probe socket 10, and the other side (e.g., the bottom side of the probe socket 10 in fig. 1) of the probe socket 10 can be used for testing an object (not shown, e.g., a semiconductor wafer) to be tested.
It should be noted that, for the convenience of understanding the present embodiment, the drawings only show a partial structure of the probe card apparatus 100, so as to clearly show the structure and connection relationship of the components of the probe card apparatus 100. The construction of each component of the probe holder 10 and the connection relationship thereof will be described below.
The probe holder 10 includes a first guide plate 1(upper die), a second guide plate 2(lower die), a partition plate (not shown) clamped between the first guide plate 1 and the second guide plate 2, and a plurality of circular probes 3. The first guide plate 1 is formed with a plurality of first through holes 11, and each first through hole 11 has a first aperture D11. The second guide plate 2 is substantially parallel to the first guide plate 1, and the second guide plate 2 is formed with a plurality of second through holes 21, the positions of the plurality of second through holes 21 respectively correspond to the positions of the plurality of first through holes 11, and each second through hole 21 has a second aperture D21 not larger than the first aperture D11.
Furthermore, the circular probes 3 are arranged in a matrix, and each circular probe 3 sequentially penetrates through the corresponding first through hole 11 of the first guide plate 1, the corresponding second through hole 21 of the partition plate and the corresponding second guide plate 2. However, since the above-described partition plate has low relevance to the point of improvement of the present invention, the structure of the partition plate will not be described in detail below.
Further, although the circular probe 3 of the present embodiment is described as being associated with the first guide plate 1, the spacer and the second guide plate 2, the practical application of the circular probe 3 is not limited thereto. The probe card apparatus 100 of the present embodiment limits the circular probes 3 to be manufactured by drawing, so that rectangular probes (manufactured by mems technology) having different manufacturing processes are excluded in the present embodiment. In other words, the round probe 3 of the present embodiment has no motivation to refer to each other because the manufacturing processes are different compared to the rectangular probe.
Since the plurality of circular probes 3 of the probe holder 10 of the present embodiment have substantially the same structure, the single circular probe 3 is taken as an example in the drawings and the following description, but the present invention is not limited thereto. For example, in an embodiment of the present invention, which is not shown, the plurality of circular probes 3 of the probe holder 10 may also have different configurations from each other.
The circular probe 3 includes a metal pin 31, an insulating tenon 32 formed on the metal pin 31, and an insulating layer 33 formed on the metal pin 31 and spaced from the insulating tenon 32. However, in embodiments of the invention not shown, the circular probes 3 may also omit the insulating layer 33.
The metal needle 31 is a flexible straight strip structure, and the cross section of any part of the metal needle 31 is approximately the same circle. That is, the metal pin 31 is formed by drawing, and during the drawing, no concave or convex structure is formed on the outer surface of the metal pin 31. Furthermore, the outer diameter D31 of the metal pin 31 is defined as not greater than 40 micrometers (μm) in the present embodiment, and is preferably smaller than the first aperture D11 and smaller than the second aperture D21.
More specifically, the metal needle body 31 of the present embodiment includes an inner needle body 31a and an outer needle body 31b covering the outer surface of the inner needle body 31a, and the central axes of the inner needle body 31a and the outer needle body 31b are substantially overlapped; the Young's modulus of the outer needle body 31b is greater than that of the inner needle body 31a, so that the circular probe 3 has better mechanical strength characteristics; the electrical conductivity of the inner needle 31a is greater than that of the outer needle 31b, so that the circular probe 3 has better current conduction characteristics. However, the metal needle body 31 of the present invention is not exemplified by the above-described configuration, that is, in the embodiment of the present invention which is not shown, the metal needle body 31 may be made of a single material.
In the present embodiment, the young's modulus of the inner needle 31a is between 40 to 100Gpa, and the conductivity of the inner needle 31a is 5.0 × 10-4Omega m or more, Young's modulus of the outer needle body 31b is 100Gpa or more, and conductivity of the outer needle body 31b is 4.6 x 10-4Ω m or more, the inner needle 31a and the outer needle 31b of the present invention are not limited thereto. The material of the metal needle 31 (e.g., the inner needle 31a or the outer needle 31b) is, for example, gold (Au), silver (Ag), copper (Cu), nickel (Ni), cobalt (Co), or an alloy thereof; the material of the metal pin 31 is preferably copper, copper alloy, nickel-cobalt alloy or palladium-nickel alloy, but the metal pin 31 of the present invention is not limited to the above material.
Specifically, as shown in fig. 1 to 3, the metal pin 31 includes a middle section 311, a first connection section 312 and a second connection section 313 respectively extending from two opposite ends of the middle section 311, a first contact section 314 extending from the first connection section 312 in a direction away from the middle section 311, and a second contact section 315 extending from the second connection section 313 in a direction away from the middle section 311.
