CN111912538B - Crimping type semiconductor device, crimping submodule and elastic temperature measurement packaging assembly - Google Patents
Crimping type semiconductor device, crimping submodule and elastic temperature measurement packaging assembly Download PDFInfo
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- CN111912538B CN111912538B CN202010670448.XA CN202010670448A CN111912538B CN 111912538 B CN111912538 B CN 111912538B CN 202010670448 A CN202010670448 A CN 202010670448A CN 111912538 B CN111912538 B CN 111912538B
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- 238000002788 crimping Methods 0.000 title claims abstract description 64
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000000523 sample Substances 0.000 claims abstract description 95
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a crimping type semiconductor device, a crimping submodule and an elastic temperature measurement packaging assembly, wherein the crimping type semiconductor device comprises a plurality of crimping submodules, the elastic temperature measurement packaging assembly is attached to a chip assembly and used for measuring the temperature of the chip, the elastic temperature measurement packaging assembly comprises a temperature measurement probe used for attaching to the chip assembly to measure the temperature, a probe fixing piece used for fixing the temperature measurement probe, and a limiting sleeve sleeved outside the probe fixing piece, the probe fixing piece is slidably arranged in the limiting sleeve, the top end of the limiting sleeve can be abutted against the chip assembly, and an elastic piece is arranged in the limiting sleeve. The temperature measuring probe can be directly attached to the chip assembly, so that contact temperature measurement is achieved, visual and effective temperature measurement of the chip inside the crimping type semiconductor device is achieved, the temperature measurement requirement of the crimping type semiconductor device is met, the accuracy is high, the using area is wide, the calculation mode is simple, the electric insulation performance is good, and the temperature measuring probe is not easily interfered by the external environment.
Description
Technical Field
The invention relates to the technical field of temperature measurement of semiconductor devices, in particular to a crimping type semiconductor device, a crimping submodule and an elastic temperature measurement packaging assembly.
Background
For a multi-chip large-scale parallel connection grouped crimping type semiconductor device, due to the interaction of internal physical fields, junction temperatures of chips are different, so that the performance and reliability of the device are influenced, and the semiconductor device becomes one of important factors for restricting the improvement of the power level of the device. Therefore, accurate measurement of the junction temperature of each chip becomes one of the most interesting problems in the application of the crimp type semiconductor device.
The current method for obtaining the internal junction temperature of the crimping type semiconductor device generally comprises the following steps:
(1) an optical method: the optical method for measuring junction temperature mainly comprises two methods of optical fiber temperature measurement and infrared thermal imaging. The optical fiber temperature measurement is to connect an optical fiber temperature measuring instrument with an internal chip of a crimping type semiconductor device by using an optical fiber, and the optical fiber temperature measuring instrument estimates junction temperature by emitting irradiation light and receiving reflection light, and is only suitable for a welding type IGBT module. The infrared thermal imaging method, as an optical temperature measurement technique, has the functions of globally monitoring temperature distribution and rapidly imaging the temperature distribution, and the principle is to obtain the distribution of a temperature field on the surface of an object through the thermal radiation property of the object. However, the optical method is not suitable for the actual field application with complex working condition environment because the package of the device needs to be damaged when the temperature is measured.
(2) Iterative numerical value calculation algorithm: the junction temperature calculation method takes the electrothermal coupling relation of the device into consideration in the calculation process, and improves the junction temperature calculation accuracy to a certain extent, but the junction temperature calculation method is off-line junction temperature calculation, so that the on-line measurement of the junction temperature cannot be realized, and in some occasions with high requirements on the temperature calculation accuracy, the accuracy requirements can be met by carrying out multiple iterations, and the calculation is complex, so that the application of the junction temperature calculation method is limited.
(3) Thermal sensitive electrical parameter method: and acquiring the corresponding relation between the thermosensitive electrical sensing parameters and the known junction temperature in an off-line mode, measuring the thermosensitive electrical sensing parameters under the normal running condition of the crimping type semiconductor device, and deducing a junction temperature value according to the corresponding relation between the thermosensitive electrical sensing parameters and the junction temperature acquired in the previous step. However, due to the dispersibility of the crimping type semiconductor devices, the temperature-sensitive characteristics of each device are not completely the same, so that the existing junction temperature measurement technology is difficult to be directly applied to an engineering practical system.
(4) Thermal sensor method: junction temperature is measured by using the temperature characteristic of the thermosensitive element, and the temperature sensor needs to be in close contact with a measured object when being installed. The method is generally used for over-temperature protection of devices in engineering, and junction temperature is indirectly obtained by measuring the shell temperature of a compression-type semiconductor device and then calculating by using the power consumption and the crusting thermal resistance of the device. Since the mounting conditions can seriously affect the incrustation thermal resistance, the measurement error is large.
The above measurement methods are all indirect for measuring the junction temperature, because the crimping type semiconductor device adopts a multilayer structure for packaging, and needs a certain pressure during normal operation, so that the chip is not easy to directly contact, if the temperature sensor is directly arranged on the contact surface of the chip or embedded in other components, the chip will be damaged due to overlarge stress, and the measurement precision and even the damage of the temperature sensor can be caused.
Disclosure of Invention
The invention aims to provide a crimping type semiconductor device, a crimping submodule and an elastic temperature measurement packaging assembly, and aims to solve the technical problems that junction temperature is difficult to measure and a temperature measurement structure is possibly damaged due to the fact that a temperature sensor is adopted for direct measurement in the prior art.
In order to realize the purpose, the invention adopts the technical scheme that: the elastic temperature measurement packaging assembly is used for measuring the temperature of a chip assembly and comprises a temperature measurement probe, a probe fixing piece and a limiting sleeve, wherein the temperature measurement probe is used for being attached to the chip assembly to measure the temperature, the probe fixing piece is used for fixing the temperature measurement probe, the limiting sleeve is sleeved outside the probe fixing piece, and the temperature measurement probe is fixed to the top of the probe fixing piece; the probe fixing piece is arranged in the limiting sleeve in a sliding mode, the top end of the limiting sleeve can be abutted to the chip assembly, an elastic piece is arranged in the limiting sleeve, one end of the elastic piece is abutted to the probe fixing piece, and the other end of the elastic piece is abutted to the limiting sleeve.
Furthermore, the top of the probe fixing piece extends outwards to form a first limiting boss, the inner part of the limiting sleeve extends towards the probe fixing piece to form a second limiting boss, the elastic piece is sleeved on the outer side of the probe fixing piece, and two ends of the elastic piece are respectively abutted against the first limiting boss and the second limiting boss.
Furthermore, the temperature measurement probe also comprises a temperature measurement lead wire connected with the temperature measurement probe, and the temperature measurement lead wire penetrates through the probe fixing part and is led out from the bottom.
The temperature measurement device further comprises a hollow guide compression bar, wherein a hollow hole for the temperature measurement lead to pass through is formed in the hollow guide compression bar, and a side hole for the temperature measurement lead to be led out is formed in one side of the hollow guide compression bar.
Furthermore, the outer side of the hollow guide pressure rod is sleeved with a conductive connecting sheet and a plurality of groups of first combined disc springs, and the first combined disc springs are arranged between the two conductive connecting sheets.
Furthermore, the conductive connecting sheet comprises a first conductive sheet, a second conductive sheet and a connecting sheet for connecting the first conductive sheet and the second conductive sheet, and the first conductive sheet and the second conductive sheet are respectively arranged on the outer side of the first mating disc spring.
Furthermore, the number of the conductive connecting sheets is two, and the two groups of the conductive connecting sheets are oppositely arranged.
The invention also discloses a crimping sub-module which comprises a collecting electrode plate, a chip assembly and the elastic temperature measurement packaging assembly, wherein the temperature measurement probe is attached to the chip assembly, and the chip assembly comprises a chip attached to the collecting electrode plate.
Furthermore, the chip assembly further comprises an emission polar plate arranged between the chip and the elastic temperature measurement packaging assembly.
Furthermore, the LED chip also comprises a DBC substrate attached to the collecting electrode plate, and the DBC substrate is electrically connected with the chip.
Further, the DBC substrate is arranged between the two chips.
Further, the bottom of the DBC substrate is provided with an elastic compression joint assembly.
Furthermore, the elastic compression joint assembly comprises a guide compression bar and a top compression sleeve arranged at the bottom of the guide compression bar, the guide compression bar is connected with the top compression sleeve in a sliding manner, and a conductive connecting sheet and a plurality of groups of second butt-joint disc springs are sleeved on the outer side of the guide compression bar.
The collecting electrode plate is buckled at one end of the sub-module shell, and the chip and the elastic temperature measurement packaging assembly are both positioned in the sub-module shell.
The invention also provides a crimping type semiconductor device which comprises an outer frame and at least one set of crimping sub-modules arranged in the outer frame.
Furthermore, a positioning plate is arranged at the bottom of the outer frame, and a through hole for the compression joint sub-module to be inserted into and a wire groove for the temperature measuring bus to pass through are preset on the positioning plate.
The crimping type semiconductor device, the crimping submodule and the elastic temperature measurement packaging assembly provided by the invention have the beneficial effects that:
1. the temperature probe can be directly attached to the chip assembly, the temperature of the chip is obtained, contact temperature measurement can be achieved, visual and effective temperature measurement of the chip inside the crimping type semiconductor device is achieved, the temperature measurement requirement of the crimping type semiconductor device is met, the accuracy is high, the using area is wide, the calculation mode is simple, the electric insulation performance is good, and the temperature probe is not prone to being interfered by the external environment.
