JP4186972B2 - Sheet-like device for connection between substrates and connection structure - Google Patents

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for electrically connecting wiring boards on which electronic circuits are formed, and more particularly to a board-like device for board-to-board connection (hereinafter referred to as sheet device) having a noise prevention function and a connection structure using the same About the body.

  In recent years, electronic devices have been miniaturized mainly for portable devices, and at the same time, development for multi-functionality and high functionality by adding additional functions has been performed. In such an electronic device, not only the main wiring board but also a plurality of wiring boards such as a flexible board connected to the main wiring board are mounted. The plurality of wiring boards are connected to the main wiring board by connectors. In such an electronic device, it is required to remove noise generated from inside or outside the electronic device.

  In order to satisfy both requirements for noise removal and miniaturization, a configuration in which a chip capacitor that has been mounted on a main wiring board or the like is conventionally arranged in a connector is also performed. FIG. 11 shows an example of a connector with a filter in which a capacitor for removing noise is provided inside the connector. FIG. 11A is an exploded perspective view for explaining the assembly method, and FIG. 11B is a cross-sectional view showing the filter element section.

  In this connector, a plurality of contact elements 161 are arranged in two rows, a housing 162 in which cuts 163 are formed so as to expose a part of the two rows of contact elements 161, a ground electrode 165, and a multiple filter mechanism 168. And a shield frame 169 surrounding the housing 162, the multiple filter mechanism 168 is inserted into the notch 163 of the housing 162, and the housing 162 is inserted into the shield frame 169 to be surrounded. The multiple filter mechanism 168 is configured by forming filter elements 166 and individual electrodes 167 on both surfaces of the substrate 164.

  Further, as shown in FIG. 11B, in this connector, corresponding contact elements 161 and individual electrodes 167 are electrically connected, for example, by elastic protrusions 161A of the contact elements 161, respectively. Further, the shield frame 169 and the ground electrode 165 are electrically connected by, for example, a leaf spring projection 170 (see, for example, Patent Document 1).

  In addition, in order to cope with downsizing of electronic devices, a configuration in which a filter is incorporated in a connection portion with a connector of a flexible substrate is also shown. 12A and 12B are diagrams showing the configuration of the filter forming portion of the flexible substrate, in which FIG. 12A is a perspective view thereof, and FIG. 12B is a cross-sectional view of a connection portion with a connector.

  This connector includes a flexible base film 171 made of a dielectric, connection terminals 172 and ground terminals which are signal lines and ground lines provided on one surface of the base film 171, and an end of the other surface of the base film 171. A ground electrode layer 174 that is electrically connected to a ground terminal 173 through a through hole 175 provided in the base film 171 and forms a filter element with a signal line through the base film 171; And a reinforcing plate 176.

12B, when the end portion of the base film 171 is inserted into the opening 178 of the connector housing 177, a plurality of metal lead terminals 179 attached to the upper portion of the housing 177 are provided. The contact portion having the spring property is elastically in contact with the connection terminal 172 and the ground terminal 173, and is electrically connected to a signal line or a ground line on the circuit board 180 to remove noise (for example, a patent) Reference 2).
Japanese Patent Laid-Open No. 11-8019 JP-A-8-279667

  By using the connector of the first example, signal noise between connected wiring boards can be removed. However, since the connector of this example has a relatively large height, there is a problem such as a large restriction on the use in a portable electronic device that is particularly required to be thin.

  In the configuration of the flexible substrate of the second example, the capacitor is formed on the flexible substrate portion where the connection terminals are provided, so that the thickness can be reduced. However, in this configuration, the flexible substrate itself is used as a dielectric layer to form a capacitor. Generally as a flexible substrate, a polyimide resin, a polyethylene terephthalate (PET) resin, etc. are used as a base material. The relative dielectric constant of these resin materials is about 2 to 3. Moreover, it is difficult to increase the conductor width of the connection terminal that is a signal line. Therefore, there is a great limitation on the capacity value that can be manufactured. That is, there is a problem that only a capacitor element having a relatively small capacitance value can be manufactured, and a usable range is limited.

  The present invention has been made to solve such a conventional problem, and a sheet device having a noise removal function capable of being thinly connected while incorporating a capacitor element having a relatively large capacitance value, and the same are used. It is an object to provide a connected structure.

  In order to solve the problems as described above, the sheet device of the present invention includes a sheet-like substrate having an insulating surface at least, and a plurality of connecting terminals between two wiring boards formed on the sheet-like substrate. Wiring conductor and a capacitor element formed on the sheet-like substrate and composed of a lower electrode layer, a dielectric layer, and an upper electrode layer, and the predetermined wiring conductor of the wiring conductor is a lower layer of the capacitor element The electrode layer or the upper electrode layer is electrically connected, and the upper electrode layer or the lower electrode layer of the capacitor element is connected to the ground conductor of the wiring conductor.

  In the above configuration, a part of the preset wiring conductor may be used as the lower electrode layer or the upper electrode layer of the capacitor element.

  With such a configuration, when two wiring boards are connected using a sheet device, capacitor elements can be connected at the same time, so that the mounting process can be simplified. Further, since the capacitor element can be formed very thin, even if a sheet device having a capacitor element is used, the overall thickness is not increased. As a result, when the sheet device of the present invention is used, an electronic circuit device that is smaller, has a higher density, and can effectively remove noise than the conventional case where a chip capacitor is mounted on a wiring board. realizable.

  Further, in the above configuration, a plurality of capacitor elements are provided in the center of the sheet-like substrate, the wiring conductor is formed so as to cross the capacitor element, and the connection regions connecting the two wiring substrates are on both sides of the capacitor element. Each of the wiring conductors may constitute each lower electrode layer of the capacitor element. Alternatively, a plurality of capacitor elements are provided in the center of the sheet-like substrate, at least a plurality of lower electrode layers of the capacitor elements are connected in common and connected to the ground conductor, and the upper electrode layer of the capacitor element also functions as a wiring conductor You may make it do.

