CN111819687A - 包括有源像素ic的led像素封装及其制造方法 - Google Patents

包括有源像素ic的led像素封装及其制造方法 Download PDF

Info

Publication number
CN111819687A
CN111819687A CN201980003581.5A CN201980003581A CN111819687A CN 111819687 A CN111819687 A CN 111819687A CN 201980003581 A CN201980003581 A CN 201980003581A CN 111819687 A CN111819687 A CN 111819687A
Authority
CN
China
Prior art keywords
led
pixel
active pixel
manufacturing
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980003581.5A
Other languages
English (en)
Chinese (zh)
Inventor
金镇赫
金钟善
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Xinneng Electronic Technology Co.,Ltd.
Original Assignee
Siliconinside Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconinside Co ltd filed Critical Siliconinside Co ltd
Publication of CN111819687A publication Critical patent/CN111819687A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
CN201980003581.5A 2019-02-11 2019-12-26 包括有源像素ic的led像素封装及其制造方法 Pending CN111819687A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020190015409A KR102238284B1 (ko) 2019-02-11 2019-02-11 능동화소 ic를 포함하는 led 픽셀 패키지 및 그 제조방법
KR10-2019-0015409 2019-02-11
PCT/KR2019/018504 WO2020166814A1 (ko) 2019-02-11 2019-12-26 능동화소 ic를 포함하는 led 픽셀 패키지 및 그 제조방법

Publications (1)

Publication Number Publication Date
CN111819687A true CN111819687A (zh) 2020-10-23

Family

ID=72043926

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980003581.5A Pending CN111819687A (zh) 2019-02-11 2019-12-26 包括有源像素ic的led像素封装及其制造方法

Country Status (3)

Country Link
KR (1) KR102238284B1 (ko)
CN (1) CN111819687A (ko)
WO (1) WO2020166814A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112802400A (zh) * 2021-01-06 2021-05-14 季华实验室 一种显示面板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220064004A (ko) * 2020-11-11 2022-05-18 삼성전자주식회사 디스플레이 모듈 및 이를 포함하는 디스플레이 장치
WO2022255504A1 (ko) * 2021-06-01 2022-12-08 엘지전자 주식회사 디스플레이 디바이스
KR102663687B1 (ko) * 2021-07-30 2024-05-08 엘지전자 주식회사 발광 소자 패키지의 제조 방법, 디스플레이 장치 및 디스플레이 장치의 제조 방법
WO2023096141A1 (ko) * 2021-11-24 2023-06-01 삼성전자주식회사 디스플레이 모듈을 포함하는 디스플레이 장치 및 그 제조 방법
KR102514778B1 (ko) * 2022-06-10 2023-03-29 주식회사 서브뮬레드 투명 사이니지용 고효율 칩 스케일 패키지
CN115763453A (zh) * 2022-10-21 2023-03-07 武汉华星光电半导体显示技术有限公司 拼接显示面板和显示终端

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010038119A (ko) * 1999-10-22 2001-05-15 윤종용 비지에이 패키지용 몰딩 장치
KR101089956B1 (ko) * 2009-10-28 2011-12-05 삼성전기주식회사 플립칩 패키지 및 그의 제조방법
KR102024295B1 (ko) * 2013-02-05 2019-09-23 엘지이노텍 주식회사 발광 모듈
KR20160032429A (ko) * 2014-09-16 2016-03-24 엘지이노텍 주식회사 발광 소자 패키지
KR102605585B1 (ko) * 2016-08-11 2023-11-24 삼성전자주식회사 발광소자 패키지 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112802400A (zh) * 2021-01-06 2021-05-14 季华实验室 一种显示面板
CN112802400B (zh) * 2021-01-06 2023-12-15 季华实验室 一种显示面板

Also Published As

Publication number Publication date
KR102238284B1 (ko) 2021-04-23
WO2020166814A1 (ko) 2020-08-20
KR20200097941A (ko) 2020-08-20

Similar Documents

Publication Publication Date Title
CN111819687A (zh) 包括有源像素ic的led像素封装及其制造方法
JP7248828B2 (ja) シリコン上のカラーｉｌｅｄディスプレイ
US10490534B2 (en) Display device with LED pixels
KR100489452B1 (ko) 기판을제거한led디스플레이패키지및그제조방법
JP4869165B2 (ja) 発光装置の製造方法
US11143808B2 (en) Light emitting module
US20160290600A1 (en) Multi-colored led array on a single substrate
KR20180009116A (ko) 마이크로 led 어레이 디스플레이 장치
CN108702827A (zh) 发光模块制造方法和显示装置
CN111933630A (zh) Led芯片封装模块、显示屏及其制作方法
CN109309154B (zh) 显示单元、显示基板及其制备方法、显示装置
US10950763B2 (en) Method of manufacturing light emitting module
EP4131385A1 (en) Stacked structure, display screen and display device
CN214671553U (zh) 显示装置
KR101086997B1 (ko) 발광 소자 패키지와 그의 제조 방법 및 그를 이용한 카메라 플래시 모듈
US20150236224A1 (en) Light emitting device package and method of fabricating the same
TW202119383A (zh) 顯示系統
KR20200128066A (ko) 자동차 조명 애플리케이션들을 위한 칩 스케일 패키지 광 방출 다이오드 모듈
KR102501887B1 (ko) 능동화소 ic를 포함하는 발광 소자 픽셀 패키지 및 그 패키징 방법
KR101037369B1 (ko) 형광액이 도포된 led 칩의 제조방법 및 이에 의해 제조된 led 칩
CN219696480U (zh) Led显示模组及led显示屏
US20210384379A1 (en) Display panel
CN221102094U (zh) Led显示模组及led显示屏
TWI655765B (zh) 微發光二極體顯示面板
CN113391481A (zh) 发光元件装载基板及背光源

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20220920

Address after: Room 21003, Block B, Galaxy SOHO, No.2 Nanzhugan Hutong, Dongcheng District, Beijing

Applicant after: Beijing Xinneng Electronic Technology Co.,Ltd.

Address before: 163302 Lun Xian Road, ruicao District, Seoul, Korea

Applicant before: SILICONINSIDE Co.,Ltd.