CN111885755A - Wafer heating device with zone heating function, multi-station glue dispenser and wafer heating method - Google Patents
Wafer heating device with zone heating function, multi-station glue dispenser and wafer heating method Download PDFInfo
- Publication number
- CN111885755A CN111885755A CN202010694765.5A CN202010694765A CN111885755A CN 111885755 A CN111885755 A CN 111885755A CN 202010694765 A CN202010694765 A CN 202010694765A CN 111885755 A CN111885755 A CN 111885755A
- Authority
- CN
- China
- Prior art keywords
- heating
- wafer
- zone
- temperature
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer heating device for zone heating, a multi-station glue dispenser and a wafer heating method, wherein the wafer heating device for zone heating comprises: the heating device comprises a heating support table, a heating pipe, a heating plate, at least two thermocouples and a temperature controller, wherein a heating cavity is limited in the heating support table; the heating pipe extends into the heating cavity to heat; the heating plate is attached to the heating support platform and is positioned above the heating support platform, the upper surface of the heating plate forms a heating surface, the heating plate receives the heat of the heating pipe and transmits the heat to the wafer through the heating surface, and at least two heating zones are arranged on the heating plate; the at least two thermocouples are respectively arranged in the at least two heating zones to detect the temperature of each heating zone; the temperature controller is connected with the heating pipe and the thermocouple, and controls the heating pipe to heat according to the temperature detected by the thermocouple. The wafer heating device and the wafer heating method for zone heating have the advantages that the wafer is heated uniformly, and the heating process is stable.
Description
Technical Field
The invention belongs to the technical field of dispensing, and particularly relates to a wafer heating device capable of heating in a partitioned mode, a multi-station dispenser with the wafer heating device and a wafer heating method.
Background
With the continuous progress of science and technology, the demand of the market for semiconductors is continuously increasing, wafers are the basic materials for manufacturing semiconductor chips, the dispensing technology of wafers is the most important key technology in the advanced electronic manufacturing industry, and the dispensing technology is widely applied to chip packaging and integrated circuit equipment, and aims to reduce the failure probability of elements caused by cold and heat changes, falling, vibration and other factors in the use process of products, so as to prolong the service life of the products. Therefore, the dispensing technology is used as the key and core of the electronic packaging technology, and the improvement of the technical level is directly related to the quality of the packaging technology. The glue dispenser is used as a novel automatic device and mainly has the function of dripping glue to a corresponding position through a preset path in a specific mode.
In the dispensing process of the wafer, the temperature of the wafer needs to reach the preset temperature and is easy to burst when the temperature is lower than the preset temperature, so that the wafer heating device has a crucial influence on the dispensing process. However, the existing wafer heating device is easy to generate temperature difference, which causes the problems of poor dispensing effect, low product yield and the like. Therefore, the temperature detection and control of the wafer heating device need to be further perfected, so that the dispensing result is effectively ensured.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art.
Therefore, the invention provides a wafer heating device with zone heating, which has the advantage of enabling the wafer to be heated uniformly.
The invention also provides a multi-station glue dispenser which has the advantages of uniform wafer heating, higher glue dispensing efficiency and better finished product effect.
The invention also provides a wafer heating method which has the advantages of simple and easy control steps, good control effect, high accuracy and the like.
According to the embodiment of the first aspect of the invention, the wafer heating device with zone heating comprises: the heating support platform is internally provided with a heating cavity; the heating pipe extends into the heating cavity to heat; the heating plate is attached to the heating support platform and located above the heating support platform, a heating surface is formed on the upper surface of the heating plate, the heating plate receives heat of the heating pipe and transmits the heat to the wafer through the heating surface, and at least two heating zones are arranged on the heating plate; the at least two thermocouples are respectively arranged in the at least two heating zones to detect the temperature of each heating zone; and the temperature controller is connected with the heating pipe and the thermocouple and controls the heating pipe to heat according to the temperature detected by the thermocouple.
According to the wafer heating device with the zone heating function, the heating support table, the heating pipe, the heating plate, the at least two thermocouples and the temperature controller are combined, the zone control of the wafer heating device can be achieved, wafers are heated uniformly, the dispensing efficiency is high, and the finished product effect is good.
