CN101957389A - Test device and manufacturing method thereof - Google Patents

Test device and manufacturing method thereof Download PDF

Info

Publication number
CN101957389A
CN101957389A CN 200910152143 CN200910152143A CN101957389A CN 101957389 A CN101957389 A CN 101957389A CN 200910152143 CN200910152143 CN 200910152143 CN 200910152143 A CN200910152143 A CN 200910152143A CN 101957389 A CN101957389 A CN 101957389A
Authority
CN
China
Prior art keywords
probe
proving installation
contact site
manufacture method
buffering body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 200910152143
Other languages
Chinese (zh)
Other versions
CN101957389B (en
Inventor
吴俊杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QIAOXIANG SCIENCE AND TECHNOLOGY Co Ltd
Original Assignee
QIAOXIANG SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by QIAOXIANG SCIENCE AND TECHNOLOGY Co Ltd filed Critical QIAOXIANG SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN 200910152143 priority Critical patent/CN101957389B/en
Publication of CN101957389A publication Critical patent/CN101957389A/en
Application granted granted Critical
Publication of CN101957389B publication Critical patent/CN101957389B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Measuring Leads Or Probes (AREA)

Abstract

The invention discloses a test device and a manufacturing method thereof. The method comprises the steps of: (a) manufacturing a plurality of probe modules, two cover plates and a mould, wherein the mould is internally provided with a plurality of needle seats at intervals for inserting one end of each probe module; (b) inserting the probe modules on each needle seat; (c) filling at least one liquid resin material in the mould; and (d) demoulding the resin material after solidification for finishing a combined blank. The combined blank is provided with a buffer main body and the probe modules which are arranged in the buffer main body at intervals. In this way, the manufacturing operation is simple and quick, the product is wide in application range, the operation efficiency of probe replacement can be enhanced, and the cost of the probe replacement can be reduced.

Description

Proving installation and manufacture method thereof
Technical field
The present invention relates to a proving installation and manufacture method thereof, be meant a kind of semi-conductive proving installation and manufacture method thereof especially.
Background technology
Along with the progress of semiconductor technology, significantly improve for the requirement of Measurer precision, the test signal is to contact transmission by probe under the situation of high-frequency test.
Consult Fig. 1, existing detecting probe 1, for example the novel patent in Taiwan is M333565 number, is to be arranged in the probe aperture 101 of a test bench 100, in order to be electrically connected a test contacts 300 and a reception contact 400.This detecting probe 1 is to make with conductive material, and it comprises that one is arranged in the upper and lower contact element 11,12 of this probe aperture 21, is arranged at the elastic parts 13 of 11,12 of upper and lower contact elements with reaching a compressible deformation.Wherein, upper and lower contact element 11,12 has on one contact site 111 and contact site 121 once respectively, in order to touch with corresponding test contacts 300 and reception contact 400 respectively.
In when test, contact with test contacts 300 and reception contact 400 respectively and this test probe 11 is produced by this upper and lower contact site 111,121 and conduct, and then will test signal and be passed to an analytical instrument (scheming not show) to carry out the signal analysis.
But, increase along with testing time, on, following contact site 111,121 and test contacts 300 and reception contact 400 between for a long time mutually scraped finish, cause, following contact site 111,121 wear and tear easily or are infected with dirt, and then make that the test signal is bad, severe patient more can take place can't conducting phenomenon, just must clear up or replace with in good time this moment, following contact site 111,121, but because of following contact element 12 is to be arranged in the contact element 11, so that can't change down contact element 12 separately or go up contact element 11, and must change whole group test probe 1, not only increase the complicacy of changing probe 1 thus and make maintenance cost improve, more cause test jobs to postpone because of replacing test probe 1, online in the production of seizing every minute and second, the time of prolongation maintenance activity is suitable serious situation for producing the dealer, do not meet economic benefit, also will bear the risk of shipment as scheduled.
Summary of the invention
Purpose of the present invention is to provide a kind of scope of application extensive, and can improves and eliminate the operating efficiency that changes probe, and can reduce and eliminate the proving installation that changes the probe cost.
Proving installation of the present invention, comprise: a buffering body, and most probe modules of being located at interval in this buffering body, each probe module has one first probe, and second probe that is positioned at the relative below of this first probe, this first probe place near to the upper end is formed with a butting section and extension first contact site from this butting section apical margin, this second probe upper end is formed with a junction surface, one and is formed on this junction surface and can stretches the grafting space of putting for this first probe, and extension is from second contact site at this junction surface.
Another object of the present invention, then providing a kind of manufacturing operation the simple manufacture method of proving installation fast, this manufacture method comprises: (a) prepare most probe modules, two cover plates and a mould, be interval with most in this mould and can supply the respectively needle stand of this probe module one end plant, (b) described probe module is inserted in respectively on this needle stand, (c) at least one liquid gum material is filled out in filling in this mould, and (d) treat that this colloidal materials solidifies after, give the demoulding, just finish a combination base substrate.
Effect of the present invention is that the manufacture method operation is simply quick, and made application range of products is extensive, and as long as removal cover plate, just can pull out particular probe easily, new probe can follow the embedding location of former hole, easily eliminates trade-in, not only overcomes the inconvenience of changing probe module, more improve maintenance and eliminate the operating efficiency that changes, and can reduce to eliminate and change the probe cost.
Description of drawings
Fig. 1 is a partial side, cross-sectional view, and the annexation of general test probe is described;
Fig. 2 is a process flow diagram, and first preferred embodiment of the manufacture method of proving installation of the present invention is described;
Fig. 3 is a cut-open view, illustrates that most probes of this first preferred embodiment are arranged in the mould, and finishes and irritate the aspect of filling out padded coaming;
Fig. 4 is a partial side view, the aspect after key diagram 3 demouldings;
Fig. 5 is a side cutaway view, and the assembled state of first preferred embodiment of proving installation of the present invention is described;
Fig. 6 is a side cutaway view, and the aspect of the upper cover plate removal of this first preferred embodiment is described;
Fig. 7 is a side cutaway view, and after explanation pulled away this buffering body with first probe in damaged condition in this first preferred embodiment, the first new probe can follow the embedding location of former pin hole; And
Fig. 8 is a side cutaway view, and the assembled state of second preferred embodiment of proving installation of the present invention is described.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples.Before the present invention is described in detail, be noted that in the following description content similarly assembly is to represent with identical numbering.
Consulting Fig. 2,3, is first preferred embodiment of the manufacture method of proving installation of the present invention, includes following steps:
At first in step 800, be to prepare most probe modules 3 and a mould 4 earlier, wherein each probe module 3 has one first probe 31 and one second probe 32, each first probe 31 is formed with first contact site 312 that 311 apical margins from the butting section are extended in a butting section 311, in place near to the upper end, and a portion that stretches into 313 that 311 root edges protrude out downwards from the butting section.And each second probe 32 is formed with a junction surface 321, and is formed at grafting space 322 on the junction surface 321 in the upper end, and one extend from the junction surface 321 second contact site 323, and described grafting space 322 also can be stretched for the portion that stretches into 313 of first probe 31 and put.In addition, this mould 4 includes the patrix 42 of a counterdie 41 and closed this counterdie 41 of an energy, and counterdie 41 has die cavity 411 in, and in the interior die cavity 411 and interval is formed with most needle stands 412.And also have a die cavity 421 and a material hole (figure does not show) in one in the patrix 42.
