CN111849402A - Conductive silver adhesive for packaging semiconductor lead frame and preparation method thereof - Google Patents
Conductive silver adhesive for packaging semiconductor lead frame and preparation method thereof Download PDFInfo
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- CN111849402A CN111849402A CN202010773002.XA CN202010773002A CN111849402A CN 111849402 A CN111849402 A CN 111849402A CN 202010773002 A CN202010773002 A CN 202010773002A CN 111849402 A CN111849402 A CN 111849402A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/328—Phosphates of heavy metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides conductive silver adhesive for packaging a semiconductor lead frame and a preparation method thereof, belonging to the technical field of conductive adhesive. The conductive silver adhesive comprises the following raw materials of 60-75 parts of superfine spherical silver powder, 10-25 parts of epoxy resin, 1-2 parts of nano organic bentonite, 0.5-1.5 parts of zirconium aluminate, 3-5 parts of polyimide, 2-3 parts of a curing agent, 0.2-0.5 part of an accelerator and 1-5 parts of nano graphite. According to the invention, through the addition of the organic bentonite, the zirconium aluminate, the nano graphite, the polyimide, the curing agent and the accelerator, the viscosity, the curing performance and the conductivity of the conductive silver adhesive are improved together, and the prepared product has strong viscosity and high thermal stability.
Description
Technical Field
The invention belongs to the technical field of conductive adhesives, and particularly relates to a conductive silver adhesive for packaging a semiconductor lead frame and a preparation method thereof.
Background
The conductive silver adhesive is an adhesive with certain conductive performance after being cured or dried, and generally takes matrix resin and conductive filler, namely conductive particles as main components, and the conductive particles are combined together through the bonding action of the matrix resin to form a conductive path so as to realize the conductive connection of the bonded materials. The conductive paste is divided into isotropic conductive silver paste and anisotropic conductive silver paste according to a conductive direction. The conductive silver adhesive is widely applied to packaging and bonding of liquid crystal display screens, LEDs, IC chips, printed circuit boards, radio frequency identification electronic elements and components, and can avoid environmental pollution caused by heavy metal lead in tin-lead solder.
At present, the silver content of conductive silver paste is generally higher, although excellent conductive performance is guaranteed, the cost is higher, if other metals are adopted for substitution, the conductive capability can be reduced, and due to higher resistivity, the paste after dispensing can have a wire drawing phenomenon, and the poor phenomena of pattern edge blurring and the like are caused. In addition, although the addition of curing agents, curing accelerators and the like to epoxy resin bases is helpful for increasing the curing speed and improving the curing effect, the curing accelerators, diluents and the like are seriously volatilized in the curing process, and the volatilized gas contains certain toxic and harmful substances, which not only affects the working environment, but also has the risk of damaging the health of online operators; in addition, in order to ensure proper viscosity, more organic solvent and/or dispersant needs to be added, and the organic solvent and the dispersant volatilize after the silver colloid is solidified, so that the volume of the silver colloid is reduced.
Disclosure of Invention
One of the objectives of the present invention is to provide a conductive silver paste for semiconductor lead frame packaging, which has the advantages of stronger bonding strength, low curing shrinkage, good conductivity and lower cost, in view of the problems or defects existing in the conventional conductive silver paste. The invention also aims to provide a preparation method of the conductive silver adhesive.
In order to achieve the purpose, the invention adopts the technical scheme that the conductive silver adhesive for packaging the semiconductor lead frame comprises the following raw materials in parts by weight:
60-75 parts of superfine spherical silver powder, 10-25 parts of epoxy resin, 1-2 parts of nano organic bentonite, 0.5-1.5 parts of zirconium aluminate, 3-5 parts of polyimide, 2-3 parts of curing agent, 0.2-0.5 part of accelerator and 1-5 parts of nano graphite.
Further, the conductive silver adhesive for packaging the semiconductor lead frame is prepared from the following raw materials in parts by weight: 67 parts of superfine spherical silver powder, 15 parts of epoxy resin, 1.5 parts of nano organic bentonite, 1 part of zirconium aluminate, 4 parts of polyimide, 2.5 parts of curing agent, 0.3 part of accelerator and 3 parts of nano graphite.
Preferably, in some embodiments of the present invention, the average particle size of the ultrafine spherical silver powder is 0.2 to 1 μm.
Preferably, in some embodiments of the present invention, the epoxy resin is a novolac epoxy resin, a bisphenol a type epoxy resin, an aliphatic epoxy resin in a ratio of 1: 2: 1 by weight ratio.
Preferably, in some embodiments of the present invention, the curing agent is m-phenylenediamine, m-xylylenediamine, diaminodiphenyl sulfone in a 1:2 by weight ratio.
Preferably, in some embodiments of the present invention, the accelerator is a mixture of triethanolamine and dibutyltin dilaurate in a 3:2 weight ratio.
The invention also provides a preparation method of the conductive silver adhesive, which comprises the steps of mixing the epoxy resin, the nano organic bentonite, the zirconium aluminate, the polyimide and the nano graphite, stirring at the constant temperature of 50-80 ℃ for 2-3h, cooling to the normal temperature, adding the superfine spherical silver powder, the curing agent and the accelerator, and fully and uniformly stirring to obtain the conductive silver adhesive.
Compared with the prior art, the invention has the technical effects that: through the addition of the organic bentonite, the zirconium aluminate, the nano graphite, the polyimide, the curing agent and the accelerator, the viscosity, the curing performance and the conductivity of the conductive silver adhesive are improved together, and the prepared product has strong viscosity and high thermal stability.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. The following description is of the preferred embodiment of the present invention only for the purpose of illustrating the technical solutions of the present invention, and those skilled in the art can make various modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention.
Example 1
The conductive silver adhesive for packaging the semiconductor lead frame provided by the embodiment comprises the following raw materials in parts by weight: 60 parts of superfine spherical silver powder, 10 parts of epoxy resin, 1 part of nano organic bentonite, 1.5 parts of zirconium aluminate, 5 parts of polyimide, 2 parts of curing agent, 0.2 part of accelerator and 5 parts of nano graphite; the average particle size of the superfine spherical silver powder is 1 mu m; the epoxy resin is phenolic epoxy resin, bisphenol A epoxy resin and aliphatic epoxy resin, and the weight ratio of the epoxy resin to the aliphatic epoxy resin is 1: 2: 1 by weight ratio; the curing agent is m-phenylenediamine, m-xylylenediamine and diaminodiphenyl sulfone according to the proportion of 1:2 by weight ratio; the accelerant is formed by mixing triethanolamine and dibutyltin dilaurate according to the weight ratio of 3: 2.
The preparation method of the conductive silver adhesive comprises the steps of mixing epoxy resin, nano organic bentonite, zirconium aluminate, polyimide and nano graphite, stirring at a constant temperature of 50 ℃ for 3 hours, cooling to normal temperature, adding superfine spherical silver powder, a curing agent and an accelerator, and stirring fully and uniformly to obtain the conductive silver adhesive.
Partial performance test of the conductive silver paste of the embodiment shows that the viscosity (25 ℃) of the finished product is close to 6100cP, the longitudinal shrinkage rate after curing is close to 9%, the transverse shrinkage rate is close to 6%, the shear strength is 25.3MPa, the thermal conductivity is 32.1W/m.K, and the volume resistivity is 1.4 multiplied by 10-4Ω·cm。
Example 2
The conductive silver adhesive for packaging the semiconductor lead frame provided by the embodiment comprises the following raw materials in parts by weight: 75 parts of superfine spherical silver powder, 25 parts of epoxy resin, 2 parts of nano organic bentonite, 0.5 part of zirconium aluminate, 3 parts of polyimide, 3 parts of curing agent, 0.5 part of accelerator and 1 part of nano graphite; the average particle size of the superfine spherical silver powder is 0.2 mu m; the epoxy resin is phenolic epoxy resin, bisphenol A epoxy resin and aliphatic epoxy resin, and the weight ratio of the epoxy resin to the aliphatic epoxy resin is 1: 2: 1 by weight ratio; the curing agent is m-phenylenediamine, m-xylylenediamine and diaminodiphenyl sulfone according to the proportion of 1:2 by weight ratio; the accelerant is formed by mixing triethanolamine and dibutyltin dilaurate according to the weight ratio of 3: 2.
The preparation method of the conductive silver adhesive comprises the steps of mixing the epoxy resin, the nano organic bentonite, the zirconium aluminate, the polyimide and the nano graphite, stirring at a constant temperature of 80 ℃ for 2 hours, cooling to normal temperature, adding the superfine spherical silver powder, the curing agent and the accelerator, and stirring fully and uniformly to obtain the conductive silver adhesive.
Partial performance tests on the conductive silver paste of the embodiment show that the viscosity (25 ℃) of a finished product is close to 6600cP, the longitudinal shrinkage rate after curing is close to 6%, the transverse shrinkage rate is close to 2%, the shear strength is 28.6MPa, the thermal conductivity is 25.4W/m.K, and the volume resistivity is 1.8 multiplied by 10-4Ω·cm。
Example 3
The conductive silver adhesive for packaging the semiconductor lead frame provided by the embodiment comprises the following raw materials in parts by weight: 67 parts of superfine spherical silver powder, 15 parts of epoxy resin, 1.5 parts of nano organic bentonite, 1 part of zirconium aluminate, 4 parts of polyimide, 2.5 parts of curing agent, 0.3 part of accelerator and 3 parts of nano graphite; the average particle size of the superfine spherical silver powder is 0.2 mu m; the epoxy resin is phenolic epoxy resin, bisphenol A epoxy resin and aliphatic epoxy resin, and the weight ratio of the epoxy resin to the aliphatic epoxy resin is 1: 2: 1 by weight ratio; the curing agent is m-phenylenediamine, m-xylylenediamine and diaminodiphenyl sulfone according to the proportion of 1:2 by weight ratio; the accelerant is formed by mixing triethanolamine and dibutyltin dilaurate according to the weight ratio of 3: 2.
The preparation method of the conductive silver adhesive comprises the steps of mixing epoxy resin, nano organic bentonite, zirconium aluminate, polyimide and nano graphite, stirring at a constant temperature of 65 ℃ for 2.5 hours, cooling to normal temperature, adding superfine spherical silver powder, a curing agent and an accelerator, and stirring fully and uniformly to obtain the conductive silver adhesive.
Partial performance tests on the conductive silver paste of the embodiment show that the viscosity (25 ℃) of a finished product is nearly 6300cP, the longitudinal shrinkage rate after curing is nearly 7%, the transverse shrinkage rate is nearly 4%, the shear strength is 26.7MPa, the heat conductivity is 31.8W/m.K, and the volume resistivity is 1.2 x 10-4Ω·cm。
Claims (7)
1. The conductive silver adhesive for packaging the semiconductor lead frame is characterized by comprising the following raw materials in parts by weight:
60-75 parts of superfine spherical silver powder, 10-25 parts of epoxy resin, 1-2 parts of nano organic bentonite, 0.5-1.5 parts of zirconium aluminate, 3-5 parts of polyimide, 2-3 parts of curing agent, 0.2-0.5 part of accelerator and 1-5 parts of nano graphite.
2. The conductive silver paste for semiconductor lead frame packaging according to claim 1, which is prepared from the following raw materials in parts by weight: 67 parts of superfine spherical silver powder, 15 parts of epoxy resin, 1.5 parts of nano organic bentonite, 1 part of zirconium aluminate, 4 parts of polyimide, 2.5 parts of curing agent, 0.3 part of accelerator and 3 parts of nano graphite.
3. The conductive silver paste for semiconductor lead frame packaging according to claim 1, wherein: the average particle size of the superfine spherical silver powder is 0.2-1 mu m.
4. The conductive silver paste for semiconductor lead frame packaging according to claim 1, wherein: the epoxy resin is phenolic epoxy resin, bisphenol A epoxy resin and aliphatic epoxy resin, and the weight ratio of the epoxy resin to the aliphatic epoxy resin is 1: 2: 1 by weight ratio.
5. The conductive silver paste for semiconductor lead frame packaging according to claim 1, wherein: the curing agent is m-phenylenediamine, m-xylylenediamine and diaminodiphenyl sulfone according to the proportion of 1:2 by weight ratio.
6. The conductive silver paste for semiconductor lead frame packaging according to claim 1, wherein: the accelerant is formed by mixing triethanolamine and dibutyltin dilaurate according to the weight ratio of 3: 2.
7. The method for preparing the conductive silver paste for semiconductor lead frame packaging according to claim 1, wherein the method comprises the following steps: the preparation method specifically comprises the steps of mixing epoxy resin, nano organic bentonite, zirconium aluminate, polyimide and nano graphite, stirring at a constant temperature of 50-80 ℃ for 2-3 hours, cooling to normal temperature, adding superfine spherical silver powder, a curing agent and an accelerator, and fully and uniformly stirring to obtain the epoxy resin nano organic bentonite/polyimide nano graphite composite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010773002.XA CN111849402A (en) | 2020-08-04 | 2020-08-04 | Conductive silver adhesive for packaging semiconductor lead frame and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010773002.XA CN111849402A (en) | 2020-08-04 | 2020-08-04 | Conductive silver adhesive for packaging semiconductor lead frame and preparation method thereof |
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| CN111849402A true CN111849402A (en) | 2020-10-30 |
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| CN202010773002.XA Pending CN111849402A (en) | 2020-08-04 | 2020-08-04 | Conductive silver adhesive for packaging semiconductor lead frame and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805575A (en) * | 2010-04-09 | 2010-08-18 | 连云港昭华科技有限公司 | High-performance conductive silver paste and preparation method thereof |
| CN102174306A (en) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive |
| CN106459718A (en) * | 2014-05-29 | 2017-02-22 | 田中贵金属工业株式会社 | Thermoconductive electroconductive adhesive composition |
| CN107207935A (en) * | 2015-02-02 | 2017-09-26 | 田中贵金属工业株式会社 | Thermal conductivity conductive adhesive composition |
-
2020
- 2020-08-04 CN CN202010773002.XA patent/CN111849402A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805575A (en) * | 2010-04-09 | 2010-08-18 | 连云港昭华科技有限公司 | High-performance conductive silver paste and preparation method thereof |
| CN102174306A (en) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive |
| CN106459718A (en) * | 2014-05-29 | 2017-02-22 | 田中贵金属工业株式会社 | Thermoconductive electroconductive adhesive composition |
| CN107207935A (en) * | 2015-02-02 | 2017-09-26 | 田中贵金属工业株式会社 | Thermal conductivity conductive adhesive composition |
Non-Patent Citations (3)
| Title |
|---|
| 吴培熙等: "《聚合物共混改性》", 31 August 2017, 中国轻工业出版社 * |
| 姚道坤等: "《中国膨润土矿床及其开发应用》", 31 May 1994, 地质出版社 * |
| 衷平海等: "《实用塑料制品生产技术及应用配方》", 31 May 2005, 江西科学技术出版社 * |
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Application publication date: 20201030 |