  By adopting such a configuration, the capacitor element is arranged at the center of the sheet-like substrate, and the connection regions for connecting the two wiring substrates are arranged on both sides. The process of connecting between them can be simplified. Note that the connection between the two wiring boards may be performed by press-contact connection, or may be performed using solder, a conductive adhesive, or the like. Alternatively, one wiring board may be connected by solder or a conductive adhesive, and the other wiring board may be press-contact connected.

  In the above configuration, the connection region of the wiring conductors connected to the two wiring boards may be arranged on one side of the sheet-like board, and a plurality of capacitor elements may be arranged on the other side of the sheet-like board. Or the connection area | region of a wiring conductor may be provided in the center area | region of a sheet-like board | substrate, and the capacitor | condenser element may be provided in both sides on both sides of a connection area | region.

  With such a configuration, a capacitor element forming region can be widened, and thus a capacitor element having a large capacity can be easily formed.

  Further, in the above configuration, a resistor that is connected in series to each connection terminal that connects the two wiring boards is further provided between the connection areas of the wiring boards, and one terminal of the resistor and the lower layer electrode of the capacitor element The upper electrode layer or the upper electrode layer may be connected, and the upper electrode layer or the lower electrode layer may be connected to the ground conductor.

  By adopting such a configuration, not only a noise removal function using only the capacitor element but also a CR filter can be configured, and thus a sheet device having a further excellent noise removal effect can be obtained. Not only can all the wiring conductors be connected to the CR filter, but the wiring conductor is connected to only the capacitor element, the wiring conductor is connected to the CR filter, or the wiring conductor is not connected to the capacitor element or the resistance layer. Various configurations can be produced in accordance with the requirements of the wiring board.

  Furthermore, the sheet device of the present invention includes a sheet-like substrate made of a material formed by mixing an inorganic dielectric material with an insulating resin, and connection terminals for two wiring boards formed on one surface of the sheet-like substrate. A plurality of wiring conductors that connect each other and a ground wiring conductor formed at a position facing the wiring conductor on the other surface of the sheet-like substrate, and the capacitor element is formed by the wiring conductor, the sheet-like substrate, and the ground wiring conductor. The ground wiring conductor is configured to be connected to the ground conductor formed on the surface on which the wiring conductor is formed by a through conductor provided on the sheet-like substrate.

  With such a configuration, a sheet device with a simple manufacturing process and a large capacitance value can be easily obtained.

  Further, the connection structure of the present invention includes a first wiring board having first connection terminal regions formed at a constant pitch on the first base material, and a first connection terminal region on the second base material. Inter-board connection for electrically connecting a second wiring board having second connection terminal areas formed at the same pitch, and the first connection terminal area of the first wiring board and the second connection terminal area of the second wiring board. And the inter-substrate connecting device is a sheet device described above.

  With such a configuration, the first wiring board and the second wiring board are electrically connected using a sheet device that is thin and flexible even when the capacitor element is formed, and at the same time for noise removal. It can also be connected to other capacitor elements. As a result, it is possible to realize a connection structure that can have a higher circuit scale than the conventional configuration.

  Further, in the above configuration, the electrical connection between the first connection terminal region of the first wiring substrate and the second connection terminal region of the second wiring substrate is performed by the connection region formed on the same surface of the sheet device. It is good. In this case, the electrical connection between the first connection terminal region and the second connection terminal region may be performed by elastically pressing the connection region of the sheet device. Alternatively, the electrical connection between the first connection terminal region and the second connection terminal region may be performed by connecting the connection region of the sheet device to the first connection terminal region and the connection region and the second connection terminal region with solder or conductive adhesive resin, respectively. The connection may be performed by any one of connection by anisotropic conductive resin, connection by direct contact, and connection by mechanical adhesion by an insulating resin.

  By adopting such a configuration, for example, in the case of a connection configuration that elastically presses, it is possible to easily replace when a defect or the like occurs in the first wiring board or the second wiring board. Further, in the case of a configuration in which the connection is made by solder or the like, for example, a structure for pressing the sheet device is not necessary, and thus a simpler connection structure can be achieved.

  Further, in the above configuration, the sheet device is provided only in the set first connection terminal area and second connection terminal area of the first connection terminal area of the first wiring board and the second connection terminal area of the second wiring board. The capacitor element may be connected.

  With such a configuration, it is possible to connect a capacitor element for noise prevention to an arbitrary terminal in the first connection terminal region and the second connection terminal region.

  Furthermore, in the above configuration, the sheet device is further provided with a resistor in the connection region connecting the first connection terminal region and the second connection terminal region, and the filter circuit may be configured including the capacitor element. Good.

  With such a configuration, it is possible to easily connect to a terminal that requires a CR filter.

  According to the present invention, since a capacitor element for removing noise generated in a wiring board or the like can be integrally formed on a sheet device, the electronic circuit device can be thinned, miniaturized and densified. Play.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same element and description may be abbreviate | omitted.

(First embodiment)
1A and 1B are diagrams for explaining the configuration of a sheet device 1 according to a first embodiment of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA. .

  The sheet device 1 according to the present embodiment includes a sheet-like substrate 2 having at least an insulating surface, and a plurality of wiring conductors 3 formed on the sheet-like substrate 2 and connecting between connection terminals of two wiring substrates. The capacitor element 6 is formed on the sheet-like substrate 2 and includes a lower electrode layer 3C, a dielectric layer 4, and an upper electrode layer 5.

  In the present embodiment, all of the wiring conductors 3 also function as the lower electrode layer 3 </ b> C of the capacitor element 6. Further, the upper electrode layers 5 of the capacitor elements 6 are connected in common, and the extending portion thereof is connected to the ground conductor 5A of the wiring conductor.

  Furthermore, in the sheet device 1 of the present embodiment, a plurality of capacitor elements 6 are provided in the central portion of the sheet-like substrate 2. The wiring conductor 3 is formed so as to cross the row of the capacitor elements 6, and connection regions 3 </ b> A and 3 </ b> B connected to two wiring boards (not shown) are respectively arranged on both sides with the capacitor element 6 as the center. . Further, a part of the wiring conductor 3 constitutes the lower electrode layer 3 </ b> C of each capacitor element 6.

  Hereinafter, the configuration will be described in more detail. The sheet-like substrate 2 is desirably a relatively thin resin sheet having flexibility. Further, it is desirable that the surface of the dielectric layer 4 for forming the capacitor element is as smooth as possible from the viewpoint of securing the withstand voltage and pattern processing. From these points, polyimide resin is one of the preferred materials.

  On the surface of the sheet-like substrate 2, for example, a metal material having good conductivity such as aluminum (Al) and having relatively good adhesion to the resin is formed by a film formation method such as sputtering. Then, a plurality of wiring conductors 3 are formed in a stripe shape as shown in FIG. 1 by performing an exposure process and an etching process.

Next, materials generally used as dielectric materials, such as barium titanate (BaTiO ₃ ), tantalum oxide (Ta ₂ O ₅ ), silicon nitride (Si ₃ N ₄ ), or silicon oxide (SiO ₂ ), are similarly used. After forming a film by sputtering, an exposure process and an etching process are performed to form the dielectric layer 4. In this case, the wiring conductor 3 is formed so as to reliably cover the region to be the lower electrode layer 3C. Thereafter, for example, copper (Cu) is further formed by a film forming method such as sputtering, and an exposure process and an etching process are performed to form the upper electrode layer 5.

  Furthermore, a two-layered plating film made of, for example, copper (Cu) and gold (Au) is formed on the connection regions 3A and 3B of the wiring conductor 3 including the connection region 5B of the ground conductor 5A. Further, it is desirable to form a protective film 7 in the region excluding the connection regions 3A and 3B and the connection region 5B of the ground conductor 5A. As this protective film 7, for example, a resin material such as a plating resist can be formed by printing or the like. In addition, it is preferable to form the thickness of the plating film thicker than the thickness of the resin protective film 7.

  As described above, the sheet device 1 of the present embodiment is obtained. Such a sheet device 1 can be formed in a lump by using a large-area resin sheet.

  FIG. 2 is a diagram for explaining a configuration for connecting two wiring boards using the sheet device 1. FIG. 2A is a diagram showing a lower base for fixing the first wiring board 10 and the second wiring board 14. FIG. 18B is a plan view thereof, FIG. 18C is a plan view thereof, FIG. 18C is a connection structure in which the sheet device 1 is aligned and fixed by an upper base 20 for fixing, and electrically and mechanically connected. (D) shows an equivalent circuit diagram. FIG. 2A is a cross-sectional view taken along the line BB shown in FIG.

  As shown in FIGS. 2A and 2B, first connection terminal regions 12 are formed on the first base substrate 11 at the same pitch as the wiring conductors 3 of the sheet device 1 on the first wiring substrate 10. Has been. Various wiring patterns are formed on the extending portion of the first connection terminal region 12 and electronic components are mounted, but this is not shown.

  On the other hand, on the second wiring substrate 14, the inter-substrate connecting terminal region 16 </ b> A is formed on the second base material 15 at the same pitch as the wiring conductor 3 of the sheet device and the first connecting terminal region 12 of the first wiring substrate 10. Has been. Further, the second wiring board 14 is also formed with a ground connection terminal region 16B for connection to the ground conductor 5A of the sheet device 1. The extending portion of the ground connection terminal region 16B is connected to a ground terminal (not shown). The ground connection terminal region 16B and the inter-substrate connection terminal region 16A are collectively referred to as a second connection terminal region 16. In the first wiring board 10, various wiring patterns are formed in the extending portion of the second connection terminal region 16, and electronic components are mounted, but this is not shown.

  As shown in FIGS. 2A and 2B, the first connection terminal region 12 and the second connection terminal region 16 are aligned on the lower fixing base 18 so as to correspond to each other, for example, with a double-sided tape or the like. Fix it. Thereafter, the connection region 5B and the connection regions 3A, 3B of the ground conductor 5A, which is one of the wiring conductors 3 of the sheet device 1, are brought into close contact with the first connection terminal region 12 and the second connection terminal region 16. Then, the fixing upper base 20 is pressed with an elastic member 19 such as rubber interposed therebetween, and is fixed in a state of being pressed by a spring or a screw (not shown).

  Thereby, the configuration of the equivalent circuit diagram shown in FIG. Therefore, the first connection terminal region 12 of the first wiring substrate 10 and the second connection terminal region 16 of the second wiring substrate 14 are electrically connected, and the capacitor element 6 is connected to these. It is done. Thereby, noise removal can be performed. Since the capacitor element 6 is formed by a thin film process, the sheet device 1 can be formed very thin. Therefore, as shown in FIG. 2C, even if the connection structure is manufactured by stacking the first wiring board 10 and the second wiring board 14, the increase in the thickness as a whole can be ignored. Degree. As a result, it is not necessary to mount a chip capacitor for noise removal on the surface of the first wiring board 10 or the second wiring board 14, so that either the first wiring board 10 or the second wiring board 14 is mounted. It becomes possible to make it smaller.

  Furthermore, in the present embodiment, since the sheet device 1 is connected by pressure bonding, even if a defect occurs in either the first wiring board 10 or the second wiring board 14, it can be easily replaced.

  The elastic member 19 is not always necessary, and may not be provided when the fixing upper base 20 is pressed by a spring.

  In the present embodiment, the fixing lower base 18 and the fixing upper base 20 are used to press with a spring or a screw, but the present invention is not limited to this. For example, the structure fixed while pressing with a clip may be sufficient. Further, connection by solder or conductive adhesive resin is possible instead of connection by press contact.

  Furthermore, even if the thicknesses of the first wiring board 10 and the second wiring board 14 are different, the sheet device 1 has flexibility, so that a certain thickness difference can be absorbed. However, if there is a thickness difference that cannot be absorbed, a step may be provided in the lower fixing base 18 so that the surfaces of the first wiring board 10 and the second wiring board 14 are the same.

  3A and 3B are views showing a sheet device of a modification according to the present embodiment, in which FIG. 3A is a plan view of the sheet device 25 of the first modification, and FIG. 3B is a sheet device 26 of the second modification. FIG.

  As shown in FIG. 3A, the dielectric layer 4 may be divided for each wiring conductor 3. In this way, since the stress applied to the dielectric layer 4 when the sheet device 25 is deformed can be reduced, the reliability with respect to deformation can be further improved.

  As shown in FIG. 3B, the sheet device 26 of the second modified example has a configuration in which the ground conductor 5 </ b> A of the upper electrode layer 5 is connected to one of the wiring conductors 3. The ground conductor 5 </ b> A is connected to the ground line in the first connection terminal region 12 of the first wiring substrate 10 and the second connection terminal region 16 of the second wiring substrate 14. With such a configuration, it is not necessary to separately provide the ground connection terminal region 16B and a ground line as an extension portion of the second wiring substrate 14 in the second wiring substrate 14, so that the wiring substrate normally used can be used as it is. .

  In the present embodiment, the upper electrode layer has a continuous shape including a plurality of capacitor elements, but a pattern may be formed for each capacitor element. In this case, a wiring pattern that connects the upper electrode layers divided into the respective patterns may be formed and connected to the ground conductor.

(Second Embodiment)
4A and 4B are diagrams showing the configuration of the sheet device 30 according to the second embodiment of the present invention, in which FIG. 4A is a plan view, FIG. 4B is a cross-sectional view taken along line CC, and FIG. ) Is a cross-sectional view taken along line DD, and (d) is a cross-sectional view taken along line EE.

  In the sheet device 30 of the present embodiment, wiring conductors 32A, 34A, 35 for connecting to two wiring boards are arranged on one side of the sheet-like board 2, and the capacitor element 31 is the other side of the sheet-like board 2. It is composed of a plurality of arrangements on the side. In the case of the present embodiment, the extended portion of the wiring conductor 32 </ b> A is connected to the lower electrode layer 32 of the capacitor element 31. Further, the wiring conductor 34 </ b> A (hereinafter referred to as the ground conductor 34 </ b> A) serving as the ground conductor has an extending portion connected to the upper electrode layer 34 of the capacitor element 31. On the other hand, the wiring conductor 35 is not connected to the capacitor element 31 at all. As can be seen from FIG. 4, the wiring conductors 32A, 35 and the ground conductor 34A almost constitute a connection region. Similar to the first embodiment, for example, a copper (Cu) -gold (Au) plating layer is laminated in this connection region.

  Note that the lower electrode layer 32, the dielectric layer 33 and the upper electrode layer 34 of the capacitor element 31, and the materials and manufacturing methods of the wiring conductors 32A and 35 and the ground conductor 34A are the same as those in the first embodiment. The description is omitted because it can be formed by a manufacturing method. The description of the protective film 36 formed in the region including the capacitor element 31 is omitted because the same material and manufacturing method as in the first embodiment may be used.

  In the sheet device 30 of the present embodiment, the capacitor element 31 can be connected only to the wiring conductor 32A that requires noise removal, and the capacitance value of the capacitor element is increased, that is, the area of the capacitor element is increased. It can be easily performed.

  FIG. 5 is a diagram for explaining a configuration for connecting two wiring boards using the sheet device 30. FIG. 5A shows a lower base for fixing the first wiring board 37 and the second wiring board 40 together. FIG. 4B is a plan view thereof, FIG. 4C is a plan view thereof, and FIG. 4C is a connection structure in which the sheet device 30 is aligned and fixed by an upper base 45 for fixing, and electrically and mechanically connected. Sectional drawing which shows the state made into is shown. 5A is a cross-sectional view taken along the line GG shown in FIG. 5B.

  As shown in FIGS. 5A and 5B, the first wiring board 37 has a wiring conductor 32 </ b> A, 35 of the sheet device 30 and a ground conductor that is one of the wiring conductors on the first base material 38. First connection terminal regions 39 are formed at the same pitch as 34A. Various wiring patterns are formed and electronic components are mounted on the extending portion of the first connection terminal region 39, which is not shown.

  On the other hand, on the second wiring board 40, second connection terminal regions 42 are formed on the second base material 41 at the same pitch as the wiring conductors 32 </ b> A and 35 and the ground conductor 34 </ b> A of the sheet device 30.

  As can be seen from FIGS. 5A and 5B, in the present embodiment, the first connection terminal region 39 of the first wiring substrate 37 and the second connection terminal region 42 of the second wiring substrate 40 have the same pitch. And the same number. However, it does not necessarily need to be the same number. That is, one or both of the wiring boards may be provided with unused wiring conductors.

  Further, the element connection terminal region 39A in the first connection terminal region 39 and the element connection terminal region 42A in the second connection terminal region 42 connected to the wiring conductor 32A of the sheet device 30 are the capacitor element 31 of the sheet device 30. The lower electrode layer 32 is connected.

  However, regarding the connection terminal region 39C in the first connection terminal region 39 and the connection terminal region 42C in the second connection terminal region 42, these electrical connections are only performed by the wiring conductor 35.

  The ground connection terminal region 39B in the first connection terminal region 39 and the ground connection terminal region 42B in the second connection terminal region 42 are connected to the ground conductor 34A that is one of the wiring conductors of the sheet device 30. However, these are ground lines, and are connected to a ground terminal (not shown) on either or both of the first wiring board 37 and the second wiring board 40.

  Also in the present embodiment, as shown in FIG. 5C, the first wiring board 37 and the second wiring board 40 are fixed to the lower fixing base 43 by, for example, a double-sided tape. Thereafter, the connection area of the sheet device 30 is pressed against the first connection terminal area 39 of the first wiring board 37 and the second connection terminal area 42 of the second wiring board 40 to make an electrical connection. For this purpose, pressing is performed by the fixing upper base 45 and the elastic member 44 made of a rubber-like material. And it fixes in the state pressed with the spring or screw which is not shown in figure. Thereby, the connection structure of this Embodiment is realizable.

  Also in this embodiment, the configuration is the same as the equivalent circuit diagram shown in FIG. That is, the first connection terminal area 39 of the first wiring board 37 and the second connection terminal area 42 of the second wiring board 40 are electrically connected, and the preset terminals are set in advance. The wiring conductors are connected by pressure welding. Furthermore, a capacitor element 31 is connected to a preset terminal, and noise removal can be performed. Since the capacitor element 31 is formed by a thin film process, even if the sheet device 30 is arranged so as to be stacked on the first wiring board 37 and the second wiring board 40 as shown in FIG. The increase in the overall thickness is negligible. As a result, it is not necessary to mount a chip capacitor for noise removal on the surface of the first wiring board 37 or the second wiring board 40. Therefore, either the first wiring board 37 or the second wiring board 40 is used. It becomes possible to make it smaller.

  Furthermore, in the present embodiment, since the sheet device 30 is connected by pressure bonding, even if a defect occurs in either the first wiring board 37 or the second wiring board 40, it can be easily replaced.

  The elastic member 44 is not always necessary, and may not be provided when the fixing upper base 45 is pressed by a spring.

  In the present embodiment, the lower base 43 for fixing and the upper base 45 for fixing are used to press with a spring or a screw, but the present invention is not limited to this. For example, the structure fixed while pressing with a clip may be sufficient. Further, connection by solder or conductive adhesive resin is possible instead of connection by press contact.

  Further, even if the thicknesses of the first wiring board 37 and the second wiring board 40 are different, the sheet device 30 has flexibility, so that a certain thickness difference can be absorbed. However, if there is a thickness difference that cannot be absorbed, a step is provided in the lower fixing base 43 so that the surfaces of the first wiring board 37 and the second wiring board 40 are the same.

  In this embodiment, the capacitor element is connected only to a preset wiring conductor, but the present invention is not limited to this. Similarly to the first embodiment, capacitor elements may be connected to all the wiring conductors. Furthermore, in the present embodiment, only one ground conductor is used, but two or more ground conductors may be used. Further, the upper electrode layer and the dielectric layer may be divided corresponding to each capacitor element. In this case, a wiring pattern for connecting the upper electrode layers may be formed and connected to the ground conductor.

(Third embodiment)
6A and 6B are diagrams showing the configuration of the sheet device 50 according to the third embodiment of the present invention, in which FIG. 6A is a plan view thereof, and FIG. 6B is a cross-sectional view cut along the line HH. . The sheet device 50 according to the present embodiment has a configuration in which the connection region 52A of the wiring conductor 52 is provided in the central region of the sheet-like substrate 51, and the capacitor elements 53 and 54 are provided on both sides of the connection region 52A. .

  As shown in FIG. 6, wiring conductors 52 are formed on the surface of the sheet-like substrate 51 at a constant pitch. The portions 52B and 52C of the wiring conductor 52 are the lower electrode layers of the capacitor elements 53 and 54, respectively. That is, the capacitor element 53 has a configuration in which the lower electrode layer 52B, the dielectric layer 55, and the upper electrode layer 56 are laminated. Similarly, the capacitor element 54 has a configuration in which a lower electrode layer 52C, a dielectric layer 55, and an upper electrode layer 56 are laminated. The connection region 52A of the wiring conductor 52 is disposed at the center of the sheet-like substrate 51, and the first wiring substrate and the second wiring substrate are electrically connected by the connection region 52A. The connection region 56A connected to the upper electrode layer 56 is also a wiring conductor and a ground conductor. The connection regions 56A that are also the ground conductors are also arranged at the same pitch as the other wiring conductors 52.

  Note that the wiring conductor 52, the dielectric layer 55, the upper electrode layer 56, and the connection regions 52A and 56A can be manufactured by the materials and the manufacturing method described in the first embodiment, and thus description thereof is omitted. Further, similarly to the first embodiment, a plating film having a laminated structure of, for example, copper (Cu) -gold (Au) is formed on the connection regions 52A and 56A. The left and right capacitor elements 53 and 54 can be manufactured by simultaneously performing a film forming process, an exposure process, an etching process, and the like.

  Further, as shown in FIG. 6B, a protective film 57 is formed in the region excluding the connection regions 52A and 56A. In FIG. 6A, the protective film 57 is used for easy understanding of the drawing. Is not shown.

  FIG. 7 is a diagram for explaining a configuration for connecting two wiring boards using the sheet device 50. FIG. 7A shows a lower base for fixing the first wiring board 10 and the second wiring board 14 together. FIG. 6B is a plan view thereof, FIG. 5C is a plan view thereof, and FIG. 4C is a connection structure in which the sheet device 50 is aligned and fixed by an upper base 62 for fixing, and electrically and mechanically connected. It is sectional drawing which shows the state made into. FIG. 7A is a cross-sectional view taken along the line KK shown in FIG. 7B.

  The first wiring board 10 and the second wiring board 14 shown in FIGS. 7A and 7B are used to explain the configuration in which the sheet device 1 of the first embodiment is connected by pressure contact. Since it is the same as that shown in FIG.

  As shown in FIGS. 7A and 7B, the first connection terminal area 12 and the second connection terminal area 16 are aligned on the lower base 60 for fixing so as to correspond to each other, for example, with a double-sided tape or the like. Fix it. In this case, unlike the first embodiment, the first connection terminal region 12 of the first wiring board 10 and the second connection terminal region 16 of the second wiring board 14 need to be arranged close to each other. As can be seen from FIG. 6, the lengths of the connection regions 52A and 56A of the sheet device 50 are short, and it is necessary to press-contact the first connection terminal region 12 and the second connection terminal region 16 in these regions. by.

  After fixing in such an arrangement, the connection region (also a ground conductor) 56A which is one of the wiring conductors of the sheet device 50 and the connection region 52A of the other wiring conductor 52 are connected to the first connection terminal region 12 and the first 2 Close contact with the connection terminal region 16. Then, the fixing upper base 62 is pressed with an elastic member 61 such as rubber interposed therebetween, and is fixed while being pressed by a spring or a screw (not shown). Thereby, the connection structure of this Embodiment is realizable.

  Thus, basically the same configuration as that of the equivalent circuit diagram shown in FIG. Therefore, the first connection terminal region 12 of the first wiring substrate 10 and the second connection terminal region 16 of the second wiring substrate 14 are electrically connected, and the capacitor elements 53 and 54 are connected in parallel to these. Can be configured. Thereby, the capacitance value of the capacitor for noise removal can be increased.

  Furthermore, since the capacitor elements 53 and 54 are formed by a thin film process, the sheet device 50 can be formed very thin. Therefore, as shown in FIG. 7C, even if the first wiring board 10 and the second wiring board 14 are arranged so as to be laminated, an increase in the thickness as a whole is negligible. As a result, it is not necessary to mount a chip capacitor for noise removal on the surface of the first wiring board 10 or the second wiring board 14, so that either the first wiring board 10 or the second wiring board 14 is mounted. It becomes possible to make it smaller.

  Furthermore, in the case of the present embodiment, since the capacitor elements 53 and 54 are connected in parallel, the capacitance value can be increased.

  In the present embodiment, since the sheet device 50 is connected by pressure bonding, even if a defect occurs in either the first wiring board 10 or the second wiring board 14, it can be easily replaced.

  The elastic member 61 is not always necessary, and may not be provided when the upper fixing base 62 is pressed by a spring.

  In the present embodiment, the lower base 60 for fixing and the upper base 62 for fixing are used to press with a spring or a screw, but the present invention is not limited to this. For example, the structure fixed while pressing with a clip may be sufficient. Further, connection by solder or conductive adhesive resin is possible instead of connection by press contact.

  Furthermore, even if the thicknesses of the first wiring board 10 and the second wiring board 14 are different, since the sheet device 50 has flexibility, a certain thickness difference can be absorbed. However, if there is a thickness difference that cannot be absorbed, a step is provided on the lower fixing base 60 so that the surfaces of the first wiring substrate 10 and the second wiring substrate 14 are the same.

  In the present embodiment, all the wiring conductors 52 are connected to the capacitor elements 53 and 54, but the present invention is not limited to this. For example, only a preset wiring conductor may be connected to the capacitor element. Furthermore, although the wiring conductor is connected to the capacitor elements provided on both sides, it may be configured to connect only to the capacitor element on one side. Further, the dielectric layer and the upper electrode layer may be formed separately for each capacitor element. In this case, the upper electrode layer may be connected in common by the wiring pattern and then connected to the connection region 56A which is also a ground conductor.

(Fourth embodiment)
FIGS. 8A and 8B are diagrams showing a configuration of a sheet device 65 according to the fourth embodiment of the present invention, in which FIG. 8A is a plan view thereof, and FIG. 8B is a cross-sectional view taken along line LL. c) is a cross-sectional view taken along line MM, and (d) is a cross-sectional view taken along line NN.

  The sheet device 65 of the present embodiment has a configuration similar to that of the sheet device 25 of the first modification of the first embodiment, but the first, fourth, and seventh in FIG. A feature is that a resistor 73 is provided on a part of the second wiring conductor 67.

  Hereinafter, the configuration of the sheet device 65 of the present embodiment will be described in more detail. The sheet device 65 according to the present embodiment further includes a resistor 73 connected in series between the connection regions 67 </ b> A and 67 </ b> B of the wiring conductor 67. One end portion of the lower electrode layer 67 </ b> C of the capacitor element 70 also serves as one terminal of the resistor 73. Further, the upper electrode layer 69 of the capacitor element 70 is connected to the ground conductor 69A.

  On the sheet-like substrate 66, the same number of capacitor elements 70 as the wiring conductors 67 are made of the lower electrode layer 67 </ b> C, the dielectric layer 68, and the upper electrode layer 69. In the present embodiment, a part of the wiring conductor 67 also serves as the lower electrode layer 67 </ b> C of the capacitor element 70. Further, connection regions 67A and 67B are provided on both sides of the lower electrode layer 67C. As described in the first embodiment, the plating film is formed in the connection regions 67A and 67B.

  The upper electrode layer 69 of the capacitor element 70 is connected to the ground conductor 69A by connecting all the capacitor elements 70 in common. A connection region 69B is provided at the end of the ground conductor 69A, and a plating film is similarly formed on the connection region 69B.

  As shown in FIG. 8C, the first, fourth, and seventh wiring conductors 67 that are set in advance are provided with a resistor 73 in series between the connection regions 67A and 67B. The resistor 73 includes a connection region 67B, a resistor layer 72, and a lower electrode layer 67C. In this way, the resistor 73 is arranged in series between the connection regions 67A and 67B, and one terminal of the resistor 73 is the lower electrode layer 67C. Therefore, the capacitor element 70 is connected to one terminal of the resistor 73. In addition, a configuration in which the upper electrode layer 69 is grounded through the ground conductor 69A is obtained. Thereby, a CR filter is configured.

  Note that only the capacitor element 70 is connected to the wiring conductor 67 on which the resistor 73 is not disposed.

  Since the method for connecting the wiring boards using the sheet device 65 having such a configuration is the same as that in the first embodiment, the description thereof is omitted.

  With the sheet device 65 configured as described above, a CR filter can be connected to necessary wiring conductors and only a capacitor element can be connected to other wiring conductors, so that a more excellent noise removal effect can be obtained. it can.

  In this embodiment, capacitor elements are connected to all wiring conductors, but the present invention is not limited to this. You may connect a capacitor | condenser element only to the wiring conductor set beforehand.

  Moreover, in this Embodiment, although the resistor was formed in a part of wiring conductor, this invention is not limited to this. For example, a similar CR filter configuration can be obtained by inserting a resistor layer and a resistor electrode layer between the lower electrode layer and the dielectric layer. However, in this case, since the resistance value is mainly determined in the thickness direction of the resistor layer, it is necessary to select a material having a large specific resistance.

(Fifth embodiment)
FIGS. 9A and 9B are diagrams showing a configuration of a sheet device 75 according to the fifth embodiment of the present invention, in which FIG. 9A is a plan view and FIG. 9B is a cross-sectional view taken along the line PP. In the sheet device 75 according to the present embodiment, a plurality of capacitor elements 80 are provided in the central portion of the sheet substrate 76, and at least a plurality of lower electrode layers 77 of the capacitor elements 80 are connected in common and connected to the ground conductor 77A. The upper electrode layer 79 of the capacitor element 80 also functions as a wiring conductor. That is, the lower electrode layer 77 of the sheet-like substrate 76 is formed with an area smaller than the area of the dielectric layer 78. Then, a dielectric layer 78 is formed so as to cover the lower electrode layer 77. Next, the upper electrode layer 79 also serving as a wiring conductor is formed on the upper surface of the dielectric layer 78.

  In this case, for example, a plating film is formed in the connection region 79B of the ground conductor 79A so as to be at least as high as the upper electrode layer 79 also serving as a wiring conductor. A plating film may also be formed on the upper electrode layer 79 that also serves as a wiring conductor. In this case, a protective film is formed in a region other than the connection region on both sides of the upper electrode layer 79 also serving as the wiring conductor and the connection region of the ground conductor 79A, and for example, a plating film is formed so as to be higher than the protective film. It may be. With such a configuration, the reliability can be further improved.

  The configuration for connecting the two wiring boards using the sheet device 75 is basically the same as the method described in the first embodiment, and thus the description thereof is omitted.

  The sheet device 75 of the present embodiment can connect two wiring boards with a simpler structure and can be manufactured at low cost.

  Note that a resistor may be formed between the connection regions of the upper electrode layer that also serves as the wiring conductor. A CR filter can be formed by manufacturing a resistor. For this purpose, when the upper electrode layer 79 is formed, the resistor layer is formed first, and the upper electrode layer 79 is removed by etching only in the region where the resistor is to be formed. It can be easily manufactured.

(Sixth embodiment)
FIGS. 10A and 10B are diagrams showing the configuration of a sheet device 85 according to the sixth embodiment of the present invention, where FIG. 10A is a plan view and FIG. 10B is a cross-sectional view taken along the line QQ. The sheet device 85 according to the present embodiment is characterized in that the sheet-like substrate 86 is made of a dielectric resin obtained by mixing a resin material such as polyimide or polyester and a high dielectric constant material such as barium titanate. It is. An upper electrode layer 87 also serving as a wiring conductor is formed on one surface of the sheet-like substrate 86, and a lower electrode layer 88 is formed on the other surface with an area slightly smaller than the area of the sheet-like substrate 86. Yes. The lower electrode layer 88 on the other surface is connected to the ground conductor 88 </ b> A on the upper electrode layer 87 side through the through conductor 89.

  The configuration for connecting the two wiring boards using the sheet device 85 is basically the same as the method described in the first embodiment, and thus the description thereof is omitted.

  The sheet device 85 according to the present embodiment can connect two wiring boards with a simpler structure, and can be manufactured at low cost.

  Note that a resistor may be formed between the connection regions of the upper electrode layer that also serves as the wiring conductor. A CR filter can be formed by manufacturing a resistor. For this purpose, when the upper electrode layer 79 is formed, the resistor layer is formed first, and the upper electrode layer 79 is removed by etching only in the region where the resistor is to be formed. It can be easily manufactured.

  The sheet device of the present invention can be connected between wiring boards of electronic equipment in a thin shape, and can be connected to a capacitor element for noise removal at the same time as the connection. It is.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining the structure of the sheet | seat device concerning the 1st Embodiment of this invention, (a) is a top view, (b) is sectional drawing cut | disconnected along the AA line It is a figure for demonstrating the structure which connects between two wiring boards using the sheet | seat device of the embodiment, (a) has arrange | positioned the 1st wiring board and the 2nd wiring board in the lower base for fixation. (B) is a plan view thereof, (c) is a cross-sectional view showing a state in which the sheet device is aligned and fixed by an upper base for fixing, and is electrically and mechanically connected, (d) is Equivalent circuit diagram FIG. 5A is a plan view of a sheet device according to the first modification, and FIG. 5B is a plan view of the sheet device according to the second modification. It is a figure which shows the structure of the sheet | seat device concerning the 2nd Embodiment of this invention, (a) is a top view, (b) is sectional drawing cut | disconnected along CC line, (c) is DD Sectional drawing cut along line, (d) is a sectional view cut along line EE It is a figure for demonstrating the structure which connects between two wiring boards using the sheet | seat device of the embodiment, (a) has arrange | positioned the 1st wiring board and the 2nd wiring board in the lower base for fixation. (B) is a plan view thereof, (c) is a cross-sectional view showing a state in which the sheet device is aligned and fixed by an upper base for fixing, and is electrically and mechanically connected. It is a figure which shows the structure of the sheet | seat device concerning the 3rd Embodiment of this invention, (a) is the top view, (b) is sectional drawing cut | disconnected along the HH line | wire It is a figure for demonstrating the structure which connects between two wiring boards using the sheet | seat device of the embodiment, (a) has arrange | positioned the 1st wiring board and the 2nd wiring board in the lower base for fixation. (B) is a plan view thereof, (c) is a cross-sectional view showing a state in which the sheet device is aligned and fixed by an upper base for fixing, and is electrically and mechanically connected. It is a figure which shows the structure of the sheet | seat device concerning the 4th Embodiment of this invention, (a) is the top view, (b) is sectional drawing cut | disconnected along the LL line, (c) is M- Sectional view cut along line M, (d) is a sectional view cut along line NN It is a figure which shows the structure of the sheet | seat device concerning the 5th Embodiment of this invention, (a) is a top view, (b) is sectional drawing cut | disconnected along PP line It is a figure which shows the structure of the sheet | seat device concerning the 6th Embodiment of this invention, (a) is a top view, (b) is sectional drawing cut | disconnected along the QQ line It is a figure which shows an example of the prior art example of the connector with a filter which provided the capacitor for noise removal inside the connector, (a) is an exploded perspective view for demonstrating an assembly method, (b) is a filter element part cut | disconnected Cross section shown It is a figure which shows an example of the prior art example of a structure of the filter formation part of a flexible substrate, (a) is the perspective view, (b) is sectional drawing of a connection part with a connector.

Explanation of symbols

1,25,26,30,50,65,75,85 Sheet device (sheet-like device for inter-board connection)
2, 51, 66, 76, 86 Sheet-like substrate 3, 32A, 35, 52, 67 Wiring conductors 3A, 3B, 5B, 52A, 56A, 67A, 67B, 69B, 79B Connection areas 3C, 32, 67C, 77, 88 Lower electrode layer 4, 33, 55, 68, 78 Dielectric layer 5, 34, 56, 69, 79, 87 Upper electrode layer 5A, 69A, 77A, 79A, 88A Ground conductor 6, 31, 53, 54, 70 , 80 Capacitor element 7, 36, 57 Protective film 10, 37 First wiring board 11, 38 First base material 12, 39 First connection terminal area 14, 40 Second wiring board 15, 41 Second base material 16 , 42 Second connection terminal area 16A Inter-board connection terminal area 16B Ground connection terminal area 18, 43, 60 Lower base for fixing 19, 44, 61 Elastic member 20, 45, 62 Upper for fixing Over the scan 34A ground conductor (wiring conductor)
39A, 42A Element connection terminal area 39B, 42B Ground connection terminal area 39C, 42C Connection terminal area 52B, 52C Part (lower electrode layer)
72 resistor layer 73 resistor 89 through conductor 161 contact element 161A elastic protrusion 162, 177 housing 163 notch 164 substrate 165 ground electrode 166 filter element 167 individual electrode 168 multiple filter mechanism 169 shield frame 170 leaf spring protrusion 171 base film 172 Connection terminal 173 Ground terminal 174 Ground electrode layer 175 Through hole 176 Reinforcement plate 178 Opening 179 Lead terminal 180 Circuit board

Claims (14)

A sheet-like substrate having at least an insulating surface;
A plurality of wiring conductors connecting the connection terminals of the two wiring boards formed on the sheet-like substrate;
A capacitor element composed of a lower electrode layer, a dielectric layer and an upper electrode layer formed on the sheet-like substrate,
A predetermined wiring conductor among the wiring conductors is electrically connected to the lower electrode layer or the upper electrode layer of the capacitor element, and the upper electrode layer or the lower electrode layer of the capacitor element is connected to the wiring conductor. A sheet-like device for board-to-board connection, wherein the sheet-like device is connected to a ground conductor. The sheet-like device for inter-substrate connection according to claim 1, wherein a part of the wiring conductor set in advance is used as the lower electrode layer or the upper electrode layer of the capacitor element. A plurality of the capacitor elements are provided at the center of the sheet-like substrate,
The wiring conductor is formed so as to cross the capacitor element, and connection regions connected to the two wiring boards are respectively arranged on both sides around the capacitor element, and a part of the wiring conductor is part of the capacitor The sheet-like device for board-to-board connection according to claim 2, wherein the lower electrode layer of each element is configured. A plurality of the capacitor elements are provided at the center of the sheet-like substrate,
At least a plurality of the lower electrode layers of the capacitor element are connected in common and connected to the ground conductor,
The sheet-like device for board-to-board connection according to claim 1, wherein the upper electrode layer of the capacitor element also functions as the wiring conductor. The connection area of the wiring conductor connected to the two wiring boards is disposed on one side of the sheet-like board,
The sheet-like device for inter-substrate connection according to claim 1 or 2, wherein a plurality of the capacitor elements are arranged on the other side of the sheet-like substrate. The connection region of the wiring conductor is provided in a central region of the sheet-like substrate;
The said capacitor | condenser element is provided in the both sides on both sides of the said connection area | region, The sheet-like device for board | substrate connection of Claim 1 or Claim 2 characterized by the above-mentioned. A resistor that is connected in series to each connection terminal that connects the two wiring boards is further provided between the connection regions of the wiring board,
The one terminal of the resistor is connected to the lower electrode layer or the upper electrode layer of the capacitor element, and the upper electrode layer or the lower electrode layer is connected to the ground conductor. Item 7. The sheet-like device for board-to-board connection according to item 4 or claim 6. A sheet-like substrate made of a material formed by mixing an inorganic dielectric material with an insulating resin;
A plurality of wiring conductors connected between connection terminals of two wiring boards formed on one surface of the sheet-like board;
A ground wiring conductor formed at a position facing the wiring conductor on the other surface of the sheet-like substrate;
A capacitor element is constituted by the wiring conductor, the sheet-like substrate and the ground wiring conductor,
The inter-substrate connecting sheet-like device, wherein the ground wiring conductor is connected to a ground conductor formed on a surface on which the wiring conductor is formed by a through conductor provided on the sheet-like substrate. A first wiring board having first connection terminal regions formed at a constant pitch on the first substrate;
A second wiring board having second connection terminal regions formed on the second base material at the same pitch as the first connection terminal regions;
An inter-board connection device for electrically connecting the first connection terminal region of the first wiring board and the second connection terminal region of the second wiring board;
9. The connection structure according to claim 1, wherein the inter-substrate connection device is the inter-substrate connection sheet-like device according to any one of claims 1 to 8. A connection region in which electrical connection between the first connection terminal region of the first wiring substrate and the second connection terminal region of the second wiring substrate is formed on the same surface of the inter-substrate connection sheet-like device. The connection structure according to claim 9, wherein the connection structure is performed by: The electrical connection between the first connection terminal area of the first wiring board and the second connection terminal area of the second wiring board elastically presses the connection area of the inter-substrate connection sheet-like device. The connection structure according to claim 10, wherein the connection structure is performed. The electrical connection between the first connection terminal region of the first wiring board and the second connection terminal region of the second wiring board is the connection region and the first connection terminal of the inter-substrate connection sheet-like device. The region and the connection region and the second connection terminal region are each connected by solder or conductive adhesive resin, connected by anisotropic conductive resin, or connected by direct contact and mechanical adhesion by insulating resin. The connection structure according to claim 10, wherein the connection structure is performed by any one of the following. Only in the set first connection terminal region and the second connection terminal region of the first connection terminal region of the first wiring substrate and the second connection terminal region of the second wiring substrate, the substrate The connection structure according to any one of claims 9 to 12, wherein a capacitor element of the sheet-like device for inter-connection is connected. The inter-substrate sheet-like device is further provided with a resistor in the connection region connecting the first connection terminal region and the second connection terminal region, and includes a filter circuit including the capacitor element. The connection structure according to claim 13, wherein the connection structure is configured.

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