Then, in step 801, be that second probe 32 with described probe module 3 is inserted on each needle stand 412 of bed die 41 one by one, and 321 upper ends, junction surface of each second probe 32 also are inserted in the interior die cavity 411 of counterdie 41, each first probe 31 is then borrowed it to stretch into portion 313 and is inserted in the grafting space 322 of each second probe 32 part tightly, and is combined on second probe 32.
After treating described probe module 3 plant location, carry out step 802, be rubber-like liquid gum material 71 to be irritated fill in the interior die cavity 411 of counterdie 41 in this step, described colloidal materials 71 can be silica gel or plastics etc., is to do explanation with silica gel in the present embodiment.Finish irritate fill out operation after, patrix 42 is placed on the counterdie 41 carrying out mold closing, this moment each first probe, 31 upper end and stretching in the interior die cavity 421 of patrix 42.
In step 803, be through after a while, after treating that colloidal materials 71 solidifies, give the demoulding, finish combination base substrate 700 as shown in Figure 4, this combination base substrate 700 includes a buffering body 701, described probe module 3 then is shaped in the buffering body 701, first contact site 312 and local butting section 311 of first probe 31 of each probe module 3, and second contact site 323 and local engagement portion 321 of second probe 32 all are piercing in outside the buffering body 701.
In step 804, as shown in Figure 5, prepare two cover plates 5,6 more at last, be interval with most the through holes 51,61 that can run through for corresponding first and second probe 31,32 respectively on each cover plate 5,6.Whereby cover plate 5,6 is covered to put respectively and be positioned to cushion body 701 end faces and bottom surface, first probe 31 of each probe module 3 and second probe 32 also pass via each through hole 51,61 on the corresponding cover plate 5,6, so just finish the manufacturing of proving installation.
Consult Fig. 5, the present invention utilizes the made proving installation of said method to comprise a buffering body 701, most compartment of terrains and is shaped in the probe module 3 that cushions in the body 701, and is located at the end face of buffering body 701 and two cover plates 5,6 on the bottom surface respectively.As first contact site 312 of first probe 31 of above-mentioned each probe module 3 and the part of butting section 311, and the part at second contact site 323 of second probe 32 and junction surface 321, all be piercing in outside the buffering body 701.And each cover plate 5, each through hole 51 on 6,61 have a large aperture portion 511 near buffering body 701,611, and one away from buffering body 701 and with corresponding large aperture portion 511, the 611 small-bore portions 512 that are connected, 612, and each large aperture portion 511,611 with each small-bore portion 512, all be formed with a shoulder 513 between 612,613, the butting section 311 of each first probe 31 is to be positioned at each large aperture portion 511 place and to abut against in each shoulder 513,321 at the junction surface of each second probe 32 is to be positioned at each large aperture portion 611 place and to abut against in each shoulder 613, and first contact site 312 of each first probe 31 and 323 of second contact sites of each second probe 32 run through corresponding each cover plate 5 respectively, 6 small-bore portion 512,612.
Still consult Fig. 5, proving installation of the present invention in the use can by each first and second contact site 312,323 of each probe module 3 respectively with majority on test point 600 and most test point 601 down contact and constitute electrically conducting.That is to say, when each first and second contact site 312,323 respectively with each on test point 600 and each time test point 601 when contacting, it is made by the rubber-like colloid material utilizing buffering body 701, so buffering body 701 can produce compression set simultaneously, this moment, the portion that stretches into 313 of first probe 31 more goed deep into forming electrically conducting in the grafting space 322 of second probe 32, to transmit the test signal.
Because first and second contact site 312,323 of first and second probe 31,32 is in test process, contact with described upper and lower test point 600,601 continually, so that cause first and second contact site 312,323 to produce wearing and tearing or dirt easily, bad when causing signal to transmit, and need to change probe.And proving installation of the present invention is when changing first probe 31, shown in Fig. 6,7, as long as unload cover plate 5, just can the first old probe 31 will be pulled out easily, can stay hole 702 this moment on buffering body 701, the first new probe 31 ' just can follow described hole 702 and be arranged in the buffering body 701, and the portion that stretches into 313 ' of the first new probe 31 ' also can go deep in the grafting space 322 of second probe 32, so just finishes first the eliminating of probe 31 (31 ') and changes; In addition, when changing second probe 32,, just can change, not repeat them here as finishing second the eliminating of probe 32 as the above-mentioned replacing operation then as long as unload cover plate 6 earlier.Therefore, can carry out like a cork really each first and second probe 31 (31 '), 32 eliminate trade-in, improve maintenance and eliminate the operating efficiency that changes, and can reduce to eliminate and change the probe cost.
Consulting Fig. 2,8, is second preferred embodiment of the present invention, and the present embodiment and first preferred embodiment are roughly the same, do not exist together only be present embodiment method in abovementioned steps 800, also comprise having prepared most elastic partss 33; In step 801, each elastic parts 33 is placed through respectively between first and second probe 31,32 of each probe module 3, and elastic parts 33 two ends reach the respectively junction surface 321 of second probe 32 in the butting section 311 of each first probe 31 of butt respectively.Can utilize the setting of described elastic parts 33 whereby and can strengthen the buffering body 701 elastic acting force.In addition, first contact site 312 ' of each first probe 31 and second contact site, the 323 ' ora terminalis of each second probe 32 can form many ratchet-like respectively, can increase the contact area with upper and lower test point 600,601 whereby.
What deserves to be mentioned is at this, each first and second contact site 312 (312 '), the aspect of 323 (323 ') be not in the limitation diagram institute paint, such as cab over type, tip formula or other form all can, need look the aspect of its test point and can change to some extent.
In sum, the manufacture method of proving installation of the present invention is by the ejection formation operation, make probe module 3 one-body molded, when combination thereby as long as cover the assembling that two cover plates 5,6 just can be finished proving installation again, therefore make, assemble all quite simply fast with buffering body 701.In addition, the made proving installation scope of application is extensive, and as long as removal cover plate 5 (or 6), just can pull out specific first probe 31 (or second probe 32) easily, new probe can follow the embedding location of former hole, easily eliminates trade-in, not only overcomes the inconvenience of changing probe module 3, more improve maintenance and eliminate the operating efficiency that changes, and can reduce to eliminate and change the probe cost.So can reach purpose of the present invention really.

Claims (17)

1. proving installation, it is characterized in that: this proving installation comprises a buffering body, and most probe modules of being located at interval in this buffering body, each probe module has one first probe, and second probe that is positioned at the relative below of this first probe, this first probe place near to the upper end is formed with a butting section, reach first contact site of an extension from this butting section apical margin, this second probe upper end is formed with a junction surface, one is formed on this junction surface and stretches the grafting space of putting for this first probe, and extension is from second contact site at this junction surface.
2. proving installation as claimed in claim 1 is characterized in that: respectively this first probe has protruded out one respectively downwards in this butting section root edge respectively and has stretched into portion, respectively this portion of stretching into and can wringing fit stretching place respectively should the grafting space.
3. proving installation as claimed in claim 1, it is characterized in that: this proving installation also includes the end face of being located at this buffering body respectively and two cover plates on the bottom surface, and makes first contact site of described first probe and second contact site of described second probe run through corresponding respectively this cover plate respectively.
4. proving installation as claimed in claim 3, it is characterized in that: described cover plate is interval with most large aperture portions respectively in this surface near this buffering body, and then be interval with plurality of small holes footpath portion respectively in this surface away from this buffering body, each large aperture portion is connected with each small-bore portion, and this large aperture portion and respectively all be formed with a shoulder between this small-bore portion respectively, respectively the butting section of this first probe is to be positioned at respectively this large aperture portion place and to abut against in this shoulder respectively, respectively first contact site of this first probe and respectively this second probe second contact site and run through the respectively small-bore portion of this cover plate respectively.
5. as claim 1 or 3 or 4 described proving installations, it is characterized in that: this proving installation also includes most the elastic partss between first and second probe that is placed through this probe module respectively respectively, respectively respectively the butting section and the junction surface of this second probe respectively of this first probe of butt respectively, the two ends of this elastic parts.
6. proving installation as claimed in claim 1 is characterized in that: this buffering body is made by the rubber-like colloidal materials.
7. proving installation as claimed in claim 1 is characterized in that: respectively first contact site of this first probe and respectively the second contact site ora terminalis of this second probe form many ratchet-like respectively.
8. the manufacture method of a proving installation, it is characterized in that: this manufacture method comprises step (a) and prepares most probe modules, two cover plates, and mould, be interval with most in this mould and supply the respectively needle stand of this probe module one end plant, (b) described probe module is inserted in respectively on this needle stand, (c) in this mould, irritates and fill out at least one liquid gum material, and (d) treat that this colloidal materials solidifies after, give the demoulding, just finish a combination base substrate.
9. the manufacture method of proving installation as claimed in claim 8 is characterized in that: in step (d), made combination base substrate includes a buffering body, and the described probe module that is arranged at intervals in this buffering body.
10. the manufacture method of proving installation as claimed in claim 9, it is characterized in that: this manufacture method also includes a step (e), be end face and the bottom surface that this two cover plate is positioned this combination base substrate respectively in this step, and respectively this probe module run through corresponding cover plate respectively.
11. manufacture method as claim 9 or 10 described proving installations, it is characterized in that: each probe module has one first probe, and one second probe, and in step (a), respectively this probe module is to be inserted in respectively on this needle stand with this second probe respectively.
12. the manufacture method of proving installation as claimed in claim 11, it is characterized in that: this first probe place near to the upper end is formed with a butting section, reach first contact site of an extension from this butting section apical margin, this second probe upper end is formed with a junction surface, one and is formed on this junction surface and for this first probe and stretches the grafting space of putting, and extension is from second contact site at this junction surface.
13. the manufacture method of proving installation as claimed in claim 11 is characterized in that: in step (a), this mould includes a counterdie, and the patrix of this counterdie of closure, and this counterdie has an interior die cavity, and described needle stand is to be located in this interior die cavity.
14. the manufacture method of proving installation as claimed in claim 12 is characterized in that: in step (e), respectively this probe module be with first contact site of this first probe respectively and respectively second contact site of this second probe run through corresponding respectively this cover plate respectively.
15. the manufacture method of proving installation as claimed in claim 14, it is characterized in that: described cover plate is interval with most large aperture portions respectively in this surface near this buffering body, then be interval with plurality of small holes footpath portion respectively in this surface away from this buffering body, each large aperture portion is connected with each small-bore portion, and this large aperture portion and respectively all be formed with a shoulder between this small-bore portion respectively, respectively the butting section of this first probe is to be positioned at respectively this large aperture portion place and to abut against in this shoulder respectively, respectively first contact site of this first probe and respectively this second probe second contact site and run through the respectively small-bore portion of this cover plate respectively.
16. the manufacture method of proving installation as claimed in claim 12, it is characterized in that: in step (a), also comprise preparing most the elastic partss between first and second probe that is placed through this probe module respectively respectively, respectively respectively the butting section and the junction surface of this second probe respectively of this first probe of butt respectively, the two ends of this elastic parts.
17. the manufacture method of proving installation as claimed in claim 12 is characterized in that: respectively first contact site of this first probe and respectively the second contact site ora terminalis of this second probe form many ratchet-like respectively.
CN 200910152143 2009-07-13 2009-07-13 Test device and manufacturing method thereof Active CN101957389B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200910152143 CN101957389B (en) 2009-07-13 2009-07-13 Test device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200910152143 CN101957389B (en) 2009-07-13 2009-07-13 Test device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN101957389A true CN101957389A (en) 2011-01-26
CN101957389B CN101957389B (en) 2013-09-04