According to one embodiment of the present invention, the heating plate is formed in a circular shape, and the heating plate is uniformly divided into three heating zones along a circumferential direction thereof, and each heating zone is provided with one thermocouple.
According to an embodiment of the invention, the center of the heating plate is also provided with the thermocouple, and the thermocouple is used for detecting the temperature of the center of the heating plate.
According to one embodiment of the invention, the temperature controllers send alarm information when the temperature difference detected by the two thermocouples is greater than a preset value.
According to one embodiment of the invention, the temperature controller controls the heating pipe to be continuously heated for a preset time when the temperature difference detected by the two thermocouples is greater than a preset value, and after the preset time, the temperature difference of the two thermocouples is still greater than the preset value, and then alarm information is sent.
According to one embodiment of the invention, the preset value is 3 ℃ and the predetermined time is 5 min.
The multi-station dispenser according to the second aspect of the invention comprises the wafer heating device with zone heating described in any one of the above embodiments.
According to the wafer heating method of the third aspect embodiment of the invention, the method comprises the following steps: s1, placing the wafer on a wafer heating device for heating, wherein the wafer heating device is provided with at least two heating zones; s2, respectively detecting the temperature of each heating area in the heating process, judging whether the temperature difference between any two heating areas is larger than a preset value, if so, executing the step S3, and if not, continuing heating; s3, sending first alarm information, and meanwhile, continuing to heat the wafer; and S4, after heating for a preset time, judging whether the temperature difference between any two heating areas is still larger than the preset value, if so, sending second alarm information, stopping heating, and if not, continuing heating.
According to one embodiment of the invention, the number of the heating zones is three, and each heating zone is provided with a thermocouple for detecting temperature.
According to one embodiment of the invention, the preset value is 3 ℃ and the predetermined time is 5 min.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a zone heating wafer heating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a heating tube of a zone heating wafer heating apparatus according to an embodiment of the present invention;
fig. 3 is a flowchart of a wafer heating method of the zone heating wafer heating apparatus according to an embodiment of the present invention.
Reference numerals:
a wafer heating device 210 for zone heating;
a heat generating support table 250;
a heating pipe 252; a heating plate 257; a thermocouple 258.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The zone heating wafer heating apparatus 210 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 3, a zone heating wafer heating apparatus 210 according to an embodiment of the present invention includes: a heat generating support table 250, a heating pipe 252, a heating plate 257, at least two thermocouples 258 and a temperature controller.
Specifically, it has the heating chamber to inject in the brace table 250 generates heat, heating pipe 252 stretches into the heating chamber in order to heat, heating plate 257 laminates in the brace table that generates heat and is located the top of the brace table that generates heat, the upper surface of heating plate 257 forms the heating surface, heating plate 257 receives the heat of heating pipe 252 and transmits for the wafer by the heating surface, be equipped with two at least heating zones on the heating plate 257, at least two thermocouples 258 establish respectively in two at least heating zones in order to detect the temperature in every heating zone, the temperature controller links to each other with heating pipe 252 and thermocouple 258, the temperature controller heats according to the temperature control heating pipe 252 that thermocouple 258.
In other words, the zone heating wafer heating apparatus 210 according to the embodiment of the present invention mainly comprises a heat-generating support table 250, a heat pipe 252, a heating plate 257, at least two thermocouples 258, and a temperature controller. Wherein, the inside at the brace table 250 that generates heat is equipped with the heating chamber, is equipped with the heating pipe 252 that is used for providing the heat for the wafer in the heating chamber, and heating pipe 252 bending type. A heating plate 257 is arranged above the heating cavity, the upper surface of the heating plate 257 is a heating surface, and the heating surface can transfer heat provided by the heating pipe 252 to the wafer, so that the wafer is heated. At least two heating zones can be divided on the heating plate 257, and at least two thermocouples 258 are respectively arranged in the at least two heating zones to detect the temperature of each heating zone. The wafer heating device 210 with zone heating is further provided with a temperature controller, the temperature controller is installed on the rack and can be connected with the heating pipe 252 and the thermocouple 258, temperature information obtained by detection of the thermocouple 258 can be fed back to the temperature controller, and therefore the temperature controller can control the heating state of the heating pipe 252 according to the feedback condition.
Therefore, according to the wafer heating device 210 with zone heating provided by the embodiment of the invention, the heating support table 250, the heating pipe 252, the heating plate 257, the at least two thermocouples 258 and the temperature controller are combined, so that zone control over the wafer heating device 210 can be realized, zone control over the temperature of the wafer is realized, the wafer is uniformly heated, the dispensing efficiency is higher, and the finished product effect is better.
According to an embodiment of the present invention, the heating plate 257 is formed in a circular shape, and the heating plate 257 is uniformly divided into three heating zones along a circumferential direction thereof, each heating zone being provided with one thermocouple 258. That is, in order to match the wafer shape, the heating plate 257 may be designed to be circular, and the heating plate 257 is equally divided into three fan-shaped heating zones, each heating zone has a thermocouple 258 for feeding back the temperature thereof, the three thermocouples 258 may be set to work separately without affecting each other, so that the separate control of the temperature zones may be realized.
In some embodiments of the present invention, a thermocouple 258 is further disposed at the center of the heating plate 257, and the thermocouple 258 is used to detect the temperature at the center of the heating plate 257. By providing the thermocouple 258 at the center of the heating plate 257, the temperature at the center of the heating plate 257 can be detected, and the temperature at the center of the heating plate 257 can be fed back to the temperature controller by the thermocouple 258.
Optionally, the thermostat sends an alarm message when the temperature difference detected by the two thermocouples 258 is greater than a preset value. The temperature data of the above-mentioned three zone of heating and the temperature data at center are read through the temperature controller, and when four group's data maximums differed with the minimum and were greater than the default, the temperature controller can send alarm information, in time reminds staff to notice, prevents to cause the damage to the wafer.
Preferably, the temperature controller controls the heating pipe 252 to continuously heat for a predetermined time when the temperature difference detected by the two thermocouples 258 is greater than a preset value, and after the predetermined time, the temperature difference of the two thermocouples 258 is still greater than the preset value, and then an alarm message is sent. That is, when the temperature difference detected by the temperature controller is greater than the predetermined value, the heating pipe 252 is controlled to heat the wafer within the predetermined time until the temperature difference is less than the predetermined value, and the alarm is not stopped. If the preset time is exceeded, the wafer does not reach the preset temperature, and the temperature difference is still greater than the preset value, the temperature controller can remind a worker to check or replace the heating pipe 252.
According to one embodiment of the invention, the preset value is 3 ℃ and the predetermined time is 5 min. That is, if the maximum temperature difference between the temperature values fed back by the thermocouples 258 in the three heating zones and the center exceeds 3 ℃, the temperature controller will send out alarm information. At this time, the heating pipe 252 will start to heat to make the temperature difference less than 3 ℃, if the maximum temperature difference still exceeds 3 ℃ after heating for 5min, the temperature controller will send out an alarm to remind the operator to replace the heating pipe 252.
The multi-station glue dispenser according to the embodiment of the invention is provided with the wafer heating device 210 with the zone heating function according to any one of the embodiments, and the technical effects are achieved, so that the multi-station glue dispenser according to the embodiment of the invention also has the corresponding technical effects, so that wafers are uniformly heated, the glue dispensing efficiency is higher, and the finished product effect is better.
Other structures and operations of the multi-station dispenser according to the embodiments of the present invention will be understood and readily implemented by those skilled in the art, and thus will not be described in detail.
As shown in fig. 3, the wafer heating method according to the embodiment of the invention includes the following steps: s1, placing the wafer on the wafer heating device 210 for heating, wherein the wafer heating device 210 is provided with at least two heating zones; s2, respectively detecting the temperature of each heating area in the heating process, judging whether the temperature difference between any two heating areas is larger than a preset value, if so, executing the step S3, and if not, continuing heating; s3, sending first alarm information, and meanwhile, continuing to heat the wafer; and S4, after heating for a preset time, judging whether the temperature difference between any two heating areas is still larger than a preset value, if so, sending second alarm information, stopping heating, and if not, continuing heating. The heating method can realize the heating of the wafer, and has uniform heating, slow heating process and no burst of the wafer due to uneven temperature rise.