2. Realize the sliding connection between spacing sleeve and the probe mounting through the elastic component, make temperature probe can contract when pressure is great inside spacing sleeve, the outer wall through spacing sleeve supports outside pressure, avoided crimping stress to chip and temperature probe's influence, protect chip and temperature probe, after the temperature measurement function has been increased, do not increase the inside parasitic inductance of device, also do not influence the stress of chip, make whole crimping submodule piece and crimping type semiconductor device's electricity, heat and mechanical properties are good.
3. The inside spare part installation dress of elasticity temperature measurement encapsulation subassembly is simple, is convenient for mutually support the location, is applicable to scientific research and engineering and uses, and can regard as the chip of solitary temperature measurement module according to different positions of concrete user demand cooperation and different quantity, its compact structure, the volume is less, realization multiple spot temperature measurement that can be nimble, the distribution condition of observation temperature that can be accurate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic perspective view of a crimp-type semiconductor device according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of another angle of the crimp-type semiconductor device according to the embodiment of the present invention, in which the case is not shown;
FIG. 3 is a schematic perspective view of a positioning plate according to an embodiment of the present invention;
Fig. 4 is a schematic top view of a crimp-type semiconductor device according to an embodiment of the present invention;
FIG. 5 is a sectional view taken along line A-A of FIG. 4;
FIG. 6 is a sectional view taken along line B-B of FIG. 4;
fig. 7 is a schematic perspective view of a crimping sub-module according to an embodiment of the present invention;
FIG. 8 is a schematic perspective view of another angle of a crimp sub-module provided in accordance with an embodiment of the present invention, wherein the sub-module housing is not shown;
FIG. 9 is a schematic cross-sectional view of a crimp sub-module provided in an embodiment of the invention;
FIG. 10 is a schematic cross-sectional view of an elastic crimping assembly employed in an embodiment of the present invention;
fig. 11 is a schematic cross-sectional view of an elastic temperature measurement package assembly according to an embodiment of the invention.
Description of reference numerals:
1. an outer frame; 2. positioning a plate; 4. a conductive connecting sheet; 3. a crimping sub-module; 5. a drive terminal; 6. a temperature measuring bus; 11. a housing; 12. packaging the bottom plate; 21. a limiting hole; 22. a wire slot; 23. a fixing hole; 24. a long groove; 31. a collector electrode plate; 32. a chip; 33. a DBC substrate; 34. an elastic temperature measurement packaging assembly; 35. an elastic crimping assembly; 36. a sub-module housing; 37. an emitting electrode plate; 341. a temperature measuring probe; 342. a probe fixing member; 343. a limiting sleeve; 344. an elastic member; 345. a temperature measuring lead; 346. a hollow guide pressure lever; 347. a first mating disc spring; 351. a guide pressure lever; 352. pressing the sleeve; 353. a second opposing disc spring; 41. a first conductive sheet; 42. a second conductive sheet; 43. and (7) connecting the sheets.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 to 6 together, a crimp-type semiconductor device according to the present invention will now be described. The crimping type semiconductor device includes an outer frame 1 and at least one crimping sub-module 3 provided in the outer frame 1, wherein the number of the crimping sub-modules 3 can be increased or decreased according to current capacity and other requirements, and the size of the outer frame 1 is also increased or decreased accordingly.
The outer frame 1 generally comprises a shell 11 with an opening at the bottom end, the bottom end of the shell 11 is sealed by a packaging bottom plate 12, so that a containing cavity can be formed between the shell 11 and the packaging bottom plate 12, the crimping sub-module 3 is arranged in the containing cavity, and a plurality of grooves can be formed in the outer part of the shell 11, so that the requirement of high-voltage creepage distance can be met. The top end of the housing 11 is also provided with an opening, the top end of the crimping sub-module 3 can protrude out of the opening to contact with the outside, and a plurality of crimping sub-modules 3 can be arranged in the opening.
Preferably, the outer frame 1 is generally made of an insulating part made of SMC (sheet molding compound) composite material, the housing 11 and the package substrate 12 may be made of SMC composite material, the package substrate 12 may also be made of oxygen-free copper TUI material, the housing 11 and the package substrate 12 may be bonded by using an electrode adhesive, or may be fixedly connected by using a fastener such as a screw, which is not limited herein.
Further, referring to fig. 3, a positioning plate 2 is disposed at the bottom of the outer frame 1, and a limiting hole 21 for inserting the crimping sub-module 3 and a wire slot 22 for passing through the temperature measuring bus 6 are preset on the positioning plate 2. Specifically, locating plate 2 directly sets up on the packaging bottom plate 12 of bottom, reserves the recess according to specific user demand on the locating plate 2 for crimping submodule piece 3 and temperature measurement bus 6 can block in spacing hole 21 or wire casing 22's inside, can fix a position crimping submodule piece 3 and temperature measurement bus 6, avoid it to take place the displacement. The locating plate 2 is directly fixed on the packaging bottom plate 12, a plurality of fixing holes 23 can be formed in the outer edge of the locating plate 2, the locating plate 2 and the packaging bottom plate 12 can be directly and fixedly connected through fasteners such as screws, or the locating plate 2 is directly and integrally formed on the packaging bottom plate 12 according to actual use requirements.
Preferably, the positioning plate 2 is generally made of a polyimide plate, and the thickness of the positioning plate is not greater than the height of the large cross section of the lower end of the hollow guiding pressure rod 346, so that the fixing effect of the elastic temperature measurement packaging assembly 34 can be satisfied. The temperature measuring lead 345 is led out from each elastic temperature measuring packaging component 34, so that the wire casing 22 is communicated with each through hole in sequence.
Preferably, a via hole for leading out the temperature measuring bus 6 is formed in one side of the bottom end of the outer frame 1, and the temperature measuring bus 6 is electrically connected with the temperature measuring probes 341 inside each crimping submodule 3, so that data measured by the temperature measuring probes 341 can be transmitted to the outside. A via hole for extending the driving terminal 5 is further formed in one side of the bottom end of the outer frame 1, the driving terminal 5 is electrically connected to the DBC substrate 33 in each of the crimping sub-modules 3, the driving terminal 5 is a strip-shaped plate, and the elastic crimping component 35 corresponding to each DBC substrate 33 is directly and fixedly connected to the driving terminal 5.
Preferably, a long groove 24 for placing the driving terminal 5 is reserved on the positioning plate 2, so that the driving terminal 5 can be positioned by the positioning plate 2, and meanwhile, the occupied space of the whole crimping sub-module 3 can be saved. The wire casing 22 on the positioning plate 2 is communicated with a via hole at the bottom end of the outer frame 1 for the temperature measuring bus 6 to penetrate through.
Further, referring to fig. 7 to 9, the crimping sub-module 3 according to the present invention will now be described. The crimping sub-module 3 comprises a collecting electrode plate 31, a chip assembly, a dbc (direct Bonding coater) substrate 33 and an elastic thermometric packaging assembly 34, wherein the chip assembly comprises a chip 32, the chip 32 is attached to the collecting electrode plate 31, and the thermometric probe 341 is attached to the chip assembly. The collecting electrode plate 31 is generally a thick molybdenum plate, a plurality of groups of chips 32 and DBC substrates 33 can be attached to the bottom of one collecting electrode plate 31, 2 chips 32 and 1 DBC substrate 33 are attached to the bottom of each group of collecting electrode plate 31, the DBC substrate 33 is disposed between two chips 32, and the gates of the two chips 32 and the DBC substrate 33 are connected by bonding wires. Each group of chips 32 corresponds to one elastic temperature measurement packaging assembly 34, the elastic temperature measurement packaging assembly 34 can directly or indirectly measure the temperature of the chips 32, and the non-welding surface of each DBC substrate 33 corresponds to one elastic compression-connection assembly 35.
Wherein, the chip subassembly includes chip 32 and locates the transmission polar plate 37 between chip 32 and the elasticity temperature measurement encapsulation subassembly, and transmission polar plate 37 generally has two plate bodys, wherein is thick molybdenum plate and thick aluminum plate respectively, and the thickness of molybdenum plate and aluminum plate is 1mm generally, and transmission polar plate 37 is square plate body generally, and the cross sectional area of transmission polar plate 37 is less than the area of chip 32, and is greater than the outer fringe area of spacing sleeve 343. The emitting electrode plate 37 can be directly abutted against the temperature probe 341, and the heat of the chip 32 can be transferred to the temperature probe 341 through the emitting electrode plate 37, so that the temperature measurement of the chip 32 is realized, the chip 32 can be protected, and the surface of the chip 32 is prevented from being abraded.
Whole crimping submodule piece 3 can also be provided with a submodule piece shell 36 outward, and submodule piece shell 36 can be fixed in submodule piece shell 36's inside with collecting electrode plate 31, chip 32, DBC base plate 33, elasticity temperature measurement encapsulation subassembly 34 and elasticity crimping subassembly 35 etc. can strengthen its wholeness, makes it can form an holistic module, conveniently carries out the use of modular assembling as required.
Preferably, the sub-module housing 11 is a housing having an opening at a top end thereof, the collecting electrode plate 31 is fastened to the opening of the sub-module housing 11, the chip 32, the elastic thermometric packaging assembly 34, the DBC substrate 33, the elastic crimping assembly 35, and the like are all disposed inside the sub-module housing 11, the bottom of the sub-module housing 11 also has a through hole, and the bottoms of the elastic thermometric packaging assembly 34 and the elastic crimping assembly 35 can extend out of the sub-module housing 11 and contact with the positioning plate 2.
The DBC substrate 33 is a copper-clad ceramic substrate, which has the characteristics of ceramic, such as high thermal conductivity, high electrical insulation, high mechanical strength, low expansion, and the like, and has high electrical conductivity and excellent soldering performance of oxygen-free copper, and can be etched into various patterns like a PCB (printed circuit board). The chip 32 and the DBC substrate 33 are both devices conventionally used in a crimp-type semiconductor, and are not particularly limited herein.
Further, referring to fig. 10, the elastic compression joint assembly 35 includes a guiding compression bar 351 and a pressing sleeve 352 disposed at the bottom of the guiding compression bar 351, the guiding compression bar 351 is slidably connected to the pressing sleeve 352, and a conductive connecting piece 4 and a plurality of sets of second mating disc springs 353 are sleeved on the outer side of the guiding compression bar 351. The top end of the guide compression bar 351 is abutted to the DBC substrate 33, the jacking sleeve 352 can be abutted to the driving terminal 5 at the bottom, the guide compression bar 351 and the jacking sleeve 352 can be in sliding connection, damage to the DBC substrate 33 when the compression stress is too large can be avoided, and the DBC substrate 33 can move downwards along with the downward movement of the guide compression bar 351. Alternatively, the guiding pressing rod 351 may be located at the bottom to directly contact with the driving terminal 5 and the pressing sleeve 352 may be located at the top to contact with the DBC substrate 33 according to actual conditions and specific requirements, which are not limited herein.
Wherein, the top of guide pressure pole 351 has spacing boss, the external diameter of roof pressure cover 352 is greater than the diameter of guide pressure pole 351 lower extreme, and offer on the roof pressure cover 352 and supply guide pressure pole 351 slip male through-hole, a plurality of groups second is to closing the dish spring 353 cover and locate on the guide pressure pole 351, the second that the top is to closing the dish spring 353 can with spacing boss looks butt, the second that the bottom is to closing the dish spring 353 and roof pressure cover 352 looks butt, when making roof pressure cover 352 or guide pressure pole 351 pressurized, can be with the compression of multiunit second pair closing the dish spring 353, its compression yield is 2mm generally, make roof pressure cover 352 or guide pressure pole 351 can elastic support DBC base plate 33.
The top end and the bottom end of the second butt-joint disc spring 353 are both provided with a conductive connecting sheet 4, the conductive connecting sheet 4 comprises a first conductive sheet 41, a second conductive sheet 42 and a connecting sheet 43 for connecting the first conductive sheet 41 and the second conductive sheet 42, the first conductive sheet 41 and the second conductive sheet 42 are both sleeved on the guide pressure rod 351, the first conductive sheet 41 and the second conductive sheet 42 are respectively arranged on the outer side of the second butt-joint disc spring 353, and the connecting sheet 43 is arranged on the outer side of the second butt-joint disc spring 353, so that the first conductive sheet 41 and the second conductive sheet 42 are connected from the outer part of the second butt-joint disc spring 353. Wherein the connecting piece 43 is a generally "V" shaped connecting piece 43 such that the connecting piece 43 can compress and extend in cooperation with the distance between the first conductive piece 41 and the second conductive piece 42.
Preferably, the number of the conductive connecting pieces 4 is two, the first conductive pieces 41 and the second conductive pieces 42 of the two conductive connecting pieces 4 are sleeved on the guide pressing rod 351, and the connecting pieces 43 are respectively located on two opposite sides of the guide pressing rod 351.
Further, referring to fig. 11, the flexible temperature measurement package assembly 34 of the present invention will now be described. The elastic temperature measurement packaging assembly 34 is used for elastically measuring the temperature of the chip 32, and comprises a temperature measurement probe 341 which can be attached to the chip assembly for measuring the temperature, a probe fixing member 342 for fixing the temperature measurement probe 341, and a limiting sleeve 343 which is sleeved outside the probe fixing member 342, wherein the temperature measurement probe 341 is fixed on the top of the probe fixing member 342; the probe fixing part 342 is slidably disposed in the limiting sleeve 343, the top end of the limiting sleeve 343 can abut against the chip assembly, an elastic part 344 is disposed in the limiting sleeve 343, one end of the elastic part 344 abuts against the probe fixing part 342, and the other end abuts against the limiting sleeve 343.
Compared with the prior art, the elastic temperature measurement packaging assembly 34 provided by the invention has the advantages that the temperature measurement probe 341 can be directly attached to the chip assembly, so that contact temperature measurement is realized, intuitive and effective temperature measurement on the chip 32 in the crimping type semiconductor device is realized, the temperature measurement requirement of the crimping type semiconductor device is met, the accuracy is higher, the use area is wider, the calculation mode is simpler, the electric insulation property is good, and the external environment interference is not easily caused. Realize the sliding connection between spacing sleeve 343 and the probe mounting 342 through elastic component 344 for inside temperature probe 341 can contract spacing sleeve 343 when pressure is great, supported outside pressure through the outer wall of spacing sleeve 343, avoided crimping stress to chip 32 and temperature probe 341's influence, protected chip 32 and temperature probe 341.
The temperature probe 341 is a contact micro temperature measuring element, which generally uses a thermocouple or a thermal resistor, and has a temperature measuring range of-40 ℃ to +350 ℃, a tolerance value of ± 0.5 ℃, and an external dimension of generally 2mm in diameter and 1.5mm in height. The probe fixing member 342 is used to fix the temperature measuring probe 341, which generally adopts pfa (perfluoroalkkoxy) plastic, and has better insulation and high temperature resistance, and can avoid the influence on the transmitting plate 37 and the chip 32. Spacing sleeve 343 generally has the sleeve of through-hole in the middle of, probe mounting 342 can insert to this spacing sleeve 343 inside, and probe mounting 342 can slide from top to bottom in spacing sleeve 343, and carry out elasticity spacing through elastic component 344, spacing sleeve 343's top can be directly with chip subassembly looks butt, when outside crimping stress is great, support the chip subassembly through spacing sleeve 343's top, avoid the chip subassembly to crush temperature probe 341, thereby protect temperature probe 341.
The elastic part 344 is generally made of a pressure spring, the pressure spring is generally made of stainless steel, the design working load is not lower than 1N, the working stroke is not lower than 2mm, and therefore the elastic part 344 can stably support the probe fixing part 342 and cannot cause the temperature measuring probe 341 to be crushed. Of course, according to actual conditions and specific requirements, in other embodiments of the present invention, the type and specification of the temperature measuring probe 341 can be adjusted as needed, the probe fixing member 342 and the limiting sleeve 343 can be made of other plastics with high hardness, the elastic member 344 can be made of metal materials such as iron, and the working load and the stroke can be adjusted according to the specific use environment.
Preferably, the top end of the temperature probe 341 is provided with a groove for accommodating the temperature probe 341, and the depth of the groove is smaller than the thickness of the temperature probe 341, so that the top end of the temperature probe 341 can be directly abutted against the chip assembly. For example, when the thickness of the temperature measuring probe 341 is 2mm, the depth of the groove is 1.2 mm.
Further, there are various embodiments for the position patterns among the probe holder 342, the elastic member 344 and the position limiting sleeve 343, and the following two embodiments are listed in the present invention, but the position layout among the probe holder 342, the elastic member 344 and the position limiting sleeve 343 includes, but is not limited to, the following two embodiments:
the top of the probe fixing member 342 extends outwards to form a first limiting boss, the inside of the limiting sleeve 343 extends towards the probe fixing member 342 to form a second limiting boss, the elastic member 344 is sleeved outside the probe fixing member 342, and two ends of the elastic member 344 are respectively abutted against the first limiting boss and the second limiting boss. The elastic member 344 is directly sleeved outside the probe fixing member 342, and the position of the elastic member 344 is limited by the combination of a first limiting boss protruding outside the probe fixing member 342 and a second limiting boss at the bottom of the limiting sleeve 343, so that the probe fixing member 342 can extend and contract inside the limiting sleeve 343.
Or, a limiting boss or the bottom end of the limiting sleeve 343 may also directly extend towards the middle inside the limiting sleeve 343 to form a closed structure, a pressure spring is disposed at the bottom of the probe fixing part 342, one end of the pressure spring directly abuts against the bottom end of the probe fixing part 342, and the other end of the pressure spring abuts against the inner wall surface of the limiting sleeve 343 through the limiting boss, so that the probe fixing part 342 has a degree of freedom that slides in the height direction of the limiting sleeve 343.
Further, referring to fig. 8 and 9, as an embodiment of the elastic temperature measurement package assembly 34 provided by the present invention, the elastic temperature measurement package assembly 34 further includes a temperature measurement lead 345 connected to the temperature measurement probe 341, and the temperature measurement lead 345 passes through the probe fixing member 342 and is led out from the bottom. Specifically, the temperature measurement lead 345 is disposed inside the probe fixing member 342, and the temperature measurement lead 345 can be led out from the bottom of the probe fixing member 342, so that all the temperature measurement leads 345 can be conveniently gathered to form the temperature measurement bus 6, and the internal lead makes the circuit clearer and does not affect the layout of other components. Preferably, the temperature measuring lead 345 is a wire inside and a plastic sheath outside, and the material of the plastic sheath is PFA plastic.
Further, the elastic temperature measurement packaging assembly 34 further includes a hollow guiding pressure bar 346, a hollow hole for the temperature measurement lead 345 to pass through is formed inside the hollow guiding pressure bar 346, a side hole for the temperature measurement lead 345 to be led out is formed in one side of the hollow guiding pressure bar 346, the temperature measurement lead 345 can be led out to the positioning plate 2 through the side hole through the hollow hole in the hollow guiding pressure bar 346, and the temperature measurement leads 345 on the positioning plate 2 are connected, so that the temperature measurement bus 6 is formed. Of course, according to practical situations and specific requirements, in other embodiments of the present invention, the hollow guiding pressing rod 346 may also be replaced by a non-hollow structure, and the wire guide slot 22 for leading out the temperature measuring lead 345 is opened on the hollow guiding pressing rod 346, which is not limited herein.
Furthermore, the top end of the hollow guiding pressing rod 346 is abutted to the bottom of the limiting sleeve 343, the bottom end of the hollow guiding pressing rod 346 is directly fixed on the positioning plate 2, and the hollow guiding pressing rod 346 and the limiting sleeve 343 can be in sliding connection, so that damage to the chip 32 caused by overlarge compression stress can be avoided, and the chip 32 can move downwards along with the downward movement of the hollow guiding pressing rod 346.
The bottom end of the hollow guide pressure rod 346 is provided with a limit boss, the outer diameter of the limit sleeve 343 is larger than the diameter of the upper end of the hollow guide pressure rod 346, a through hole for the hollow guide pressure rod 346 to be inserted in a sliding mode is formed in the bottom of the limit sleeve 343, a plurality of groups of first combined disc springs 347 are sleeved on the hollow guide pressure rod 346, the first combined disc springs 347 at the bottommost end can be abutted to the limit boss, the first combined disc springs 347 at the topmost end are abutted to the bottom surface of the limit sleeve 343, the limit sleeve 343 can compress a plurality of groups of first combined disc springs 347 when being pressed, the compression amount is generally 2mm, the limit sleeve 343 can elastically support the chip 32, and damage to the chip 32 is avoided.
The top end and the bottom end of the first pairing butterfly spring 347 are both provided with a conductive connecting sheet 4, each conductive connecting sheet 4 comprises a first conductive sheet 41, a second conductive sheet 42 and a connecting sheet 43 for connecting the first conductive sheet 41 with the second conductive sheet 42, the first conductive sheet 41 and the second conductive sheet 42 are both sleeved on the hollow guide pressure rod 346, the first conductive sheet 41 and the second conductive sheet 42 are respectively arranged on the outer side of the first pairing butterfly spring 347, and the connecting sheet 43 is arranged on the outer side of the first pairing butterfly spring 347, so that the first conductive sheet 41 and the second conductive sheet 42 are connected from the outer side of the first pairing butterfly spring 347. Wherein the connecting piece 43 is a generally "V" shaped connecting piece 43 such that the connecting piece 43 can compress and extend in cooperation with the distance between the first conductive piece 41 and the second conductive piece 42.
Preferably, the number of the conductive connecting pieces 4 is two, the first conductive pieces 41 and the second conductive pieces 42 of the two conductive connecting pieces 4 are sleeved on the hollow guiding compression bar 346, and the connecting pieces 43 are respectively located at two opposite sides of the hollow guiding compression bar 346.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (12)
1. Elasticity temperature measurement encapsulation subassembly for to chip subassembly temperature measurement, its characterized in that: comprises that
A temperature probe (341) for attaching to the chip assembly to measure temperature;
the temperature measuring probe fixing part (342) is used for fixing the temperature measuring probe (341), and the temperature measuring probe (341) is fixed at the top of the probe fixing part (342);
the probe fixing part (342) is sleeved with a limiting sleeve (343), the probe fixing part (342) is slidably arranged in the limiting sleeve (343), the top end of the limiting sleeve (343) can be abutted against the chip assembly, an elastic part (344) is arranged in the limiting sleeve (343), one end of the elastic part (344) is abutted against the probe fixing part (342), and the other end of the elastic part is abutted against the limiting sleeve (343) by 1;
The temperature measuring lead wire (345) is connected with the temperature measuring probe (341), and the temperature measuring lead wire (345) penetrates through the probe fixing part (342) and is led out from the bottom;
a first limiting boss extends outwards from the top of the probe fixing piece (342), a second limiting boss extends towards the probe fixing piece (342) from the inside of the limiting sleeve (343), the elastic piece (344) is sleeved on the outer side of the probe fixing piece (342), and two ends of the elastic piece (344) are respectively abutted to the first limiting boss and the second limiting boss;
the temperature measuring device is characterized by further comprising a hollow guide compression bar (346), a hollow hole for the temperature measuring lead wire (345) to pass through is formed in the hollow guide compression bar (346), and a side hole for the temperature measuring lead wire (345) to be led out is formed in one side of the hollow guide compression bar (346);
the outer side of the hollow guide pressure rod (346) is sleeved with a conductive connecting sheet (4) and a plurality of groups of first combined disc springs (347), and the first combined disc springs (347) are arranged between the two conductive connecting sheets (4).
2. The resilient thermometric package assembly of claim 1, wherein: the conductive connecting sheet (4) comprises a first conductive sheet (41), a second conductive sheet (42) and a connecting sheet (43) connected with the first conductive sheet (41) and the second conductive sheet (42), and the first conductive sheet (41) and the second conductive sheet (42) are respectively arranged at the outer side of the first combined disc spring (347).
3. The resilient thermometric package assembly of claim 1, wherein: the number of the conductive connecting sheets (4) is two, and the two groups of the conductive connecting sheets (4) are oppositely arranged.
4. A crimping submodule, characterized by: the flexible thermometric package assembly of any of claims 1-3, comprising a collector plate (31), a chip assembly to which the thermometric probe (341) is attached, the chip assembly comprising a chip (32) attached to the collector plate (31).
5. The crimp submodule of claim 4, wherein: the chip assembly further includes an emitter pad (37) disposed between the chip (32) and the elastic thermometric package assembly (34).
6. The crimping sub-module of claim 4, wherein: the LED chip is characterized by further comprising a DBC substrate (33) attached to the collector plate (31), wherein the DBC substrate (33) is electrically connected with the chip (32).
7. The crimping sub-module of claim 6, wherein: the DBC substrate (33) is arranged between the two chips (32).
8. The crimping sub-module of claim 6, wherein: and an elastic crimping component (35) is arranged at the bottom of the DBC substrate (33).
9. The crimp submodule of claim 8, wherein: the elastic crimping component (35) comprises a guide pressure rod (351) and a jacking sleeve (352) arranged at the bottom of the guide pressure rod (351), the guide pressure rod (351) is connected with the jacking sleeve (352) in a sliding mode, and a conductive connecting sheet (4) and a plurality of groups of second opposite-combination disc springs (353) are sleeved on the outer side of the guide pressure rod (351).
10. The crimp submodule of any one of claims 4 to 9, wherein: the collector electrode plate (31) is buckled at one end of the sub-module shell (36), and the chip (32) and the elastic thermometric packaging assembly (34) are both located in the sub-module shell (36).
11. A crimp-type semiconductor device characterized in that: comprising an outer frame (1) and at least one set of crimp sub-modules according to any one of claims 4 to 10 arranged within said outer frame (1).
12. A crimp-type semiconductor device according to claim 11, wherein: the bottom of the outer frame (1) is provided with a positioning plate (2), and a through hole for inserting the crimping sub-module (3) and a wire groove (22) for the temperature measuring bus (6) to pass through are preset on the positioning plate (2).
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| CN202010670448.XA CN111912538B (en) | 2020-07-13 | 2020-07-13 | Crimping type semiconductor device, crimping submodule and elastic temperature measurement packaging assembly |
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| CN202010670448.XA CN111912538B (en) | 2020-07-13 | 2020-07-13 | Crimping type semiconductor device, crimping submodule and elastic temperature measurement packaging assembly |
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| CN111912538B true CN111912538B (en) | 2022-06-28 |
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| CN102538993B (en) * | 2012-02-10 | 2013-04-03 | 浙江大学 | Temperature measuring device of machine tool |
| CN103579165B (en) * | 2013-11-04 | 2016-08-31 | 国家电网公司 | A kind of Full-pressure-weldinpower power device |
| CN104966704B (en) * | 2015-07-23 | 2019-01-25 | 国网智能电网研究院 | A kind of compression joint type power device package of low thermal resistance |
| CN108428677B (en) * | 2018-03-16 | 2020-09-11 | 全球能源互联网研究院有限公司 | Crimping type IGBT elastic press mounting structure and crimping type IGBT packaging structure |
| DE202018102895U1 (en) * | 2018-05-24 | 2018-06-11 | Stankowitz Test Equipment Gmbh | Plug of a thermocouple, socket for connection to this plug and measuring and evaluation system with such a plug and a connector socket |
| CN109855752A (en) * | 2019-03-22 | 2019-06-07 | 华北电力大学 | A kind of contact temperature-measuring system of crimp type semiconductor device inside Temperature Distribution |
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