Family

ID=43484836

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200910152143 Active CN101957389B (en) 2009-07-13 2009-07-13 Test device and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN101957389B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104280677A (en) * 2014-10-30 2015-01-14 南通富士通微电子股份有限公司 Semiconductor testing jig
CN104282596A (en) * 2014-10-30 2015-01-14 南通富士通微电子股份有限公司 Forming method of semiconductor testing jig
CN104347448A (en) * 2014-10-30 2015-02-11 南通富士通微电子股份有限公司 Forming method of semiconductor test fixture
CN104407182A (en) * 2014-10-30 2015-03-11 南通富士通微电子股份有限公司 Semiconductor test tool
CN104407183A (en) * 2014-10-30 2015-03-11 南通富士通微电子股份有限公司 Formation method for test probe and semiconductor test tool
CN107631835A (en) * 2017-09-13 2018-01-26 中国电子科技集团公司第四十九研究所 A kind of pressure test device applied to non-leaded package MEMS absolute pressure cake cores
US10067164B2 (en) 2015-08-24 2018-09-04 Johnstech International Corporation Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings
CN109507457A (en) * 2017-09-15 2019-03-22 中华精测科技股份有限公司 Probe card device and its circular probe

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10001509B2 (en) 2014-10-30 2018-06-19 Tongfu Microelectronics Co., Ltd. Semiconductor testing fixture and fabrication method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100212169B1 (en) * 1996-02-13 1999-08-02 오쿠보 마사오 Probe, manufacture of same, and vertically operative type probe card assembly employing the same
JP2001116791A (en) * 1999-10-20 2001-04-27 Fujitsu Ltd Electronic component tester and electric connector
CN2494034Y (en) * 2001-08-13 2002-05-29 吴志成 Means for testing semiconductor package element
TWI252925B (en) * 2004-07-05 2006-04-11 Yulim Hitech Inc Probe card for testing a semiconductor device
CN2722254Y (en) * 2004-08-30 2005-08-31 昆翌电子(深圳)有限公司 Testing needle structural improvement of base board detection
CN2775663Y (en) * 2005-02-03 2006-04-26 芽庄科技股份有限公司 Improved detector for real mounting board
KR100741697B1 (en) * 2005-10-28 2007-07-23 주식회사 파이컴 Probe Card And Method Of Fabricating The Same

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104282596B (en) * 2014-10-30 2017-12-08 通富微电子股份有限公司 The forming method of semiconductor test tool
CN104347448B (en) * 2014-10-30 2018-08-10 通富微电子股份有限公司 The forming method of semiconductor test jig
CN104347448A (en) * 2014-10-30 2015-02-11 南通富士通微电子股份有限公司 Forming method of semiconductor test fixture
CN104407182A (en) * 2014-10-30 2015-03-11 南通富士通微电子股份有限公司 Semiconductor test tool
CN104407183A (en) * 2014-10-30 2015-03-11 南通富士通微电子股份有限公司 Formation method for test probe and semiconductor test tool
CN104280677B (en) * 2014-10-30 2017-11-10 通富微电子股份有限公司 Semiconductor test tool
CN104282596A (en) * 2014-10-30 2015-01-14 南通富士通微电子股份有限公司 Forming method of semiconductor testing jig
CN104407183B (en) * 2014-10-30 2018-10-23 通富微电子股份有限公司 Test the forming method of syringe needle and semiconductor test jig
CN104280677A (en) * 2014-10-30 2015-01-14 南通富士通微电子股份有限公司 Semiconductor testing jig
CN104407182B (en) * 2014-10-30 2018-09-21 通富微电子股份有限公司 Semiconductor test jig
US10067164B2 (en) 2015-08-24 2018-09-04 Johnstech International Corporation Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings
US10928423B2 (en) 2015-08-24 2021-02-23 Johnstech International Corporation Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings
CN107631835A (en) * 2017-09-13 2018-01-26 中国电子科技集团公司第四十九研究所 A kind of pressure test device applied to non-leaded package MEMS absolute pressure cake cores
CN109507457A (en) * 2017-09-15 2019-03-22 中华精测科技股份有限公司 Probe card device and its circular probe
CN111913019A (en) * 2017-09-15 2020-11-10 中华精测科技股份有限公司 Circular probe of probe card device

Also Published As

Publication number Publication date
CN101957389B (en) 2013-09-04

Similar Documents

Publication Publication Date Title
CN101957389B (en) Test device and manufacturing method thereof
SG148061A1 (en) An ultrasonic transducer array and a method for making a transducer array
CN108225950A (en) Subgrade soils dynamic resilience modulus predictor method based on matric suction and stress state
CN109190315A (en) A kind of design method of the bolt of engine crankshaft bearing shell
CN202088453U (en) Hot-forming mould for polypropylene hollow plate
CN107310141B (en) A kind of multistation button texturizing equipment
CN203496219U (en) Novel injection mould with pressure induction device
CN204807861U (en) Press tool
CN202316620U (en) Cold extrusion molding wedge-shaped die for lute hole of whole axle housing of automobile
CN205353505U (en) Liquid crystal display module's test fixture
CN205246334U (en) Button accredited testing organization
CN204177803U (en) For the mould that the mould current mark of epoxy molding plastic detects
CN204470410U (en) A kind of spinning belt pulley assembling die
CN102967241B (en) A kind of VIN code character depth measurement device
CN107030979A (en) A kind of disc spring sealing automatic ejection mould
CN206937158U (en) Assembling product frock
CN202894025U (en) Forming die for automobile windscreen wiper upper reinforcing plates
CN205735884U (en) A kind of injection mold die opening mechanism of palm
CN201417235Y (en) Stop block for spring fatigue testing machine
CN110253793A (en) A kind of forming frock and forming method of flexible beam
CN201689117U (en) Novel reverse testing fixture
CN209371922U (en) A kind of vehicle label gadget detection device
CN108974860A (en) A kind of aligning method of combined type cylindrical part and its tooling
CN207682829U (en) A kind of injection mold of plastic flip cover seat
CN208240507U (en) A kind of capacitor rubber plug curing forming mold

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant