CN213462455U - Low-impedance multilayer circuit board - Google Patents
Low-impedance multilayer circuit board Download PDFInfo
- Publication number
- CN213462455U CN213462455U CN202022661692.8U CN202022661692U CN213462455U CN 213462455 U CN213462455 U CN 213462455U CN 202022661692 U CN202022661692 U CN 202022661692U CN 213462455 U CN213462455 U CN 213462455U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- inner layer
- welding
- low impedance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a low impedance multilayer circuit board, including the circuit board body, the circuit board body includes component layer, welding layer and intermediate level, the intermediate level includes first inlayer, second inlayer, first inlayer is located between component layer, the second inlayer is located between first inlayer and the welding layer, be equipped with the base plate on the surface that the welding layer deviates from the second inlayer, be equipped with the attaching plate on the base plate, the outside of welding layer, base plate and intermediate level is equipped with the frame layer, be equipped with the heat conduction post on the surface of frame layer, all be equipped with spacing piece on the both sides side of attaching plate; the outer frame layer that the plastic material was made encloses in the outside of circuit board panel, avoids circuit board panel and external contact, has slowed down the ageing degree of circuit board body and has reduced the degree of weing of circuit board body, avoids tin cladding material and performance on the circuit board body to receive the influence, and then leads to the impedance too high, influences the performance of circuit board.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to low impedance multilayer circuit board.
Background
The manufacture method of the multilayer circuit board is generally that the inner layer pattern is firstly made, then the single-sided or double-sided substrate is made by printing and etching method and is put into the appointed interlayer, and then the multilayer circuit board is manufactured by heating, pressurizing and bonding; the multilayer circuit board has the advantages of high assembly density, small volume, light weight and high assembly density, and the connecting lines among the components (including components) of the multilayer circuit board are reduced, so that the reliability is improved.
When the existing multilayer circuit board is used, the problems that a substrate of the multilayer circuit board is in contact with the outside, the substrate is interfered by the outside, and the aging degree and the moisture degree of a base material are high exist, so that a low-impedance multilayer circuit board is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low impedance multilayer circuit board to the base plate and the external world contact of the multilayer circuit board that proposes in solving above-mentioned background art, the base plate receives external disturbance, the ageing degree of substrate and the high problem of degree of weing.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a low impedance multilayer circuit board, includes the circuit board body, the circuit board body includes component layer, welding layer and intermediate level, the intermediate level includes first inlayer, second inlayer, first inlayer is located between component layer, the second inlayer is located between first inlayer and the welding layer, the welding layer deviates from the second inlayer be equipped with the base plate on the surface, be equipped with the attaching plate on the base plate, the outside of welding layer, base plate and intermediate level is equipped with the frame layer, the frame layer be equipped with the heat conduction post on the surface, all be equipped with spacing piece on the both sides avris of attaching plate.
Preferably, the element layer and the welding layer are both metal aluminum base copper clad laminates.
Preferably, the first inner layer is made of a ceramic material and the second inner layer is made of an epoxy resin material.
Preferably, adjacent two layers of the element layer, the first inner layer, the second inner layer and the welding layer are connected in an adhering mode through prepregs.
Preferably, the outer frame layer is of a mouth-shaped structure, the outer frame layer is bonded to the outer sides of the element layer, the first inner layer, the second inner layer, the welding layer and the substrate through epoxy resin, and the outer frame layer is made of plastic materials.
Preferably, round holes are formed in the surfaces, opposite to each other, of the outer frame layers, the round holes are filled with the heat conduction columns, and the heat conduction columns are made of graphite materials.
Preferably, the rectangular cavity has been seted up to the inside of base plate, the rigging board is located the rectangular cavity, the spacing groove of "L" type structure has all been seted up to the position that is close to the centre on base plate both sides avris, spacing piece and spacing groove cooperation, base plate, rigging board and spacing piece are made by glass fiber material.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through the base plate that sets up, rigging board, frame layer, the frame layer that the plastic material was made encloses in the outside of circuit board panel, avoids circuit board panel and external contact, has slowed down the ageing degree of circuit board body and has reduced the degree of weing of circuit board body, avoids tin cladding material and performance on the circuit board body to receive the influence, and then leads to the impedance too high, influences the performance of circuit board.
