CN111867324B - Heat radiation structure suitable for spacecraft high-power device - Google Patents
Heat radiation structure suitable for spacecraft high-power device Download PDFInfo
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- CN111867324B CN111867324B CN202010623249.3A CN202010623249A CN111867324B CN 111867324 B CN111867324 B CN 111867324B CN 202010623249 A CN202010623249 A CN 202010623249A CN 111867324 B CN111867324 B CN 111867324B
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- power device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
- H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
Abstract
The invention relates to a heat radiation structure suitable for a spacecraft high-power device, which comprises an installation pressing block, an elastic sponge body, heat conduction fillers, an insulating ceramic piece, an insulating sleeve and an installation plate, wherein the installation plate and the installation pressing block are main heat radiation structures; the fastener is isolated from the single-lug high-power device metal shell by using a T-shaped insulating sleeve; an elastic sponge body is filled between the installation pressing block and the device to provide uniform pressing force for the device installation surface. The invention does not need to draw a large-area heat conduction path and provide an active thermal control measure, can inhibit the temperature rise of a single-ear high-power device by more than 23 percent, can realize the insulation and voltage resistance of more than 10kV, and can be widely applied to the insulation, heat dissipation and installation of a spacecraft high-power device.
Description
Technical Field
The invention relates to a heat radiation structure suitable for a spacecraft high-power device, which can be widely applied to heat radiation installation and insulation installation of a single-lug high-power device in an aerospace electronic product, so that the single-lug high-power device not only meets the requirement of insulation installation, but also can withstand the harsh thermal shock test environment, and the single-lug high-power device does not have temperature failure such as over-high junction temperature and the like.
Background
The high-power device is a common electronic switch component in aerospace electronic products, and needs to be insulated and mounted in order to prevent short circuit damage to a command bus caused by short circuit of the high-power device; meanwhile, in order to meet the requirement of the thermal environment condition of the spacecraft, the junction temperature of the high-power device in the thermal environment cannot exceed the I-level derating temperature, so that the high-power device needs a good thermal shock resistant installation environment when being installed.
Because the on-orbit operation of the spacecraft is in a vacuum environment and convection heat dissipation cannot be carried out, the heat of the spacecraft can be transmitted to the cryogenic outer space from the inner part of the product to the mounting surface and the outer surface of the product through the heat of the device in a general product thermal design idea and in a mode of mainly using a heat conduction mode and assisting radiation heat dissipation. In order to save precious on-orbit energy, a high-power device in a general product does not adopt an active thermal control measure, but adopts a passive thermal control measure instead. With the rapid development of the in-orbit application technology of products, the in-orbit application heat consumption of devices is larger and higher, and the power density of the devices is higher and higher, so that the requirement on the reliability of the thermal environment for the application and installation of the devices is higher and higher. The heat consumption of the conventional power device is not more than 1.5W generally, and the corresponding heat flux density is only 3W/cm 2 Along with the change of the on-orbit application working condition of a product, a single-lug installation device with the heat consumption of 9.2W of a single device appears in a certain product, and the heat flow density of the single-lug installation device is up to 18.4W/cm 2 。
Part of traditional high-power devices are directly installed on the printed board, so that the devices are conveniently installed in an insulating mode, however, due to the fact that the normal heat transfer coefficient of the printed board is low, heat accumulation is prone to occurring in the thermal shock process, junction temperature is greatly increased when the devices work, the service life of the high-power devices is shortened, and reliability of products is reduced.
The high-power device is directly mounted on the structure, so that although the heat conduction distance between the device and the heat dissipation surface is theoretically reduced, the contact thermal resistance between the device and the heat dissipation surface is increased due to rigid mounting, and meanwhile, extra measures are required to be taken to perform insulating mounting on the high-power device.