In other words, along a straight line direction (e.g., from top to bottom in fig. 3) of the adapter plate 20 toward the object to be tested, the metal pin 31 is sequentially formed with a first contact section 314, a first connection section 312, a middle section 311, a second connection section 313 and a second contact section 315 having substantially the same outer diameter. Wherein, the first contact section 314 passes through the corresponding first through hole 11 of the first guide plate 1 and abuts against the corresponding conductive contact of the adapting plate 20; the first connecting sections 312 are arranged in the corresponding first through holes 11 of the first guide plate 1 in a penetrating manner; the middle section 311 is located between the first guide plate 1 and the second guide plate 2; the second connecting section 313 penetrates through the corresponding second through hole 21 of the second guide plate 2; the second contact section 315 passes through the corresponding second through hole 21 of the second guide plate 2 and abuts against the corresponding conductive contact (not shown in the figure) of the object to be tested.
As shown in fig. 2 and 3, the insulation trip 32 is formed on a partial first contact section 314, such that an end portion of the first contact section 314 (e.g., the free end of the first contact section 314 shown in fig. 3) protrudes out of the insulation trip 32 and defines a protrusion 3141. That is, the insulation latch 32 of the present embodiment is formed at the middle portion of the first contact section 314, not at the end portion.
The insulating latch 32 and the first contact section 314 together form an outer diameter D32 larger than the first aperture D11 and larger than the second aperture D21. Further, a maximum distance T formed between the outer surface of the insulation tenon 32 and the adjacent outer surface portion of the metal pin 31 is preferably not greater than the outer diameter D31 (e.g., 40 μm) of the metal pin 31.
In more detail, the specific configuration of the insulation latch 32 can be modified according to the needs of the designer, and the following describes possible embodiments of the insulation latch 32 according to the present embodiment, but the present invention is not limited thereto. As shown in fig. 4, the insulation tenon 32 is an annular insulation glue layer 322 attached to the first contact section 314. Alternatively, as shown in fig. 5, the insulating latch 32 is a bump-shaped insulating colloid 323 attached to the first contact section 314. As shown in fig. 6, the insulating latch 32 includes a circular metal plating layer 321 plated on the first contact section 314, and an insulating adhesive layer 322 completely covering the metal plating layer 321.
As shown in fig. 3, the insulation layer 33 is formed on the middle section 311 of the metal pin 31, and an outer diameter D33 formed by the middle section 311 of each circular probe 3 and the insulation layer 33 is smaller than the first aperture D11 of the first guide plate 1 and larger than the second aperture D21 of the second guide plate 2, so that the insulation layer 33 of the circular probe 3 of the embodiment can pass through the corresponding first through hole 11, and the insulation layer 33 of the circular probe 3 can be prevented from passing through the second through hole 21 and falling out of the probe holder 10. The distance between the insulating layer 33 and the second guide plate 2 is preferably not greater than the distance between the insulating latch 32 and the first guide plate 1, but the invention is not limited thereto.
In the above description of the structure of the single circular probe 3 of the present embodiment, the following description uses the angle of the probe base 10 to describe the connection relationship between the components. Specifically, a distance G of not more than 100 μm is preferably formed between any two adjacent metal pins 31 in the probe seat 10, and the adapter plate 20 can be used to abut against the protrusion 3141 of each circular probe 3.
[ technical effects of embodiments of the present invention ]
In summary, in the probe card apparatus 100 and the circular probe 3 thereof disclosed in the embodiments of the invention, the insulating tenon 32 is formed on the partial first contact section 314 of the metal needle 31 having an outer diameter not greater than 40 μm, and the outer diameter D32 formed by the insulating tenon 32 and the corresponding first contact section 314 of the circular probe 3 is larger than the first aperture D11, so as to effectively prevent the circular probe 3 from passing through the first through hole 11 and falling out of the probe base 10 during the probe implantation process.
Moreover, the circular probe 3 of the present embodiment can integrally form the outer pin 31b with a larger young's modulus on the outer surface of the inner pin 31a with a smaller young's modulus, so that the circular probe 3 can effectively improve the mechanical strength of the metal pin 31 on the premise of not affecting the current conduction characteristic of the metal pin 31.
In addition, the circular probe 3 can form an insulating layer 33 on the middle section 311 of the metal needle body 31, so that the insulating layer 33 of the circular probe 3 can pass through the corresponding first through hole 11, and the insulating layer 33 of the circular probe 3 is prevented from passing through the second through hole 21 and falling outside the probe holder 10.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention, which is defined by the appended claims.
Claims (5)
1. A circular probe of a probe card apparatus, comprising:
a metal pin body having an outer diameter of no greater than 40 microns, and comprising:
a middle section;
a first connecting section and a second connecting section which are respectively formed by extending from two opposite ends of the middle section;
a first contact section extending from the first connection section in a direction away from the intermediate section; and
a second contact section extending from the second connecting section in a direction away from the middle section; and
the insulating clamping tenon is formed on the first contact section of the metal needle body, so that the tail end part of the first contact section extends out of the insulating clamping tenon; the maximum distance formed between the outer surface of the insulating clamping tenon and the adjacent outer surface part of the metal needle body is not larger than the outer diameter of the metal needle body;
wherein the circular probe comprises an insulating layer formed on the middle section; the metal needle body comprises an inner needle body and an outer needle body coated on the outer surface of the inner needle body, the central axes of the inner needle body and the outer needle body are overlapped, the Young modulus of the outer needle body is larger than that of the inner needle body, and the electric conductivity of the inner needle body is larger than that of the outer needle body.
2. The circular probe of the probe card apparatus as claimed in claim 1, wherein the insulating tenon is a circular insulating adhesive layer attached to the first contact section, or the insulating tenon comprises a circular metal plating layer plated on the first contact section and an insulating adhesive layer completely coated on the metal plating layer.
3. The circular probe of the probe card apparatus as claimed in claim 1, wherein the insulation tenon is a circular insulation adhesive layer attached to the first contact section.
4. The circular probe of the probe card apparatus as claimed in claim 1, wherein the insulating latch comprises a circular metal plating layer plated on the first contact section and an insulating adhesive layer completely covering the metal plating layer.
5. The circular probe of the probe card apparatus as claimed in claim 1, wherein the Young's modulus of the inner pin body is between 40 to 100GPa, and the conductivity of the inner pin body is 5.0 x 10-4Omega m or more, the Young's modulus of the outer needle body is 100Gpa or more, and the conductivity of the outer needle body is 4.6 x 10-4Omega m or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010777195.6A CN111913019A (en) | 2017-09-15 | 2017-09-15 | Circular probe of probe card device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710834758.9A CN109507457B (en) | 2017-09-15 | 2017-09-15 | Probe card device |
| CN202010777195.6A CN111913019A (en) | 2017-09-15 | 2017-09-15 | Circular probe of probe card device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710834758.9A Division CN109507457B (en) | 2017-09-15 | 2017-09-15 | Probe card device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111913019A true CN111913019A (en) | 2020-11-10 |
Family
ID=65745148
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010777195.6A Pending CN111913019A (en) | 2017-09-15 | 2017-09-15 | Circular probe of probe card device |
| CN201710834758.9A Expired - Fee Related CN109507457B (en) | 2017-09-15 | 2017-09-15 | Probe card device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710834758.9A Expired - Fee Related CN109507457B (en) | 2017-09-15 | 2017-09-15 | Probe card device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN111913019A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109425818B (en) * | 2017-09-04 | 2020-09-08 | 中华精测科技股份有限公司 | Probe card device and rectangular probe thereof |
| CN112198346B (en) * | 2019-07-08 | 2024-07-05 | 技鼎股份有限公司 | Probe head and conductive probe of probe head |
| CN113219221B (en) * | 2020-01-21 | 2023-08-01 | 台湾中华精测科技股份有限公司 | Probe card device and neck-like probe thereof |
| JP7566493B2 (en) * | 2020-05-27 | 2024-10-15 | 株式会社日本マイクロニクス | Connecting Devices |
| CN115747556A (en) * | 2022-12-21 | 2023-03-07 | 江苏苏青电子材料股份有限公司 | Novel platinum-based material, preparation method and application thereof, and platinum alloy probe |
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- 2017-09-15 CN CN202010777195.6A patent/CN111913019A/en active Pending
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| US20050227383A1 (en) * | 2004-04-09 | 2005-10-13 | Masayoshi Okamoto | Manufacturing method of semiconductor integrated circuit device and probe card |
| KR100825231B1 (en) * | 2007-06-29 | 2008-04-25 | (주)피티앤케이 | Method for manufacturing probe needle used in probe card and probe needle |
| CN101957389A (en) * | 2009-07-13 | 2011-01-26 | 巧橡科技有限公司 | Test device and manufacturing method thereof |
| JP2011228427A (en) * | 2010-04-19 | 2011-11-10 | Kyocera Corp | Probe card and probe device |
| TW201331590A (en) * | 2012-01-30 | 2013-08-01 | Certain Micro Applic Technology Inc | Probe unit structure and method of manufacturing the same |
| TW201350861A (en) * | 2012-05-31 | 2013-12-16 | Tcl Yamaichi Taiwan Inc | Probe card |
| JP2014238270A (en) * | 2013-06-06 | 2014-12-18 | 日置電機株式会社 | Probe unit and substrate inspection device |
| CN105510650A (en) * | 2015-11-30 | 2016-04-20 | 广东长盈精密技术有限公司 | Probe and testing device comprising same |
| CN205333701U (en) * | 2015-12-31 | 2016-06-22 | 东莞市连威电子有限公司 | Miniature insulating probe |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109507457A (en) | 2019-03-22 |
| CN109507457B (en) | 2020-10-16 |
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Application publication date: 20201110 |