CN111829267A - Cooling and heat dissipating device and method for chip after high-temperature test - Google Patents
Cooling and heat dissipating device and method for chip after high-temperature test Download PDFInfo
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- CN111829267A CN111829267A CN202010807782.5A CN202010807782A CN111829267A CN 111829267 A CN111829267 A CN 111829267A CN 202010807782 A CN202010807782 A CN 202010807782A CN 111829267 A CN111829267 A CN 111829267A
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- 238000012360 testing method Methods 0.000 title claims abstract description 30
- 238000001816 cooling Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 72
- 239000004065 semiconductor Substances 0.000 claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 238000007664 blowing Methods 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 11
- 238000012545 processing Methods 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241000883990 Flabellum Species 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D15/00—Devices not covered by group F25D11/00 or F25D13/00, e.g. non-self-contained movable devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D25/00—Charging, supporting, and discharging the articles to be cooled
- F25D25/04—Charging, supporting, and discharging the articles to be cooled by conveyors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to the technical field of semiconductor processing, and discloses a cooling and heat dissipating device and a cooling and heat dissipating method after high-temperature testing of a chip. According to the cooling and heat dissipation device and method for the chip after high-temperature test, the carrying disc heat conduction plate is connected with the carrying disc on the high-temperature detection equipment, the semiconductor refrigerator is arranged at the lower end of the carrying disc heat conduction plate, the carrying disc heat conduction plate is cooled through the semiconductor refrigerator, and meanwhile, the blowing air shower mechanism directly dissipates heat of the surface of the chip, so that the chip is prevented from being frequently carried, and the effect of avoiding the chip from being frequently carried is achieved.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a cooling and heat dissipation device and method for a chip after high-temperature test.
Background
After a high-temperature test procedure in the production and manufacturing process of the vehicle-mounted chip product, the product is required to be rapidly cooled and dissipated, so that the requirements of the production process of normal-temperature test treatment on the vehicle-mounted chip product for the later stage are met. According to the traditional method, the vehicle-mounted chip products are conveyed and transferred to other spaces in a mechanical transfer mode, long-time cooling and heat dissipation are needed, the vehicle-mounted chip products are conveyed and transferred back to the equipment after the temperature is reduced to the normal temperature, and normal-temperature test treatment is carried out.
Therefore, the applicant provides a cooling and heat dissipating device and method after a high-temperature test of a chip, which are used for reducing the process that the chip needs to be frequently carried in the process.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a cooling and heat dissipating device and a cooling and heat dissipating method after a chip is tested at a high temperature, which have the advantages of reducing the carrying of electronic chips and the like, and solve the problem that the chips need to be carried frequently in the traditional mode mentioned in the background technology.
(II) technical scheme
In order to achieve the purpose of reducing the carrying of the electronic chip, the invention provides the following technical scheme: the utility model provides a cooling heat abstractor and method behind chip high temperature test, includes the bottom mounting panel, the top bolted connection of bottom mounting panel has horizontal alignment board, horizontal alignment board top threaded connection has horizontal alignment bolt, the top right side fixedly connected with wind of horizontal alignment board drenches the solenoid valve, the top fixedly connected with of horizontal alignment board supports the guide rod post, be provided with bottom heat dissipation fan between the support guide rod post, the upper end bolted connection who supports the guide rod post has the bottom heating panel, the upper end fixedly connected with pottery heat insulating ring of bottom heating panel, the upper end of bottom heating panel is provided with the semiconductor refrigerator, the upper end fixedly connected with year dish heat-conducting plate of pottery heat insulating ring, the upper end fixedly connected with detection thermocouple of year dish heat-conducting plate.
The top rear side of bottom heating panel is provided with the top heating panel, bottom heating panel top fixedly connected with blows wind and drenches the mechanism, the upper end threaded connection of bottom heating panel has the protection casing pillar, the surface of protection casing pillar has cup jointed the top heat dissipation fan, the upper end bolted connection of protection casing pillar has safety protection casing.
Preferably, the number of the horizontal adjusting bolts is four, and the four horizontal adjusting bolts are equidistantly distributed at four corners of the horizontal adjusting plate.
The four horizontal adjusting bolts can be adjusted more conveniently during horizontal adjustment.
Preferably, the top of the bottom heat dissipation fan is connected with the bottom of the bottom heat dissipation plate through a bolt.
The bottom heat dissipation fan can better dissipate heat of the bottom heat dissipation plate, so that the heating end of the semiconductor refrigerator can be more quickly dissipated.
Preferably, a fixing groove is formed in the front end of the top of the bottom heat dissipation plate, the semiconductor refrigerator is located in the fixing groove in the top of the bottom heat dissipation plate, and the top of the semiconductor refrigerator is in lap joint with the bottom of the carrying disc heat conduction plate.
The semiconductor refrigerator is located inside the groove, so that the contact area can be effectively increased, and the diffusion rate of energy efficiency is effectively improved.
Preferably, the air blowing and sprinkling mechanism is positioned between the heat-conducting plate of the carrying tray and the heat-radiating plate at the top, and the upper end of the air blowing and sprinkling mechanism extends to the top of the heat-conducting plate of the carrying tray.
The upper end of the air blowing and sprinkling mechanism extends to the top of the heat-conducting plate of the carrying disc, so that the air blowing and sprinkling mechanism can directly radiate the chip on the heat-conducting plate of the carrying disc, and the radiating efficiency is improved.
Preferably, the upper end of the protective cover pillar penetrates through the top heat dissipation plate and the top heat dissipation fan respectively, the upper end of the safety protective cover is provided with air holes, and the air holes are matched with fan blades of the top heat dissipation fan.
Safety shield upper end bleeder vent can let the steam of top heat dissipation fan extraction release better to promote radiating efficiency.
A cooling and heat dissipation method after high-temperature testing of a chip comprises the following steps:
the first step is to install the whole device at the rear end of the chip high-temperature test process, so that the chip after high-temperature test can directly enter the top of the carrying tray heat-conducting plate.
Therefore, the chip after high-temperature test can directly enter the upper surface of the carrying disc heat-conducting plate through the carrying disc, and the steps of carrying the chip are reduced.
And secondly, electrifying the semiconductor refrigerator, so that one end of the two ends of the semiconductor refrigerator is heated, and the other end of the semiconductor refrigerator is refrigerated.
The semiconductor refrigerator can refrigerate through the driving of the electric energy, so that the heat dissipation of the chip is realized.
And thirdly, connecting the heating end of the semiconductor refrigerator with a heat dissipation device through a mechanism, and quickly releasing heat through a bottom heat dissipation fan.
Through the extraction of bottom heat dissipation fan, with the quick eduction gear of the end heat that generates heat of semiconductor cooler to reduce the holistic temperature of device, further promotion radiating effect.
And fourthly, absorbing heat of the refrigerating end of the semiconductor refrigerator to the chip through a carrying disc heat-conducting plate connected with the chip.
The low temperature of semiconductor cooler refrigeration end manufacture can be fast with the heat on chip surface further absorption to realize high-efficient cooling.
And fifthly, further radiating the chip on the heat-conducting plate of the loading tray through a blowing air shower mechanism at the upper end of the heat-conducting plate of the loading tray.
The air blowing and showering mechanism directly blows air to the surface of the chip, so that the temperature of the chip can be quickly reduced.
Compared with the prior art, the invention provides a cooling and heat dissipating device and a cooling and heat dissipating method after high-temperature testing of a chip, which have the following beneficial effects:
1. according to the cooling and heat dissipation device and method for the chip after high-temperature test, the carrying disc heat conduction plate is connected with the carrying disc on the high-temperature detection equipment, the semiconductor refrigerator is arranged at the lower end of the carrying disc heat conduction plate, the carrying disc heat conduction plate is cooled through the semiconductor refrigerator, and meanwhile, the blowing air shower mechanism directly dissipates heat of the surface of the chip, so that the chip is prevented from being frequently carried, and the effect of avoiding the chip from being frequently carried is achieved.
2. According to the cooling and heat dissipation device and method for the chip after high-temperature test, the bottom heat dissipation fan is arranged at the lower end of the heat-conducting plate of the carrying disc, and when the semiconductor refrigerator cools the chip, the bottom heat dissipation fan can quickly conduct fan heat on the heating end of the semiconductor refrigerator, so that the self heating of the device is reduced, and the effect of protecting the device is achieved.
3. According to the cooling and heat dissipation device and method for the chip after high-temperature test, the carrying disc heat conduction plate is cooled by using the semiconductor refrigerator, the air blowing and spraying mechanism is arranged at the upper end of the carrying disc heat conduction plate, the chip is cooled from the upper end of the chip, so that heat at the upper end and the lower end of the chip can be well conducted out, the bottom heat dissipation fan and the top heat dissipation fan are arranged simultaneously, heat sent by the chip is discharged outwards, and the efficient heat dissipation effect is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an assembly view of the structure of the present invention;
fig. 3 is a schematic block diagram of the present invention.
Wherein: 1. a bottom mounting plate; 2. a horizontal alignment plate; 3. a horizontal adjusting bolt; 4. an air shower electromagnetic valve; 5. supporting the guide rod column; 6. a bottom heat dissipation fan; 7. a bottom heat dissipation plate; 8. a ceramic heat insulating ring; 9. a semiconductor refrigerator; 10. a carrying plate heat-conducting plate; 11. detecting a thermocouple; 12. a top heat sink plate; 13. a blowing air shower mechanism; 14. a shield support; 15. a top heat dissipation fan; 16. a safety shield.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a cooling and heat dissipating device and method after a chip high temperature test, includes a bottom mounting plate 1, a horizontal adjusting plate 2 is bolted to the top of the bottom mounting plate 1, the horizontal adjusting plate 2 is used for adjusting the device to keep the device horizontal with the high temperature test device, horizontal adjusting bolts 3 are screwed to the top of the horizontal adjusting plate 2, the number of the horizontal adjusting bolts 3 is four, and the four horizontal adjusting bolts 3 are equidistantly distributed at four corners of the horizontal adjusting plate 2, so as to make the device horizontal adjustment more convenient, an air shower electromagnetic valve 4 is fixedly connected to the right side of the top of the horizontal adjusting plate 2, the air shower electromagnetic valve 4 is an existing mature device, and mainly controls whether an air blowing air shower mechanism 13 is used or not, a support guide rod column 5 is fixedly connected to the top of the horizontal adjusting plate 2, and the support guide rod column 5 is used for lifting a heat dissipating space at the bottom of, thereby further improving the heat dissipation efficiency, a bottom heat dissipation fan 6 is arranged between the supporting guide rod columns 5, the bottom heat dissipation fan 6 is used for dissipating heat of the heating end at the bottom of the semiconductor refrigerator 9, thereby ensuring the service life and the heat dissipation effect of the semiconductor refrigerator 9, the top of the bottom heat dissipation fan 6 is connected with the bottom of the bottom heat dissipation plate 7 through a bolt, the upper end of the supporting guide rod column 5 is connected with the bottom heat dissipation plate 7 through a bolt, the lower end of the bottom heat dissipation plate 7 is provided with a plurality of heat dissipation fins for improving the heat dissipation area of the device, the front end of the top of the bottom heat dissipation plate 7 is provided with a fixing groove for limiting the position of the semiconductor refrigerator 9, and simultaneously the contact area of the heating end at the bottom of the semiconductor refrigerator 9 is improved, thereby improving the heat dissipation efficiency, the upper end of the bottom heat dissipation plate 7 is fixedly, thereby promote the radiating efficiency, the upper end of bottom heating panel 7 is provided with semiconductor cooler 9, semiconductor cooler 9 is current refrigeration plant, be used for cooling down the chip, semiconductor cooler 9 is located the fixed recess at bottom heating panel 7 top, and semiconductor cooler 9's top and the bottom overlap joint of carrying a set heat-conducting plate 10, the upper end fixedly connected with of pottery heat insulating ring 8 carries a set heat-conducting plate 10, it is used for bearing the chip to carry a set heat-conducting plate 10, cool down the chip simultaneously, the upper end fixedly connected with detection thermocouple 11 of carrying a set heat-conducting plate 10, detection thermocouple 11 is used for detecting the temperature, thereby make the efficiency release that carries on that semiconductor cooler 9 can be better.
The rear side of the top of the bottom heat dissipation plate 7 is provided with a top heat dissipation plate 12, the top heat dissipation plate 12 is used for absorbing heat and dissipating heat, the top of the bottom heat dissipation plate 7 is fixedly connected with an air blowing and spraying mechanism 13, the air blowing and spraying mechanism 13 is used for directly blowing and dissipating heat on the surface of the chip, so as to further improve the heat dissipation effect, the air blowing and spraying mechanism 13 is positioned between the carrier tray heat conduction plate 10 and the top heat dissipation plate 12, the upper end of the air blowing and spraying mechanism 13 extends to the top of the carrier tray heat conduction plate 10, the upper end of the bottom heat dissipation plate 7 is in threaded connection with a protective cover support 14, the protective cover support 14 is used for supporting a safety protective cover 16, so that the safety protective cover 16 can be fixed, the upper end of the protective cover support 14 respectively penetrates through the top heat dissipation plate 12 and the top heat dissipation fan 15, the outer surface of, thereby make the decline that the holistic temperature of device can be stable, the upper end bolted connection of protection casing pillar 14 has safety protection casing 16, and safety protection casing 16 is used for protecting the mechanical mechanism of activity to prevent that the mechanical structure of activity from causing the injury to operating personnel, the bleeder vent has been seted up to the upper end of safety protection casing 16, and the flabellum looks adaptation of bleeder vent and top heat dissipation fan 15, thereby further promotion radiating effect.
As shown in fig. 1-3, a method for cooling and dissipating heat after a high-temperature test of a chip includes the following steps: in the first step, the whole device is installed at the rear end of the chip high-temperature test procedure, so that the chip subjected to the high-temperature test can directly enter the top of the carrying tray heat-conducting plate 10.
Through the steps, the chips after high-temperature test can directly enter the upper surface of the carrier plate heat-conducting plate 10 through the carrier plate, so that the steps of carrying the chips are reduced.
In the second step, the semiconductor refrigerator 9 is energized, so that one end of the semiconductor refrigerator 9 is heated and the other end is cooled.
Through the steps, the semiconductor refrigerator 9 can refrigerate through the driving of electric energy, and the low temperature is moved to take away the high temperature on the surface of the chip, so that the heat dissipation of the chip is realized.
And thirdly, connecting the heating end of the semiconductor refrigerator 9 with a heat dissipation device through a mechanism, and quickly releasing heat through a bottom heat dissipation fan 6.
Through the steps, the heat of the heating end of the semiconductor refrigerator 9 is quickly discharged through the extraction of the bottom heat dissipation fan 6, so that the overall temperature of the device is reduced, and the heat dissipation effect is further improved.
And fourthly, absorbing heat of the chip by the refrigerating end of the semiconductor refrigerator 9 through a carrying disc heat-conducting plate 10 connected with the chip.
Through the steps, the low temperature manufactured by the refrigerating end of the semiconductor refrigerator 9 can quickly absorb the heat on the surface of the chip, so that the efficient cooling is realized.
And fifthly, further radiating the chip on the heat-conducting plate 10 through the blowing air shower mechanism 13 at the upper end of the heat-conducting plate 10.
Through the steps, the air blowing and showering mechanism 13 directly blows air to the surface of the chip, so that the temperature of the chip can be quickly reduced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a cooling heat abstractor and method after chip high temperature test, includes bottom mounting panel (1), its characterized in that: the top of the bottom mounting plate (1) is connected with a horizontal adjusting plate (2) through a bolt, the top of the horizontal adjusting plate (2) is in threaded connection with a horizontal adjusting bolt (3), the right side of the top of the horizontal adjusting plate (2) is fixedly connected with an air shower electromagnetic valve (4), the top of the horizontal adjusting plate (2) is fixedly connected with a supporting guide rod column (5), a bottom heat radiation fan (6) is arranged between the supporting guide rod columns (5), the upper ends of the supporting guide rod columns (5) are connected with a bottom heat radiation plate (7) through bolts, the upper end of the bottom heat dissipation plate (7) is fixedly connected with a ceramic heat insulation ring (8), the upper end of the bottom heat dissipation plate (7) is provided with a semiconductor refrigerator (9), the upper end of the ceramic heat insulation ring (8) is fixedly connected with a carrying disc heat conduction plate (10), the upper end of the carrying disc heat-conducting plate (10) is fixedly connected with a detection thermocouple (11);
the top rear side of bottom heating panel (7) is provided with top heating panel (12), bottom heating panel (7) top fixedly connected with blows wind and drenches mechanism (13), the upper end threaded connection of bottom heating panel (7) has protection casing pillar (14), the surface of protection casing pillar (14) has cup jointed top heat dissipation fan (15), the upper end bolted connection of protection casing pillar (14) has safety protection casing (16).
2. The device and the method for cooling and dissipating heat after high-temperature testing of the chip according to claim 1, wherein: the number of the horizontal adjusting bolts (3) is four, and the four horizontal adjusting bolts (3) are equidistantly distributed at four corners of the horizontal adjusting plate (2).
3. The device and the method for cooling and dissipating heat after high-temperature testing of the chip according to claim 1, wherein: the top of the bottom heat dissipation fan (6) is connected with the bottom of the bottom heat dissipation plate (7) through a bolt.
4. The device and the method for cooling and dissipating heat after high-temperature testing of the chip according to claim 1, wherein: the top front end of the bottom heat dissipation plate (7) is provided with a fixing groove, the semiconductor refrigerator (9) is located in the fixing groove in the top of the bottom heat dissipation plate (7), and the top of the semiconductor refrigerator (9) is in lap joint with the bottom of the carrying disc heat conduction plate (10).
5. The device and the method for cooling and dissipating heat after high-temperature testing of the chip according to claim 1, wherein: the air blowing and showering mechanism (13) is positioned between the heat-conducting plate (10) of the carrying disc and the heat-radiating plate (12) at the top, and the upper end of the air blowing and showering mechanism (13) extends to the top of the heat-conducting plate (10) of the carrying disc.
6. The device and the method for cooling and dissipating heat after high-temperature testing of the chip according to claim 1, wherein: the upper end of the protective cover support column (14) penetrates through the top heat dissipation plate (12) and the top heat dissipation fan (15) respectively, air holes are formed in the upper end of the safety protective cover (16), and the air holes are matched with fan blades of the top heat dissipation fan (15).
7. A cooling and heat dissipation method after high-temperature testing of a chip is characterized by comprising the following steps: the method comprises the following steps: firstly, the whole device is arranged at the rear end of a chip high-temperature test procedure, so that the chip subjected to high-temperature test can directly enter the top of the carrying disc heat-conducting plate (10).
And secondly, electrifying the semiconductor refrigerator (9), so that one end of the two ends of the semiconductor refrigerator (9) generates heat, and the other end of the semiconductor refrigerator generates cold.
And thirdly, connecting the heating end of the semiconductor refrigerator (9) with a heat dissipation device through a mechanism, and quickly releasing heat through a bottom heat dissipation fan (6).
Fourthly, the refrigeration end of the semiconductor refrigerator (9) absorbs heat to the chip through a carrying disc heat conducting plate (10) which is connected with the chip.
Fifthly, further radiating the chip on the heat-conducting plate (10) of the carrying disc through a blowing air shower mechanism (13) at the upper end of the heat-conducting plate (10) of the carrying disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010807782.5A CN111829267A (en) | 2020-08-12 | 2020-08-12 | Cooling and heat dissipating device and method for chip after high-temperature test |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010807782.5A CN111829267A (en) | 2020-08-12 | 2020-08-12 | Cooling and heat dissipating device and method for chip after high-temperature test |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112684320A (en) * | 2020-12-17 | 2021-04-20 | 海光信息技术股份有限公司 | Chip low-temperature testing environment bin and chip testing machine |
| CN112880298A (en) * | 2021-01-27 | 2021-06-01 | 青岛海信宽带多媒体技术有限公司 | Equipment for adjusting temperature of optical module shell |
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| CN206113480U (en) * | 2016-08-30 | 2017-04-19 | 重庆科斯迈生物科技有限公司 | Top refrigerating mechanism of reagent blending device |
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Application publication date: 20201027 |