The mounting method of the power device disclosed at present has the following defects: (1) By adopting the heat dissipation installation design of the power device in the traditional passive heat transfer mode, although the heat dissipation effect can be increased on the common power device, the heat dissipation problem of the high-power device cannot be solved (the heat difference is that the power density is greater than that of the high-power device)3W/cm 2 Time); (2) Because the area of the mounting surface of the power device is large and the roughness distribution is uneven (for example, the roughness of the mounting surface is more than 6.3 mu m), the traditional mounting method can not solve the problem that the heat distribution of the mounting surface of the power device is unbalanced (for example, part of the mounting surface is not actually contacted with a heat dissipation surface due to uneven stress of the mounting surface), and is not beneficial to the design improvement of the thermal reliability of the device; (3) The insulation protection effect on the high-power device cannot be achieved by the method.
Disclosure of Invention
The technical problem solved by the invention is as follows: the defects in the prior art are overcome, the radiating structure suitable for the spacecraft high-power device is provided, the insulating installation of the high-power device can be met, and the working temperature of the high-power device can be reduced.
The technical scheme of the invention is as follows:
a heat dissipation structure suitable for a spacecraft high-power device is characterized by comprising a mounting pressing block, an elastic sponge body, an insulating sleeve, a first heat conduction filler, an insulating ceramic sheet, a second heat conduction filler and a mounting plate,
the mounting plate is a main mounting structure of a single-lug high-power device, an insulating ceramic plate is placed on the mounting plate, heat-conducting fillers are uniformly coated between the insulating ceramic plate and the mounting plate,
the single-lug high-power device is placed on the insulating ceramic chip, heat-conducting fillers are uniformly coated between the insulating ceramic chip and the high-power device, the insulating sleeve is installed in an installation hole of the single-lug high-power device, a first fastening screw penetrates through the installation plate, the insulating ceramic chip, the single-lug high-power device and the insulating sleeve, a flat washer and a spring washer are sequentially installed on the insulating sleeve, finally, a nut is screwed into the first fastening screw, and the nut is screwed tightly to complete the insulating heat-dissipation installation of the single-lug high-power device;
and adhering at least one layer of elastic sponge body between the mounting pressing block and the single-lug high-power device, and enabling a second fastening screw to respectively pass through the mounting plate and the mounting pressing block to finish the pressing and mounting of the single-lug high-power device.
Furthermore, the tensile strength of the first fastening screw is larger than 800Mpa.
Furthermore, the breakdown strength of the insulating ceramic sheet is more than or equal to 230kV/mm.
Further, the thickness of the elastic sponge body is 0.25mm or 0.38mm.
Further, the yield strength of the mounting plate is higher than 260MPa.
Furthermore, the working voltage VDS of the single-ear high-power device is more than or equal to 200V, and the current ID is more than or equal to 33.0A.
Furthermore, the tensile strength of the insulating sleeve is more than or equal to 110MPa, and the breakdown strength is more than or equal to 100kV/mm.
Furthermore, the surface vulcanization time of the heat-conducting filler is 10-70 min. The breaking strength is more than or equal to 3.9MPa, and the elongation is more than or equal to 300 percent
Furthermore, the breaking strength of the heat-conducting filler is more than or equal to 3.9MPa.
Furthermore, the elongation of the heat-conducting filler is more than or equal to 300 percent.
Compared with the prior art, the invention has the beneficial effects that:
(1) The invention adopts a pressing installation mode of normal bidirectional clamping of a single-lug installation device, so that the installation surface of the high-power device is uniformly stressed and has no local warpage, and the problem gradient of the installation surface is reduced to be within 1.5 ℃;
(2) The invention selects the mounting surface heat transfer material with high heat conductivity, reduces the heat transfer resistance, can effectively inhibit the temperature rise of the device by combining the bidirectional clamping and pressing mounting, and has the average temperature rise reduction amplitude reaching 23 percent through the test;
(3) The invention selects the insulating material with high breakdown strength, improves the insulating and voltage-resistant capability, and the insulating and voltage-resistant performance of the metal shell of the device can reach more than 10 kV;
(4) The invention can reduce the temperature rise of the single-ear power device in rated operation, effectively meet the I-level derating temperature requirement, and have larger safe operating temperature margin compared with the traditional installation mode;
(5) The invention can be widely applied to heat dissipation installation and insulation installation of high-power devices in aerospace electronic products, so that the high-power devices not only meet the requirement of insulation installation, but also can withstand the harsh thermal impact test environment, and the high-power devices do not have temperature failure such as over-high junction temperature and the like.
