CN111836526A - Electromagnetic shielding heat-conducting adhesive tape and forming method thereof - Google Patents

Electromagnetic shielding heat-conducting adhesive tape and forming method thereof Download PDF

Info

Publication number
CN111836526A
CN111836526A CN202010764903.2A CN202010764903A CN111836526A CN 111836526 A CN111836526 A CN 111836526A CN 202010764903 A CN202010764903 A CN 202010764903A CN 111836526 A CN111836526 A CN 111836526A
Authority
CN
China
Prior art keywords
heat
layer
insulating layer
electromagnetic
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010764903.2A
Other languages
Chinese (zh)
Other versions
CN111836526B (en
Inventor
邓世强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Nanjin Electronic Materials Co ltd
Original Assignee
Jiangsu Nanjin Electronic Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Nanjin Electronic Materials Co ltd filed Critical Jiangsu Nanjin Electronic Materials Co ltd
Priority to CN202010764903.2A priority Critical patent/CN111836526B/en
Publication of CN111836526A publication Critical patent/CN111836526A/en
Application granted granted Critical
Publication of CN111836526B publication Critical patent/CN111836526B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00Adapting or protecting infrastructure or their operation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention relates to an electromagnetic shielding heat-conducting adhesive tape, which is characterized in that: the electromagnetic shielding heat-conducting adhesive tape comprises an insulating layer (1), a heat-conducting shielding layer (2), an electromagnetic absorption layer (3), a heat-resistant insulating layer (4) and a sticking protective layer (5); through the collocation of different functional materials, solve cell-phone LCM module electromagnetic interference and heat dissipation problem to make the sticky tape wholly integrate into a whole through a whole sticky heat conduction shielding layer that has, the user can once only be once only with realize that a plurality of sticky tapes that correspond the function are once only attached on the IC of cell-phone LCM module when using, the function is high-efficient, saves man-hour, reduce cost, raises the efficiency.

Description

Electromagnetic shielding heat-conducting adhesive tape and forming method thereof
Technical Field
The invention relates to the technical field of heat-conducting adhesive tapes, in particular to an electromagnetic shielding heat-conducting adhesive tape and a forming method thereof.
Background
For functions such as the heat dissipation of realizing the smart mobile phone among the prior art, insulating and electromagnetic shield, often can wrap up the sticky tape that IC was provided with corresponding function on high-end smart mobile phone LCM module in order to realize corresponding the function, however there is following defect in above-mentioned mode among the prior art:
1) different adhesive tapes are often arranged aiming at different functions, so that the thickness of the adhesive tape needs to be synchronously increased while the function is increased, and a larger structural space is occupied;
2) the multilayer setting about the sticky tape, after certain sticky tape function failure in the middle of, often need tear the sticky tape of the different functions of multilayer simultaneously, load and unload inconveniently.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention provides an electromagnetic shielding heat-conducting adhesive tape and a forming method thereof.
The technical scheme adopted by the invention for solving the technical problems is as follows:
an electromagnetic shielding heat conducting adhesive tape, which is characterized in that: the electromagnetic shielding heat-conducting adhesive tape comprises an insulating layer, a heat-conducting shielding layer, an electromagnetic absorption layer, a heat-resistant insulating layer and a sticking protective layer; the insulating layer is positioned on the upper surface of the heat conduction shielding layer, and the electromagnetic absorption layer, the heat-resistant insulating layer and the adhesive protection layer are positioned on the lower surface of the heat conduction shielding layer;
wherein the content of the first and second substances,
the insulating layer comprises an insulating body part, the front end of the insulating body part extends towards the left side and the right side to form a front flange part, the two sides of the rear end of the insulating body part extend towards the rear side to form a rear flange part, a clamping groove part is concavely arranged in the rear flange part, and a positioning groove is formed in one side of the connecting position of the insulating body part and the rear flange part;
the heat conduction shielding layer is positioned below the insulating layer, has the same shape as the insulating layer and is matched with the insulating layer in an aligned mode;
the electromagnetic absorption layer is positioned inside the connecting position of the insulating body part and the front flange part, and the left end and the right end of the electromagnetic absorption layer are identical to the left end and the right end of the connecting position in shape and are matched in an aligned mode;
the heat-resistant insulating layer is positioned in the insulating body part, and the left end and the right end of the heat-resistant insulating layer are aligned and matched with the left end and the right end of the insulating body part;
the pasting protective layer is located at the rear end of the rear flange portion and extends out of the heat conduction shielding layer towards the same side.
Further, the rear flange portion protrudes to the left and right sides by a dimension larger than that of the front flange portion.
Further, the connecting position of the insulating body part and the front flange part is set to be a round angle.
Furthermore, the included angle between the clamping groove part and the rear flange part is set to be a round angle.
Further, the left and right ends of the front side of the electromagnetic absorption layer are aligned with the left and right ends of the front flange portion, and the left and right ends of the rear side of the electromagnetic absorption layer are aligned with the left and right ends of the insulating body portion.
Furthermore, paste the protective layer and be provided with 2 the same and set up respectively to be the structure that the inboard corner of connecting is the fillet outside for right angle equilateral L shape.
Further, the invention also provides a forming method of the electromagnetic shielding heat-conducting adhesive tape, which is characterized in that: the method comprises the following steps:
1) respectively putting raw materials correspondingly provided with an insulating layer, a heat conduction shielding layer, an electromagnetic absorption layer, a heat-resistant insulating layer and a sticking protective layer into a rolling machine, and rolling out the raw materials as a rolling material at a constant speed;
2) cutting the coil stock into a mould material with a proper width according to the sizes of the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resistant insulating layer and the sticking protective layer;
3) putting the die material into a die cutting device, and cutting the die material into corresponding shapes by rough die cutting and fine die cutting according to die shapes preset in a die for the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resistant insulating layer and the adhesive protective layer;
4) respectively coating adhesive materials on the upper surface and the lower surface of the heat-conducting shielding layer after die cutting and forming;
5) the insulating layer is bonded to the upper surface of the heat conduction shielding layer, and the electromagnetic absorption layer, the heat-resistant insulating layer and the bonding protective layer are bonded to the lower surface of the heat conduction shielding layer.
Further, the size of the die material cut in the step 2) is larger than the corresponding size of the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resisting insulating layer and the adhesive protection layer.
Further, a detection device for detecting whether the corresponding shape cut by the die material meets a preset standard is arranged at the tail part of the die cutting device in the step 3), and the next step is carried out after the corresponding shape is detected to be qualified; and when the detection is unqualified, performing subsequent steps according to the amplitude value of the corresponding shape exceeding the preset standard.
Further, the air conditioner is provided with a fan,
when the detection is unqualified, the corresponding shape exceeds a preset standard, and the exceeded amplitude exceeds a preset threshold, detecting the cut die material after rough die cutting and fine die cutting in sequence;
when the detection is unqualified and the corresponding shape exceeds the preset standard and the exceeded amplitude does not exceed the preset threshold, detecting the cut die material after the die material is subjected to fine die cutting;
when the detection is unqualified and the corresponding shape is smaller than the preset standard and the smaller amplitude exceeds the preset threshold value, recycling the cut die material;
and when the detection is unqualified and the corresponding shape is smaller than the preset standard and the smaller amplitude value does not exceed the preset threshold value, re-measuring the size of the cut die material and determining to perform fine die cutting or recycling treatment according to the measurement result.
The invention has the beneficial effects that:
(1) through the collocation of different functional materials, solve cell-phone LCM module electromagnetic interference and heat dissipation problem to make the sticky tape wholly integrate into a whole through a whole sticky heat conduction shielding layer that has, the user can once only be once only with realize that a plurality of sticky tapes that correspond the function are once only attached on the IC of cell-phone LCM module when using, the function is high-efficient, saves man-hour, reduce cost, raises the efficiency.
(2) The forming of the heat-conducting adhesive tape is realized through coiling, cutting, die cutting, detecting, coating and adhesion, the process is simple, the required environmental limitation is less, and meanwhile, different corresponding measures are selected through different detection results to realize accurate die cutting and save raw materials.
Drawings
FIG. 1 is an exploded view of the electromagnetic shielding heat conductive tape according to the present invention;
fig. 2 is a structural bottom view of the electromagnetic shielding heat-conducting tape of the present invention.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in the figures 1-2 of the drawings,
an electromagnetic shielding heat conduction adhesive tape comprises an insulating layer 1, a heat conduction shielding layer 2, an electromagnetic absorption layer 3, a heat-resistant insulating layer 4 and a sticking protective layer 5; the insulating layer 1 is positioned on the upper surface of the heat conduction shielding layer 2, and the electromagnetic absorption layer 3, the heat-resistant insulating layer 4 and the adhesive protection layer 5 are positioned on the lower surface of the heat conduction shielding layer 2;
wherein the content of the first and second substances,
the insulating layer 1 comprises an insulating body part 1-1, the front end of the insulating body part 1-1 extends towards the left and right sides to be provided with a front flange part 1-2, the two sides of the rear end of the insulating body part 1-1 extend towards the rear to be provided with a rear flange part 1-3, a clamping groove part 1-4 is concavely arranged in the rear flange part 1-3, and one side of the connecting position of the insulating body part 1-1 and the rear flange part 1-3 is provided with a positioning groove 6; the positioning grooves 6 are arranged to simultaneously position the heat-conducting adhesive tape in the left-right direction and the up-down direction, and the positioning grooves 6 are arranged to be square notches, so that the manufacturing and forming are facilitated, and in addition, the positioning grooves 6 of the square notches are convenient for the installation and positioning of induction devices in the temperature and other tests in the mobile phone module after the manufacturing is completed; the insulating layer 1 is used for protecting the IC from being isolated from other components of the mobile phone so as to prevent the IC from being conducted and burning out components;
the heat conduction shielding layer 2 is positioned below the insulating layer 1, has the same shape as the insulating layer 1 and is matched with the insulating layer in an aligned mode; the functional adhesive tape with the copper foil base material is selected as the layer, and the metal copper has excellent functions of heat conduction, heat storage and electromagnetic shielding, so that the temperature generated during the work of the IC can be effectively reduced, and the interference of the IC electromagnetic wave on other electronic components of the mobile phone can be isolated;
the electromagnetic absorption layer 3 is positioned inside the connecting position of the insulating body part 1-1 and the front flange part 1-2, and the left end and the right end of the electromagnetic absorption layer are same as the left end and the right end of the connecting position in shape and are matched in an aligned mode; the layer is a functional material which is prepared by fusing polymer and multiple metal powders and can absorb electromagnetic waves, and can effectively absorb the interference of the electromagnetic waves generated by the components in the corresponding region of the IC on other components;
the heat-resistant insulating layer 4 is positioned in the insulating body part 1-1, and the left end and the right end of the heat-resistant insulating layer are aligned and matched with the left end and the right end of the insulating body part 1-1; polyimide material is selected for use to this layer, can be for a long time able to bear 260 degrees high temperature and possess insulating function simultaneously, can effectively completely cut off the contact of heat conduction shielding layer 2 and IC and the components and parts that cause burn the risk.
The pasting protective layer 5 is located at the rear end of the rear flange part 1-3 and extends out of the heat conduction shielding layer 2 towards the same side, and the pasting protective layer 5 is directly torn off by a user when the heat conduction adhesive tape is used, so that the heat conduction shielding layer 2 is effectively protected when the heat conduction adhesive tape is not used.
Specifically, the size that rear flange portion 1-3 stretches out to the left and right sides is greater than the size that front flange portion 1-2 stretches out to the left and right sides, and front flange portion 1-2 stretches out to the left and right sides in order to realize the left and right sides location of heat conduction sticky tape front end, and rear flange portion 1-3 jets out to the rear side in order to realize the front and back location of heat conduction sticky tape rear end, and the size that rear flange portion 1-3 stretches out to the left and right sides is greater than the size that front flange portion 1-2 stretches out to the left and right sides on the one hand can also reserve sufficient size for draw-in groove portion 1-4 in order to guarantee the realization of draw-in groove portion 1-4 location effect when realizing.
Specifically, the connecting position of the insulating body part 1-1 and the front flange part 1-2 is set to be a round corner, which is convenient for molding and avoids the damage possibly caused by the included angle of the sharp shape when positioning between the connecting positions of the insulating body part 1-1 and the front flange part 1-2.
Specifically, the included angle between the clamping groove part 1-4 and the rear flange part 1-3 is set to be a round angle, so that the clamping groove part 1-4 is convenient to form, and damage possibly caused by the included angle in a sharp shape when being positioned is avoided.
Specifically, the left and right ends of the front side of the electromagnetic absorption layer 3 are aligned with the left and right ends of the front flange part 1-2, and the left and right ends of the rear side of the electromagnetic absorption layer 3 are aligned with the left and right ends of the insulating body part 1-1, so that the interference of electromagnetic waves generated by components in corresponding regions of the IC on other components is effectively absorbed in a comprehensive covering mode that the left and right ends of the electromagnetic absorption layer are completely matched in the front and rear different shapes.
Specifically, paste protective layer 5 and be provided with 2 the same and set up respectively to be the structure that the inboard corner joint is the right angle equilateral L shape for the fillet outside to only need tear the whole of pasting protective layer 5 and tearing off through tearing the one end that pastes protective layer 5 and extend before the use and remove.
Specifically, the invention also provides a forming method of the electromagnetic shielding heat-conducting adhesive tape, which comprises the following steps:
1) respectively putting raw materials correspondingly provided with an insulating layer, a heat conduction shielding layer, an electromagnetic absorption layer, a heat-resistant insulating layer and a sticking protective layer into a rolling machine, and rolling out the raw materials as a rolling material at a constant speed;
2) cutting the coil stock into a mould material with a proper width according to the sizes of the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resistant insulating layer and the sticking protective layer;
3) putting the die material into a die cutting device, and cutting the die material into corresponding shapes by rough die cutting and fine die cutting according to die shapes preset in a die for the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resistant insulating layer and the adhesive protective layer; the die cutting device of the insulating layer is positioned in a first plane, the die cutting device of the heat conduction shielding layer is positioned in a second plane, the die cutting device of the electromagnetic absorption layer, the heat-resistant insulating layer and the adhesive protection layer is positioned in a third plane, the first plane is higher than the second plane, and the second plane is higher than the third plane, so that the raw materials subjected to die cutting are arranged in advance according to corresponding positions;
4) respectively coating adhesive materials on the upper surface and the lower surface of the heat-conducting shielding layer after die cutting and forming;
5) the insulating layer is bonded to the upper surface of the heat conduction shielding layer, the electromagnetic absorption layer, the heat-resistant insulating layer and the bonding protective layer are bonded to the lower surface of the heat conduction shielding layer, preferably, the electromagnetic absorption layer, the heat-resistant insulating layer and the bonding protective layer are bonded to the lower surface of the heat conduction shielding layer, and then the electromagnetic absorption layer, the heat-resistant insulating layer and the bonding protective layer are turned over to bond the insulating layer to the upper surface of the heat conduction shielding layer, so that whether the bonding effect of the electromagnetic absorption layer, the heat-resistant insulating layer and the bonding protective layer is stable or not is.
Specifically, the size of the die material cut in the step 2) is larger than the corresponding size of the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resisting insulating layer and the sticking protective layer, so that raw materials are provided for next-step die cutting.
Specifically, a detection device for detecting whether the corresponding shape cut by the die material meets a preset standard is arranged at the tail part of the die cutting device in the step 3), and the next step is carried out after the detection is qualified; and when the detection is unqualified, performing subsequent steps according to the amplitude value of the corresponding shape exceeding the preset standard.
In particular, the amount of the solvent to be used,
when the detection is unqualified, the corresponding shape exceeds a preset standard, and the exceeded amplitude exceeds a preset threshold, detecting the cut die material after rough die cutting and fine die cutting in sequence; at the moment, because the exceeding amplitude exceeds the preset threshold, the coarse die cutting and the fine die cutting are required to be realized for multiple times in sequence so as to realize the corresponding accurate die cutting;
when the detection is unqualified and the corresponding shape exceeds the preset standard and the exceeded amplitude does not exceed the preset threshold, detecting the cut die material after the die material is subjected to fine die cutting; at the moment, the exceeded amplitude is small and does not exceed the preset threshold, so that the corresponding die cutting requirements can be realized only by fine die cutting;
when the detection is unqualified and the corresponding shape is smaller than the preset standard and the smaller amplitude exceeds the preset threshold value, the cut die material is recycled, and the die cut material is recycled to realize recycling because the size of each aspect of the die cut material is smaller and cannot meet the die cutting requirement;
and when the detection is unqualified and the corresponding shape is smaller than the preset standard and the smaller amplitude value does not exceed the preset threshold value, re-measuring the size of the cut die material and determining to perform fine die cutting or recycling according to the measurement result, wherein the requirement for secondary die cutting can be realized because the size of one side is too small to meet the requirement and the size of the other side can still meet the requirement for die cutting after rotation, and the die material is recycled to realize recycling when the measurement result after rotation still cannot meet the requirement for die cutting.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (10)

1. An electromagnetic shielding heat conducting adhesive tape, which is characterized in that: the electromagnetic shielding heat-conducting adhesive tape comprises an insulating layer (1), a heat-conducting shielding layer (2), an electromagnetic absorption layer (3), a heat-resistant insulating layer (4) and a sticking protective layer (5); the insulating layer (1) is positioned on the upper surface of the heat-conducting shielding layer (2), and the electromagnetic absorption layer (3), the heat-resistant insulating layer (4) and the adhesive protection layer (5) are positioned on the lower surface of the heat-conducting shielding layer (2);
wherein the content of the first and second substances,
the insulating layer (1) comprises an insulating body part (1-1), the front end of the insulating body part (1-1) extends towards the left side and the right side to form a front flange part (1-2), the two sides of the rear end of the insulating body part (1-1) extend towards the rear side to form a rear flange part (1-3), a clamping groove part (1-4) is concavely arranged in the rear flange part (1-3), and a positioning groove (6) is arranged on one side of the connecting position of the insulating body part (1-1) and the rear flange part (1-3);
the heat conduction shielding layer (2) is positioned below the insulating layer (1) and is identical to the insulating layer (1) in shape and matched with the insulating layer in an aligned mode;
the electromagnetic absorption layer (3) is positioned inside the connecting position of the insulating body part (1-1) and the front flange part (1-2), and the left end and the right end of the electromagnetic absorption layer are identical to the left end and the right end of the connecting position in shape and are matched in an aligned mode;
the heat-resistant insulating layer (4) is positioned in the insulating body part (1-1) and the left end and the right end of the heat-resistant insulating layer are aligned and matched with the left end and the right end of the insulating body part (1-1);
the sticking protective layer (5) is positioned at the rear end of the rear flange part (1-3) and extends out of the heat conduction shielding layer (2) towards the same side.
2. An electromagnetic shielding heat conducting adhesive tape according to claim 1, wherein: the size of the rear flange part (1-3) extending towards the left and right sides is larger than the size of the front flange part (1-2) extending towards the left and right sides.
3. An electromagnetic shielding heat conducting adhesive tape according to claim 1, wherein: the connecting position of the insulating body part (1-1) and the front flange part (1-2) is set to be a round angle.
4. An electromagnetic shielding heat conducting adhesive tape according to claim 1, wherein: and the included angle between the clamping groove part (1-4) and the rear flange part (1-3) is set to be a round angle.
5. An electromagnetic shielding heat conducting adhesive tape according to claim 1, wherein: the left and right ends of the front side of the electromagnetic absorption layer (3) are aligned with the left and right ends of the front flange part (1-2), and the left and right ends of the rear side of the electromagnetic absorption layer (3) are aligned with the left and right ends of the insulating body part (1-1).
6. An electromagnetic shielding heat conducting adhesive tape according to claim 1, wherein: paste protective layer (5) and be provided with 2 the same and set up respectively to be the structure that the inboard corner joint is the right angle equilateral L shape for the fillet outside.
7. A method for forming an electromagnetic shielding heat-conducting adhesive tape is characterized by comprising the following steps: the method comprises the following steps:
1) respectively putting raw materials correspondingly provided with an insulating layer, a heat conduction shielding layer, an electromagnetic absorption layer, a heat-resistant insulating layer and a sticking protective layer into a rolling machine, and rolling out the raw materials as a rolling material at a constant speed;
2) cutting the coil stock into a mould material with a proper width according to the sizes of the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resistant insulating layer and the sticking protective layer;
3) putting the die material into a die cutting device, and cutting the die material into corresponding shapes by rough die cutting and fine die cutting according to die shapes preset in a die for the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resistant insulating layer and the adhesive protective layer;
4) respectively coating adhesive materials on the upper surface and the lower surface of the heat-conducting shielding layer after die cutting and forming;
5) the insulating layer is bonded to the upper surface of the heat conduction shielding layer, and the electromagnetic absorption layer, the heat-resistant insulating layer and the bonding protective layer are bonded to the lower surface of the heat conduction shielding layer.
8. The method for forming an electromagnetic shielding heat-conducting adhesive tape according to claim 7, wherein: the size of the die material cut in the step 2) is larger than the corresponding size of the insulating layer, the heat-conducting shielding layer, the electromagnetic absorption layer, the heat-resisting insulating layer and the adhesive protection layer.
9. The method for forming an electromagnetic shielding heat-conducting adhesive tape according to claim 7, wherein: a detection device for detecting whether the corresponding shape cut by the die material meets a preset standard is arranged at the tail part of the die cutting device in the step 3), and the next step is carried out after the corresponding shape is detected to be qualified; and when the detection is unqualified, performing subsequent steps according to the amplitude value of the corresponding shape exceeding the preset standard.
10. The method for forming an electromagnetic shielding heat-conducting adhesive tape according to claim 9, wherein:
when the detection is unqualified, the corresponding shape exceeds a preset standard, and the exceeded amplitude exceeds a preset threshold, detecting the cut die material after rough die cutting and fine die cutting in sequence;
when the detection is unqualified and the corresponding shape exceeds the preset standard and the exceeded amplitude does not exceed the preset threshold, detecting the cut die material after the die material is subjected to fine die cutting;
when the detection is unqualified and the corresponding shape is smaller than the preset standard and the smaller amplitude exceeds the preset threshold value, recycling the cut die material;
and when the detection is unqualified and the corresponding shape is smaller than the preset standard and the smaller amplitude value does not exceed the preset threshold value, re-measuring the size of the cut die material and determining to perform fine die cutting or recycling treatment according to the measurement result.
CN202010764903.2A 2020-07-31 2020-07-31 Electromagnetic shielding heat-conducting adhesive tape and forming method thereof Active CN111836526B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010764903.2A CN111836526B (en) 2020-07-31 2020-07-31 Electromagnetic shielding heat-conducting adhesive tape and forming method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010764903.2A CN111836526B (en) 2020-07-31 2020-07-31 Electromagnetic shielding heat-conducting adhesive tape and forming method thereof

Publications (2)

Publication Number Publication Date
CN111836526A true CN111836526A (en) 2020-10-27
CN111836526B CN111836526B (en) 2022-08-09

Family

ID=72919313

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010764903.2A Active CN111836526B (en) 2020-07-31 2020-07-31 Electromagnetic shielding heat-conducting adhesive tape and forming method thereof

Country Status (1)

Country Link
CN (1) CN111836526B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114479711A (en) * 2022-03-24 2022-05-13 苏州益邦电子材料有限公司 Dustproof buffering wave-absorbing material convenient to it is high-efficient synchronous attached and coil stock thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697694A (en) * 1992-09-16 1994-04-08 Hitachi Ltd Electromagnetic shield film and shield structure body using this film
CN206283714U (en) * 2016-12-29 2017-06-27 苏州世沃电子科技有限公司 One kind electromagnetic shielding diaphragm
CN209989307U (en) * 2019-05-26 2020-01-24 苏州玮俊电子科技有限公司 Copper foil adhesive tape for mobile phone display screen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697694A (en) * 1992-09-16 1994-04-08 Hitachi Ltd Electromagnetic shield film and shield structure body using this film
CN206283714U (en) * 2016-12-29 2017-06-27 苏州世沃电子科技有限公司 One kind electromagnetic shielding diaphragm
CN209989307U (en) * 2019-05-26 2020-01-24 苏州玮俊电子科技有限公司 Copper foil adhesive tape for mobile phone display screen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114479711A (en) * 2022-03-24 2022-05-13 苏州益邦电子材料有限公司 Dustproof buffering wave-absorbing material convenient to it is high-efficient synchronous attached and coil stock thereof

Also Published As

Publication number Publication date
CN111836526B (en) 2022-08-09

Similar Documents

Publication Publication Date Title
US4670347A (en) RFI/EMI shielding apparatus
US20120261181A1 (en) Electromagnetic shielding method and electromagnetic shielding film
CN111836526B (en) Electromagnetic shielding heat-conducting adhesive tape and forming method thereof
CN212752722U (en) Battery protection board and mobile terminal
US7482250B2 (en) Method for cutting printed circuit board
US7173512B2 (en) Thermistor having improved lead structure and secondary battery having the thermistor
KR102527317B1 (en) Electronic apparatus having metal case with metal pad attached therein
CN208543077U (en) A kind of automatic pressure-sensitive motor laser tin soldering equipment
CN110430678B (en) Manufacturing process of flexible circuit board
CN209577114U (en) A kind of spray painting auxiliary mould of processing circuit board
CN103929885B (en) The processing method for protecting PCB stepped plate step surface line patterns
CN215180800U (en) Conductive adhesive attaching detection jig and conductive adhesive attaching system
JP2004247159A (en) Battery pack and its manufacturing method
CN110896592B (en) 3D (three-dimensional) switching type PCB (printed circuit board) and manufacturing method thereof
US20160072115A1 (en) Secondary battery
KR102071137B1 (en) A current detection resistor and the manufacturing method
CN111618588A (en) Method for welding tab of soft-packaged battery cell
CN209218456U (en) High-intensitive compound FPC plate
CN210506178U (en) Multifunctional film structure and have its utmost point ear
JPH0690082A (en) Method of connecting circuit substrate
CN217823153U (en) Naked electric core insulation system and secondary battery
CN108617090A (en) Mobile terminal and its circuit board
CN213028703U (en) Printed wiring board
CN219892359U (en) Battery and electronic equipment
CN210314100U (en) Multifunctional integrated adhesive tape assembly

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant