CN111816503A - Reed pipe packaging and sintering structure - Google Patents

Reed pipe packaging and sintering structure Download PDF

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Publication number
CN111816503A
CN111816503A CN202010796941.6A CN202010796941A CN111816503A CN 111816503 A CN111816503 A CN 111816503A CN 202010796941 A CN202010796941 A CN 202010796941A CN 111816503 A CN111816503 A CN 111816503A
Authority
CN
China
Prior art keywords
reed
glass
glass tube
pipe
sintering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202010796941.6A
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Chinese (zh)
Inventor
李少锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xiaoci Technology Co ltd
Original Assignee
Shenzhen Xiaoci Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xiaoci Technology Co ltd filed Critical Shenzhen Xiaoci Technology Co ltd
Priority to CN202010796941.6A priority Critical patent/CN111816503A/en
Publication of CN111816503A publication Critical patent/CN111816503A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00Re-forming shaped glass
    • C03B23/04Re-forming tubes or rods
    • C03B23/09Reshaping the ends, e.g. as grooves, threads or mouths
    • C03B23/099Reshaping the ends, e.g. as grooves, threads or mouths by fusing, e.g. flame sealing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Switches (AREA)

Abstract

The invention provides a reed pipe packaging and sintering structure, which comprises a glass pipe, a left reed and a right reed, wherein the glass pipe is a sealing chamber, inert gas is filled in the sealing chamber, a part of the left reed and the right reed are sealed in the glass pipe, and the parts of the left reed and the right reed in the glass pipe are mutually overlapped and leave a gap, and the reed pipe packaging and sintering structure is characterized in that: gold-plated layers are arranged on the parts of the left spring and the right spring outside the glass tube, and the end part of the glass tube is perpendicular to the straight line where the axial directions of the left spring and the right spring are located. The invention has the advantages that the sintering head is full, the stress area is large, the stress borne by the reed is transmitted to the sintering position when the product is cut or bent in the subsequent process, the stress point of the glass tube is vertical and right-angled due to the top end plane structure, and the stress borne by the glass tube is completely dispersed when the glass tube is stressed, so that the glass tube is not easy to break.

Description

Reed pipe packaging and sintering structure
Technical Field
The invention relates to a magnetic reed switch, in particular to improvement of a magnetic reed switch structure.
Background
As shown in fig. 1, which is an explosion diagram of a reed switch, the names of the components in the diagram are as follows: glass shell 1, first reed 2, second reed 3.
The use principle of the product is as follows: a reed switch, also called a reed switch, operated by applying a magnetic field;
the product application is as follows: the method is widely applied to the fields of household appliances, automobiles, communication, industrial control, medical treatment, security and the like;
the product comprises the following components: the first reed 2, the second reed 3 and the glass shell 1, and inert gas nitrogen is arranged in the middle.
As shown in fig. 2 and 3: in the figure, L1 is the length of the tin plating, and L2 is the total length of the switch. A is the adhering part and the glass adhering surface, B is the adhering part, C is the external force supporting part, D is the external force stress point, and E is the sealing part. The sintering mode adopted by the existing products in the current market is coil heating sintering, the structure of sealing tube sintering is a conical structure, the area of a close part and a glass binding face A is small, and a lead is tinned.
The structure of the prior product has the following defects:
the head is sintered to be sharp, the stress is poor, and the glass is fragile when the glass falls off;
sharp corners and uneven appearance are easy to appear in sintering;
when the product is cut or bent in the subsequent process, the stress borne by the reed is transmitted to a sintering part, because the bonding area of the sintered close part and the glass is small, and because the stress point direction of the glass tube of the conical structure is an oblique angle, according to the principle of force and force arm, the glass tube is easy to cause the close part B to generate a gap under the action of oblique angle stress, so that nitrogen is leaked, even the glass tube is easy to crack, and the effect of a magnetic reed switch is lost;
the reed tinned wire has relatively poor contact resistance and conductivity and is easy to oxidize.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a reed pipe packaging and sintering structure which comprises a glass pipe, a left reed and a right reed, wherein the glass pipe is a sealing chamber, inert gas is filled in the sealing chamber, a part of the left reed and a part of the right reed are sealed in the glass pipe, the left reed and the right reed are mutually overlapped in the glass pipe and are provided with gaps, gold-plated layers are arranged on the parts of the left reed and the right reed outside the glass pipe, and the end part of the glass pipe is perpendicular to a straight line where the axial directions of the left reed and the right reed are located.
As a further improvement of the present invention, the gold plating layer is made of gold.
As a further improvement of the invention, the reed pipe packaging and sintering structure is sintered by adopting a packaging and sintering process of light irradiation.
As a further improvement of the invention, the inert gas is nitrogen.
The invention has the beneficial effects that:
the packaging sintering process adopting lamp illumination and the top end plane structure have the advantages that: the sintering head is full, the stress area is large, the stress borne by the reed is transmitted to the sintering position when the product is cut or bent in the subsequent process, the stress point of the glass tube is vertical and right-angled due to the top end plane structure, and the stress borne by the glass tube is completely dispersed when the glass tube is stressed, so that the glass tube is not easy to break;
the glass tube structure of the sintering process has beautiful and mellow appearance;
the sealing performance of the sintering position is good, firm and durable;
the switch has good electrical performance, more durable times, high speed and long service life;
the gold-plated lead wire with the reed has the advantages of small contact resistance, good conductivity, easy welding, strong corrosion resistance and difficult oxidation.
Drawings
FIG. 1 is an exploded view of a prior art reed switch;
FIG. 2 is a schematic diagram of a prior art reed switch;
FIG. 3 is an enlarged view of the VI portion of FIG. 2;
FIG. 4 is a schematic diagram of the construction of the reed switch of the present invention;
fig. 5 is an enlarged view of a portion v in fig. 4.
The names of the components in the figure are as follows:
the glass tube 101, the left spring leaf 102, the right spring leaf 103, the gold-plated layer 104, the gold-plated length L3, the total switch length L4, the adhering part and the glass tube adhering surface A1, the light sintering adhering part B1, the external force supporting part C1, the external force stress point D1 and the sealing part E1.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
A reed switch packaging and sintering structure, as shown in fig. 4 and 5: the glass tube 101 is a sealed chamber, inert gas is filled in the sealed chamber, a part of the left reed 102 and the right reed 103 is sealed in the glass tube 101, the left reed 102 and the right reed 103 are mutually overlapped in the glass tube and a gap is left, and the glass tube is characterized in that: the left spring piece 102 and the right spring piece 103 are plated with gold on the outer part of the glass tube, and the end part of the glass tube 101 is perpendicular to the straight line where the axial directions of the left spring piece 102 and the right spring piece 103 are located.
The invention adopts a packaging sintering process and a sintering structure of lamplight irradiation, the sealing tube structure is a top end plane structure, the area of the close part and the glass binding surface A1 is large, and the wire is plated with gold.
The packaging sintering process adopting lamp illumination and the top end plane structure have the advantages that:
the sintering head is full, the stress area is large, the stress borne by the reed is transmitted to the sintering position when the product is cut or bent in the subsequent process, the stress point of the glass tube is vertical and right-angled due to the top end plane structure, and the stress borne by the glass tube is completely dispersed when the glass tube is stressed, so that the glass tube is not easy to break;
the glass tube structure of the sintering process has beautiful and mellow appearance;
the sealing performance of the sintering position is good, firm and durable;
the switch has good electrical performance, more durable times, high speed and long service life;
the gold-plated lead wire with the reed has the advantages of small contact resistance, good conductivity, easy welding, strong corrosion resistance and difficult oxidation.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims (4)

1. The utility model provides a reed pipe encapsulation sintering structure, includes glass pipe (101), left reed (102) and right reed (103), and glass pipe (101) are the sealed chamber, fill inert gas in the sealed chamber, and left reed (102) and right reed (103) partly seal in glass pipe (101), and left reed (102) and right reed (103) are overlapped and are left the clearance in the intraductal part of glass, its characterized in that: the parts of the left spring (102) and the right spring (103) outside the glass tube are provided with gold plating layers (104), and the end part of the glass tube (101) is perpendicular to the straight line where the axial directions of the left spring (102) and the right spring (103) are located.
2. The dry reed pipe package sintering structure according to claim 1, wherein: the gold-plated layer (104) is made of gold.
3. The dry reed pipe package sintering structure according to claim 1, wherein: the reed switch packaging and sintering structure is sintered by adopting a packaging and sintering process of light irradiation.
4. The dry reed pipe package sintering structure according to claim 1, wherein: the inert gas is nitrogen.
CN202010796941.6A 2020-08-10 2020-08-10 Reed pipe packaging and sintering structure Withdrawn CN111816503A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010796941.6A CN111816503A (en) 2020-08-10 2020-08-10 Reed pipe packaging and sintering structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010796941.6A CN111816503A (en) 2020-08-10 2020-08-10 Reed pipe packaging and sintering structure

Publications (1)

Publication Number Publication Date
CN111816503A true CN111816503A (en) 2020-10-23

Family

ID=72864607

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010796941.6A Withdrawn CN111816503A (en) 2020-08-10 2020-08-10 Reed pipe packaging and sintering structure

Country Status (1)

Country Link
CN (1) CN111816503A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024067257A1 (en) * 2022-09-29 2024-04-04 厦门宏发信号电子有限公司 Reed relay

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024067257A1 (en) * 2022-09-29 2024-04-04 厦门宏发信号电子有限公司 Reed relay

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Application publication date: 20201023

WW01 Invention patent application withdrawn after publication