Drawings
FIG. 1 is a perspective view of the present invention;
fig. 2 is a cross-sectional view of the present invention.
Detailed Description
The present invention is described in further detail below with reference to the attached drawings.
A heat dissipation structure suitable for a spacecraft high-power device comprises a mounting pressing block 1, an elastic sponge body 2, an insulating sleeve 7, a first heat conduction filler 8, an insulating ceramic sheet 9, a second heat conduction filler 10 and a mounting plate 12 as shown in figures 1 and 2,
the mounting plate 12 is the main mounting structure of the single-lug high-power device, the insulating ceramic plate 9 is placed on the mounting plate 12, the heat conducting filler 10 is evenly coated between the insulating ceramic plate 9 and the mounting plate 12,
the single-lug high-power device is placed on an insulating ceramic plate 9, heat-conducting fillers 8 are uniformly coated between the insulating ceramic plate 9 and the high-power device, an insulating sleeve 7 is installed in an installation hole of the single-lug high-power device, a first fastening screw 3 penetrates through an installation plate 12, the insulating ceramic plate 9, the single-lug high-power device and the insulating sleeve 7, a plain washer 6 and a spring washer 5 are sequentially installed on the insulating sleeve 7, finally a nut 4 is screwed into the first fastening screw 3, and the nut 4 is screwed tightly to complete the insulating heat-radiating installation of the single-lug high-power device;
at least one layer of elastic sponge body 2 is adhered between the mounting pressing block 1 and the single-lug high-power device, and the second fastening screws 11 respectively penetrate through the mounting plate 12 and the mounting pressing block 1 to finish the pressing mounting of the single-lug high-power device.
The mounting plate 12 is made of aluminum alloy, the metal structure plate has the characteristics of light weight, high ultimate strength and easiness in processing, the mark is 2A12H112, the yield strength is higher than 260Mpa, the heat conductivity coefficient is 117 ℃/W, and the supporting protection and heat dissipation mounting of a single-lug high-power device can be realized.
The single-lug high-power device is a TO254 or TO257 packaging device with a single mounting lug, can realize the functions of power on-off, magnetic reset, rectification and follow current, and has the working voltage VDS not less than 200V, the current ID not less than 33.0A and the highest power consumption up TO 12.9W according TO the related derating coefficient.
The T-shaped insulating sleeve 7 is a polyimide rod, normal insulating protection of a single-lug high-power device is realized, the tensile strength is greater than or equal to 110MPa, and the breakdown strength is greater than or equal to 100kV/mm.
The heat-conducting filler 8 is single-component room-temperature vulcanized silicone rubber, the material is the grade GD414, and the surface vulcanization time of the material is as follows: (10-70) min, the tensile strength at break is more than or equal to 3.9MPa, the elongation is more than or equal to 300 percent, the heat transfer characteristic is good, the contact surface filling rate is high, and the heat dissipation protection of a high-power device can be realized.
The first fastening screw 3, the nut 4, the spring washer 5 and the flat washer 6 are fastening components, the first fastening screw 3 of the main force bearing part is made of A2-70 stainless steel, the tensile strength is greater than 800Mpa, and reliable fastening and installation of a single-lug high-power device can be realized.
The insulating ceramic sheet material is aluminum nitride, the thickness is 1mm, the size is consistent with the size of the installation surface of the single-lug high-power device, the heat conductivity coefficient is 183 ℃/W, the breakdown strength is more than or equal to 230kV/mm, and the insulating protection and heat dissipation installation design of the single-lug high-power device in the parallel direction is realized.
The mounting pressing block 1 provides normal support for the single-lug high-power device, and the normal support is consistent with the material performance of the mounting plate 12.
The elastic sponge body 2 is a heat-conducting insulating Pad made of Sil-Pad-2000, the general thickness is 0.25mm or 0.38mm, and the heat conductivity is as follows: 3.5W/(m.K), the normal maximum volume compressibility is 36%, the material is an elastic heat-conducting insulating material, the heat transfer characteristic is good, and the normal compressibility ratio is high.
The second fastening screw 11 can realize the reliable fastening installation of the installation pressing block 1, and the material performance of the second fastening screw is consistent with that of the first fastening screw 3.
The invention adopts a pressing installation mode of normal bidirectional clamping of a single-lug installation device, so that the installation surface of the high-power device is uniformly stressed and has no local warpage, and the problem gradient of the installation surface is reduced to be within 1.5 ℃; the heat transfer material with high heat conductivity is selected for mounting surfaces, so that the heat transfer resistance is reduced, the temperature rise of the device can be effectively inhibited by combining bidirectional clamping and pressing mounting, and the average temperature rise reduction amplitude reaches 23% through test tests; the insulating material with high breakdown strength is selected, so that the insulating and voltage-resisting capability is improved, and the insulating and voltage-resisting capability of a metal shell of a device is more than 10 kV;
the invention can reduce the temperature rise of the single-ear power device in rated operation, effectively meet the I-level derating temperature requirement, and have larger safe operating temperature margin compared with the traditional installation mode; the high-power device can be widely applied to heat dissipation installation and insulation installation of high-power devices in aerospace electronic products, so that the high-power devices can meet the requirement of insulation installation and can also withstand the harsh thermal shock test environment, and the high-power devices do not lose efficiency at high temperature such as over-high junction temperature.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (5)
1. A heat dissipation structure suitable for a spacecraft high-power device is characterized in that,
comprises an installation pressing block (1), an elastic sponge body (2), an insulation sleeve (7), a first heat-conducting filler (8), an insulation ceramic sheet (9), a second heat-conducting filler (10) and an installation plate (12),
the mounting plate (12) is a main mounting structure of a single-lug high-power device, an insulating ceramic plate (9) is placed on the mounting plate (12), a second heat-conducting filler (10) is uniformly coated between the insulating ceramic plate (9) and the mounting plate (12),
the single-lug high-power device is placed on an insulating ceramic plate (9), a first heat conducting filler (8) is uniformly coated between the insulating ceramic plate (9) and the high-power device, an insulating sleeve (7) is installed in an installation hole of the single-lug high-power device, a first fastening screw (3) penetrates through an installation plate (12), the insulating ceramic plate (9), the single-lug high-power device and the insulating sleeve (7), a plain washer (6) and a spring washer (5) are sequentially installed on the insulating sleeve (7), and finally a nut (4) is screwed into the first fastening screw (3) and is screwed down to complete the insulating heat dissipation installation of the single-lug high-power device;
at least one layer of elastic sponge body (2) is adhered between the mounting pressing block (1) and the single-lug high-power device, and a second fastening screw (11) respectively penetrates through the mounting plate (12) and the mounting pressing block (1) to complete the pressing mounting of the single-lug high-power device;
the working voltage VDS of the single-ear high-power device is more than or equal to 200V, and the current ID is more than or equal to 33.0A;
the tensile strength of the insulating sleeve (7) is more than or equal to 110MPa, and the breakdown strength is more than or equal to 100kV/mm;
the surface vulcanization time of the heat-conducting filler is 10-70 min, the breaking strength is more than or equal to 3.9MPa, and the elongation is more than or equal to 300 percent;
the breaking strength of the heat-conducting filler is more than or equal to 3.9MPa;
the elongation of the heat-conducting filler is more than or equal to 300 percent;
a pressing mounting mode of normal bidirectional clamping of a single-lug mounting device is adopted, so that the mounting surface of the high-power device is uniformly stressed and has no local warping, and the problem gradient of the mounting surface is reduced to be within 1.5 ℃;
the method reduces the temperature rise of the single-ear power device in rated operation, meets the I-level derating temperature requirement, is applied to the heat dissipation installation and the insulation installation of the high-power device in an aerospace electronic product, and avoids the temperature failure of the high-power device caused by overhigh junction temperature.
2. The heat dissipation structure for high-power spacecraft devices according to claim 1, wherein the tensile strength of the first fastening screw (3) is greater than 800Mpa.
3. The heat dissipation structure suitable for spacecraft high-power devices as claimed in claim 1, wherein the breakdown strength of the insulating ceramic sheet (9) is greater than or equal to 230kV/mm.
4. The heat dissipation structure for high-power spacecraft devices according to claim 1, wherein the thickness of the elastic sponge body (2) is 0.25mm or 0.38mm.
5. The heat dissipation structure for high power devices in spacecraft of claim 1, wherein the mounting plate (12) has a yield strength greater than 260Mpa.
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| CN114190042A (en) * | 2021-11-16 | 2022-03-15 | 北京卫星制造厂有限公司 | High-power module integrated circuit device of aerospace power supply product and mounting method thereof |
| CN114025579A (en) * | 2021-11-16 | 2022-02-08 | 北京卫星制造厂有限公司 | Compressing heat dissipation device |
| CN114198456A (en) * | 2021-11-16 | 2022-03-18 | 北京卫星制造厂有限公司 | Vibration damper |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051088A (en) * | 2003-07-30 | 2005-02-24 | Japan Radio Co Ltd | Printed circuit board with heat conductive member, and method for manufacturing the same |
| JP2006319134A (en) * | 2005-05-12 | 2006-11-24 | Fujitsu Ltd | Heat dissipation structure |
| CN101336074A (en) * | 2007-06-29 | 2008-12-31 | 深圳富泰宏精密工业有限公司 | Assembly mechanism and portable electronic apparatus applying the assembly member |
| CN102283677A (en) * | 2011-07-12 | 2011-12-21 | 中国科学院深圳先进技术研究院 | Ultrasound array sound head and production method thereof |
| CN202189775U (en) * | 2011-08-23 | 2012-04-11 | 山亿新能源股份有限公司 | Solar energy transistor radiating fixing structure |
| CN102569223A (en) * | 2012-01-11 | 2012-07-11 | 华为技术有限公司 | Power device insulation heat radiation structure, circuit board and power supply device |
| CN202857197U (en) * | 2012-11-09 | 2013-04-03 | 谢俊福 | Electronic circuit board waterproof and heat radiating device |
| CN103066186A (en) * | 2013-01-07 | 2013-04-24 | 浙江华正新材料股份有限公司 | Insulating layer and aluminum substrate of ceramic chip composite structure and manufacturing method of the same |
| CN103426833A (en) * | 2013-08-06 | 2013-12-04 | 深圳市依思普林科技有限公司 | Compression joint type power module |
| CN103680779A (en) * | 2013-11-04 | 2014-03-26 | 西安电子工程研究所 | High-pressure-resistant and large-power solid current limiting resistor |
| CN104730295A (en) * | 2015-04-02 | 2015-06-24 | 中国电子科技集团公司第十三研究所 | Clamp for thermal resistance test of SMD packaged semiconductor device |
| CN206672930U (en) * | 2017-01-22 | 2017-11-24 | 嘉兴斯达半导体股份有限公司 | New crimp type power model |
| CN207508486U (en) * | 2017-11-27 | 2018-06-19 | 同辉电子科技股份有限公司 | A kind of welding fixture of power module package |
| CN207602554U (en) * | 2017-12-27 | 2018-07-10 | 浙江西盈科技股份有限公司 | A kind of heat dissipation clamp system of power device |
| CN109048728A (en) * | 2018-07-25 | 2018-12-21 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of connector quick assembling adjustable tool |
| CN110265367A (en) * | 2019-07-17 | 2019-09-20 | 中天昱品科技有限公司 | A kind of middle power inverter single tube radiator structure |
| CN110379783A (en) * | 2018-07-09 | 2019-10-25 | 株洲中车奇宏散热技术有限公司 | Promote the method and structure of the insulation of semiconductor devices opposite heat sink and heat dissipation performance |
| CN210403608U (en) * | 2019-09-04 | 2020-04-24 | 深圳欣锐科技股份有限公司 | Fool-proof structure for installation |
| CN210491324U (en) * | 2019-08-27 | 2020-05-08 | 苏州汇川技术有限公司 | Power device crimping mechanism and electric control equipment with same |
| CN111301718A (en) * | 2020-03-10 | 2020-06-19 | 上海卫星工程研究所 | Storage battery pack insulation installation and implementation method for spacecraft |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2699473Y (en) * | 2004-03-10 | 2005-05-11 | 鸿富锦精密工业（深圳）有限公司 | Locking device for radiator |
-
2020
- 2020-06-30 CN CN202010623249.3A patent/CN111867324B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051088A (en) * | 2003-07-30 | 2005-02-24 | Japan Radio Co Ltd | Printed circuit board with heat conductive member, and method for manufacturing the same |
| JP2006319134A (en) * | 2005-05-12 | 2006-11-24 | Fujitsu Ltd | Heat dissipation structure |
| CN101336074A (en) * | 2007-06-29 | 2008-12-31 | 深圳富泰宏精密工业有限公司 | Assembly mechanism and portable electronic apparatus applying the assembly member |
| CN102283677A (en) * | 2011-07-12 | 2011-12-21 | 中国科学院深圳先进技术研究院 | Ultrasound array sound head and production method thereof |
| CN202189775U (en) * | 2011-08-23 | 2012-04-11 | 山亿新能源股份有限公司 | Solar energy transistor radiating fixing structure |
| CN102569223A (en) * | 2012-01-11 | 2012-07-11 | 华为技术有限公司 | Power device insulation heat radiation structure, circuit board and power supply device |
| CN202857197U (en) * | 2012-11-09 | 2013-04-03 | 谢俊福 | Electronic circuit board waterproof and heat radiating device |
| CN103066186A (en) * | 2013-01-07 | 2013-04-24 | 浙江华正新材料股份有限公司 | Insulating layer and aluminum substrate of ceramic chip composite structure and manufacturing method of the same |
| CN103426833A (en) * | 2013-08-06 | 2013-12-04 | 深圳市依思普林科技有限公司 | Compression joint type power module |
| CN103680779A (en) * | 2013-11-04 | 2014-03-26 | 西安电子工程研究所 | High-pressure-resistant and large-power solid current limiting resistor |
| CN104730295A (en) * | 2015-04-02 | 2015-06-24 | 中国电子科技集团公司第十三研究所 | Clamp for thermal resistance test of SMD packaged semiconductor device |
| CN206672930U (en) * | 2017-01-22 | 2017-11-24 | 嘉兴斯达半导体股份有限公司 | New crimp type power model |
| CN207508486U (en) * | 2017-11-27 | 2018-06-19 | 同辉电子科技股份有限公司 | A kind of welding fixture of power module package |
| CN207602554U (en) * | 2017-12-27 | 2018-07-10 | 浙江西盈科技股份有限公司 | A kind of heat dissipation clamp system of power device |
| CN110379783A (en) * | 2018-07-09 | 2019-10-25 | 株洲中车奇宏散热技术有限公司 | Promote the method and structure of the insulation of semiconductor devices opposite heat sink and heat dissipation performance |
| CN109048728A (en) * | 2018-07-25 | 2018-12-21 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of connector quick assembling adjustable tool |
| CN110265367A (en) * | 2019-07-17 | 2019-09-20 | 中天昱品科技有限公司 | A kind of middle power inverter single tube radiator structure |
| CN210491324U (en) * | 2019-08-27 | 2020-05-08 | 苏州汇川技术有限公司 | Power device crimping mechanism and electric control equipment with same |
| CN210403608U (en) * | 2019-09-04 | 2020-04-24 | 深圳欣锐科技股份有限公司 | Fool-proof structure for installation |
| CN111301718A (en) * | 2020-03-10 | 2020-06-19 | 上海卫星工程研究所 | Storage battery pack insulation installation and implementation method for spacecraft |
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