CN111831167A - Manufacturing method of capacitive touch panel and capacitive touch panel - Google Patents
Manufacturing method of capacitive touch panel and capacitive touch panel Download PDFInfo
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- CN111831167A CN111831167A CN201910298795.1A CN201910298795A CN111831167A CN 111831167 A CN111831167 A CN 111831167A CN 201910298795 A CN201910298795 A CN 201910298795A CN 111831167 A CN111831167 A CN 111831167A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 57
- 238000004891 communication Methods 0.000 claims abstract description 106
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 238000000034 method Methods 0.000 claims abstract description 46
- 238000012360 testing method Methods 0.000 claims description 39
- 238000001514 detection method Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a method for manufacturing a capacitive touch panel, which mainly comprises the steps of forming a sensing circuit structure on a substrate, and forming a communicating structure on the substrate, wherein the communicating structure is a conductive structure, the communicating structure is arranged adjacent to at least two adjacent side edges of the substrate, and a gap is formed between the communicating structure and a plurality of adjacent electrode structures. Then, a plurality of bridge structures are formed so that a plurality of sensing electrodes of the sensing circuit structure are connected with the communication structure. Finally, the via structures are removed using a laser to form a plurality of output lines. Compared with the traditional manufacturing method, the manufacturing method of the capacitive touch panel has the advantage of relatively low production cost, particularly under the condition of changing the forming position of the output line.
Description
Technical Field
The present invention relates to a method for manufacturing a touch panel and a touch panel, and more particularly, to a method for manufacturing a capacitive touch panel and a capacitive touch panel.
Background
As shown in fig. 1, in the conventional capacitive touch panel P, manufacturers must arrange the output line module PX (including a flexible board for connecting the output lines of the touch panel P) on different sides P1, P2, P3, and P4 of the touch panel P according to different customer requirements. Even if different clients designate the output line modules PX to be disposed on the same side of the touch panel P, the positions designated by different clients may be different, for example, two clients may both designate the output line modules PX to be disposed on the side P1, but one of the client-designated output line modules PX may be disposed near the side P2, and the other client-designated output line module PX may be disposed near the side P3.
With the existing production process of the capacitive touch panel P, when a manufacturer changes the position of the output line module PX, the manufacturer needs to redesign the corresponding mask, which results in a significant increase in production cost.
Disclosure of Invention
Embodiments of the present invention provide a method for manufacturing a capacitive touch panel and a touch panel, so as to solve the problem that manufacturers of the conventional capacitive touch panel have to redesign a mask according to requirements of different customers for different positions of an output line, which greatly increases the production cost.
The embodiment of the invention discloses a manufacturing method of a capacitive touch panel, which comprises the following steps: a sensing circuit structure forming step: forming a sensing circuit structure on a substrate; the sensing circuit structure comprises a plurality of sensing electrodes; the plurality of sensing electrodes are arranged in a plurality of rows; a communicating structure forming step: forming a communicating structure on the substrate, wherein the communicating structure is a conductive structure, the communicating structure is arranged adjacent to at least two adjacent side edges of the substrate, and a gap is formed between the communicating structure and a plurality of adjacent electrode structures; a step of forming a bridge structure: forming a plurality of bridging structures, wherein one ends of the bridging structures are connected with the plurality of sensing electrodes, and the other ends of the bridging structures are connected with the communicating structures; the bridging structure is a conductive structure; an output line forming step: removing a part of the communication structure by laser to make the communication structure become a plurality of output lines, wherein one end of each output line is connected to one sensing electrode through a bridging structure; the output lines are not connected with each other; the output circuit is used for connecting with a control device, and signals correspondingly generated by operating any one sensing electrode can be transmitted to the control device through the output circuit.
Preferably, in the step of forming the output line, at least one shielding structure is correspondingly formed while removing a portion of the communication structure with laser to form the output line, and the shielding structure is not connected to any output line or any sensing electrode.
Preferably, the communicating structure is in the shape of an L, a U or a ring.
Preferably, the method further comprises a substrate cutting step after the output line forming step: cutting the substrate only or simultaneously cutting the substrate and the communication structure; before the substrate cutting step, a mark forming step is also included: forming a plurality of mark structures on a substrate; in the step of cutting the substrate, the substrate is cut according to the plurality of mark structures.
