CN111901962B - Double-layer high-strength flexible circuit board with inner reinforcing mechanism - Google Patents
Double-layer high-strength flexible circuit board with inner reinforcing mechanism Download PDFInfo
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- CN111901962B CN111901962B CN202010866889.7A CN202010866889A CN111901962B CN 111901962 B CN111901962 B CN 111901962B CN 202010866889 A CN202010866889 A CN 202010866889A CN 111901962 B CN111901962 B CN 111901962B
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- circuit board
- plate
- heat
- heat conduction
- reinforcing plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of circuit boards, in particular to a double-layer high-strength flexible circuit board with an internal reinforcing mechanism, which comprises a circuit board, a reinforcing plate and a heat dissipation structure, wherein the circuit board is bonded on the outer side of the reinforcing plate through a bonding agent, the reinforcing plate and the circuit board are fixedly connected on two sides of the heat dissipation structure through positioning screws, the heat dissipation structure comprises a heat conduction plate, a plurality of heat conduction columns which are uniformly distributed are convexly arranged on the outer sides of two ends of the heat conduction plate, the heat conduction columns penetrate through the reinforcing plate to be connected with the circuit board, and support columns are welded between the heat conduction plates, so that the double-layer high-strength flexible circuit board with the internal reinforcing mechanism has the beneficial effects that: can increase reinforcement structure and heat radiation structure between double-deck flexible line way board, can increase flexible line way board's intensity and toughness through the reinforcement structure, increase the guard effect, heat radiation structure can increase the radiating effect between the circuit board, prevents that the circuit board from receiving high temperature to influence the result of use to the guard line board does not receive high temperature damage, and heat radiation structure also can play the effect of increase circuit board intensity.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a double-layer high-strength flexible circuit board with an internal reinforcing mechanism.
Background
A Flexible Printed Circuit (FPC) is a highly reliable and excellent Flexible Printed Circuit board made of polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. The double-layer flexible circuit board is used in combination.
Because electronic components are required to be installed on both sides of the double-layer flexible circuit board when the double-layer flexible circuit board is used, the double-layer flexible circuit board cannot increase the strength and toughness of the circuit board by adding the reinforcing plate on the back surface like a single-layer circuit board, only the reinforcing structure can be added from the inner side of the double-layer circuit board, however, the addition of the reinforcing structure from the inner layer will result in the reduction of the air permeability and heat dissipation effect of the circuit boards at both sides, which will result in the failure of reasonable heat dissipation during the use of the circuit boards and the influence of high temperature on the use effect of the circuit boards, in addition, the existing double-layer flexible circuit board cannot be effectively positioned when the reinforcing structure is added, which may cause the flexible circuit board to slide on two sides of the reinforcing structure to influence the use effect, and the strength of the flexible circuit board can not be guaranteed, and the flexible circuit board can be broken, therefore, the invention provides a double-layer high-strength flexible circuit board with an internal reinforcing mechanism for solving the problems.
Disclosure of Invention
The present invention is directed to a dual-layer high-strength flexible printed circuit board with an internal reinforcement mechanism, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a double-deck high strength flexible printed circuit of in-band reinforcement mechanism, includes circuit board, stiffening plate and heat radiation structure, its characterized in that: the circuit board is bonded on the outer side of the reinforcing plate through a bonding agent, the reinforcing plate and the circuit board are fixedly connected on two sides of a heat dissipation structure through positioning screws, the heat dissipation structure comprises a heat conduction plate, a plurality of heat conduction columns which are uniformly distributed are convexly arranged on the outer sides of two ends of the heat conduction plate, the heat conduction columns penetrate through the reinforcing plate to be connected with the circuit board, support columns are welded between the heat conduction plates and are supported and fixed through support columns, a plurality of radiating fins which are uniformly distributed are integrally formed in the middle of the heat conduction plate, the circuit board comprises plastic on one side, a plurality of reinforcing ribs which are uniformly distributed are embedded and connected in the plastic, the reinforcing ribs are supported by glass fibers and are distributed in the plastic in a net shape, conductor circuits are embedded and connected on the outer side of the plastic, the outer side of the conductor circuits is coated with insulating films, the insulating films are bonded on the outer side of the plastic, and the outer side of the insulating films are coated with wear-resistant coatings, the circuit board is provided with a positioning hole and a heat conducting hole, a positioning screw is connected in the positioning hole, the circuit board is positioned and fixed on the outer side of the reinforcing plate through the positioning screw, and a heat conducting column is inserted in the heat conducting hole;
the reinforcing plate comprises a stainless steel plate body, a convex plate is welded on the outer side of the stainless steel plate body, a wavy convex surface is integrally formed on the convex plate, an adhesive is coated on the upper end of the convex surface, a circuit board is bonded on the outer side through the adhesive, holes corresponding to positioning holes and heat conducting holes in the circuit board are formed in the reinforcing plate and fixed through positioning screws, heat conducting columns penetrate through the reinforcing plate to be connected with the circuit board, the circuit board and the reinforcing plate are divided into an upper layer and a lower layer, the two layers of the circuit board and the reinforcing plate are symmetrically distributed along a heat radiating structure, the heat radiating structure comprises two heat conducting plates, supporting columns are welded at four corners between the two heat conducting plates at two sides, a plurality of radiating fins which are uniformly distributed are integrally formed between the heat conducting plates at the inner sides of the supporting columns, radiating grease is coated on two sides of the radiating fins, and threaded grooves corresponding to the positioning screws on the circuit board are formed in the heat conducting plates, the positioning screw penetrates through the circuit board and the reinforcing plate and is connected to the heat conducting plate in a threaded mode, and the circuit board and the reinforcing plate are positioned and fixed.
Compared with the prior art, the invention has the beneficial effects that:
the reinforcing structure and the heat dissipation structure can be added between the double-layer flexible circuit boards, the strength and the toughness of the flexible circuit boards can be increased through the reinforcing structure, the protection effect is improved, the heat dissipation structure can increase the heat dissipation effect between the circuit boards, the circuit boards are prevented from being influenced by high temperature, the circuit boards are protected from being damaged by high temperature, the heat dissipation structure can also play a role in increasing the strength of the circuit boards, the reinforcing mechanism is also added in the flexible circuit board body, the strength and the toughness of the circuit boards can be effectively increased, the circuit boards are ensured not to be broken, and the service life of the circuit boards is prolonged.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of FIG. 1;
fig. 3 is an enlarged schematic view of the structure at a in fig. 1.
In the figure: the heat-conducting plate comprises a circuit board 1, an adhesive 2, a reinforcing plate 3, a heat-conducting plate 4, support columns 5, heat radiating fins 6, heat-conducting columns 7, positioning screws 8, plastic 9, reinforcing ribs 10, conductor lines 11, an insulating film 12, a wear-resistant coating 13, a stainless steel plate 14 and a convex surface layer 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a double-deck high strength flexible printed circuit of in-band reinforcement mechanism, including circuit board 1, stiffening plate 3 and heat radiation structure, circuit board 1 bonds in the 3 outsides of stiffening plate through adhesive 2, stiffening plate 3 and circuit board 1 pass through 8 fixed connection in heat radiation structure both sides of set screw, heat radiation structure includes heat-conducting plate 4, the protrusion in the 4 both ends outsides of heat-conducting plate is equipped with a plurality of evenly distributed's heat conduction post 7, heat conduction post 7 passes stiffening plate 3 and connects circuit board 1, welding support post 5 between the heat-conducting plate 4, it is fixed to support through support post 5, the integrative fin 6 that is equipped with a plurality of evenly distributed that takes shape in the middle of heat-conducting plate 4.
The invention can be further set that the circuit board 1 comprises plastic 9 on one side, the outer side of the plastic 9 is embedded with a conductor circuit 11, the outer side of the conductor circuit 11 is coated with an insulating film 12, the insulating film 12 is adhered to the outer side of the plastic 9, the outer side of the insulating film 12 and the outer side of the plastic 9 are coated with wear-resistant coatings 13, a positioning hole and a heat conduction hole are formed in the circuit board 1, a positioning screw 8 is connected in the positioning hole, the circuit board 1 is fixedly positioned on the outer side of the reinforcing plate 3 by the positioning screw 8, the heat conduction column 7 is inserted in the heat conduction hole, and the transverse and longitudinal tensile forces of the circuit board 1 can be effectively increased through the reinforcing ribs 10 which are distributed in the plastic 9 in a latticed manner, so that the toughness of the circuit board 1 can be effectively increased, the use effect or damage of the circuit board 1 is prevented from being influenced by breakage, and the service life of the circuit board 1 is prolonged.
The invention can be further arranged in such a way that a plurality of reinforcing ribs 10 which are uniformly distributed are embedded and connected in the plastic 9, the reinforcing ribs 10 are supported by glass fiber, and the reinforcing ribs 10 are distributed in the plastic 9 in a net shape.
The invention can be further set that the reinforcing plate 3 comprises a main stainless steel plate 14, a convex panel 15 is welded on the outer side of the stainless steel plate 14, a wavy convex surface is integrally formed on the convex panel 15, the upper end of the convex surface is coated with an adhesive 2, the circuit board 1 is adhered on the outer side through the adhesive 2, holes corresponding to the positioning holes and the heat conducting holes on the circuit board 1 are formed in the reinforcing plate 3 and are fixed through positioning screws 8, the heat conducting columns 7 penetrate through the reinforcing plate 3 to be connected with the circuit board 1, the connecting surface with the adhesive 2 can be increased through the convex panel 15, the connection tightness is improved, the circuit board 1 is more conveniently adhered on the reinforcing plate 3, the use convenience is improved, the circuit board 1 can be positioned through the positioning screws 8, the stability of the circuit board 1 is ensured, and the circuit board is prevented from falling off or sliding, and the use effect is influenced.
The invention can be further arranged that the circuit board 1 and the reinforcing plate 3 are divided into an upper layer and a lower layer, the two layers of circuit board 1 and the reinforcing plate 3 are symmetrically distributed along a heat dissipation structure, the heat dissipation structure comprises heat conduction plates 4 at two sides, support columns 5 are welded at four corners between the heat conduction plates 4 at two sides, a plurality of uniformly distributed radiating fins 6 are integrally formed between the heat conduction plates 4 at the inner sides of the support columns 5, radiating grease is coated at two sides of the radiating fins 6, a thread groove corresponding to a positioning screw 8 on the circuit board 1 is arranged on the heat conduction plate 4, the positioning screw 8 penetrates through the circuit board 1 and the reinforcing plate 3 to be connected on the heat conduction plate 4 in a threaded manner to position and fix the circuit board 1 and the reinforcing plate 3, the heat dissipation effect of the circuit board 1 can be greatly increased through the heat dissipation structure, and the heat radiation structure can play the secondary reinforcement effect, further increases the intensity and the toughness of circuit board 1, improves the result of use, increases circuit board 1's life.
The working principle is as follows: during operation, when double-deck flexible line way board switch on power supply was used, inboard side bonding stiffening plate 3 of circuit board 1, can effectively increase the intensity and the toughness of circuit board 1 through stiffening plate 3, improve the result of use and the life of circuit board 1, circuit board 1 sends out the heat in the use, the heat conducts to the inboard side fixed connection's of stiffening plate 3 in heat-conducting plate 4 through heat conduction post 7, again from heat-conducting plate 4 diffusion to fin 6, and give off from fin 6, can effectively increase the radiating effect of circuit board 1, prevent that high temperature from influencing circuit board 1 and using, damage circuit board 1 even, increase the protection effect to circuit board 1 and prolong its life, through heat-conducting plate 4, fin 6 and heat conduction post 7 can further increase the reinforcement effect, increase the reinforcement effect to circuit board 1, and improve the result of use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. The utility model provides a double-deck high strength flexible printed circuit of in-band reinforcement mechanism, includes circuit board (1), stiffening plate (3) and heat radiation structure, its characterized in that: the circuit board (1) is bonded outside the reinforcing plate (3) through a bonding agent (2), the reinforcing plate (3) and the circuit board (1) are fixedly connected to two sides of a heat dissipation structure through positioning screws (8), the heat dissipation structure comprises a heat conduction plate (4), heat conduction columns (7) which are distributed uniformly are arranged on the outer sides of two ends of the heat conduction plate (4) in a protruding mode, the heat conduction columns (7) penetrate through the reinforcing plate (3) to be connected with the circuit board (1), support columns (5) are welded between the heat conduction plates (4) and are supported and fixed through the support columns (5), radiating fins (6) which are distributed uniformly are integrally formed in the middle of the heat conduction plate (4), the circuit board (1) comprises plastic (9) on one side, reinforcing ribs (10) which are distributed uniformly are embedded and connected inside the plastic (9), and the reinforcing ribs (10) are supported by glass fibers, the reinforcing ribs (10) are distributed in the plastic (9) in a net shape, the outer side of the plastic (9) is embedded with and connected with the conductor circuit (11), the outer side of the conductor circuit (11) is coated with an insulating film (12), the insulating film (12) is adhered to the outer side of the plastic (9), the outer side of the insulating film (12) and the outer side of the plastic (9) are coated with wear-resistant coatings (13), the circuit board (1) is provided with positioning holes and heat conducting holes, the positioning holes are internally connected with positioning screws (8), the circuit board (1) is positioned and fixed on the outer side of the reinforcing plate (3) by the positioning screws (8), and the heat conducting columns (7) are inserted in the heat conducting holes;
reinforcing plate (3) are including main part corrosion resistant plate (14), corrosion resistant plate (14) outside welding convex plate (15), integrative taking shape's being equipped with is the protruding face of wave on convex plate (15), protruding face upper end is scribbled and is established adhesive (2) to through adhesive (2) outside bonding circuit board (1), set up on reinforcing plate (3) and go up the hole that locating hole and heat conduction hole correspond with circuit board (1) to it is fixed through set screw (8), heat conduction post (7) pass reinforcing plate (3) connecting line board (1), circuit board (1) and reinforcing plate (3) divide into two-layer from top to bottom, and heat radiation structure symmetric distribution is followed in two-layer circuit board (1) and reinforcing plate (3), heat radiation structure includes both sides heat-conducting plate (4), both sides four corners welding support column (5) between heat-conducting plate (4), integrative taking shape is equipped with a plurality of evenly distributed between heat-conducting plate (4) of support column (5) inboard The radiating fin (6), the heat dissipation fat is scribbled to radiating fin (6) both sides, set up the thread groove that corresponds with set screw (8) on circuit board (1) on heat-conducting plate (4), set screw (8) pass circuit board (1) and stiffening plate (3) threaded connection on heat-conducting plate (4), fix a position circuit board (1) and stiffening plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010866889.7A CN111901962B (en) | 2020-08-26 | 2020-08-26 | Double-layer high-strength flexible circuit board with inner reinforcing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010866889.7A CN111901962B (en) | 2020-08-26 | 2020-08-26 | Double-layer high-strength flexible circuit board with inner reinforcing mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111901962A CN111901962A (en) | 2020-11-06 |
| CN111901962B true CN111901962B (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010866889.7A Active CN111901962B (en) | 2020-08-26 | 2020-08-26 | Double-layer high-strength flexible circuit board with inner reinforcing mechanism |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113414998A (en) * | 2021-07-12 | 2021-09-21 | 重庆泛锐科技有限公司 | High-strength heat-insulation composite board and preparation method thereof |
| CN114823582B (en) * | 2022-07-01 | 2022-11-01 | 开平依利安达电子有限公司 | Packaging structure of chip heat dissipation part of multilayer printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210381456U (en) * | 2019-08-05 | 2020-04-21 | 深圳市科晟电子有限公司 | Flexible circuit board with novel reinforcement structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204206606U (en) * | 2014-12-05 | 2015-03-11 | 深圳市普能达电子有限公司 | A kind of reinforced flexible circuit board |
| CN208258166U (en) * | 2018-05-12 | 2018-12-18 | 深圳顺易捷科技有限公司 | A kind of novel flexible circuit board |
| CN208480048U (en) * | 2018-08-08 | 2019-02-05 | 昆山度边电子科技有限公司 | A kind of flexible circuit board reinforcement steel disc |
| CN209593876U (en) * | 2018-10-22 | 2019-11-05 | 佛山市顺德区铭昆电子科技有限公司 | A kind of flexible printed-circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210381456U (en) * | 2019-08-05 | 2020-04-21 | 深圳市科晟电子有限公司 | Flexible circuit board with novel reinforcement structure |
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