CN111908777A

CN111908777A - Substrate applied to optical device and preparation method thereof

Info

Publication number: CN111908777A
Application number: CN202010639668.6A
Authority: CN
Inventors: 何相平; 李建杰; 骆志财; 智健; 罗新华; 杜永建; 黄朋
Original assignee: Guangzhou Honsun Opto-Electronic Co ltd
Current assignee: Guangzhou Honsun Opto-Electronic Co ltd
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2020-11-10
Anticipated expiration: 2040-07-06
Also published as: CN111908777B

Abstract

The invention discloses a substrate applied to an optical device and a preparation method thereof, wherein the method comprises the steps of processing a selected quartz rod into a prefabricated rod according to the design requirement of a product; melting and drawing the prefabricated rod into a plurality of substrate long billets meeting the design requirement; bonding the arranged and combined long base plate blanks by adopting a preset paraffin mixture to prepare block blanks; cutting the block blank into a plate blank according to the size of a finished product, and dissolving each end face of the plate blank by adopting a first solution; performing surface roughening treatment on each end face of the dissolved plate blank by using a second solution, and performing paraffin removal and cleaning treatment on the plate blank; carrying out fire polishing processing on each end face of the plate blank after the wax removal and cleaning treatment on special equipment to prepare a finished substrate product; the preparation of the substrate with high positioning precision, low breakage rate and high reliability is realized; and the damage rate in the production process is reduced, the production yield is improved, and the production cost is reduced.

Description

Substrate applied to optical device and preparation method thereof

Technical Field

The invention relates to the technical field of optical fiber communication, in particular to a substrate applied to an optical device and a preparation method thereof.

Background

With the rapid development of the information age and the internet, optical devices with different purposes and styles are widely applied to telecommunication networks, cable television networks, optical fiber sensing and optical fiber communication technologies. The optical fiber coupler is also called an optical splitter, and refers to an optical passive device for splitting/combining optical signals by combining two or more optical fibers together. The quartz substrate is a component made of quartz material and used for fixing optical fibers, and generally, an optical fiber coupler generally adopts a long-strip single-groove quartz substrate with an outer diameter smaller than 3 mm and a length smaller than 30 mm to package and protect a coupling area so as to ensure stable product parameters.

Most of substrates disclosed in the prior art have the defects of low reliability, poor positioning accuracy, high breakage rate and the like. For example, patent document (publication number: CN 201773196U) discloses a quartz substrate with a single groove and a large notch, which has the following disadvantages: firstly, the product lower part is the circular arc, easily rotates when using, leads to difficult clamping that realizes the accuracy between optic fibre and the quartz substrate, and the distance uniformity of optic fibre and the three groove face of constant head tank is difficult to control. Secondly, because the plane that two optic fibre place is parallel with the bottom surface in groove when the product design is used, consequently the tank bottom and the notch of product are all wider, cause the volume of using glue when some glue to be big, and the solidification shrink of gluing is big to the tensile stress of groove both sides, leads to using glue with high costs and some glue bad proportion of breaking. And thirdly, when the product is used, the optical fibers are required to be fixed by dispensing at two ends, and the length of a dispensing area is not correspondingly controlled during the structural design of the quartz substrate, so that the difficulty in controlling the dispensing amount is high. The above problems are not favorable for the reliability of the optical fiber coupler.

Patent document (publication No. CN1153992C) discloses a mechanical grinding method for preparing a quartz substrate, which is a fine quartz rod with a diameter meeting the requirement, and a fine grinding wheel is used to process a required positioning groove based on precise clamping and positioning. The finished products are small in size and large in quantity; and the defects of complicated clamping and disassembling work, large workload, low production efficiency and the like of a mechanical grinding method. And the method has high requirements on the dimensional accuracy and the clamping accuracy of the material, so that the finished product has low dimensional yield. Meanwhile, the surface of the groove prepared by the mechanical grinding method is rough, a large number of microcracks and mechanical stress residues which are difficult to detect and discover exist, the quality problem that the dispensing part is easy to crack and break after the product is put into use is caused by the defects, the qualified rate of the dispensing process is reduced, the production cost of a customer is increased, and meanwhile, the reliability of the optical fiber coupler is also reduced due to the existence of the large number of microcracks and mechanical stress.

Patent document (publication No. CN1872751A) discloses a quartz substrate prepared by a high-temperature melt-drawing method, in which a groove is prepared by using a thick quartz rod, and then the quartz substrate is manufactured by conventional high-temperature drawing and cutting. Compared with a mechanical grinding method, the high-temperature melting wire-drawing method has higher production efficiency and lower requirements on the precision of materials and clamping. However, the surface of the groove prepared by the high-temperature melting wire drawing method is a smooth surface, and although the quality problem that the glue is easy to break in the mechanical grinding method is solved, the glue removing problem ratio in the glue removing process is increased due to the poor bonding strength between the smooth surface and the glue, and meanwhile, the glue solution is easy to flow on the smooth surface in the glue removing process, so that the control difficulty of the glue removing amount is increased, the qualified rate of the glue removing process is also reduced, and the production cost of customers is increased. In addition, two end faces of the quartz substrate produced by the high-temperature melt-drawing method are still processed by a mechanical grinding method, microcracks and mechanical stress exist, the intersected edge of the end face and the cylindrical surface is sharp, the breakage ratio is high in the cold processing process, and the process yield is low.

In order to improve the adhesion between the glue and the groove surface, patent document (publication No. CN106956185A) discloses a roughening method of brushing the surface of the groove back and forth with a brush added with mortar, and a quartz substrate prepared by the roughening method, wherein the smooth surface is treated into a roughened surface. The method needs to align the groove surfaces of the quartz substrates one by one, and the bottom surfaces of the quartz substrates are cylindrical surfaces and can roll, so that the method is poor in clamping consistency and low in efficiency. The method coarsens the whole groove surface, the positions of glue dispensing are only arranged at two ends of the product when the product is used, and the groove surface in the middle part does not need to be roughened. After the rough surface treatment is carried out on the whole groove surface, the light transmittance of the product is poor, the appearance detection is difficult, the gas line defect in the quartz substrate is difficult to detect, and the reliability of the product is reduced.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a substrate applied to an optical device with high reliability and a method for manufacturing the same.

The first technical scheme adopted by the invention is as follows:

a method for preparing a substrate applied to an optical device comprises the following steps:

processing the selected quartz rod into a prefabricated rod according to the design requirement of a product, wherein the prefabricated rod is provided with a flat bottom surface;

melting and drawing the prefabricated rod into a plurality of substrate long billets meeting the design requirement;

bonding the arranged and combined long base plate blanks by adopting a preset paraffin mixture to prepare block blanks;

cutting the block blank into a plate blank according to the size of a finished product, and dissolving each end face of the plate blank by adopting a first solution;

performing surface roughening treatment on each end face of the dissolved plate blank by using a second solution, and performing paraffin removal and cleaning treatment on the plate blank;

and carrying out fire polishing processing on each end face of the plate blank subjected to the wax removal and cleaning treatment on special equipment to obtain a finished substrate.

Optionally, according to product design requirements, the step of processing the selected quartz rod into a preform, where the preform has a flat bottom surface specifically includes the following steps:

processing the selected quartz rod into a prefabricated rod with a flat bottom surface on a fixed clamp;

according to the design requirements of products, a groove structure is formed in the prefabricated rod on the positioning fixture, the bottom of the groove structure is in a semicircular arc shape, and the groove depth is larger than the groove width.

Optionally, the step of bonding the arranged and combined long substrates into a block blank by using a pre-set paraffin mixture specifically includes the following steps:

arranging and combining the long blanks of the substrates at preset intervals, wherein the preset intervals are 1-2 mm;

and adhering the arranged and combined long base plate blanks by adopting a preset paraffin mixture to prepare block blanks, wherein the preset paraffin mixture is a uniform mixture of rosin and paraffin.

Optionally, the step of cutting the block blank into a plate blank according to the finished product size and dissolving each end face of the plate blank with a first solution specifically includes the following steps:

cutting the block blank into a plate blank according to the product size in a fixed length manner;

and dissolving each end face of the plate by fixed length by adopting a first solution.

Optionally, the first solution comprises acetone or dewaxed water.

Optionally, after performing matte treatment on each end surface of the dissolved slab by using the second solution, the step of performing paraffin removal and cleaning treatment on the slab specifically includes the following steps:

performing matte treatment on each end face dissolving area of the plate blank by adopting a second solution to reach the size of a finished product, wherein the second solution is a hydrofluoric acid solution;

carrying out dewaxing treatment on the slab with the roughened surface on a dewaxing fixture;

and cleaning the slab subjected to the paraffin removal treatment on a cleaning clamp.

Optionally, the wax removal treatment includes at least one of physical wax removal, ultrasonic wax removal, and chemical wax removal.

Optionally, the cleaning process comprises ultrasonic cleaning or chemical cleaning.

Optionally, the special equipment includes a flame polishing machine, and the step of performing fire polishing processing on each end surface of the slab subjected to the wax removal and cleaning treatment on the special equipment to manufacture a finished substrate product specifically includes the following steps:

and carrying out fire polishing treatment on each end face of the plate blank subjected to wax removal and cleaning treatment on a flame polishing machine to obtain a finished product of the substrate with rounded edges.

The second technical scheme adopted by the invention is as follows:

the substrate applied to the optical device is prepared by the substrate preparation method applied to the optical device.

The invention has the beneficial effects that: compared with the prior art, the substrate preparation method applied to the optical device, which is provided by the technical scheme, has the advantages of high production efficiency, low cost and small influence on the appearance detection of the finished product, no mechanical collision is generated all the time in the production process, the defects of damage and scratch on the surface of the substrate are greatly reduced, the damage rate of the edge of the product is effectively reduced by performing fire polishing treatment on each end face, the substrate prepared by the substrate preparation method provided by the technical scheme has high positioning precision, low damage rate, no quality hidden danger of microcracks and mechanical stress and high product reliability, and the reliability of the substrate finished product and the protected optical device can be improved.

Drawings

FIG. 1 is a flow chart of the steps of a method for fabricating a substrate for an optical device according to the present invention;

FIG. 2 is a flow chart of a substrate fabrication process for an optical device according to the present invention;

FIG. 3 is a block diagram of a substrate structure fabricated by the method of the present invention applied to a substrate for an optical device;

fig. 4 is a schematic end view of a substrate manufactured by the method for manufacturing a substrate applied to an optical device according to the present invention.

Reference numerals: 1. the substrate comprises a substrate body, 11 grooves, 12 cylindrical surfaces, 13 planes, 14 first dispensing areas, 15 protective areas, 16 second dispensing areas and 101 circular arc chamfers.

Detailed Description

Referring to fig. 1, in one aspect, the present invention provides a method for manufacturing a substrate for an optical device, including the steps of:

s1, processing the selected quartz rod into a prefabricated rod according to the product design requirement, wherein the prefabricated rod is provided with a flat bottom surface;

s2, melting and drawing the prefabricated rod into a plurality of long base plate blanks meeting the design requirement;

s3, bonding the arranged and combined long base plate blanks by adopting a preset paraffin mixture to prepare block blanks;

s4, cutting the block blank into a plate blank according to the size of the finished product, and dissolving each end face of the plate blank by adopting a first solution;

s5, performing frosting treatment on each end face of the dissolved plate blank by using a second solution, and performing dewaxing and cleaning treatment on the plate blank;

and S6, performing fire polishing on each end face of the plate blank subjected to the wax removal and cleaning treatment on special equipment to obtain a finished product of the substrate.

In the embodiment, the selected quartz rod is processed into the prefabricated rod with the flat ground, and the prefabricated rod is melted and drawn into a plurality of substrate long billets meeting the design requirement; after arranging and combining the drawn substrate long blanks, adopting a preset paraffin mixture to bond and fix the arranged and combined substrate long blanks into block blanks; cutting the prepared block blank into a plate blank according to the size of a finished product (substrate), and then removing wax and dissolving each end face of the prepared plate blank by adopting a first solution; performing matte treatment and corresponding paraffin removal treatment and cleaning treatment on each end face of the dissolved plate blank by adopting a second solution; then, carrying out fire polishing processing on each end face of the plate blank subjected to the paraffin removal and cleaning treatment on professional equipment to prepare a finished substrate product; therefore, the prepared substrate has high positioning precision and low breakage rate, has no potential quality hazards of microcracks and mechanical stress, improves the reliability of the substrate and the protected optical device, and realizes the production of a high-reliability substrate finished product; moreover, the substrate preparation method provided by the technical scheme of the application has the advantages that the production efficiency is high, mechanical collision is avoided all the time in the production process, the defects of damage and scratch on the surface of the substrate are greatly reduced, the damage rate of the edge of a product is effectively reduced by performing fire polishing treatment on each end face, the production cost is low, the influence on the appearance detection of the finished product is small, and the method is suitable for mass production so as to improve the yield in the production process.

Optionally, step S1 specifically includes the following steps:

s11, processing the selected quartz rod on a fixed clamp into a prefabricated rod with a flat bottom surface;

s12, according to the product design requirement, grooving the prefabricated rod on a positioning clamp to form a groove structure, wherein the bottom of the groove structure is in a semi-arc shape, and the groove depth is larger than the groove width.

In the embodiment, the groove structure is designed into a narrow and deep groove structure, so that the glue dispensing difficulty and the glue dispensing amount are reduced, and the narrow and deep groove structure can avoid mechanical stress of glue on two side surfaces of the groove after glue dispensing, so that the breakage rate is reduced; semi-circular arcs include, but are not limited to, semi-circular arcs, major arcs, or minor arcs; if the groove depth is set to be 20mm, the groove width is set to be 18mm, and the groove bottom is a semicircular arc with the radius of 9 mm.

Optionally, step S3 specifically includes the following steps:

s31, arranging and combining the long blanks of the substrates at preset intervals, wherein the preset intervals are 1-2 mm;

and S32, bonding the arranged and combined long base plate blanks into block blanks by adopting a preset paraffin mixture, wherein the preset paraffin mixture is a uniform mixture of rosin and paraffin.

In this example, the pre-set paraffin mixture was prepared by mixing rosin and paraffin according to a ratio of 65:35, uniformly mixing the melted mixture, and arranging and combining the substrate long blanks according to the interval of 1-2 mm to be beneficial to mass production.

Optionally, step S4 specifically includes the following steps:

s41, cutting the block blank into a plate blank according to the product size;

and S42, adopting the first solution to dissolve each end face of the plate in a fixed length mode.

In this embodiment, the first solution includes, but is not limited to, acetone or paraffin removal water, the block blank is fixed on a multi-wire cutting device and is cut in a segmented manner to form a plate blank, the plate blank formed after cutting is mounted on a fixture, and acetone or paraffin removal water with the temperature controlled at 23-28 ℃ is used for wax removal and dissolution of the two end faces of the plate blank in a fixed length manner, so that the purpose of making the height difference between the subsequent glue dispensing area and the coupling area is facilitated.

Optionally, the first solution comprises acetone or dewaxed water.

Optionally, step S5 specifically includes the following steps:

s51, performing matte treatment on the dissolving area of each end face of the plate blank to the size of a finished product by using a second solution, wherein the second solution is a hydrofluoric acid solution;

s52, performing dewaxing treatment on the slab with the roughened surface on a dewaxing clamp;

and S53, cleaning the slab subjected to the dewaxing treatment on a cleaning clamp.

In the embodiment, the second solution includes but is not limited to hydrofluoric acid, the slab with the wax removed at the two ends is placed into a hydrofluoric acid solution with the temperature controlled at 23-28 ℃ and the concentration of 10% for rough surface treatment for a certain time such as 15 minutes, the rough surface treatment at the two ends is observed, the length is tested, and the required rough surface is removed, so that the design requirement that a basic finished product dispensing area and a coupling device have a certain height difference is met, and the effect of stopping the glue solution is realized; and then respectively carrying out wax removal treatment and cleaning treatment on the plate blank on a clamp.

In this example, the physical wax removal is a high temperature wax removal such as at 130 ℃; the chemical wax removal comprises cleaning by adopting an environment-friendly cleaning agent and ultra-pure water cleaning.

Alternatively, the cleaning process is ultrasonic cleaning or chemical cleaning.

Optionally, step S6 specifically includes the following steps:

and S61, performing fire polishing treatment on each end face of the plate blank subjected to wax removal and cleaning treatment on a flame polishing machine to obtain a finished product of the base plate with a round edge.

In the embodiment, the flame polishing machine controls the hydrogen flow to be 6L/min and the oxygen flow to be 3L/min to realize the control of the flame size and control the fire polishing time of two end faces of the plate blank, so that the preparation of the finished product of the substrate with the cylindrical surface and the end face fillet is realized, and the damage risk in the production and use processes of the finished product of the substrate is avoided.

In another aspect, the present invention provides a substrate for an optical device, wherein the substrate is manufactured by the above method for manufacturing a substrate for an optical device.

Detailed description of the preferred embodiment

As shown in fig. 2, a flow chart of a substrate preparation process applied to an optical device of the present invention specifically includes the following steps:

1) preform rod processing and forming

Selecting a quartz glass rod with the diameter of 40mm and the length of 400mm, fixing the quartz glass rod on a clamp, and processing a plane with the opposite side dimension of 34.5 mm; the machined plane is taken as a reference plane and is bonded on a positioning clamp, the width of the groove is 18mm, the depth of the groove is 20mm, and the bottom of the groove is an R9mm semicircle;

2) melt-drawing of long billets

Melting and drawing a quartz substrate blank rod with the diameter of 1.38mm and the length of 260mm at the high temperature of 1900 ℃;

3) arranged in parallel at intervals and bonded

Independently fixing quartz substrate blank rods on a special jig one by one at intervals of 2mm, heating to 120 ℃ after parallel arrangement, pouring a molten uniform mixture (65:35) of rosin and paraffin into a block-shaped mold, cooling and taking out the mold;

4) segmented cutting

Fixing the quartz substrate bonded into a block on multi-wire cutting equipment, wherein the cutting length is 31.0 mm;

5) fixed-length paraffin removal in glue dispensing area

Mounting the cut quartz substrate blank on a clamp, controlling the temperature of the paraffin removal water to be 23-28 ℃, enabling the paraffin removal water liquid level to be 8mm higher than the bottom surface of the quartz substrate, dissolving paraffin for 20 minutes, then turning the clamp over 180 degrees, and processing the other end of the quartz substrate;

6) acid etching rough surface treatment in glue dispensing area

Putting the quartz base block blank with the paraffin removed at the two ends into HF acid with the concentration of 10% at the temperature of 23-28 ℃, taking out after acid etching for 15 minutes, observing the condition of the rough surfaces at the two ends, testing the length of the substrate to be 30.0 +/-0.05 mm, and taking out when the length meets the requirement;

7) wax removal and cleaning

Aligning one end (exposed by 8mm) of the base block blank with a special cleaning clamp hole, placing the base block blank in the cleaning clamp hole, and then removing wax at the high temperature of 130 ℃ for 2 hours; taking out and cooling, putting into an ultrasonic tank of an environment-friendly cleaning agent, and ultrasonically removing wax for 5 minutes, wherein the environment-friendly liquid tank passes through 3 tanks; then, a photoelectric cleaning agent with the concentration of 5 percent and the temperature of 40 ℃ are put into the tank, and ultrasonic cleaning is carried out for 5 minutes, wherein 3 cleaning agent tanks are arranged in total; then putting the mixture into ultrapure water (more than 15 megaohms) at 40 ℃, ultrasonically cleaning the mixture for 5 minutes, cleaning the mixture by pure water for 4 grooves in total, taking out the mixture, and centrifugally drying the mixture at a high speed;

8) end face fire polishing

Putting the cleaned quartz substrate on an automatic flame polishing machine, and performing fire polishing on the end face of the quartz substrate by using oxyhydrogen flame, wherein the hydrogen flow is controlled at 6L/min, and the oxygen is controlled at 3L/min;

9) manufacture of substrate product

And (3) detecting the quality of the quartz substrate with the fire-polished end face, such as the outer diameter, the length, the groove width, the groove depth, the end face broken point, the scratch and the like.

Detailed description of the invention

Referring to fig. 1 and 2, a substrate applied to an optical device includes a substrate main body 1, a groove 11 is formed in the top of the substrate main body 1 along the axial direction, a cylindrical surface 12 is formed on the side surface of the substrate main body 1, a plane 13 is formed at the bottom of the substrate main body 1, a first dispensing area 14, a second dispensing area 16 and a protection area 15 are respectively formed on the substrate main body 1, the inner surfaces of the grooves of the first dispensing area 14 and the second dispensing area 16 are rough surfaces, the inner surface of the groove of the protection area 15 is a smooth surface, and the grooves 11, the cylindrical surface 12 and the end surface of the substrate main body 1 are arc chamfers 101.

The substrate body 1 is strip-shaped, the top of the substrate body is provided with a groove 11, and the end face of the substrate body 1 is approximately horseshoe-shaped and axisymmetric. Establish the recess internal surface of first dispensing district 14 and the recess internal surface of second dispensing district 16 into the mat surface, be favorable to improving the adhesive force on glue and groove surface, improve the problem of coming unstuck to and set up protection zone 15 into the problem that the light transmissivity is poor for the smooth surface, be convenient for detect the base plate. The design of the arc chamfer 101 among the groove 11 of the substrate main body, the cylindrical surface 12 of the substrate main body and the end surface of the substrate main body can be beneficial to reducing stress concentration and edge breakage rate in the processing process, meanwhile, the surface has no microcrack, and the reliability of the substrate is improved. In addition, the bottom surface of the substrate main body 1 is set to be the plane 13, so that the positioning precision of the substrate can be improved, and the substrate is effectively prevented from rolling in the dispensing process; thereby achieving the effect of high reliability of the substrate.

In addition, the length of the first dispensing zone 14 and the length of the second dispensing zone 16 may or may not comprise the same; therefore, in the actual production operation process, the length of the first dispensing area 14 and the length of the second dispensing area 16 can be set to be the same or different according to the design requirements of the substrate, and the reliability of the substrate is further improved. The bottom of the groove 11 is a semicircular arc, and the diameter of the semicircular arc is larger than that of the built-in optical fiber; the bottom of the arc-shaped groove is convenient to process, surface microcracks are avoided, and the reliability of the product is further improved. The built-in optical fiber refers to an optical fiber arranged in the groove. Specifically, in the present embodiment, the bottom of the groove 11 can also be designed as a minor arc and a major arc, and the diameter of the semicircular arc can be selected to be 0.1 to 0.2 mm larger than the diameter of the built-in optical fiber. The groove 11 is symmetrical about the symmetry axis of the substrate body 1, and the semicircular arc is tangent to two side surfaces of the groove 11; the tangential arc transition between the groove 11 with the semicircular arc shape at the bottom and the two side surfaces of the groove 11 further reduces the stress concentration in the processing process, reduces the edge damage rate in the cold processing process and realizes the improvement of the product reliability. Both side surfaces of the groove 11 are perpendicular to the bottom of the substrate body 1. The groove width of the protection area 15 is smaller than the groove width of the first dispensing area 14 and the groove width of the second dispensing area 16. The groove depth of the protective area 15 is smaller than the groove depth of the first dispensing area 14 and the groove depth of the second dispensing area 16; the height difference is designed between the dispensing area and the protection area, so that the flowing glue solution can be stopped, and more accurate control of the dispensing amount is facilitated. The end face, the cylindrical surface, the plane of the substrate body 1 and the inner surface of the groove of the protective area 15 are all subjected to surface smoothing treatment. The surface smoothing process includes polishing or lapping.

While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A substrate preparation method applied to an optical device is characterized by comprising the following steps:

2. The method of claim 1, wherein the step of fabricating a preform from a selected quartz rod according to product design requirements, the preform having a flat bottom surface, comprises the steps of:

3. The method as claimed in claim 1, wherein the step of bonding the aligned and combined substrate strips into a block by using a pre-paraffin mixture comprises the following steps:

4. The method as claimed in claim 1, wherein the step of cutting the block blank into a slab according to the finished size and dissolving each end face of the slab with the first solution comprises the following steps:

5. A method as claimed in claim 4, wherein the first solution comprises acetone or de-waxing water.

6. The method for preparing a substrate for an optical device according to claim 1 or 4, wherein the step of performing the de-waxing and cleaning treatment on the slab after performing the matte treatment on each end face of the slab after the dissolving by using the second solution comprises the following steps:

7. The method as claimed in claim 6, wherein the de-waxing process comprises at least one of physical de-waxing, ultrasonic de-waxing and chemical de-waxing.

8. A method as claimed in claim 6, wherein the cleaning process comprises ultrasonic cleaning or chemical cleaning.

9. The method as claimed in claim 1, wherein the special equipment comprises a flame polishing machine, and the step of performing fire polishing on each end surface of the slab subjected to the wax removal and cleaning treatment on the special equipment to obtain a finished substrate product comprises the following steps:

10. A substrate for optical devices, wherein the substrate is manufactured by the manufacturing method of any one of claims 1 to 9.