CN111889326A - Image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and encapsulating method - Google Patents
Image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and encapsulating method Download PDFInfo
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- CN111889326A CN111889326A CN202010493271.0A CN202010493271A CN111889326A CN 111889326 A CN111889326 A CN 111889326A CN 202010493271 A CN202010493271 A CN 202010493271A CN 111889326 A CN111889326 A CN 111889326A
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- power supply
- multiplying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/007—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0272—After-treatment with ovens
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
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Abstract
The invention discloses an image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and an encapsulating method, belongs to the technical field of low-light-level image intensifier high-voltage power supplies, and provides an image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and an encapsulating method, which are used for solving the problems of test discharge of a high-voltage power supply multiplying assembly, low troubleshooting efficiency and damage to the power supply voltage-multiplying assembly due to discharge; the technical scheme is as follows: the encapsulation method comprises the following steps of firstly, assembling an electronic element and a lead on a PCB by using an electric iron to obtain a complete voltage-multiplying circuit PCB, secondly, immersing the voltage-multiplying circuit PCB into a hydrophilic agent, taking out the voltage-multiplying circuit PCB, placing the voltage-multiplying circuit PCB for 20min, inserting the voltage-multiplying circuit PCB along a circuit board fixing groove in an encapsulation shell, thirdly, fixing the encapsulation shell filled with the voltage-multiplying circuit PCB in a clamp, encapsulating by using potting adhesive, after the encapsulation shell is filled, vacuumizing and exhausting the encapsulation shell by using a vacuum pump, and after the exhausting is finished, filling the potting adhesive, and putting the encapsulation adhesive into an oven for standing.
Description
Technical Field
The invention discloses an image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device, an encapsulating method and a clamp, belongs to the technical field of low-light-level image intensifier high-voltage power supplies, and particularly relates to an image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and an encapsulating method.
Background
The output of the high-voltage power supply voltage-multiplying module of the image intensifier can reach several kilovolts, and the high-voltage power supply is easy to discharge during power-on test. When testing, the voltage doubling module needs to be completely immersed in insulating oil.
When the power circuit board enters the shell, the bending angle of the voltage doubling module area is large, and the welding disc is easy to fall off or the circuit board is easy to break.
During filling and sealing, the affinity agent needs to be coated on the high-voltage multiplication part circuit, so that the affinity of the insulating adhesive is improved, and the surface creepage of the voltage-multiplying component is avoided. And putting the circuit board coated with the affinity agent into a shell, adding a potting clamp, then injecting the exhausted potting glue into the shell, and putting the clamp into a vacuum pump to vacuumize and exhaust. And after exhausting, supplementing the pouring sealant, putting the fixture into an oven for standing, and curing the pouring sealant.
The prior art has the following disadvantages:
1. the insulating oil used in the test is high in cost and volatile, and is harmful to health after being inhaled by a human body;
2. the voltage doubling assembly consists of dispersed elements, and if faults occur, only one voltage doubling assembly can be checked and maintained one by one, so that the efficiency is low;
3. the existing product can only be immersed in insulating oil for power-on test, if a fault occurs, a universal meter, a probe and the like cannot be used for direct test, and the existing product can only be taken out for power-off maintenance, so that the troubleshooting effect is poor, and the rejection rate is high;
4. the existing shell entering mode can increase the risks of PCB board fracture and pad falling;
5. the relative positions of the voltage-multiplying component and the power supply shell are not accurately positioned in the existing shell entering process, so that the voltage-multiplying component is easily spaced too close to other circuits, and the discharging damage is easily caused;
6. the distance between the existing voltage doubling component and a power supply shell is too close after the existing voltage doubling component is placed into the shell, an affinity agent is not easy to coat, and further the surface creepage of the voltage doubling component is caused by poor affinity of an insulating adhesive; the affinity agent is easily applied to the power supply case to cause embrittlement of the power supply case.
Disclosure of Invention
The invention overcomes the defects of the prior art, provides an image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and an encapsulating method, and solves the problems of low testing discharge and fault troubleshooting efficiency of a high-voltage power supply voltage-multiplying component and damage to the power supply voltage-multiplying component due to discharge.
In order to solve the technical problems, the invention adopts the technical scheme that: an image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device comprises an encapsulating shell and a clamp;
the encapsulation shell is an arc-shaped cavity shell with an opening at one side end, a circuit board fixing groove for fixing a circuit board is formed in the inner bottom surface of the encapsulation shell, and a lead hole for leading out a power supply output line is formed in one end of the top surface of the encapsulation shell;
the anchor clamps include the screw thread metal post of two clamp bodies of fixed connection that set up side by side, and two clamp bodies are the cuboid structure, and a plurality of screw thread metal posts are one end body coupling on one of them clamp body and the other end runs through another clamp body and through nut fastening fixed, all are equipped with the curved slotted hole of a plurality of correspondences on two clamp bodies, and its slotted hole formation chamber that corresponds matches with embedment casing appearance when two clamp bodies combine to fix, the slotted hole lower extreme seals and the upper end is uncovered, and embedment casing inlays the dress and forms the intracavity and its opening end up at the corresponding slotted hole of two clamp bodies.
The encapsulation shell is integrally formed by PPO materials.
An image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating method is characterized by comprising the following operation steps:
firstly, assembling an electronic element and a lead on a PCB (printed Circuit Board) by using an electric iron to obtain a complete voltage doubling circuit PCB;
secondly, immersing the welded voltage-multiplying circuit PCB into a blending agent, taking out and placing for 15-25min, and then inserting along a circuit board fixing groove in the encapsulation shell;
and thirdly, fixedly inserting a potting shell filled with the voltage-multiplying circuit PCB into corresponding slotted hole forming cavities of two clamps arranged in parallel to enable the open ends of the potting shells to be upward, fastening and fixing the potting shells by matching threaded metal columns with nuts, using potting adhesive for potting, putting the potting shell into a vacuum pump for vacuumizing and exhausting after the potting shell is filled, and filling the potting adhesive into an oven for standing after the exhausting is finished.
Compared with the prior art, the invention has the following beneficial effects:
1. by adopting the encapsulating clamp and the encapsulating method, insulating oil is not needed during testing, so that the testing cost is reduced, and the influence on the health of testing personnel is also reduced;
2. the voltage-multiplying component is modularized, so that the voltage-multiplying component is convenient to check when a circuit fails, the voltage-multiplying module can be integrally replaced when in maintenance, the maintenance efficiency is high, the power supply can be directly subjected to power-on test due to the modularization of the voltage-multiplying component, a universal meter, a probe and the like can be used for direct test when a fault occurs, the checking effect is good, and the power supply is not easy to damage;
3. when the circuit board is placed in the shell, the modularized voltage-multiplying component is used, the circuit board does not need to be bent at a large angle, and the risk of damage to the circuit board is reduced;
4. after the voltage doubling module is arranged in the shell, the problem of discharge caused by too close distance between the original voltage doubling component and other circuits can be solved;
5. when the voltage doubling module is encapsulated, the whole PCB can be immersed in the affinity agent, so that the affinity agent is coated more uniformly, the affinity of the insulating glue and the PCB is ensured, and the surface creepage of the voltage doubling component is avoided;
6. after the voltage doubling module is used, the affinity agent is not required to be coated during encapsulation of the power supply, and the damage of the affinity agent to the power supply shell is eliminated.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings;
fig. 1 is a schematic structural view of an encapsulation shell of an image intensifier high-voltage power supply voltage-multiplying module integrated encapsulation device of the invention;
fig. 2 is a schematic structural view of a clamp of the integrated encapsulating device of the image intensifier high-voltage power supply voltage doubling module of the invention;
fig. 3 is a schematic view of a clamp unfolding-state planar structure of the integrated encapsulating device for the image intensifier high-voltage power supply voltage doubling module according to the invention;
FIG. 4 is a schematic front view of a voltage doubling module according to the present invention;
FIG. 5 is a schematic diagram of the back side of the voltage doubling module according to the present invention;
in the figure: the packaging structure comprises a filling and sealing shell 1, a clamp body 2, a threaded metal column 3, a circuit board fixing groove 5, a lead hole 6, a slotted hole 7, an electronic element 8, a lead wire 9, a PCB (printed circuit board) 10 and a bonding pad 11.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, the integrated encapsulating device for the image intensifier high-voltage power supply voltage-multiplying module comprises an encapsulating shell 1 and a clamp;
the encapsulation shell 1 is an arc-shaped cavity shell with an opening at one side end, a circuit board fixing groove 5 for fixing a circuit board is arranged on the inner bottom surface of the encapsulation shell 1, and a lead hole 6 for leading out a power supply output line is formed in one end of the top surface of the encapsulation shell 1;
the anchor clamps include the screw thread metal post 3 of two clamp bodies 2 and two clamp bodies of fixed connection that set up side by side, and two clamp bodies 2 are the cuboid structure, and a plurality of screw thread metal posts 3 are one end body coupling on one of them clamp body 2 and the other end runs through another clamp body 2 and through the nut fastening fixed, all are equipped with a plurality of curved slotted holes 7 that correspond on two clamp bodies 2, and its slotted hole 7 that correspond forms the chamber and matches with 1 appearance of embedment casing when two clamp bodies 2 combine to fix, slotted hole 7 lower extreme seals and the upper end is uncovered, and embedment casing 1 inlays the dress and forms the intracavity and its opening end up at two clamp body 2's the slotted hole 7 that corresponds.
The encapsulation shell 1 is integrally formed by PPO materials.
The clamp body 2 is used for fixing the encapsulating shell 1 and preventing the encapsulating shell 1 from being broken by volume change when the encapsulating glue is solidified. Two clamp bodies 2 are fixed through 4 cooperation nuts of screw thread metal column, can embedment a plurality of voltage doubling modules simultaneously.
An image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating method is characterized by comprising the following operation steps:
firstly, assembling an electronic element 8 and a lead 9 on a PCB (printed Circuit Board) 10 by using an electric iron to obtain a complete voltage-multiplying circuit PCB;
secondly, immersing the welded voltage-multiplying circuit PCB into a blending agent, taking out and placing for 15-25min, and then inserting along a circuit board fixing groove 5 in the encapsulation shell 1;
and thirdly, fixedly inserting the encapsulation shell 1 filled with the voltage-multiplying circuit PCB into a cavity formed by corresponding slotted holes 7 of two clamp bodies 2 arranged in parallel to enable the open end of the encapsulation shell to face upwards, fastening and fixing the encapsulation shell by a threaded metal column 3 and a nut, encapsulating by using pouring sealant, vacuumizing and exhausting the encapsulation shell 1 by a vacuum pump after the encapsulation shell 1 is filled, and filling the encapsulation sealant and placing the encapsulation shell in an oven for standing after the exhausting is finished.
As shown in fig. 4-5, the voltage doubling module is composed of an electronic component 8, a PCB 10 and a lead 9, the PCB 10 used is a separate and small PCB, and the part is encapsulated separately to form a separate module with a pad 11 and an output lead 9, and then the separate module is soldered to a main circuit board to form a high voltage power supply for the image intensifier. The electronic component 8 and the lead 9 are soldered to a PCB board 10 by soldering, two pads 11 are left at one end of the PCB board 10, and the pads 11 are located outside the potting housing 1 during potting. Meanwhile, the PCB 10 is also provided with an output lead which is led out from the lead hole 6 of the encapsulating shell 1 during encapsulation and is used for high-voltage output.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (3)
1. The utility model provides an integrated embedment device of image intensifier high voltage power supply voltage doubling module which characterized in that: comprises an encapsulating shell (1) and a clamp;
the encapsulation shell (1) is an arc-shaped cavity shell with an opening at one side end, a circuit board fixing groove (5) for fixing a circuit board is formed in the inner bottom surface of the encapsulation shell (1), and a lead hole (6) for leading out a power supply output line is formed in one end of the top surface of the encapsulation shell (1);
the utility model discloses a clamp, including anchor clamps, a plurality of clamp bodies (2) are fixed, and the clamp is characterized in that anchor clamps include two clamp bodies (2) that set up side by side and the screw thread metal post (3) of two clamp bodies of fixed connection, and two clamp bodies (2) are the cuboid structure, and a plurality of screw thread metal posts (3) are one end body coupling on one of them clamp body (2) and the other end runs through another clamp body (2) and through the nut fastening fixed, all are equipped with curved slotted hole (7) of a plurality of correspondences on two clamp bodies (2), and slotted hole (7) formation chamber that two clamp bodies (2) correspond when combining fixed matches with embedment casing (1) appearance, slotted hole (7) lower extreme seals and the upper end is uncovered, and embedment casing (1) inlays the dress and forms intracavity and its opening end up in corresponding slotted hole.
2. The integrated encapsulating device of the image intensifier high-voltage power supply voltage doubling module according to claim 1, wherein: the encapsulating shell (1) is integrally formed by PPO materials.
3. The integrated encapsulating method for the image intensifier high-voltage power supply voltage doubling module according to claim 1, characterized by comprising the following operation steps:
firstly, assembling an electronic element (8) and a lead (9) on a PCB (10) by using an electric iron to obtain a complete voltage-multiplying circuit PCB;
secondly, immersing the welded voltage-multiplying circuit PCB into a blending agent, taking out and placing for 15-25min, and then inserting along a circuit board fixing groove (5) in the encapsulation shell (1);
and thirdly, fixedly inserting the encapsulating shell (1) filled with the voltage-multiplying circuit PCB into a cavity formed by corresponding slotted holes (7) of two clamp bodies (2) arranged in parallel to enable the open end of the encapsulating shell to be upward, fastening and fixing the encapsulating shell by matching a threaded metal column (3) with a nut, encapsulating by using encapsulating glue, putting the encapsulating shell (1) into a vacuum pump to vacuumize and exhaust after the encapsulating shell (1) is filled, and filling the encapsulating glue into an oven to stand after the exhaust is finished.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010493271.0A CN111889326A (en) | 2020-06-03 | 2020-06-03 | Image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and encapsulating method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010493271.0A CN111889326A (en) | 2020-06-03 | 2020-06-03 | Image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and encapsulating method |
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| CN111889326A true CN111889326A (en) | 2020-11-06 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008264606A (en) * | 2007-04-16 | 2008-11-06 | Toray Eng Co Ltd | Coating device |
| CN204673881U (en) * | 2015-04-24 | 2015-09-30 | 沈阳兴华航空电器有限责任公司 | A kind of connector embedding clamp of turning parts into the whole |
| CN204958894U (en) * | 2015-08-15 | 2016-01-13 | 济南齐鲁医学检验有限公司 | A test tube rocks observes frame for genetic test |
| CN207616449U (en) * | 2017-12-20 | 2018-07-17 | 京信通信系统（中国）有限公司 | A kind of antenna mounting plate sealing tooling |
| CN110944463A (en) * | 2019-12-10 | 2020-03-31 | 安徽华东光电技术研究所有限公司 | Manufacturing method of grid-control gun power supply cathode voltage doubling module |
| CN111063557A (en) * | 2019-12-31 | 2020-04-24 | 铜陵市启动电子制造有限责任公司 | Thin-film capacitor encapsulating device and encapsulating process |
-
2020
- 2020-06-03 CN CN202010493271.0A patent/CN111889326A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008264606A (en) * | 2007-04-16 | 2008-11-06 | Toray Eng Co Ltd | Coating device |
| CN204673881U (en) * | 2015-04-24 | 2015-09-30 | 沈阳兴华航空电器有限责任公司 | A kind of connector embedding clamp of turning parts into the whole |
| CN204958894U (en) * | 2015-08-15 | 2016-01-13 | 济南齐鲁医学检验有限公司 | A test tube rocks observes frame for genetic test |
| CN207616449U (en) * | 2017-12-20 | 2018-07-17 | 京信通信系统（中国）有限公司 | A kind of antenna mounting plate sealing tooling |
| CN110944463A (en) * | 2019-12-10 | 2020-03-31 | 安徽华东光电技术研究所有限公司 | Manufacturing method of grid-control gun power supply cathode voltage doubling module |
| CN111063557A (en) * | 2019-12-31 | 2020-04-24 | 铜陵市启动电子制造有限责任公司 | Thin-film capacitor encapsulating device and encapsulating process |
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Application publication date: 20201106 |