Preferably, between the step of forming the sensing circuit structure and the step of forming the bridge structure, an auxiliary test structure forming step is further included: forming an auxiliary test structure on each sensing electrode adjacent to the outer side edge of the substrate, wherein each auxiliary test structure is a conductive structure; in the step of forming the bridging structures, one ends of the bridging structures are connected with the auxiliary test structures, and the other ends of the bridging structures are connected with the communication structures; the auxiliary test structures can be connected with an external detection device, and the external detection device can detect the conduction state of the sensing electrodes in the same column through the auxiliary test structures.
The embodiment of the invention also discloses a manufacturing method of the capacitive touch panel, which comprises the following steps: a circuit structure forming step: forming a sensing circuit structure and a communication structure on a substrate; the sensing circuit structure comprises a plurality of sensing electrodes; the plurality of sensing electrodes are arranged in a plurality of rows; the communication structure is an annular structure, the sensing circuit structure is correspondingly positioned in an area surrounded by the communication structure, and a gap exists between the communication structure and a plurality of adjacent electrode structures; the communication structure is a conductive structure; a step of forming a bridge structure: forming a plurality of bridging structures, wherein one ends of the bridging structures are connected with the plurality of sensing electrodes, and the other ends of the bridging structures are connected with the communicating structures; the bridging structure is a conductive structure; an output line forming step: removing a part of the communication structure by laser to make the communication structure become a plurality of output lines, wherein one end of each output line is connected to one sensing electrode through a bridging structure; the output lines are not connected with each other; the output circuit is used for connecting with a control device, and signals correspondingly generated by operating any one sensing electrode can be transmitted to the control device through the output circuit.
Preferably, in the step of forming the output line, at least one shielding structure is correspondingly formed while removing a portion of the communication structure to form the output line, and the shielding structure is not connected to any output line or any sensing electrode.
Preferably, the method further comprises a substrate cutting step after the output line forming step: cutting the substrate only or simultaneously cutting the substrate and the communication structure; before the substrate cutting step, a mark forming step is also included: forming a plurality of mark structures on a substrate; in the step of cutting the substrate, the substrate is cut according to the plurality of mark structures.
Preferably, before the step of forming the bridge structure, the method further comprises a step of forming an auxiliary test structure: forming an auxiliary test structure on each sensing electrode adjacent to the outer side edge of the substrate, wherein each auxiliary test structure is a conductive structure; in the step of forming the bridging structures, one ends of the bridging structures are connected with the auxiliary test structures, and the other ends of the bridging structures are connected with the communication structures; the auxiliary test structures can be connected with an external detection device, and the external detection device can detect the conduction state of the sensing electrodes in the same column through the auxiliary test structures.
The embodiment of the invention also discloses a manufacturing method of the capacitive touch panel, which comprises the following steps: a circuit structure forming step: forming a sensing circuit structure and a communication structure on a substrate; the sensing circuit structure comprises a plurality of sensing electrodes; the plurality of sensing electrodes are arranged in a plurality of rows; the communication structure is an annular structure, the sensing circuit structure is correspondingly positioned in the area surrounded by the communication structure, and the communication structure is connected with the plurality of sensing electrodes adjacent to the communication structure; the communication structure is a conductive structure; an output line forming step: removing a portion of the via structure with a laser to make the via structure into a plurality of output lines, one end of each output line being connected to one sensing electrode; the output lines are not connected with each other; (ii) a The output circuit is used for connecting with a control device, and signals correspondingly generated by operating any one sensing electrode can be transmitted to the control device through the output circuit.
Preferably, in the step of forming the output line, at least one shielding structure is correspondingly formed while removing a portion of the communication structure to form the output line, and the shielding structure is not connected to any output line or any sensing electrode.
The embodiment of the present invention further discloses a capacitive touch panel, which is manufactured by using any one of the above methods for manufacturing a touch panel, the capacitive touch panel comprising: the circuit board comprises a substrate, a sensing circuit structure, an output circuit and at least one shielding structure.
In summary, when a manufacturer of a touch panel manufactures the touch panel by using the method for manufacturing a capacitive touch panel according to the embodiment of the present invention, when the output lines are disposed at different positions in response to different customer requirements, the manufacturer only needs to change the forming position of the connection structure and change the position for removing the connection structure without changing the mask related to the manufacture of the sensing circuit structure, thereby greatly improving the production efficiency of the touch panel, greatly reducing the production cost, and flexibly changing the positions of the output lines according to different customer requirements.
Drawings
Fig. 1 is a schematic diagram of the prior art.
Fig. 2 is a flowchart illustrating a method for manufacturing a capacitive touch panel according to a first embodiment of the present invention.
Fig. 3 to 6 are top views of a substrate in different steps of a method for manufacturing a capacitive touch panel according to a first embodiment of the present invention.
Fig. 7 is a flowchart illustrating a manufacturing method of a capacitive touch panel according to a second embodiment of the present invention.
Fig. 8 is a top view of a substrate at a step of a manufacturing method of a capacitive touch panel according to a second embodiment of the present invention.
Fig. 9 is a flowchart illustrating a method for manufacturing a capacitive touch panel according to a third embodiment of the present invention.
Fig. 10 is a top view of a substrate at a step of a method for manufacturing a capacitive touch panel according to a third embodiment of the present invention.
Fig. 11 is a schematic side sectional view of a substrate at a step of a manufacturing method of a capacitive touch panel according to a third embodiment of the invention.
Fig. 12 to 14 are top views of a substrate at different steps of a method for manufacturing a capacitive touch panel according to a third embodiment of the present invention.
Fig. 15 is a flowchart illustrating a manufacturing method of a capacitive touch panel according to a fourth embodiment of the present invention.
Fig. 16 and 17 are top views of a substrate at different steps of a fourth embodiment of the method for manufacturing a capacitive touch panel according to the present invention.
Detailed Description
Referring to fig. 2 to 6 together, fig. 2 is a schematic flow chart illustrating a method for manufacturing a touch panel according to a first embodiment of the present invention, and fig. 3 to 6 are top views of a substrate in different steps of the present embodiment.
As shown in fig. 2, the method for manufacturing a capacitive touch panel of the present invention includes the following steps:
a sensing circuit structure forming step S10: forming a sensing circuit structure 20 on a substrate 10; the sensing circuit structure 20 includes a plurality of sensing electrodes 211, 221; the plurality of sensing electrodes 211, 221 are arranged in a plurality of rows;
a communicating structure forming step S11: forming a communication structure 30 on the substrate 10, where the communication structure 30 is a conductive structure, the communication structure 30 is disposed adjacent to at least two adjacent sides of the substrate 10, and a gap R exists between the communication structure 30 and the adjacent sensing electrodes 211 and 221;
a bridge structure forming step S12: forming a plurality of bridge structures 40, wherein one ends of the bridge structures 40 are connected with the plurality of sensing electrodes 211 and 221, and the other ends of the bridge structures 40 are connected with the communication structure 30; the bridging structure 40 is a conductive structure;
an output line forming step S13: removing a portion of the communication structure 30 with a laser to make the communication structure 30 a plurality of output lines 31, one end of each output line 31 being connected to one of the sensing electrodes 211, 221 through the bridging structure 40; the output lines are not connected with each other;
the output line 31 is used to connect with a control device, and a signal generated by operating any one of the sensing electrodes 211, 221 can be transmitted to the control device through the output line 31. In a specific application, an end of each output line 31 away from the sensing electrodes 211, 221 connected thereto may be used to connect a flexible circuit board.
As shown in fig. 3, it is a top view of the substrate after the sensing circuit structure forming step S10 is performed. In practical applications, the sensing circuit structure 20 may include a multi-column Y-axis sensing channel (Y-channel) structure 21 and a multi-column X-axis sensing channel (X-channel) structure 22; each row of the Y-axis sensing channel structures 21 and each row of the X-axis sensing channel structures 22 respectively include a plurality of sensing electrodes (electrodes) 211 and 221 connected to each other. The sensing circuit structure 20 can be manufactured by, for example, Single-layer ITO (SITO) process technology, Double-layer ITO (DITO) process technology, and the like, which is not limited herein.
In various embodiments, the sensing circuit structure 20 may also include only the multiple rows of the X-axis sensing channel structure 22; alternatively, the sensing circuit structure 20 may include only the multiple rows of the Y-axis sensing channel structure 21. In addition, the shape of each sensing electrode 211, 221 can vary according to requirements, and is shown as an exemplary embodiment.
As shown in fig. 4, it is shown as a top view of the substrate 10 after the above-described communicating structure forming step S11 is performed. In the drawings of the present embodiment, the shape of the communication structure 30 is an L shape, but the shape of the communication structure 30 is not limited thereto, and the shape of the communication structure 30 may be a shape similar to a U (character) or a ring shape (for example, a square shape). In addition, the communication structure 30 in the figure of the present embodiment is generally formed by two rectangles, but the shape of the communication structure 30 is not limited thereto, and the shape of the communication structure 30 may be any shape according to the requirement, for example, the communication structure 30 may also be in an arc shape, but the communication structure 30 is necessarily disposed adjacent to two mutually adjacent sides of the substrate 10.
In fig. 4 of the present embodiment, the communication structure 30 is formed at the upper right corner of the substrate 10, but the forming position of the communication structure 30 is not limited thereto, and the forming position of the communication structure 30 may be changed according to the requirement, for example, the communication structure 30 in fig. 4 may also be located at the lower right corner, the upper left corner, or the lower left corner of the substrate 10. In a specific implementation, the communication structure 30 may be formed on the substrate 10 by printing, etching, or the like, and the material of the communication structure 30 may be, for example, a conductive material such as copper, silver, or the like, which is not limited herein.
As shown in fig. 5, a top view of the substrate 10 after performing the bridge structure forming step S12 is shown. In a specific application, the plurality of bridge structures 40 may be formed by printing silver paste. The plurality of bridge structures 40 are used to connect the communication structure 30 with the adjacent sensing electrodes 211, 221, and therefore, the number of bridge structures 40 corresponds to the number of sensing electrodes 211, 221 adjacent to the communication structure 30.
As shown in fig. 4 to 6, when a manufacturer of a touch panel manufactures the touch panel by the method of the present invention, the position of the output line 31 can be changed by changing the forming position of the communicating structure 30; in the present embodiment, since the step S11 of forming the communication structure is independent of the step S10 of forming the sensing circuit structure, the step S10 of forming the communication structure 30 does not need to be changed correspondingly to the step S3578 of forming the sensing circuit structure, i.e., the step S30 of changing the communication structure does not need to be changed correspondingly to any mask used in the process of changing the sensing circuit structure 20. In contrast, in the conventional method for manufacturing the capacitive touch panel, if the position of the output line is to be changed, the mask needs to be changed correspondingly, which results in an increase in production cost; therefore, compared with the prior art, the manufacturing method of the capacitive touch panel has the technical effect of reducing the production cost.
In addition, as shown in fig. 4, in the embodiment in which the substrate 10 is rectangular, in the sensing circuit structure forming step S10 and the communication structure forming step S11, since the substrate 10 and the communication structure 30 do not have directionality, the sensing circuit structure forming step S10 and the communication structure forming step S11 do not need to be changed regardless of where the output line 31 is desired to be located on the substrate 10. In the present embodiment, the manufacturer of the touch panel only needs to change the position of the connecting structure 30 in the step S13 of forming the output line according to the requirement of the position of the output line 31 by different customers.
In a specific implementation, the output line forming step S13 is executed by, for the most part, making the relevant mechanical equipment perform a laser removing operation on a specific position of the communicating structure 30 according to a predetermined pattern; therefore, the manufacturer may simply change the predetermined pattern when facing the demands of different customers for the positions of the output lines 31.