According to one embodiment of the present invention, there are three heating zones, each provided with a thermocouple 258 for detecting temperature. The heating plate 257 is equally divided into three sector heating zones, each heating zone is provided with a thermocouple 258 for feeding back the temperature, and the three thermocouples 258 work respectively and do not influence each other.
In some embodiments of the invention, the preset value is 3 ℃ and the predetermined time is 5 min. If the maximum temperature difference of the temperature values fed back by the thermocouples 258 in the three heating zones and the center exceeds 3 ℃, the temperature controller can send alarm information. At this time, the heating pipe 252 will start to heat to make the temperature difference less than 3 ℃, if the maximum temperature difference still exceeds 3 ℃ after heating for 5min, the temperature controller will send out an alarm to remind the operator to replace the heating pipe 252.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A zoned-heating wafer heating apparatus, comprising:
the heating support platform is internally provided with a heating cavity;
the heating pipe extends into the heating cavity to heat;
the heating plate is attached to the heating support platform and located above the heating support platform, a heating surface is formed on the upper surface of the heating plate, the heating plate receives heat of the heating pipe and transmits the heat to the wafer through the heating surface, and at least two heating zones are arranged on the heating plate;
the at least two thermocouples are respectively arranged in the at least two heating zones to detect the temperature of each heating zone;
and the temperature controller is connected with the heating pipe and the thermocouple and controls the heating pipe to heat according to the temperature detected by the thermocouple.
2. The zone-heating wafer heating apparatus according to claim 1, wherein the heating plate is formed in a circular shape, and the heating plate is uniformly divided into three heating zones along a circumferential direction thereof, and each heating zone is provided with one thermocouple.
3. The zone heated wafer heating apparatus of claim 2, wherein the center of the heating plate is further provided with a thermocouple for detecting the temperature at the center of the heating plate.
4. The zone-heating wafer heating apparatus according to claim 1, wherein the temperature controller sends an alarm message when the temperature difference detected by the two thermocouples is greater than a preset value.
5. The zone-heating wafer heating apparatus according to claim 4, wherein the temperature controller controls the heating tube to continuously heat for a predetermined time when the temperature difference detected by the two thermocouples is greater than a predetermined value, and after the predetermined time, the temperature difference between the two thermocouples is still greater than the predetermined value, and then an alarm message is sent.
6. The zone-heating wafer heating apparatus of claim 5, wherein the preset value is 3 ℃ and the predetermined time is 5 min.
7. A multi-station dispenser, characterized in that, comprises the zone heating wafer heating device of any one of claims 1-6.
8. A method of heating a wafer, comprising the steps of:
s1, placing the wafer on a wafer heating device for heating, wherein the wafer heating device is provided with at least two heating zones;
s2, respectively detecting the temperature of each heating area in the heating process, judging whether the temperature difference between any two heating areas is larger than a preset value, if so, executing the step S3, and if not, continuing heating;
s3, sending first alarm information, and meanwhile, continuing to heat the wafer;
and S4, after heating for a preset time, judging whether the temperature difference between any two heating areas is still larger than the preset value, if so, sending second alarm information, stopping heating, and if not, continuing heating.
9. The method of claim 8, wherein there are three heating zones, and each heating zone is provided with a thermocouple for detecting temperature.
10. The method according to claim 8, wherein the preset value is 3 ℃ and the predetermined time is 5 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010694765.5A CN111885755A (en) | 2020-07-17 | 2020-07-17 | Wafer heating device with zone heating function, multi-station glue dispenser and wafer heating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010694765.5A CN111885755A (en) | 2020-07-17 | 2020-07-17 | Wafer heating device with zone heating function, multi-station glue dispenser and wafer heating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111885755A true CN111885755A (en) | 2020-11-03 |
Family
ID=73156195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010694765.5A Pending CN111885755A (en) | 2020-07-17 | 2020-07-17 | Wafer heating device with zone heating function, multi-station glue dispenser and wafer heating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111885755A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490148A (en) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Heating device, heating method and semiconductor process equipment |
| CN112563169A (en) * | 2020-12-11 | 2021-03-26 | 无锡邑文电子科技有限公司 | Hot plate device for removing photoresist by plasma dry method and using method thereof |
| CN113838780A (en) * | 2021-09-18 | 2021-12-24 | 上海芯源微企业发展有限公司 | Wafer partition heating device and control method |
| CN117393474A (en) * | 2023-12-11 | 2024-01-12 | 上海谙邦半导体设备有限公司 | Wafer multizone heating device |
-
2020
- 2020-07-17 CN CN202010694765.5A patent/CN111885755A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490148A (en) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Heating device, heating method and semiconductor process equipment |
| CN112490148B (en) * | 2020-11-13 | 2024-03-26 | 北京北方华创微电子装备有限公司 | Heating device, heating method and semiconductor process equipment |
| CN112563169A (en) * | 2020-12-11 | 2021-03-26 | 无锡邑文电子科技有限公司 | Hot plate device for removing photoresist by plasma dry method and using method thereof |
| CN112563169B (en) * | 2020-12-11 | 2022-02-11 | 无锡邑文电子科技有限公司 | Hot plate device for removing photoresist by plasma dry method and using method thereof |
| CN113838780A (en) * | 2021-09-18 | 2021-12-24 | 上海芯源微企业发展有限公司 | Wafer partition heating device and control method |
| CN117393474A (en) * | 2023-12-11 | 2024-01-12 | 上海谙邦半导体设备有限公司 | Wafer multizone heating device |
| CN117393474B (en) * | 2023-12-11 | 2024-02-13 | 上海谙邦半导体设备有限公司 | Wafer multizone heating device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111885755A (en) | Wafer heating device with zone heating function, multi-station glue dispenser and wafer heating method | |
| JP2001044176A (en) | Treatment apparatus and temperature control therefor | |
| US5435378A (en) | Apparatus for accurately heating and cooling articles | |
| US8952297B2 (en) | Reaction apparatus for processing wafer, electrostatic chuck and wafer temperature control method | |
| CN212381419U (en) | Wafer heating device with zone heating function and multi-station glue dispenser | |
| CN110191526A (en) | Induction heating apparatus, induction heating equipment, induction heating method and heat treatment method | |
| CN107464856A (en) | Heterogeneous solar cells made of crystalline silicon piece low temperature series welding method and system | |
| EP4224517A1 (en) | Temperature rate of change control apparatus and method, and semiconductor process device | |
| CN211770927U (en) | Glass bottle rapid annealing furnace | |
| CN212370488U (en) | Wafer operation platform and have its point gum machine | |
| CN111889310B (en) | Dispensing machine and dispensing method thereof | |
| TW201325355A (en) | Apparatus and control method for automatic increasing tin | |
| CN110039787A (en) | 3D printer temperature control system and 3D printer | |
| CN213245032U (en) | Glue dispenser | |
| CN212750843U (en) | Wafer heating device with partition adsorption and multi-station glue dispenser with same | |
| CN213103038U (en) | Height-adjustable wafer heating device and multi-station glue dispenser with same | |
| CN218286246U (en) | A supply liquid jar, supply liquid subassembly and wire cut electrical discharge machining for wire cut electrical discharge machining | |
| KR20150076196A (en) | Molded glass body manufacturing method, and molded glass body manufacturing device | |
| JP3979764B2 (en) | Substrate heat treatment equipment | |
| KR20040003885A (en) | Temperature detecting device of a diffusion furnace | |
| CN101570847B (en) | Nitriding device | |
| CN113828477A (en) | Wafer operation platform and have its point gum machine | |
| CN213287476U (en) | Wafer preheating mechanism and multi-station glue dispenser with same | |
| WO2017161949A1 (en) | Water drinking device and water outlet detection method thereof | |
| CN213315983U (en) | Wafer heating device and multi-station glue dispenser with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |