CN111836450B - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
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- CN111836450B CN111836450B CN201910304739.4A CN201910304739A CN111836450B CN 111836450 B CN111836450 B CN 111836450B CN 201910304739 A CN201910304739 A CN 201910304739A CN 111836450 B CN111836450 B CN 111836450B
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- insulating film
- circuit board
- flexible circuit
- solid
- solid deformation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present disclosure provides a flexible circuit board, including: a first insulating film, a second insulating film, a wiring layer, and a solid deformation member; the wiring layer is located between the first insulating film and the second insulating film; the first insulating film and the second insulating film are made of an electrically insulating material; the solid deformation piece is made of a low-elasticity easily-deformable solid material and is used for deforming under an external force and being incapable of automatically recovering the shape. Because the solid deformation piece can take place deformation, this characteristics that have guaranteed the flexible circuit board bendability can design the shape of flexible circuit board according to particular case, simultaneously, the shape after the solid deformation piece takes place deformation can keep changing, can fix the shape of flexible circuit board, in flexible circuit board assembling process, can not be because the shape is changeful, brings the difficulty for the equipment, has improved the packaging efficiency.
Description
Technical Field
The present disclosure relates to the field of electronic communication technologies, and in particular, to a flexible circuit board.
Background
With the development of electronic communication technology, various electronic devices bring much convenience to the life of users, and can meet various requirements of users. The wiring of the electronic device is generally disposed on a Circuit board, and a Flexible Printed Circuit (FPC) is made of a deformable material, such as: polyimide, polyester film, etc., and thus, the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness, good bendability, etc. However, since the flexible printed circuit board has strong elasticity, the shape of the flexible printed circuit board is not easy to fix during the assembly process, the assembly is very inconvenient, and the assembly efficiency is low.
Disclosure of Invention
The disclosed embodiment provides a flexible circuit board. The technical scheme is as follows:
according to a first aspect of the embodiments of the present disclosure, there is provided a flexible circuit board, including: a first insulating film, a second insulating film, a wiring layer, and a solid deformation member;
the wiring layer is located between the first insulating film and the second insulating film;
the first insulating film and the second insulating film are made of an electrically insulating material;
the solid deformation piece is made of a low-elasticity easily-deformable solid material and is used for deforming under an external force and being incapable of automatically recovering the shape.
Because the solid deformation piece can take place deformation, this characteristics that have guaranteed the flexible circuit board bending nature is good can design the shape of flexible circuit board according to particular case, simultaneously, the unable shape of independently restoring of solid deformation piece, that is to say the shape after the solid deformation piece takes place deformation can keep changing, can fix the shape of flexible circuit board, in the flexible circuit board assembling process, can not be because the shape is yielding, bring the difficulty for the equipment, improved the packaging efficiency.
In one embodiment, the solid deformation member is located between the first insulating film and the second insulating film;
the solid deformation member does not contact with the wire in the wiring layer.
The solid deformation piece can be arranged between the two insulating films and is arranged on the same layer as the wiring layer, and at the moment, the solid deformation piece is not in contact with the lead, so that the solid deformation piece is prevented from influencing signal transmission of the circuit.
In one embodiment, the solid deformation member comprises two solid deformation strips positioned on the wire layer, and the two solid deformation strips are respectively positioned on two sides of the wiring layer.
The two solid deformation strips do not influence the wiring of the wiring layer on the two sides of the wiring layer, and can fix the shape of the flexible circuit board.
In one embodiment, the solid deformation member includes at least one solid deformation strip located at the wire layer, the at least one solid deformation strip being between the wires of the wiring layer.
At least one solid deformation strip is embedded in the wiring layer, so that the shape change of the flexible circuit board is richer, the flexible circuit board is suitable for different scenes, and the solid deformation strip is arranged between the wires, and the wiring is not influenced.
In one embodiment, the solid deformation member is located at an outer surface of the first insulating film and/or an outer surface of the second insulating film.
The solid deformation member is located on the outer surface of the first insulating film and/or the outer surface of the second insulating film, and the influence on the wiring layer is reduced to a greater extent.
In one embodiment, the solid deformation member covers all or part of an edge of the first insulating film.
The solid deformation member may cover all or part of the edge of the first insulating film, and may also cover all or part of the edge of the second insulating film.
In one embodiment, the solid deformation member includes two solid deformation strips respectively located on both sides of the outer surface of the first insulating film.
The solid deformation strips are arranged on the two sides of the outer surface of the first insulating film respectively, so that the shape of the flexible circuit board can be fixed, and a better fixing effect can be achieved by adopting fewer materials.
In one embodiment, the solid deformable member is made of a solid metallic material that can be deformed.
Because solid metal material easily processes, it is more durable, many solid metal materials all can take place deformation and can not independently resume the shape moreover, and the material source is comparatively extensive, has satisfied the demand of the flexible circuit board that this disclosure provided.
In one embodiment, the solid deformation member comprises at least one fixing piece, each fixing piece is made of a solid material, can be deformed under an external force and cannot restore the shape automatically;
each fixing piece of the at least one fixing piece is respectively positioned at the position of the flexible circuit board, which needs to be fixed in shape.
The fixing piece is arranged at the position of the flexible circuit board, which needs to be fixed in shape, the material of the solid deformation piece does not need to be used much, the weight of the flexible circuit board is not increased too much, and the advantages of light weight and thin thickness are ensured.
In one embodiment, the solid deformation member is attached to the first insulating film or the second insulating film by an etching technique.
The shape to be processed can be conveniently obtained by the etching technology, and the etching technology is mature and easy to realize.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a cross-sectional view of an electronic device shown in accordance with an example embodiment;
FIG. 2 is a schematic diagram of a flexible circuit board shown in accordance with an exemplary embodiment;
FIG. 3 is a cross-sectional view of a flexible circuit board shown in accordance with an exemplary embodiment;
FIG. 4 is a cross-sectional view of a flexible circuit board shown in accordance with an exemplary embodiment;
FIG. 5 is a cross-sectional view of a flexible circuit board shown in accordance with an exemplary embodiment;
fig. 6 is a block diagram of a flexible circuit board shown in accordance with an example embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The flexible circuit board is made of deformable materials, such as: polyimide or polyester film, etc. and has the features of high wiring density, light weight, thin thickness, high bending performance, etc. In some application scenarios, as shown in FIG. 1, FIG. 1 is a cross-sectional view of an electronic device shown in accordance with an example embodiment; for example, if a rigid circuit board is used and is not bent, the electronic device may occupy a large space, and as shown in a portion a in fig. 1, the thickness of the electronic device may be greatly increased; if a flexible circuit board is used, the thickness of the electronic device can be reduced.
However, since the flexible printed circuit board has strong elasticity, the shape of the flexible printed circuit board is not easy to fix during the assembly process, the assembly is very inconvenient, and the assembly efficiency is low. The flexible circuit board that this disclosed embodiment provided includes: a first insulating film, a second insulating film, a wiring layer, and a solid deformation member; a wiring layer located between the first insulating film and the second insulating film and bonded on the first insulating film and the second insulating film; the first insulating film and the second insulating film are made of an electrically insulating material; the solid deformation piece is attached to the first insulating film or the second insulating film, is made of a solid material, can deform under an external force and cannot restore the shape automatically. Because the solid deformation piece can take place deformation, this characteristics that have guaranteed the flexible circuit board bending nature is good can design the shape of flexible circuit board according to particular case, simultaneously, the unable shape of independently restoring of solid deformation piece, that is to say the shape after the solid deformation piece takes place deformation can keep changing, can fix the shape of flexible circuit board, in the flexible circuit board assembling process, can not be because the shape is yielding, bring the difficulty for the equipment, improved the packaging efficiency.
Fig. 2 is a schematic structural diagram illustrating a flexible circuit board according to an exemplary embodiment, and as shown in fig. 2, the flexible circuit board 20 includes: a first insulating film 201, a second insulating film 202, a wiring layer 203, and a solid deformation member 204.
Wherein the wiring layer 203 is located between the first insulating film 201 and the second insulating film 202;
the first insulating film 201 and the second insulating film 202 are made of an electrically insulating material;
the solid deformation member 204 is made of a solid material, can be deformed by an external force, and cannot restore the shape by itself.
In fig. 2, the solid deformation element 204 is disposed above the second insulating film 202, which does not mean that the solid deformation element 204 is disposed only above the second insulating film 202, and the solid deformation element 204 may be attached to the first insulating film 201 or the second insulating film 202. In the present embodiment, the direction from the first insulating film 201 to the second insulating film 202 is a top-to-bottom direction.
The solid deformation element 204 may be bonded to the first insulating film 201 or the second insulating film 202, and the wiring layer 203 may be bonded to the first insulating film 201 and the second insulating film 202.
In one embodiment, the solid deforming member 204 is made of a solid metallic material that can be deformed.
Because solid metal material is easy to process, it is more durable, and many solid metal materials all can take place deformation and can not be from the shape of recovering, and the material source is comparatively extensive, has satisfied the demand of the flexible circuit board 20 that this disclosure provided. For example, the solid deformable member may be made of aluminum, copper, or an alloy.
In one embodiment, the solid deformation member 204 is attached to the first insulating film 201 or the second insulating film 202 by an etching technique. The shape to be processed can be conveniently obtained by the etching technology, and the etching technology is mature and easy to realize. Of course, this is by way of example only and does not represent a limitation of the present disclosure.
Because solid deformation piece 204 can take place deformation, this characteristics that guaranteed flexible circuit board 20 bending property is good can design flexible circuit board 20's shape according to particular case, simultaneously, solid deformation piece 204 can't restore the shape by oneself, that is to say solid deformation piece 204 takes place can keep the shape after the change after the deformation, can fix flexible circuit board 20's shape, in flexible circuit board 20 assembling process, can not be because the shape is changeful, bring the difficulty for the equipment, improved the packaging efficiency. The flexible circuit board is guaranteed to be good in bending performance, can be made into various shapes through deformation, guarantees that the deformed shapes can be fixed, and improves the assembling efficiency.
The solid deformation member 204 may be located between the first insulating film 201 and the second insulating film 202 at the same layer as the wiring layer 203, or may be located outside the first insulating film 201 and the second insulating film 202. The position of the solid deformation element 204 is illustrated in the following two specific examples:
in one embodiment, as shown in FIG. 3, FIG. 3 is a cross-sectional view of a flexible circuit board 20 shown in accordance with an exemplary embodiment. The solid deformation member 204 is located between the first insulating film 201 and the second insulating film 202; the solid deformation member 204 does not contact the wires in the wiring layer 203. The solid deformation member 204 may be attached on the first insulating film 201 and the second insulating film 202.
The solid deformation element 204 can be between two insulating films and on the same layer as the wiring layer 203, and at this time, the solid deformation element 204 is not in contact with a wire, so that the solid deformation element 204 is prevented from influencing signal transmission of a circuit.
Here, the position of the solid deformation member 204 between two insulating films is illustrated by two examples.
For example, as shown in fig. 3, the solid deformation member 204 includes two solid deformation strips 2041 located on the wire layer, and the two solid deformation strips 2041 are located on two sides of the wire layer, respectively.
The two solid deformation bars 2041 do not affect the wiring of the wiring layers on both sides of the wiring layers, and can fix the shape of the flexible circuit board 20.
As another example, as shown in fig. 4, the solid deformation element 204 includes at least one solid deformation strip 2041 located on the wiring layer, and at least one solid deformation strip 2041 is located between the wires of the wiring layer.
At least one solid deformation strip 2041 is embedded in the wiring layer, so that the shape change of the flexible circuit board is richer, the flexible circuit board is suitable for different scenes, and the solid deformation strips are arranged between the wires, and the wiring is not influenced.
In another embodiment, as shown in FIG. 5, FIG. 5 is a cross-sectional view of a flexible circuit board 20 shown in accordance with an exemplary embodiment. The solid deformation member 204 is located at an outer surface of the first insulating film 201 and/or an outer surface 202 of the second insulating film.
The solid deformation member 204 may be located on the outer surfaces of the first insulating film 201 and the second insulating film 202 without affecting the circuit of the wiring layer 203. The solid deformation element 204 may be attached to the first insulating film 201 or the second insulating film 202, which is not limited in the present disclosure.
The solid deformation member is located on the outer surface of the first insulating film 201 and/or the outer surface of the second insulating film 202, and the influence on the wiring layer is reduced to a greater extent.
Here, the positions of the solid deformation member 204 on the outer surfaces of the two insulating films are illustrated by two examples.
For example, the solid deformation member 204 covers all or part of the edge of the first insulating film 201.
The solid deformation member 204 may cover all or part of the edge of the first insulating film 201, and may also cover all or part of the edge of the second insulating film 202.
As another example, as shown in fig. 5, the solid deformation member 204 includes two solid deformation strips 2041 respectively located on both sides of the outer surface of the first insulating film 201.
The solid deformation strips 2041 are respectively arranged on the two sides of the outer surface of the first insulating film 201, so that the shape of the flexible circuit board 20 can be fixed, and a better fixing effect can be achieved by adopting less materials.
Of course, this is merely an exemplary illustration, the position of the solid deformation element 204 may be in various situations, and may be disposed between the first insulating film 201 and the second insulating film 202, may be disposed on the wiring layer 203, may be disposed on the outer surfaces of both the insulating films, or may be disposed on the outer surface of one of the insulating films, and the composition of the solid deformation element 204 may be arbitrarily combined according to the above examples, which is not repeated herein.
In one embodiment, as shown in FIG. 6, FIG. 6 is a block diagram of a flexible circuit board 20 shown according to an exemplary embodiment. The solid deformation member 204 comprises at least one fixing plate 2042, each fixing plate 2042 is made of a solid material, can be deformed under an external force and cannot automatically recover the shape; each of the at least one fixing piece 2042 is located at a position where the flexible circuit board 20 needs to be fixed in shape.
In fig. 6, the fixing pieces 2042 are provided at positions where a fixed shape is required for the bending deformation of the flexible circuit board 20, and one or more fixing pieces 2042 may be provided at each position where a fixed shape is required.
The shape of the fixing piece 2042 is determined by the shape of the deformed portion of the flexible circuit board 20, and is not necessarily a regular shape. Of course, the fixing plate 2042 may also be disposed at a position where the flexible circuit board 20 is not deformed, so that the flexible circuit board is easier to fix, which is not limited in the present disclosure.
The fixing plate 2042 is arranged at the position where the flexible circuit board 20 needs to be fixed in shape, the material of the solid deformation piece 204 does not need to be used much, the weight of the flexible circuit board 20 is not increased too much, and the advantages of light weight and thin thickness are ensured.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (7)
1. A flexible circuit board, characterized in that the flexible circuit board comprises: a first insulating film, a second insulating film, a wiring layer, and a solid deformation member;
the wiring layer is located between the first insulating film and the second insulating film;
the first insulating film and the second insulating film are made of an electrically insulating material;
the solid deformation piece is made of a deformable solid metal material and is used for deforming under an external force and being incapable of automatically recovering the shape,
the solid deformation member is located between the first insulating film and the second insulating film;
the solid-state deforming member does not contact with the wire in the wiring layer,
the solid deformation member includes at least one solid deformation strip located at the wiring layer, the at least one solid deformation strip being between the wires of the wiring layer.
2. The flexible circuit board of claim 1,
the solid deformation piece comprises two solid deformation strips located on the wiring layer, and the two solid deformation strips are located on two sides of the wiring layer respectively.
3. The flexible circuit board of claim 1,
the solid deformation member is located on an outer surface of the first insulating film and/or an outer surface of the second insulating film.
4. The flexible circuit board of claim 3,
the solid deformation member covers all or part of the edge of the first insulating film.
5. The flexible circuit board of claim 3,
the solid deformation piece comprises two solid deformation strips which are respectively positioned on two sides of the outer surface of the first insulating film.
6. The flexible circuit board according to any one of claims 1 to 5,
the solid deformation piece comprises at least one fixed piece, each fixed piece is made of a solid material, can deform under an external force and cannot restore the shape automatically;
each fixing piece of the at least one fixing piece is respectively positioned at the position of the flexible circuit board, which needs to be fixed in shape.
7. The flexible circuit board according to any one of claims 1 to 5,
the solid deformation member is attached to the first insulating film or the second insulating film by an etching technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304739.4A CN111836450B (en) | 2019-04-16 | 2019-04-16 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304739.4A CN111836450B (en) | 2019-04-16 | 2019-04-16 | Flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111836450A CN111836450A (en) | 2020-10-27 |
| CN111836450B true CN111836450B (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910304739.4A Active CN111836450B (en) | 2019-04-16 | 2019-04-16 | Flexible circuit board |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5445869A (en) * | 1993-01-21 | 1995-08-29 | Matsushita Electric Industrial Co., Ltd. | Composite flexible substrate |
| CN102141697A (en) * | 2010-02-02 | 2011-08-03 | Nec液晶技术株式会社 | Display device and FPC board fixing method thereof |
| CN104219873A (en) * | 2013-05-28 | 2014-12-17 | 大自达电线股份有限公司 | Shape-retaining film, and shape-retaining-type flexible circuit board provided with same shape-retaining film |
| CN105826351A (en) * | 2015-01-28 | 2016-08-03 | 株式会社日本显示器 | Display module |
| CN109379836A (en) * | 2018-10-29 | 2019-02-22 | 付秀华 | Pipeline type electron plate |
-
2019
- 2019-04-16 CN CN201910304739.4A patent/CN111836450B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5445869A (en) * | 1993-01-21 | 1995-08-29 | Matsushita Electric Industrial Co., Ltd. | Composite flexible substrate |
| CN102141697A (en) * | 2010-02-02 | 2011-08-03 | Nec液晶技术株式会社 | Display device and FPC board fixing method thereof |
| CN104219873A (en) * | 2013-05-28 | 2014-12-17 | 大自达电线股份有限公司 | Shape-retaining film, and shape-retaining-type flexible circuit board provided with same shape-retaining film |
| CN105826351A (en) * | 2015-01-28 | 2016-08-03 | 株式会社日本显示器 | Display module |
| CN109379836A (en) * | 2018-10-29 | 2019-02-22 | 付秀华 | Pipeline type electron plate |
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| Publication number | Publication date |
|---|---|
| CN111836450A (en) | 2020-10-27 |
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