As shown in fig. 6, after the output line forming step S13, a substrate cutting step may be further included: the substrate 10 is cut. Before the substrate cutting step, a mark forming step may be further included: forming a plurality of mark structures 60 on the substrate; in the substrate cutting step, the substrate 10 is cut according to the plurality of mark structures 60, i.e. the associated cutter may cut the substrate 10 along the imaginary line shown in the figure. In a specific implementation, the mark forming step may be performed after the output line forming step S13, and in the mark forming step, the image capturing unit may be further adapted to capture the image of the substrate 10 to confirm the position of the output line 31, and then determine the forming positions of the plurality of mark structures 60, so as to ensure that the output line 31 is not cut in the substrate cutting step.
Referring to fig. 7 and 8 together, fig. 7 is a schematic flow chart of a manufacturing method of a touch panel according to a second embodiment of the present invention, and fig. 8 is a top view of a substrate in one step of the manufacturing method of the touch panel according to the present embodiment. As shown in fig. 7, the present embodiment is different from the previous embodiments in the following points: the sensing circuit structure forming step S10 may include:
multiple sensing electrode forming step S101: forming a plurality of rows of sensing channel (Y/X channel) structures 21, 22 on the substrate 10; each column of sensing channel structures 21, 22 includes a plurality of sensing electrodes 211, 221 (shown in FIG. 8);
an auxiliary test structure forming step S102: an auxiliary test structure 50 is formed on each of the sensing electrodes 211, 221 adjacent to the outer side of the substrate 10, and each auxiliary test structure 50 is a conductive structure (as shown in fig. 3).
In practical applications, in the auxiliary test structure forming step S102, the plurality of auxiliary test structures 50 may be formed on the substrate 10 by printing, but not limited thereto.
As shown in fig. 5, in the subsequent step S12, one end of the bridge structures 40 is connected to the sensing electrodes 211, 221, and the other end of the bridge structures 40 is connected to the connection structure 30, so that the connection effect between the sensing electrodes 211, 221 and the bridge structures 40 can be enhanced by the design of the auxiliary test structure 50.
As shown in fig. 3, in a specific implementation, each of the auxiliary test structures 50 may be used to connect with an external detection device, and the external detection device can detect the conduction status between the plurality of sensing electrodes 211 and 221 located in the same row through each of the auxiliary test structures 50, so that the touch panel with poor conduction status can be excluded in advance, and the production cost of the subsequent process can be avoided from being wasted.
Specifically, in the present embodiment, the auxiliary test structures 50 are formed in the sensing circuit structure forming step S10, but the auxiliary test structures 50 are not limited to the sensing circuit structure forming step S10. In different embodiments, the auxiliary test structures 50 may be formed in other steps according to the requirements, for example, in the first embodiment of the method for manufacturing a touch panel of the present invention, the auxiliary test structures 50 may be formed on the substrate 10 together with the via structures 30 in the via structure forming step S11, or the auxiliary test structures 50 and the via structures 30 may be formed on the substrate 10 sequentially according to the requirements in the via structure forming step S11.
Referring to fig. 9 to 14 together, fig. 9 is a schematic flow chart illustrating a method for manufacturing a touch panel according to a third embodiment of the present invention, and fig. 10 is a top view of a substrate in one step of the present embodiment; FIG. 11 is a schematic cross-sectional side view of a substrate at a step in the present embodiment; fig. 12 to 14 are top views of the substrate at different steps of the present embodiment.
As shown in fig. 9, the method for manufacturing a touch panel of the present embodiment includes the following steps:
a circuit structure forming step S20: forming a sensing circuit structure 20 and a communication structure 30 on a substrate 10; the sensing circuit structure 20 includes a plurality of sensing electrodes 211, 221; the plurality of sensing electrodes 211, 221 are arranged in a plurality of rows; the communication structure 30 is an annular structure, the sensing circuit structure 20 is correspondingly located in an area surrounded by the communication structure 30, and a gap R exists between the communication structure 30 and the plurality of sensing electrodes 211 and 221 adjacent thereto; the communication structure 30 is a conductive structure;
a bridge structure forming step S21: forming a plurality of bridge structures 40, wherein one ends of the bridge structures 40 are connected with the plurality of sensing electrodes 211 and 221, and the other ends of the bridge structures 40 are connected with the communication structure 30; the bridging structure 40 is a conductive structure;
an output line forming step S22: removing a portion of the communication structure 30 with a laser to make the communication structure 30 a plurality of output lines 31, one end of each output line 31 being connected to one of the sensing electrodes 211, 221 through the bridging structure 40; the respective output lines 31 are not connected to each other;
the output line 31 is used to connect with a control device, and a signal generated by operating any one of the sensing electrodes 211, 221 can be transmitted to the control device through the output line 31.
As shown in fig. 11, the circuit structure forming step S20 may be performed by using a single layer of ito
The (single ito, SITO) process technology forms the sensing circuit structure 20 and the communication structure 30 on the substrate 10 at the same time, and the specific steps may include:
the method comprises the following steps: the metal circuit structure 11 and the via structure 30 are formed on the substrate 10, and the metal circuit structure 11 will be used as the conductive via structure of each row of the X/Y axis sensing channel structure (as shown in fig. 11 (a)). In practical applications, the metal circuit structure 11 and the communication structure 30 can be formed at one time by using the same mask.
Step two: an isolation layer 12 is formed on the substrate 10 and the metal wiring structure 11 (as shown in fig. 11 (b)). In this step, the isolation layer 12 may not be formed on the communication structure 30.
Step three: removing part of the isolation layer 12 to expose part of the metal circuit structure 11 (as shown in fig. 11 (c));
step four: an Indium Tin Oxide (ITO) pattern 13 is formed on the isolation layer 12 and the metal line structure 11 to form a plurality of sensing electrodes (electrodes), a portion of the sensing electrodes is connected to the metal line structure 11 to form a multi-row X-axis sensing channel (X channel) structure, and another portion of the sensing electrodes 211 and 221 forms a multi-row Y-axis sensing channel (Ychannel) structure (as shown in fig. 11 (d)).
In the first step, since the communication structure 30 is a ring structure, no matter which side of the substrate 10 the output line 31 is located, the relevant manufacturer of the touch panel does not need to change the mask for forming the communication structure 30 and the metal line structure 11, thereby avoiding the problem of the prior art that the production cost is increased due to the need of changing the mask.
It should be noted that, in different applications, the circuit structure forming step S20 may also be performed by using a Double-layer ITO (DITO) process technology to simultaneously form the sensing circuit structure 20 and the communication structure 30 on the substrate 10.
As shown in fig. 12, before the step of forming the bridge structure S21, the step of forming the auxiliary test structure (S102) may be further included to form a plurality of auxiliary test structures 50. As shown in fig. 13, in the bridge structure forming step S21, a plurality of bridge structures 40 are formed at positions corresponding to the final output lines 31. That is, in the bridge structure forming step S21 of the present embodiment, the bridge structures 40 may not be formed on all the sensing electrodes 211 and 221 adjacent to the communication structure 30, and the bridge structures 40 are only formed on part of the sensing electrodes 211 and 221.
As shown in fig. 14, in the output line forming step S22, a part of the communication structure 30 is removed by laser to form the output line 31, and at least one shielding structure 32 is correspondingly formed, wherein the shielding structure 32 is not connected to any output line 31 or any sensing electrode 211, 221. The shielding structure 32 can enhance the touch panel's ability to resist external electromagnetic interference. The shape and position of the shielding structure 32 can vary according to requirements, and preferably, the shielding structure 32 can substantially surround the plurality of sensing electrodes 211 and 221 adjacent thereto. In practical applications, in the subsequent substrate cutting step, the touch panel shown in fig. 14 may be cut into a portion of the shielding structure 32 according to requirements.
Referring to fig. 15 to 17 together, fig. 15 is a schematic flow chart illustrating a method for manufacturing a touch panel according to a fourth embodiment of the present invention, and fig. 16 and 17 are top views of a substrate in one step of the present embodiment.
As shown in fig. 15, the method for manufacturing a touch panel of the present embodiment includes the following steps:
a circuit structure forming step S30: forming a sensing circuit structure 20 and a communication structure 30 on a substrate 10; the sensing circuit structure 20 includes a plurality of sensing electrodes 211, 221; the plurality of sensing electrodes 211, 221 are arranged in a plurality of rows; the communication structure 30 is an annular structure, the sensing circuit structure 20 is correspondingly located in the area surrounded by the communication structure 30, and the communication structure 30 is connected with the plurality of sensing electrodes 211 and 221 adjacent to the communication structure; the communication structure 30 is a conductive structure;
an output line forming step S31: removing a portion of the communicating structure 30 with a laser to make the communicating structure 30 into a plurality of output lines 31, one end of each output line 31 being connected to one of the sensing electrodes 211, 221; the respective output lines 31 are not connected to each other;
the output line 31 is used to connect with a control device, and a signal generated by operating any one of the sensing electrodes 211, 221 can be transmitted to the control device through the output line 31.
As shown in fig. 16, a top view of the substrate 10 after the circuit structure forming step S30 is performed is shown. In a specific application, the communication structure 30 may be formed on the substrate 10 together with a portion of the sensing circuit structure 20, or the communication structure 30 may be formed separately after the sensing circuit structure 20 is formed on the substrate 10.
In a specific application, after the circuit structure forming step S30, the bridge structure forming step (S12) may be further included to enhance the connection effect between the communication structure 30 and the plurality of sensing electrodes 211, 221.
Please refer to fig. 6, 14 and 17, which are top views of the touch panel according to the present invention, respectively. The touch panels are manufactured by the method for manufacturing the touch panel of the present invention.
In summary, when manufacturers of touch panels manufacture touch panels by using the method of the present invention, when the output lines are located at different positions of the substrate in response to different customer requirements, the positions of the output lines can be changed by simply changing the forming positions of the communication structures and removing the positions of the communication structures with a laser. Compared with the prior art, the method for manufacturing the touch panel does not need to redesign the photomask when the position of the output line is changed, so that the method for manufacturing the touch panel has the effect of lower production cost compared with the prior art, and can change the position of the output line on the substrate more flexibly according to the requirements of different customers. In addition, in the prior art, when a manufacturer needs to modify the position of the output line, it is necessary to redesign the mask, which requires a lot of time, and thus, the manufacturing method of the touch panel according to the present invention is contrary to the above-mentioned conventional method, and when the position of the output line is modified, it is not necessary to redesign the mask, so that the manufacture method can be more quickly started to be put into mass production.
The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and drawings are included in the scope of the invention.
Claims (12)
1. A method for manufacturing a capacitive touch panel comprises the following steps:
a sensing circuit structure forming step: forming a sensing circuit structure on a substrate; the sensing circuit structure includes a plurality of sensing electrodes; the sensing electrodes are arranged in a plurality of rows;
a communicating structure forming step: forming a communicating structure on the substrate, wherein the communicating structure is a conductive structure, the communicating structure is arranged adjacent to at least two adjacent sides of the substrate, and a gap exists between the communicating structure and the plurality of adjacent sensing electrodes;
a step of forming a bridge structure: forming a plurality of bridging structures, wherein one ends of the bridging structures are connected with the sensing electrodes, and the other ends of the bridging structures are connected with the communication structures; the bridging structure is a conductive structure;
an output line forming step: removing a portion of the communication structure with a laser to make the communication structure into a plurality of output lines, one end of each of the output lines being connected to one of the sensing electrodes through the bridge structure; the output lines are not connected with each other;
the output line is used for being connected with a control device, and signals correspondingly generated when any one of the sensing electrodes is operated can be transmitted to the control device through the output line.
2. The method as claimed in claim 1, wherein in the step of forming the output lines, at least one shielding structure is correspondingly formed while removing portions of the communication structures by laser to form the output lines, and the shielding structure is not connected to any of the output lines or any of the sensing electrodes.
3. The method as claimed in claim 1, wherein the communication structure is L-shaped, U-shaped or annular.
4. The method of claim 1, further comprising a substrate cutting step after the output line forming step: cutting only the substrate or simultaneously cutting the substrate and the communication structure; before the substrate cutting step, a mark forming step is also included: forming a plurality of mark structures on the substrate; in the step of cutting the substrate, the substrate is cut according to a plurality of mark structures.
5. The method as claimed in claim 1, further comprising an auxiliary test structure forming step between the sensing circuit structure forming step and the bridge structure forming step: forming an auxiliary test structure on each sensing electrode adjacent to the outer side edge of the substrate, wherein each auxiliary test structure is a conductive structure; in the step of forming the bridge structure, one end of each of the bridge structures is connected to the auxiliary test structures, and the other end of each of the bridge structures is connected to the communication structure; the auxiliary test structures can be connected with an external detection device, and the external detection device can detect the conduction state among the sensing electrodes positioned in the same column through the auxiliary test structures.
6. A method for manufacturing a capacitive touch panel comprises the following steps:
a circuit structure forming step: forming a sensing circuit structure and a communication structure on a substrate; the sensing circuit structure includes a plurality of sensing electrodes; the sensing electrodes are arranged in a plurality of rows; the communication structure is an annular structure, the sensing circuit structure is correspondingly positioned in an area surrounded by the communication structure, and a gap exists between the communication structure and a plurality of adjacent sensing electrodes; the communication structure is a conductive structure;
a step of forming a bridge structure: forming a plurality of bridging structures, wherein one ends of the bridging structures are connected with the sensing electrodes, and the other ends of the bridging structures are connected with the communication structures; the bridging structure is a conductive structure;
an output line forming step: removing a portion of the communication structure with a laser to make the communication structure into a plurality of output lines, one end of each of the output lines being connected to one of the sensing electrodes through the bridge structure; the output lines are not connected with each other;
the output line is used for being connected with a control device, and signals correspondingly generated when any one of the sensing electrodes is operated can be transmitted to the control device through the output line.
7. The method as claimed in claim 6, wherein in the step of forming the output lines, at least one shielding structure is correspondingly formed while removing a portion of the communication structure to form the output lines, the shielding structure not being connected to any of the output lines or any of the sensing electrodes.
8. The method as claimed in claim 6, further comprising a substrate cutting step after the step of forming the output lines: cutting only the substrate or simultaneously cutting the substrate and the communication structure; before the substrate cutting step, a mark forming step is also included: forming a plurality of mark structures on the substrate; in the step of cutting the substrate, the substrate is cut according to a plurality of mark structures.
9. The method as claimed in claim 6, further comprising an auxiliary test structure forming step before the bridge structure forming step: forming an auxiliary test structure on each sensing electrode adjacent to the outer side edge of the substrate, wherein each auxiliary test structure is a conductive structure; in the step of forming the bridge structure, one end of each of the bridge structures is connected to the auxiliary test structures, and the other end of each of the bridge structures is connected to the communication structure; the auxiliary test structures can be connected with an external detection device, and the external detection device can detect the conduction state among the sensing electrodes positioned in the same column through the auxiliary test structures.
10. A method for manufacturing a capacitive touch panel comprises the following steps:
a circuit structure forming step: forming a sensing circuit structure and a communication structure on a substrate; the sensing circuit structure includes a plurality of sensing electrodes; the sensing electrodes are arranged in a plurality of rows; the communication structure is an annular structure, the sensing circuit structure is correspondingly positioned in an area surrounded by the communication structure, and the communication structure is connected with the plurality of sensing electrodes adjacent to the communication structure; the communication structure is a conductive structure;
an output line forming step: removing a portion of the communication structure with a laser to make the communication structure into a plurality of output lines, one end of each of the output lines being connected to one of the sensing electrodes; the output lines are not connected with each other;
the output line is used for being connected with a control device, and signals correspondingly generated when any one of the sensing electrodes is operated can be transmitted to the control device through the output line.
11. The method as claimed in claim 10, wherein in the step of forming the output lines, at least one shielding structure is correspondingly formed while removing a portion of the communication structure to form the output lines, and the shielding structure is not connected to any of the output lines or any of the sensing electrodes.
12. A capacitive touch panel manufactured by the method of manufacturing a capacitive touch panel according to any one of claims 2, 7 and 11, the capacitive touch panel comprising: the substrate, the sensing circuit structure, the output line and the shielding structure.
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| CN201910298795.1A CN111831167A (en) | 2019-04-15 | 2019-04-15 | Manufacturing method of capacitive touch panel and capacitive touch panel |
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| CN201910298795.1A CN111831167A (en) | 2019-04-15 | 2019-04-15 | Manufacturing method of capacitive touch panel and capacitive touch panel |
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