2. Through frame layer, the heat conduction post that sets up, the heat conduction post is made by graphite material, and the heat conductivity of heat conduction post is high, has improved the heat conductivility of circuit board body.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of the outer frame layer of the present invention;
fig. 3 is a schematic bottom view of the base plate of the present invention;
in the figure: 1. a circuit board body; 2. an element layer; 3. a first inner layer; 4. a second inner layer; 5. welding the layers; 6. a substrate; 7. attaching a plate; 8. an outer frame layer; 9. a heat-conducting column; 10. a limiting sheet; 11. a limiting groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: a low-impedance multilayer circuit board comprises a circuit board body 1, wherein the circuit board body 1 comprises an element layer 2, a welding layer 5 and an intermediate layer, the intermediate layer comprises a first inner layer 3 and a second inner layer 4, the first inner layer 3 is positioned between the element layer 2 and the second inner layer 4, the second inner layer 4 is positioned between the first inner layer 3 and the welding layer 5, the element layer 2 and the welding layer 5 are respectively a metal aluminum-based copper-clad plate, the first inner layer 3 is made of ceramic materials, the second inner layer 4 is made of epoxy resin materials, the adjacent two layers of the element layer 2, the first inner layer 3, the second inner layer 4 and the welding layer 5 are respectively connected through prepreg bonding, a substrate 6 is arranged on the surface of the welding layer 5, which is far away from the second inner layer 4, an attaching plate 7 is arranged on the substrate 6, an outer frame layer 8 is arranged on the outer side of the welding layer 5, the substrate 6 and the intermediate layer, heat conducting columns 9 are arranged on the surface of the outer frame 8, limiting plates 10 are arranged, the outer frame layer 8 made of plastic materials is bonded on the outer sides of the four sides of the circuit board body 1, the element layer 2, the first inner layer 3, the second inner layer 4, the welding layer 5 and the substrate 6 on the circuit board body 1 are prevented from contacting with the outside, the aging degree of the circuit board body 1 is slowed down, the moisture degree of the circuit board body 1 is reduced, tin coating substances and performance on the circuit board body 1 are prevented from being influenced, and further the impedance is too high, and the performance of the circuit board is influenced.
In this embodiment, frame layer 8 is "mouth" type structure, frame layer 8 bonds at component layer 2 through epoxy, first inlayer 3, second inlayer 4, the outside of welding layer 5 and base plate 6, frame layer 8 is made by plastic material, frame layer 8 closely laminates at component layer 2, first inlayer 3, second inlayer 4, the outside of welding layer 5 and base plate 6, avoid component layer 2, first inlayer 3, second inlayer 4, welding layer 5 and base plate 6 and external contact, slow down ageing degree and the degree of weing of circuit board body 1.
In this embodiment, the round hole has been seted up on the surface that frame layer 8 carried on the back mutually, and heat conduction post 9 is filled in the round hole, and heat conduction post 9 is made by graphite material, and heat conductivity of heat conduction post 9 is high, has improved circuit board body 1's heat conductivility.
In this embodiment, the rectangular cavity has been seted up to the inside of base plate 6, rigging board 7 is located the rectangular cavity, the spacing groove 11 of "L" type structure has all been seted up to the position that is close to the centre on the avris of base plate 6 both sides, spacing piece 10 and spacing groove 11 cooperation, base plate 6, rigging board 7 and spacing piece 10 are made by glass fiber material, spacing piece 10 embedding base plate 6 on the rigging board 7 is inside, rigging board 7 is inseparable with the laminating of base plate 6, rigging board 7 passes through the adhesive with base plate 6 and bonds inseparably, avoid component layer 2 of circuit board body 1, first inlayer 3, second inlayer 4, welded layer 5 and base plate 6 and external contact.
The utility model discloses a theory of operation and use flow:
the substrate 6 made of glass fiber materials is arranged on the welding layer 5 of the circuit board body 1, the attaching plate 7 is clamped and connected on the substrate 6, the outer frame layer 8 made of plastic materials is bonded on the outer sides of the four sides of the circuit board body 1, the element layer 2, the first inner layer 3, the second inner layer 4, the welding layer 5 and the substrate 6 on the circuit board body 1 are prevented from contacting with the outside, the aging degree of the circuit board body 1 is slowed down, the moisture degree of the circuit board body 1 is reduced, and the tin coating substances and performances on the circuit board body 1 are prevented from being influenced, so that the impedance is too high and the performances of the circuit board are influenced;
the frame layer 8 is packed on the surface that carries on the back mutually has heat conduction post 9, and heat conduction post 9 is made by graphite material, and heat conduction post 9's heat conductivity is high, has improved circuit board body 1's heat conductivility.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A low impedance multilayer circuit board, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises an element layer (2), a welding layer (5) and an intermediate layer, the intermediate layer comprises a first inner layer (3) and a second inner layer (4), the first inner layer (3) is located between the element layer (2) and the second inner layer (4), the second inner layer (4) is located between the first inner layer (3) and the welding layer (5), the welding layer (5) deviates from the second inner layer (4), a substrate (6) is arranged on the surface of the welding layer (5), a jointing plate (7) is arranged on the substrate (6), outer sides of the welding layer (5), the substrate (6) and the intermediate layer are provided with an outer frame layer (8), heat conducting columns (9) are arranged on the surface of the outer frame layer (8), and limiting pieces (10) are arranged on lateral sides of the jointing plate (7).
