CN104216542A - Touch panel and manufacturing method thereof - Google Patents

Touch panel and manufacturing method thereof Download PDF

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Publication number
CN104216542A
CN104216542A CN201310213407.8A CN201310213407A CN104216542A CN 104216542 A CN104216542 A CN 104216542A CN 201310213407 A CN201310213407 A CN 201310213407A CN 104216542 A CN104216542 A CN 104216542A
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China
Prior art keywords
contact panel
sensing serials
insulation course
ground wire
conductive
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CN201310213407.8A
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Chinese (zh)
Inventor
陈建宇
庄文奇
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AU Optronics Corp
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AU Optronics Corp
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Priority to CN201310213407.8A priority Critical patent/CN104216542A/en
Publication of CN104216542A publication Critical patent/CN104216542A/en
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Abstract

The invention relates to a touch panel and a manufacturing method of the touch panel. The manufacturing method comprises the steps that a substrate is provided, wherein the substrate is provided with a touch area and a peripheral area; a metal layer is formed in the peripheral area and comprises a ground lead, a plurality of connection pads and a plurality of transmission lines; a first insulation layer is formed on the metal layer and provided with a plurality of first blow holes corresponding to the connection pads and the ground lead, wherein the arrangement space between every two adjacent blow holes is equal to the arrangement space between every two connection pads; a second insulation layer is formed on the first insulation layer and provided with a plurality of second blow holes corresponding to the first blow holes. The multiple electric virtual connection pads are formed on the ground lead, so that the connection pads are free in position, only a photomask used when the metal layer is formed needs to be changed when the requirements of clients for the positions of the connection pads are changed, other photomasks do not need to be changed, universality of a processing tool is improved, the production cost is reduced, and production convenience is improved.

Description

Contact panel and manufacture method thereof
Technical field
The present invention relates to a kind of contact panel and manufacture method thereof, relate in particular to a kind of contact panel and manufacture method thereof that virtual link pad (dummy pad) is set on ground wire.
Background technology
Contact panel (Touch Panel) applies in the product application such as household electrical appliances, communication, electronic information in a large number.As the personal digital assistant (PDA) of extensive commercialization at present, various home appliance, game input interface etc.By the integration of Trackpad and display, be available for users to point or pointer clicks action that input institute wish carries out as personal digital assistant (PDA), various home appliance, game input interface according to the function choosing-item in display frame, and be utilized popular system queries instrument etc., so that the operating system of convenience-for-people effect to be provided.
Known contact panel is to lay induction region at a substrate surface, and its induction region is the object of responding to the finger of human body or the signal of induction pen and reach touch-control.The material that this induction region uses mostly adopts transparent conductive film (for example tin indium oxide ITO), makes user in the time of operation, by pressing this transparent conductive film to corresponding picture on this display, reaches the function of touch-control.
The touch-control principle often adopting at present generally can be divided into the different know-whies such as resistance-type, capacitor induction type, infrared induction, induction, sound wave induction type.Wherein the principle of work of this capacitor induction type Trackpad is the capacitance variations of utilizing the electrostatical binding between transparency electrode and the human body of arranging to produce, detects the coordinate of its position of touch from produced induced current.Because capacitor induction type contact panel is got life-span, operating temperature and initial strength everyway ready at penetrability, hardness, accuracy rate, reaction time, touch-control and is had better advantage, therefore adopted in a large number at present.
Please refer to Figure 1A and Figure 1B, the floor map of the contact panel that Figure 1A is prior art; Figure 1B is the cut-open view of section P-P in Figure 1A.Contact panel 10 comprises Touch Zone 11 and external zones 12, Touch Zone 11 is provided with transparent conductive film (not shown) for realizing touch controllable function, external zones 12 is provided with connection gasket 13, connection gasket 13 is electrically connected with the transparent conductive film in Touch Zone 11, in addition, connection gasket 13 such as, is electrically connected with external circuits (IC, FPC etc.), to realize the I/O of signal.The transparent conductive film of contact panel 10 altogether need be through five layer film processing procedures together with peripheral metal line, every thin film forms through operations such as coating, exposure, development, etching and strippings, when forming those transparent conductive films, form connection gasket 13, be that connection gasket 13 is also through five layer film processing procedures, as shown in Figure 1B, connection gasket 13 is arranged on glass substrate 14, and it comprises metal level 15, the first conductive layer 16, the second conductive layer 17, the first insulation course 18 and the second insulation course 19.
General, determine in response to customer demand the formation position of connection gasket 13 on substrate 14, in the time that client proposes change request to the position of connection gasket 13, because connection gasket 13 and the conducting wire of Touch Zone form simultaneously, once change connection gasket 13 positions, the transmission region of light shield needs to adjust, cause the light shield using in five layer film processing procedures all to need again to make, thereby cause the manufacturing cost of contact panel to rise, therefore improve the direction that the versatility of process tool, the cost industry of reducing production costs are made great efforts.
Summary of the invention
In order to address the above problem, the present invention proposes a kind of contact panel and manufacture method thereof that virtual link pad (dummy pad) is set on ground wire.
To achieve these goals, the present invention proposes a kind of manufacture method of contact panel, and the manufacture method of this contact panel comprises steps A: substrate is provided, and this substrate has Touch Zone and external zones; Step B: form metal level on this external zones, this metal level comprises ground wire, a plurality of connection gasket and a plurality of transmission lines, one end of these a plurality of transmission lines is selected one with these a plurality of connection gaskets respectively and is connected, and the two ends of this ground wire are electrically connected with two these connection gaskets respectively; Step C: form the first insulation course on this metal level, this first insulation course to should a plurality of connection gaskets and this ground wire there are a plurality of the first holes, so that this ground wire of these a plurality of connection gaskets and this first broken hole position is exposed, the arrangement pitches of adjacent this first holes equals the arrangement pitches of adjacent this connection gasket; And step D: form the second insulation course on this first insulation course, this second insulation course is to having a plurality of the second holes by a plurality of the first holes.
As optional technical scheme; between step B and step C, also comprise step B1: on this substrate, form the first conductive layer; this first conductive layer comprises a plurality of the first conductive patterns that are positioned at this external zones; this plural number first conductive pattern is positioned at these a plurality of first broken hole positions and covers these a plurality of connection gaskets and be positioned at this ground wire of this first broken hole position, to protect these a plurality of connection gaskets and to be positioned at this ground wire of this first broken hole position.
As optional technical scheme, step B1 also comprises: this first conductive layer also comprises a plurality of the first sensing serials that are positioned at this Touch Zone, these a plurality of first sensing serials are electrically connected with the other end of a plurality of these transmission lines respectively, this first sensing serials comprises a plurality of the first sensor pads, this first sensor pad adjacent in same this first sensing serials is by the first wire electrical connection, and this first insulation course covers this first wire.
As optional technical scheme, between step C and step D, also comprise step C1: on this substrate, form the second conductive layer, this second conductive layer comprises a plurality of the second conductive patterns that are positioned at this external zones, these a plurality of second conductive pattern correspondences are covered on these a plurality of first conductive patterns, and this second conductive pattern is electrically connected with this first conductive pattern.
As optional technical scheme, step C1 also comprises: this second conductive layer also comprises a plurality of the second sensing serials that are positioned at this Touch Zone, these a plurality of second sensing serials are electrically connected with the other end of a plurality of these transmission lines respectively, these a plurality of second sensing serials and this plurality of the first sensing serials are staggered, this second sensing serials comprises a plurality of the second sensor pads that are electrically connected to each other, and adjacent this second sensor pad is by the second wire electrical connection.
As optional technical scheme, after step D, also comprise step e: circuit module is provided, this circuit module is welded on these a plurality of second conductive patterns.
Contact panel of the present invention forms a plurality of electrical virtual link pads in the setting area of connection gasket, make the position of connection gasket select to become freely, in the time that client occurs to change to the locational requirement of connection gasket, only need to change the light shield using while forming metal level, all the other several roads light shields all do not need to change, the versatility that has improved process tool, has reduced production cost, has increased the convenience of producing.
In addition, the present invention also proposes a kind of contact panel, and this contact panel comprises substrate, metal level, the first insulation course and the second insulation course.This substrate has Touch Zone and external zones; This metal level is positioned at this external zones, and this metal level comprises ground wire, a plurality of connection gasket and a plurality of transmission lines, and one end of these a plurality of transmission lines is selected one with these a plurality of connection gaskets respectively and is connected, and the two ends of this ground wire are electrically connected with two these connection gaskets respectively;
The first insulation course is formed on this metal level, this first insulation course to should a plurality of connection gaskets and this ground wire there are a plurality of the first holes, so that this ground wire of these a plurality of connection gaskets and this first broken hole position is exposed, the arrangement pitches of adjacent this first holes equals the arrangement pitches of adjacent this connection gasket; The second insulation course is formed on this first insulation course, and this second insulation course is to having a plurality of the second holes by a plurality of the first holes.
As optional technical scheme; this contact panel also comprises the first conductive layer; this first conductive layer comprises a plurality of the first conductive patterns that are positioned at this external zones; these a plurality of the first conductive patterns cover this ground wire of these a plurality of connection gaskets and these a plurality of the first broken hole positions, to protect this ground wire in these a plurality of connection gaskets and this plurality of first broken vacancy.
As optional technical scheme, this first conductive layer also comprises a plurality of the first sensing serials that are positioned at this Touch Zone, these a plurality of first sensing serials are electrically connected with the other end of a plurality of these transmission lines respectively, this first sensing serials comprises a plurality of the first sensor pads, this first sensor pad adjacent in same this first sensing serials is by the first wire electrical connection, and this first insulation course covers this first wire.
As optional technical scheme, this contact panel also comprises the second conductive layer, and this second conductive layer comprises a plurality of the second conductive patterns, and these a plurality of second conductive patterns cover and be electrically connected this plurality of the first conductive patterns.
The manufacture method of contact panel of the present invention is done corresponding design for the light shield using in other which floor thin film manufacture process that form metal level, make the setting area of these other the corresponding connection gaskets of several layer films form holes or conductive pattern, the a plurality of electrical virtual link pads of final formation, then make the position of connection gasket select to become freely, in the time that client occurs to change to the locational requirement of connection gasket, only need to change the light shield using while forming metal level, all the other several roads light shields all do not need to change, improve the versatility of process tool, reduce production cost, increase the convenience of producing.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Brief description of the drawings
Figure 1A is the floor map of the contact panel of prior art;
Figure 1B is the cut-open view of section P-P in Figure 1A;
Fig. 2 A is the floor map of contact panel one embodiment of the present invention;
Fig. 2 B is the cut-open view of section A-A in Fig. 2 A;
Fig. 3 is the manufacturing flow chart of contact panel of the present invention;
Fig. 4 A is the floor map that forms metal level on substrate;
Fig. 4 B is the cut-open view of section B-B in Fig. 4 A;
Fig. 5 A is the floor map that forms the first conductive layer on substrate;
Fig. 5 B is the cut-open view of section C-C in Fig. 5 A;
Fig. 6 A is the floor map that forms the first insulation course on the first conductive layer;
Fig. 6 B is the cut-open view of section D-D in Fig. 6 A;
Fig. 7 A is the floor map that forms the second conductive layer on substrate;
Fig. 7 B is the cut-open view of section E-E in Fig. 7 A.
Embodiment
Please refer to Fig. 2 A and Fig. 2 B, Fig. 2 A is the floor map of contact panel one embodiment of the present invention; Fig. 2 B is the cut-open view of section A-A in Fig. 2 A.Substrate 100 of the present invention has Touch Zone 110 and external zones 120.On Touch Zone 110, touch-control structure is set, on external zones 120, metallic circuit is set.
Contact panel in the present embodiment forms by five layer film processing procedures, and the sequencing of its making is as follows: (1) metal level 200, is positioned at external zones 120; (2) first conductive layers 300, comprise and are positioned at a plurality of the first conductive patterns 310 on external zones 120 and are positioned at a plurality of the first sensing serials 320 on Touch Zone 110; (3) first insulation courses 400, comprise and are positioned at the first insulation division 410 on external zones 120 and are positioned at the second insulation division 420 on Touch Zone; (4) second conductive layers 500, comprise and are positioned at a plurality of the second conductive patterns 510 on external zones 120 and are positioned at a plurality of the second sensing serials 520 on Touch Zone 110; (5) second insulation courses 600, cover other region except a plurality of the second conductive patterns 510 on contact panel.
In the present embodiment, the metal level 200 arranging on external zones 120 comprises ground wire 210, a plurality of connection gasket 220 and a plurality of transmission lines 230, one end 231 of a plurality of transmission lines 230 is selected one with a plurality of connection gaskets 220 respectively and is connected, and 211 and 212, the two ends of ground wire 210 are electrically connected with two connection gaskets 220 respectively.It should be noted that, two connection gaskets 220 that are connected with ground wire 210 are not connected with a plurality of transmission lines 230.
As shown in Figure 2 B, on ground wire 210, be uniformly distributed the first conductive pattern 310, the arrangement pitches of adjacent connection gasket 220 is P1, the arrangement pitches of adjacent the first conductive pattern 310 is P2, wherein P2=P1, be the arrangement pitches that the arrangement pitches of adjacent the first conductive pattern 310 equals adjacent connection gasket 220, and both shape sizes are identical.
In the present embodiment, the second conductive pattern 510 is covered on the first conductive pattern 310, is in succession coated with the first conductive pattern 310 and the second conductive pattern 510 on connection gasket 220.The first insulation course 400 has formed a plurality of the first holes 411 in a plurality of first conductive pattern 310 place's correspondences, the second insulation course 610 has formed a plurality of the second holes 611 in a plurality of second conductive pattern 510 place's correspondences, such design makes the second conductive pattern 510 finally exposed, when contact panel need to be when external circuits plate (not shown) be connected, the signal terminal on external circuits plate is electrically connected with those second conductive patterns 510 that cover on a plurality of connection gaskets 220.
Because the ground wire 210 in the present embodiment and connection gasket 220 are to form at first, follow-up also needs through four-level membrane processing procedure, connection gasket 220 needs to be electrically connected with external circuits after contact panel manufacture completes, therefore from its form after always in exposed state, the ground wire 210 at the first holes 411 places is also in naked state, in subsequent thin film processing procedure, be subject to the corrosion of gas/liquid for fear of both, oxidation, affect end product quality and/or have reliability problem, therefore cover the first conductive pattern 310 on the ground wire 210 at the first holes 411 places and a plurality of connection gasket 220, thereby play the effect of protection metal level.And the second conductive pattern 510 is covered on the first conductive pattern 310, can further guarantee to protect the effect of metal level.
The first conductive pattern 310 and the second pattern 510 are identical with the material that the touch-control structure on Touch Zone 110 adopts, and form simultaneously, the chemical reagent that use in processing procedure process etc. are less to the burn into oxidation affects of the first conductive pattern 310 and the second conductive pattern 510, therefore those second conductive patterns 510 of follow-up covering connection gasket 220 are not affected with the effect that is connected of external circuits plate.
In the present embodiment, the first conductive pattern 310 and the second conductive pattern 510 on the ground wire 210 at connection gasket 220 and the first holes 411 places, are covered, in practical operation, also can only cover the first conductive pattern 310 or only cover the second conductive pattern 510, even both all do not cover.And in the time only covering one deck conductive pattern, can consider, in external zones 120, a layer insulating is only set.User can decide in its sole discretion according to actual needs, not as limit.
In the present embodiment, the touch-control structure arranging on Touch Zone 110 includes the first sensing serials 320 and the second sensing serials 520, and in the present embodiment, the first sensing serials 320 is perpendicular to the second sensing serials 520.In practical operation, the first sensing serials 320 and the second sensing serials 520 can also be laid on substrate 100 by other non-perpendicular corresponding angle.
Each first sensing serials 320 comprises a plurality of the first sensor pads 321 and a plurality of the first wires 322, each first sensor pad 321 is arranged on substrate 100 with the first axial XX ' direction equi-spaced apart, and respectively defines the second sensor pad configuring area 323 in the region between the first adjacent sensing serials 320 and between two adjacent the first sensor pads 321.The first sensor pad 321 adjacent in same the first sensing serials 320 is connected by the first wire 322.Each first sensor pad 3211 in same the first sensing serials 320 is after a plurality of first wires 322 are connected in series, be connected with the other end 232 of transmission line 230, and transmit signals to the control circuit (not shown) on an external circuits plate via transmission line 230.The surface of each the first wire 132 is respectively coated with the second insulation division 420.The first insulation course 400 is selected from the material with electrical insulation characteristics, and transparent insulating material (material such as such as silicon dioxide) preferably.
Each second sensing serials 520 comprises a plurality of second sensor pad 521 and a plurality of second wires 522.In the present embodiment, each second sensor pad 521 is to be arranged on substrate 100 with the second axial YY ' direction equi-spaced apart, and each second sensor pad 521 is arranged on the second sensor pad configuring area 323 one by one.In same the second sensing serials 520, between adjacent the second sensor pad 521, be connected by the second wire 522, and the second wire 522 is across the surface of crossing the second insulation division 420, so that the second sensor pad 521 adjacent in same the second sensing serials 520 is connected.Each second sensor pad 521 in same the second sensing serials 520, after a plurality of second wires 522 are connected in series, is also connected with the other end 232 of a transmission line 230, also via transmission line 230, signal is transmitted in to the control circuit on external circuits plate.
In Fig. 2 A, the second insulation division 420 arranging between the first wire 322 and the second wire 522 makes the second wire 522 between each adjacent the second sensor pad 521 in each second sensing serials 520 in the time crossing over the first corresponding wire 322, insulated from each other with the first wire 322.
In the present embodiment, substrate 100 can be glass substrate, and the first sensing serials 320 of touch-control structure and the second sensing serials 520 are transparent conductive film (for example tin indium oxide ITO conductive layers).In the present embodiment, the shape of each first sensor pad 321 and the second sensor pad 521 is hexagonal geometric profile shapes, the geometric profile shape that certainly also can be designed to other, such as rhombus, square etc., to form the effective touch-control surface of densely covered optimization on the surface at substrate 100.
Please refer to Fig. 3 to Fig. 7 B, the manufacturing flow chart that Fig. 3 is contact panel of the present invention; Fig. 4 A is the floor map that forms metal level on substrate; Fig. 4 B is the cut-open view of section B-B in Fig. 4 A; Fig. 5 A is the floor map that forms the first conductive layer on substrate; Fig. 5 B is the cut-open view of section C-C in Fig. 5 A; Fig. 6 A is the floor map that forms the first insulation course on the first conductive layer; Fig. 6 B is the cut-open view of section D-D in Fig. 6 A; Fig. 7 A is the floor map that forms the second conductive layer on substrate; Fig. 7 B is the cut-open view of section E-E in Fig. 7 A.
In the present embodiment, contact panel forms via five layer film processing procedures, and it comprises the steps:
Steps A: substrate 100 is provided, and substrate 100 has Touch Zone 110 and external zones 120.
Step B: form metal level 200 on external zones 120, metal level 200 comprises ground wire 210, a plurality of connection gasket 220 and a plurality of transmission lines 230, one end 231 of a plurality of transmission lines 230 is selected one with a plurality of connection gaskets 220 respectively and is connected, and the two ends 211 and 212 of ground wire 210 are electrically connected with two connection gaskets 220 respectively.
As shown in Fig. 4 A and Fig. 4 B, in this step, a upper sputter in surface prior to the substrate 100 that cleaned forms metal film layer, utilize that photoresist is coated with, exposes on metal film layer, the processing such as development, etching and stripping, use the metal level 200 that formation comprises ground wire 210, connection gasket 220 and transmission line 230 on substrate 100.It should be noted that, used in this step first light shield.
Because ground wire 210 and transmission line 230 all need to be connected with connection gasket 220, in the time that client proposes to change to the position of connection gasket 220, the cabling of ground wire 210 and transmission line 230 all needs to change, and first light shield cannot be general, must redesign, make new first light shield.
Step B1: form the first conductive layer 300, the first conductive layers 300 and comprise a plurality of the first conductive patterns 310 that are positioned at external zones 120 and a plurality of the first sensing serials 320 that are positioned at Touch Zone on substrate 100.
As shown in Fig. 5 A and Fig. 5 B, in this step, first sputter layer of transparent conductive membrane layer is on substrate 100, in the present embodiment, this transparent conductive film layer is tin indium oxide (ITO) layer, then utilizes that photoresist is coated with on transparent conductive film layer, the processing such as exposure, pre-baked, development and stripping, uses forming the first conductive layer 300, it should be noted that, used in this step second light shield.
Be positioned at a plurality of the first conductive patterns 310 on external zones 120 for the protection of a plurality of connection gaskets 220 and ground wire 210; wherein a part of the first conductive pattern 310 is uniformly distributed on ground wire 210; another part the first conductive pattern 310 covers those connection gaskets 220, and the arrangement pitch P2 of adjacent the first conductive pattern 310 equals the arrangement pitch P1 of adjacent connection gasket 220.A plurality of the first sensing serials 320 that are positioned on Touch Zone 110 are electrically connected with the other end 232 of a plurality of transmission lines 230 respectively, the first sensing serials 320 comprises a plurality of the first sensor pads 321, and the first sensor pad 321 adjacent in same the first sensing serials 320 is electrically connected by the first wire 322.
In the present embodiment, because a part of the first conductive pattern 310 covers a plurality of connection gaskets 220, another part the first conductive pattern 310 is uniformly distributed on ground wire 210, and the shape size of two-part the first conductive pattern 310 is identical, arrangement pitches equates, the first conductive pattern 310 is a whole circle and is uniformly distributed shape, therefore corresponding design is done in the setting area of the corresponding connection gasket of the second light shield using in this step, for example a whole circle is set and is uniformly distributed according to corresponding the first conductive pattern 310 of the characteristic of the photoresistance adopting in processing procedure (positive photoresistance or negative photoresistance), the light hole that shape size is identical, or light tight design etc. is carried out in the position of corresponding the first conductive pattern 310, because second light shield has been done corresponding design in the setting area of connection gasket 220, make the position of connection gasket 220 arrange unrestricted, in the time that client proposes to change to the position of connection gasket 220, do not need to change second light shield, can be general.
Step C: form the first insulation course 400 on metal level 200 and the first conductive layer 300.
As shown in Fig. 6 A and Fig. 6 B, deposition insulation coating, on the first conductive layer 300 and metal level 200, utilizes the processing such as photoresist is coated with, exposes, develops, admittedly bakes on insulation coating, uses and forms the first insulation course 400.It should be noted that, use in this step Liao tri-road light shields.
The first insulation course 400 comprises and is positioned at the first insulation division 410 on external zones 120 and is positioned at the second insulation division 420 on Touch Zone 110.In order to make the first conductive pattern 310 exposed; the first insulation division 410 forms the first holes 411 in the first conductive pattern 310 places; the arrangement pitches P3 of adjacent the first holes 411 equals the arrangement pitches P1 of adjacent connection gasket 220; other regions on external zones 120 are covered by the first insulation division 410, are then protected.The second insulation division 420, for covering those the first wires 322, avoids follow-up the first wire 322 to be electrically connected with the second wire 522.
In the present embodiment, because the first holes 411 is that corresponding the first conductive pattern 310 arranges, and being a whole circle, the first conductive pattern 310 is uniformly distributed, therefore being also a whole circle, the first holes 411 is uniformly distributed, do corresponding design therefore use the setting area of the corresponding connection gasket of tri-road light shield in this step, for example a whole circle is set and is uniformly distributed according to corresponding the first holes 411 of the characteristic of the photoresistance adopting in processing procedure (positive photoresistance or negative photoresistance), the light hole that shape size is identical, or light tight design etc. is carried out in the position of corresponding the first holes 411, because San road light shield has been done corresponding design in the setting area of connection gasket 220, make the position of connection gasket 220 arrange unrestricted, in the time that client proposes to change to the position of connection gasket 220, do not need to change San road light shield, can be general.
Step C1: form the second conductive layer 500, the second conductive layers 500 and comprise and be positioned at a plurality of the second conductive patterns 510 on external zones 120 and be positioned at a plurality of the second sensing serials 520 on Touch Zone 110 on substrate 100.
As Fig. 7 A and Fig. 7 B, sputter layer of transparent conductive membrane layer is on substrate 100, in the present embodiment, this transparent conductive film layer is tin indium oxide (ITO) layer, utilize subsequently that photoresist is coated with on ITO layer, the processing such as exposure, pre-baked, development and stripping, use and form as the second conductive layer 500.It should be noted that, use in this step Liao tetra-road light shields.
A plurality of the second conductive pattern 510 correspondences that are positioned at external zones 120 are covered on a plurality of the first conductive patterns 310, and the second conductive pattern 510 is electrically connected with the first conductive pattern 310.A plurality of the second sensing serials 520 that are positioned on Touch Zone 110 are electrically connected with the other end 231 of a plurality of transmission lines 230 respectively, it should be noted that, every transmission lines 230 only connects first sensing serials 320 or only connects a second sensing series connection 520, a plurality of the second sensing serials 520 are interlocked and are not electrically connected mutually with a plurality of the first sensing serials 320, the second sensing serials 520 comprises a plurality of the second sensor pads 521 and a plurality of the second wires 522, and the second sensor pad 521 adjacent in same the second sensing serials 520 is electrically connected by the second wire 522.
In the present embodiment, because a plurality of the second conductive patterns 510 are covered on a plurality of the first conductive patterns 310, corresponding the first conductive pattern 310 of the second conductive pattern 510 arranges, and being a whole circle, the first conductive pattern 310 is uniformly distributed, therefore being also a whole circle, the second conductive pattern 510 is uniformly distributed, do corresponding design therefore use the setting area of the corresponding connection gasket of tetra-road light shield in this step, for example a whole circle is set and is uniformly distributed according to corresponding the second conductive pattern 510 of the characteristic of the photoresistance adopting in processing procedure (positive photoresistance or negative photoresistance), the light hole that shape size is identical, or light tight design etc. is carried out in the position of corresponding the second conductive pattern 510, because Si road light shield has been done corresponding design in the setting area of connection gasket 220, make the position of connection gasket 220 arrange unrestricted, in the time that client proposes to change to the position of connection gasket 220, do not need to change Si road light shield, can be general.
It should be noted that, in the present embodiment, the first sensing serials 320 and the second sensing serials 520 are respectively at forming in double-layer films processing procedure, in practical operation, also can first form the first sensing serials 320 and a plurality of the second sensor pad 521, on a plurality of the first wires 322, cover after insulation course, then formed a plurality of the second wires 522, and adjacent the second sensor pad 521 in same the second sensing serials 520 has been electrically connected; Otherwise, first form the second sensing serials 520 and a plurality of the first sensing serials 321, on a plurality of the second wires 522, cover after insulation course, then formed a plurality of the first wires 322, and adjacent the first sensor pad 321 in same the first sensing serials 320 has been electrically connected.
In practical operation, user also can first form the first wire 322, then on substrate 100, form insulation course, on the insulation course at corresponding the first wire 322 places, offer two holes with exposed portions serve the first wire 322, forming the first wire 322 exposing in a plurality of the first sensor pads 321 and 520, two hole places of a plurality of the second sensing serials is electrically connected the first sensor pad 521 adjacent in same the first sensing serials 320 again; Or first form the second wire 522, then on substrate 100, form insulation course, on the insulation course at corresponding the second wire 522 places, offer two holes with exposed portions serve the second wire 322, form again a plurality of the first sensing serials 320 and a plurality of the second sensor pad 521, the second wire 522 that expose at two hole places is electrically connected the second sensor pad 521 adjacent in same the second sensing serials 520, user can select according to actual needs voluntarily, not as limit.
Step D: form corresponding a plurality of the second conductive patterns 510 of the second insulation course 600, the second insulation course 600 and there are a plurality of the second holes 610 on substrate 100.
As shown in Figure 2 A and 2 B, deposition insulation coating, on the second conductive layer 500, utilizes the processing such as photoresist is coated with, exposes, develops, admittedly bakes on this insulation coating, uses and forms the second insulation course 600.It should be noted that, use in this step Liao five road light shields, can be general.
The second insulation course 600 is for the protection of the established touch-control structure of industry on contact panel and metallic circuit; therefore the second insulation course 600 covers other region except a plurality of the second conductive patterns 610 on contact panel; in order to make a plurality of the second conductive patterns 510 exposed; corresponding the second conductive pattern 510 of the second insulation course 600 is provided with the second holes 611, and the arrangement pitches P4 of adjacent the second holes 611 equals the arrangement pitches P1 of adjacent connection gasket 220.
In the present embodiment, because corresponding the second conductive pattern 510 of the second holes 611 arranges, and being a whole circle, the second conductive pattern 510 is uniformly distributed, therefore being also a whole circle, the second holes 611 is uniformly distributed, do corresponding design therefore use the setting area of the corresponding connection gasket of five road light shield in this step, for example a whole circle is set and is uniformly distributed according to corresponding the second holes 611 of the characteristic of the photoresistance adopting in processing procedure (positive photoresistance or negative photoresistance), the light hole that shape size is identical, or light tight design etc. is carried out in the position of corresponding the second holes 611, because Wu road light shield has been done corresponding design in the setting area of connection gasket 220, make the setting position of connection gasket 220 unrestricted, in the time that client proposes to change to the position of connection gasket 220, do not need to change Wu road light shield, can be general.
It should be noted that, emphasis of the present invention is for forming second and third that use in the first conductive layer 300, the first insulation course 400, the second conductive layer 500 and the second insulation course 600 processes, Si Ji five road light shields, Zhe Si road light shield arranges the light hole of a whole circle in the setting area of connection gasket 220, make the position of connection gasket 220 arrange unrestricted, in the time that client proposes to change to the position of connection gasket 220, do not need to redesign, make new light shield, as for the production method of the touch-control structure on Touch Zone 110, user can select according to actual needs voluntarily.
Step e: external circuits plate (not shown) is provided, external circuits plate is welded on a plurality of the second conductive patterns 510 that cover those connection gaskets 220.
In the present invention, the second conductive pattern 510 is a whole circle and is uniformly distributed, and connection gasket 220 can be arranged on the optional position in this whole circle.In practical operation, if when the position of connection gasket 220 is chosen as position A and position B, can consider not arrange the conductive pattern of a whole circle, only arrange in these two positions; Or the position of connection gasket 220 is while being chosen as a certain side of contact panel, also can consider not arrange the conductive pattern of a whole circle, only, in this side setting, user can select according to actual needs voluntarily, not as limit.
In the present embodiment, contact panel forms via five layer film processing procedures, except the setting position that forms the corresponding connection gasket of other four-level membranes this one deck of ground wire has formed holes or conductive pattern, to form electrical virtual link pad; In practical operation, if contact panel is formed by four-level membrane processing procedure, except the setting position that forms the corresponding connection gasket of other three-layer thin-films this one deck of ground wire forms holes or conductive pattern, to form electrical virtual link pad.In practical operation, contact panel also may six layer film processing procedures form, even formed by three layers, double-layer films, user can operate according to the number of plies of contact panel actual film, not as limit.
The manufacture method of contact panel of the present invention is done corresponding design for the light shield using in other which floor thin film manufacture process that form metal level, make the setting position of these other the corresponding connection gaskets of several layer films form holes or conductive pattern, the a plurality of electrical virtual link pads of final formation, then make the position setting of connection gasket become freely, in the time that client occurs to change to the locational requirement of connection gasket, only need to change the light shield using while forming metal level, all the other several roads light shields all do not need to change, improve the versatility of process tool, reduce production cost, increase the convenience of producing.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (10)

1. a manufacture method for contact panel, is characterized in that comprising:
Steps A: substrate is provided, and this substrate has Touch Zone and external zones;
Step B: form metal level on this external zones, this metal level comprises ground wire, a plurality of connection gasket and a plurality of transmission lines, one end of these a plurality of transmission lines is selected one with these a plurality of connection gaskets respectively and is connected, and the two ends of this ground wire are electrically connected with two these connection gaskets respectively;
Step C: form the first insulation course on this metal level, this first insulation course to should a plurality of connection gaskets and this ground wire there are a plurality of the first holes, so that this ground wire of these a plurality of connection gaskets and this first broken hole position is exposed, the arrangement pitches of adjacent this first holes equals the arrangement pitches of adjacent this connection gasket; And
Step D: form the second insulation course on this first insulation course, this second insulation course is to having a plurality of the second holes by a plurality of the first holes.
2. the manufacture method of contact panel according to claim 1; it is characterized in that between step B and step C, also comprising step B1: on this substrate, form the first conductive layer; this first conductive layer comprises a plurality of the first conductive patterns that are positioned at this external zones; this plural number first conductive pattern is positioned at these a plurality of first broken hole positions and covers these a plurality of connection gaskets and be positioned at this ground wire of this first broken hole position, to protect these a plurality of connection gaskets and to be positioned at this ground wire of this first broken hole position.
3. the manufacture method of contact panel according to claim 2, it is characterized in that step B1 also comprises: this first conductive layer also comprises a plurality of the first sensing serials that are positioned at this Touch Zone, these a plurality of first sensing serials are electrically connected with the other end of a plurality of these transmission lines respectively, this first sensing serials comprises a plurality of the first sensor pads, this first sensor pad adjacent in same this first sensing serials is by the first wire electrical connection, and this first insulation course covers this first wire.
4. the manufacture method of contact panel according to claim 3, it is characterized in that also comprising between step C and step D step C1: on this substrate, form the second conductive layer, this second conductive layer comprises a plurality of the second conductive patterns that are positioned at this external zones, these a plurality of second conductive pattern correspondences are covered on these a plurality of first conductive patterns, and this second conductive pattern is electrically connected with this first conductive pattern.
5. the manufacture method of contact panel according to claim 4, it is characterized in that step C1 also comprises: this second conductive layer also comprises a plurality of the second sensing serials that are positioned at this Touch Zone, these a plurality of second sensing serials are electrically connected with the other end of a plurality of these transmission lines respectively, these a plurality of second sensing serials and this plurality of the first sensing serials are staggered, this second sensing serials comprises a plurality of the second sensor pads that are electrically connected to each other, and adjacent this second sensor pad is by the second wire electrical connection.
6. the manufacture method of contact panel according to claim 4, is characterized in that after step D, also comprising step e: circuit module is provided, this circuit module is welded on a plurality of these second conductive patterns that cover these a plurality of connection gaskets.
7. a contact panel, is characterized in that this contact panel comprises:
Substrate, this substrate has Touch Zone and external zones;
Metal level, this metal level is positioned at this external zones, this metal level comprises ground wire, a plurality of connection gasket and a plurality of transmission lines, and one end of these a plurality of transmission lines is selected one with these a plurality of connection gaskets respectively and is connected, and the two ends of this ground wire are electrically connected with two these connection gaskets respectively;
The first insulation course, be formed on this metal level, this first insulation course to should a plurality of connection gaskets and this ground wire there are a plurality of the first holes, so that this ground wire of these a plurality of connection gaskets and this first broken hole position is exposed, the arrangement pitches of adjacent this first holes equals the arrangement pitches of adjacent this connection gasket; And
The second insulation course, is formed on this first insulation course, and this second insulation course is to having a plurality of the second holes by a plurality of the first holes.
8. contact panel according to claim 7; it is characterized in that: this contact panel also comprises the first conductive layer; this first conductive layer comprises a plurality of the first conductive patterns that are positioned at this external zones; these a plurality of the first conductive patterns cover this ground wire of these a plurality of connection gaskets and these a plurality of the first broken hole positions, to protect this ground wire in these a plurality of connection gaskets and this plurality of first broken vacancy.
9. contact panel according to claim 8, it is characterized in that: this first conductive layer also comprises a plurality of the first sensing serials that are positioned at this Touch Zone, these a plurality of first sensing serials are electrically connected with the other end of a plurality of these transmission lines respectively, this first sensing serials comprises a plurality of the first sensor pads, this first sensor pad adjacent in same this first sensing serials is by the first wire electrical connection, and this first insulation course covers this first wire.
10. contact panel according to claim 9, is characterized in that: this contact panel also comprises the second conductive layer, and this second conductive layer comprises a plurality of the second conductive patterns, and these a plurality of second conductive patterns cover and be electrically connected this plurality of the first conductive patterns.
CN201310213407.8A 2013-05-31 2013-05-31 Touch panel and manufacturing method thereof Pending CN104216542A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105489595A (en) * 2015-11-19 2016-04-13 业成光电(深圳)有限公司 Sensor electrode device for improving noise immunity
CN105630263A (en) * 2015-12-22 2016-06-01 昆山国显光电有限公司 Touch panel, touch display screen as well as manufacturing method and equipment of touch panel
CN109002228A (en) * 2018-10-12 2018-12-14 合肥鑫晟光电科技有限公司 Touch screen and its manufacturing method, touch display unit
CN111831167A (en) * 2019-04-15 2020-10-27 万达光电科技股份有限公司 Manufacturing method of capacitive touch panel and capacitive touch panel
CN113110765A (en) * 2021-05-21 2021-07-13 业成科技(成都)有限公司 Touch panel

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105489595A (en) * 2015-11-19 2016-04-13 业成光电(深圳)有限公司 Sensor electrode device for improving noise immunity
CN105630263A (en) * 2015-12-22 2016-06-01 昆山国显光电有限公司 Touch panel, touch display screen as well as manufacturing method and equipment of touch panel
CN109002228A (en) * 2018-10-12 2018-12-14 合肥鑫晟光电科技有限公司 Touch screen and its manufacturing method, touch display unit
CN109002228B (en) * 2018-10-12 2021-10-15 合肥鑫晟光电科技有限公司 Touch screen, manufacturing method thereof and touch display device
CN111831167A (en) * 2019-04-15 2020-10-27 万达光电科技股份有限公司 Manufacturing method of capacitive touch panel and capacitive touch panel
CN111831167B (en) * 2019-04-15 2024-06-04 万达光电科技股份有限公司 Manufacturing method of capacitive touch panel and capacitive touch panel
CN113110765A (en) * 2021-05-21 2021-07-13 业成科技(成都)有限公司 Touch panel

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Application publication date: 20141217