2. The low impedance multilayer wiring board of claim 1, wherein: the element layer (2) and the welding layer (5) are all metal aluminum base copper clad plates.
3. The low impedance multilayer wiring board of claim 1, wherein: the first inner layer (3) is made of a ceramic material and the second inner layer (4) is made of an epoxy resin material.
4. The low impedance multilayer wiring board of claim 1, wherein: and adjacent two layers of the element layer (2), the first inner layer (3), the second inner layer (4) and the welding layer (5) are connected through prepreg bonding.
5. The low impedance multilayer wiring board of claim 1, wherein: the outer frame layer (8) is of a mouth-shaped structure, the outer frame layer (8) is bonded to the outer sides of the element layer (2), the first inner layer (3), the second inner layer (4), the welding layer (5) and the substrate (6) through epoxy resin, and the outer frame layer (8) is made of plastic materials.
6. The low impedance multilayer wiring board of claim 1, wherein: round holes are formed in the surfaces, back to back, of the outer frame layers (8), the heat conduction columns (9) are filled in the round holes, and the heat conduction columns (9) are made of graphite materials.
7. The low impedance multilayer wiring board of claim 1, wherein: the rectangle chamber has been seted up to the inside of base plate (6), binding plate (7) are located the rectangle intracavity, spacing groove (11) of "L" type structure are all seted up to the position that is close to the centre on base plate (6) both sides avris, spacing piece (10) and spacing groove (11) cooperation, base plate (6), binding plate (7) and spacing piece (10) are made by glass fiber material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022661692.8U CN213462455U (en) | 2020-11-17 | 2020-11-17 | Low-impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022661692.8U CN213462455U (en) | 2020-11-17 | 2020-11-17 | Low-impedance multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213462455U true CN213462455U (en) | 2021-06-15 |
Family
ID=76302359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022661692.8U Active CN213462455U (en) | 2020-11-17 | 2020-11-17 | Low-impedance multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213462455U (en) |
-
2020
- 2020-11-17 CN CN202022661692.8U patent/CN213462455U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103491706B (en) | The manufacture method of high heat conduction printed circuit board and printed circuit board | |
| CN211047454U (en) | Printed circuit board | |
| CN213462455U (en) | Low-impedance multilayer circuit board | |
| CN113825306A (en) | Circuit board and preparation method thereof | |
| CN206402513U (en) | A kind of rigid-flex combined board of flexible region with reinforcement | |
| CN214046155U (en) | Copper-clad plate based on spraying integrated structure | |
| CN210351782U (en) | PTFE high frequency thoughtlessly presses PCB circuit board | |
| CN211942401U (en) | Low-dielectric-constant double-sided flexible copper-clad plate | |
| CN211531432U (en) | Double-sided copper-clad plate | |
| CN214101918U (en) | Multilayer circuit board capable of interconnecting inner layers | |
| CN214046156U (en) | Copper-clad plate with die-casting forming structure | |
| CN218103640U (en) | Wear-resistant multilayer press-fit PCB printed circuit board | |
| CN214774488U (en) | Copper-clad plate with high thermal conductivity | |
| CN219761437U (en) | Optical communication encapsulation alumina ceramic multilayer substrate | |
| CN214507463U (en) | High-temperature-resistant composite PCB | |
| CN214101913U (en) | High-performance copper-clad plate adopting polytetrafluoroethylene filled film composite glass cloth | |
| CN219107758U (en) | Low-thickness aluminum-based copper-clad laminate | |
| CN211184408U (en) | Double-sided copper-clad plate with good heat dissipation performance | |
| CN214901450U (en) | Microwave multi-layer board structure | |
| CN214046144U (en) | High temperature resistant polyimide multilayer circuit board | |
| CN217293794U (en) | Copper-clad plate with clamping structure | |
| CN215268872U (en) | Aluminum-based printed circuit board with filling | |
| CN219395121U (en) | Double-sided PCB circuit board with anti-warping structure | |
| CN219287815U (en) | High-strength double-layer aluminum substrate | |
| CN219248149U (en) | Module ceramic copper-clad plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |