CN111812097A - Wafer cutting tool check out test set - Google Patents

Wafer cutting tool check out test set Download PDF

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Publication number
CN111812097A
CN111812097A CN202010570850.0A CN202010570850A CN111812097A CN 111812097 A CN111812097 A CN 111812097A CN 202010570850 A CN202010570850 A CN 202010570850A CN 111812097 A CN111812097 A CN 111812097A
Authority
CN
China
Prior art keywords
detected object
cutting tool
base
wafer cutting
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010570850.0A
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Chinese (zh)
Inventor
罗爱斌
陈章水
宾启雄
周铁军
叶水景
严卫东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Vital Micro Electronics Technology Co Ltd
Original Assignee
First Semiconductor Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by First Semiconductor Materials Co ltd filed Critical First Semiconductor Materials Co ltd
Priority to CN202010570850.0A priority Critical patent/CN111812097A/en
Publication of CN111812097A publication Critical patent/CN111812097A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

Abstract

The invention relates to the technical field of wafer cutting, in particular to a wafer cutting tool detection device, which comprises a detection system, a detection unit and a control unit, wherein the detection system comprises a judgment unit and a camera unit; the bearing platform comprises a platform base and a bearing base used for the detected object to be vertically placed, and the bearing base is arranged on the platform base; the camera unit or the bearing base can rotate around the vertical direction to obtain images of different positions of the circumferential surface of the detected object. The invention is helpful to avoid the damage to the circumferential surface of the detected object when the device is transversely placed, and reduces the risk of the damage of the detected object in the detection process; in addition, the degree of automation of the detection of the detected object is improved, misjudgment caused by insufficient human experience is reduced, the detection efficiency is improved, the acquisition of images of different positions of the circumferential surface of the detected object is realized, and the circumferential surface of the detected object is comprehensively detected.

Description

Wafer cutting tool check out test set
Technical Field
The invention relates to the technical field of wafer cutting, in particular to a wafer cutting tool detection device.
Background
The steel wire groove wheel axle is an important device in semiconductor crystal production, and before production, the wire grooves on the steel wire groove wheel axle must be inspected to prevent the wire breakage phenomenon in the production process caused by the groove position defects (such as the ectopic position of a groove peak, the loss of the groove peak and the like) of the steel wire groove wheel axle from causing wafer loss.
At present, because the weight of a steel wire groove wheel shaft is large, continuous turning is difficult, the microstructure image of the circumferential surface of a local steel wire and the wheel shaft is very difficult to inspect, when the experience of workers is insufficient, the microstructure inspection of the whole surface of the steel wire and the wheel shaft is more difficult, the common visual inspection method cannot well inspect the wheel shaft groove width, the steel wire pressing line and other phenomena, different workers easily have large deviation in inspection, and the phenomenon of sudden line breakage of the steel wire with the pressing line defect after the steel wire is installed on a machine is also caused; in addition, in the existing detection process, the steel wire and the wheel axle are horizontally placed on the platform for detection, and the steel wire and the wheel axle need to be continuously turned over in the detection process, so that the contact abrasion between the steel wire and the wheel axle circumferential surface and the platform is easily caused.
Disclosure of Invention
The invention aims to provide the wafer cutting tool detection equipment which is beneficial to improving the detection efficiency and the detection accuracy of a steel wire groove wheel shaft and avoiding damage to the circumferential surface of the steel wire groove wheel shaft.
In order to achieve the above object, the present invention provides a wafer cutting tool inspection apparatus comprising:
the detection system comprises a judgment unit for judging whether the circumferential surface of the detected object has defects or not and a camera unit for acquiring the image of the circumferential surface of the detected object, wherein the camera unit is in communication connection with the judgment unit;
the bearing platform comprises a platform base and a bearing base used for the detected object to be vertically placed, and the bearing base is arranged on the platform base;
the camera unit or the bearing base can rotate around the vertical direction to be used for acquiring images of different positions of the circumferential surface of the detected object.
Optionally, the determining unit includes a storage module for storing a preset image feature library, an analysis module for comparing the image acquired by the image capturing unit with the preset image feature library, and a calibration module for marking a defect position on the image acquired by the image capturing unit and outputting a defect feature type.
Optionally, the platform further comprises a platform driving mechanism, the platform driving mechanism is in transmission connection with the bearing base, and the bearing base is rotatably mounted on the platform base and can rotate around the vertical direction.
Optionally, the platform base is provided with a thrust bearing, and the bearing base is rotatably connected with the platform base through the thrust bearing.
Optionally, the device further comprises a tensioning mechanism, the bearing base is provided with an axially extending through hole, and the tensioning mechanism is arranged in the through hole and used for tensioning and fixing the detected object.
Optionally, the bearing base is provided with a safety hand hole.
Optionally, the upper surface of bearing the base is equipped with a plurality of position mark arcs, and a plurality of position mark arcs all with the rotation axis coaxial arrangement who bears the base.
Optionally, still including being used for fixed detection object upper end's positioning mechanism, positioning mechanism includes slide rail and clamping assembly, clamping assembly includes that two sets of symmetrical arrangement are used for the tight anchor clamps of circumference to be detected object, anchor clamps slide set up in on the slide rail, anchor clamps include sliding support and rotate install in sliding support's first rotating member and second rotating member, the rotation axis of first rotating member and the rotation axis of second rotating member are parallel and do not coincide.
Optionally, the first rotating member and the second rotating member each include a roller and a sheave that are coaxially arranged, and an annular groove is formed on a circumferential side of the sheave.
Optionally, the sliding support includes a sliding block and a supporting rod rotatably connected to the sliding block, the sliding block is slidably connected to the sliding rail, and the roller and the grooved wheel are respectively disposed on two sides of the supporting rod.
The embodiment of the invention has the following technical effects:
the bearing platform for vertically placing the detected object is arranged, so that the circumferential surface of the detected object is prevented from being damaged when the detected object is placed transversely, and the risk of damage to the detected object in the detection process is reduced; in addition, the camera shooting unit and the judging unit are arranged, after the image of the circumferential surface of the detected object is obtained through the camera shooting unit, the judging unit identifies the image obtained by the camera shooting unit to judge whether the circumferential surface of the detected object has defect characteristics, so that the automation degree of the detection of the detected object is improved, misjudgment caused by insufficient human experience is reduced, and the detection efficiency is improved, wherein the camera shooting unit or the bearing base can rotate around the vertical direction, so that the detected object placed on the bearing base and the camera shooting unit can rotate relatively, the acquisition of images at different positions of the circumferential surface of the detected object is realized, and the circumferential surface of the detected object is comprehensively detected.
Drawings
FIG. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
FIG. 2 is a front view of the preferred embodiment of the present invention;
FIG. 3 is a cross-sectional view taken at A-A of FIG. 2;
FIG. 4 is a schematic structural diagram of a load-bearing platform of the preferred embodiment of the present invention;
FIG. 5 is a front view of the load-bearing platform of the preferred embodiment of the present invention;
FIG. 6 is a cross-sectional view taken at B-B of FIG. 5;
FIG. 7 is a schematic structural view of a preferred embodiment load bearing base and drive mechanism of the present invention;
FIG. 8 is a front elevational view of the carrier base and drive mechanism of the preferred embodiment of the present invention;
FIG. 9 is a cross-sectional view taken at C-C of FIG. 8;
FIG. 10 is a schematic structural view of a positioning mechanism of a preferred embodiment of the present invention;
FIG. 11 is a cross-sectional view of the positioning mechanism of the preferred embodiment of the present invention;
FIG. 12 is an exploded view of the positioning mechanism of the preferred embodiment of the present invention;
FIG. 13 is a schematic structural view of a tensioning mechanism of a preferred embodiment of the present invention;
FIG. 14 is a functional block diagram of a detection system in accordance with a preferred embodiment of the present invention.
Description of reference numerals:
11. the device comprises a judging unit 111, a storage module 112, an analysis module 113, a calibration module 12, an image pickup unit 121, a CCD camera 122, a zoom lens 13 and a lifting mechanism;
2. the bearing platform comprises a bearing platform body 21, a platform base 22, a bearing base 221, a through hole 222, a transmission part 223, a supporting part 224, a bearing part 225, a safety hand hole 226, a buffer layer 227, a wear-resistant layer 228, a position marking arc line 23, a platform driving mechanism 24, a thrust bearing 25, a tensioning mechanism 251, a chuck 252, a clamping jaw 26, a radial bearing 27 and a foot cup;
3. the device comprises a positioning mechanism, a sliding rail, a sliding bracket, a clamping component, a clamp 331, a sliding support 3311, a sliding block 3311a, a guide hole 3311b, a limit groove 3312, a support rod 332, a first rotating part, a second rotating part, a roller 334, a wheel 335, a grooved wheel 336, an annular groove 34, a reset component, a 341, a spring mounting shaft 342 and a spring;
4. the object is detected.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In addition, the terms "first", "second", and the like are employed in the present invention to describe various information, but the information should not be limited to these terms, which are used only to distinguish the same type of information from each other. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.
Referring to fig. 1 to 14, an embodiment of the present invention provides a wafer cutting tool inspection apparatus, characterized by comprising:
the detection system comprises a judgment unit 1 for judging whether the circumferential surface of the detected object 4 has defects or not and a camera unit 12 for acquiring the image of the circumferential surface of the detected object, wherein the camera unit 12 is in communication connection with the judgment unit 1;
the bearing platform 2 comprises a platform base 21 and a bearing base 22 used for the detected object to be vertically placed, and the bearing base 22 is installed on the platform base 21;
the camera unit 12 or the carrying base 22 can rotate around the vertical direction to obtain images of different positions of the circumferential surface of the detected object.
The bearing platform 2 which is vertically arranged on the detected object is arranged, so that the circumferential surface of the detected object is prevented from being damaged when the detected object is transversely arranged, and the risk of damage to the detected object in the detection process is reduced; in addition, the camera unit 12 and the judgment unit 1 are provided, after the image of the circumferential surface of the detected object is acquired by the camera unit 12, the judgment unit 1 identifies and judges whether the circumferential surface of the detected object has the defect characteristics or not according to the image acquired by the camera unit 12, so that the automation degree of the detection of the detected object is improved, the misjudgment caused by insufficient human experience is reduced, and the detection efficiency is improved, wherein the camera unit 12 or the bearing base 22 can rotate around the vertical direction, so that the detected object placed on the bearing base 22 and the camera unit 12 can rotate relatively, the acquisition of the images at different positions of the circumferential surface of the detected object is realized, and the circumferential surface of the detected object is comprehensively detected.
The detected object in the invention is a steel wire groove wheel axle or a circumferential surface formed by winding a steel wire.
Referring to fig. 1 and 14, the image capturing unit 12 in this embodiment includes a CCD camera 121 (the CCD camera 121 is in a security system, and the image generation is mainly from the CCD camera 121 at present, and the CCD is an abbreviation of a charge coupled device (charge coupled device) which can change light into charges and store and transfer the charges, and can also take out the stored charges to change the voltage, so that the CCD camera 121 is an ideal CCD camera 121 component, and the CCD camera 121 formed by the zoom lens has a small volume, a light weight, is not affected by a magnetic field, and is widely applied with characteristics of vibration and impact resistance), and a zoom lens 122, the zoom lens 122 is installed at the image capturing end of the CCD camera 121, and the multiple zooming of the CCD camera 121 is realized by the arrangement of the zoom lens 122, and meanwhile, the CCD camera 121 with higher pixels, such as 3800-4500 ten thousand pixels, is matched with the zoom lens 122 for realizing the definition and rich details of the image captured by the circumferential surface of the detected object, and the judgment and identification of defect characteristics are facilitated.
Specifically, the judging unit 1 includes a storage module 111 for storing a preset image feature library, an analysis module 112 for comparing an image acquired by the camera unit 12 with the preset image feature library, and a calibration module 113 for marking a defect position and outputting a defect feature type on the image acquired by the camera unit 12, and by transmitting the image acquired by the camera unit 12 to the analysis module 112, the analysis module 112 compares the acquired image with the preset image feature library stored in the storage module 111, so as to obtain the defect feature position and the defect feature type of the acquired image, and marks the defect position of the detected object through the calibration module 113, thereby facilitating a worker to mark the defect position of the detected object according to the mark on the image.
Furthermore, the detection system comprises a lifting mechanism 13, the camera unit 12 is mounted on the lifting mechanism 13, when the axial length of the detected object is large, the camera unit 12 moves along the axial direction of the detected object through the lifting mechanism 13 to acquire images at different axial positions of the detected object, so that the complete acquisition of the images of the circumferential surface of the detected object is further facilitated, and the detection efficiency is improved.
Referring to fig. 2 to 8, in an embodiment of the present invention, the present invention further includes a platform driving mechanism 23, the platform driving mechanism 23 is in transmission connection with the bearing base 22, the bearing base 22 is rotatably installed on the platform base 21 and can rotate around a vertical direction, so as to realize automatic rotation of the bearing base 22, and under the control of the controller, a preset rotation speed and a preset rotation angle of the bearing base 22 can be realized, so that when the image capturing unit 12 obtains an image of a circumferential surface of a detected object, the controller sends a control signal to the platform driving mechanism 23, and the platform driving mechanism 23 drives the bearing base 22 to rotate at a preset speed by a preset angle according to the control signal, so that the image capturing unit 12 obtains images of different circumferential positions of the circumferential surface of the detected object at different time points.
Further, thrust bearing 24 is installed to platform base 21 in this embodiment, bear base 22 and be connected with platform base 21 rotation through thrust bearing 24, through on bearing base 22 will be detected the object vertical placement, at this moment, thrust bearing 24 is applyed to the gravity of being detected the object, thrust bearing 24 can bear great axial force and can realize the rotation of circumference, thereby the stability of atress when having realized being detected the object vertical placement, be convenient for rotatory being detected the object simultaneously, adjust being detected the object and the relative position of camera unit 12, realize the image acquisition to the different positions of being detected the object periphery.
Referring to fig. 6 and 13, in order to fix the detected object vertically placed on the bearing base 22, the embodiment further includes a tensioning mechanism 25, the bearing base 22 is provided with a through hole 221 extending axially, the tensioning mechanism 25 is disposed in the through hole 221 for tensioning and fixing the detected object, since the detected object is a hollow structure, specifically, the tensioning mechanism 25 includes a chuck 251 and a plurality of jaws 252 slidably mounted on the chuck 251 and arranged along the circumferential direction of the chuck 251, when the tensioning mechanism 25 fixes the detected object, the plurality of jaws 252 move along the radial direction of the chuck 251 until the plurality of jaws 252 tightly press and tension the inner wall of the inner hole of the detected object, thereby fixing the detected object; the claw 252 is contacted with the inner wall of the inner hole of the detected object, so that the outer circumferential surface of the detected object is prevented from being damaged, and the detection reliability is further ensured.
Referring to fig. 6 and 9, the bearing base 22 of the present embodiment includes a transmission portion 222, a support portion 223 and a bearing portion 224 coaxially arranged in sequence along the axial direction, the diameter of the support portion 223 is larger than that of the transmission portion 222, one side of the support portion 223 facing the transmission portion 222 is supported on the upper end surface of the thrust bearing 24, and the thrust bearing 24 is sleeved outside the transmission portion 222 to form a stable support for the bearing base 22.
In order to avoid the radial shaking of the bearing base 22 during rotation and ensure the stability of the bearing base 22 in rotation, the platform base 21 of the embodiment is fixedly installed with a radial bearing 26, and the radial bearing 26 is sleeved outside the supporting portion 223.
Referring to fig. 1, 4 and 7, in the process of carrying the detected object, in order to wear the detected object on the surface, a worker generally holds both ends of the detected object with hands, so when the detected object is vertically placed on the bearing base 22, the hands are easily crushed by the detected object due to untimely withdrawal, therefore, the bearing base 22 in this embodiment is provided with a safety hand hole 225, when the worker places the detected object on the bearing base 22, the hands are aligned with the safety hand hole 225, when one end of the detected object is placed flatly, the hands are accommodated in the safety hand hole 225, thereby preventing the detected object from being crushed, and ensuring the safety of the operation of the worker; specifically, the vertical projection of the safety hand hole 225 is fan-shaped, and the width is about 4-10 cm.
Referring to fig. 6 and 9, since the weight of the detected object is large, a worker can easily cause large impact to the bearing base 22 at a moment when placing the detected object on the bearing base 22, in order to avoid damaging the bearing base 22 and the thrust bearing 24 by excessive impact, the upper surface of the bearing base 22 is sequentially provided with the buffer layer 226 and the wear-resistant layer 227, on one hand, the impact to the bearing base 22 and the inference bearing at a moment when placing the detected object is reduced by the buffer layer 226, on the other hand, the wear-resistant layer 227 is arranged, so that the end of the detected object is damaged by placing the impact, and the service life of the bearing base 22 is prolonged.
Wherein, buffer layer 226 is the cotton layer of bubble, effectively cushions the impact force that load-bearing platform 2 received, and simultaneously, wearing layer 227 is the polytetrafluoroethylene layer, has better wear-resisting, corrosion resisting property, and avoids causing the damage to the detected object.
Referring to fig. 4, considering that if the detected object is not coaxial with the bearing base 22 when placed, the eccentricity easily causes the influence of the centrifugal force during the rotation process and the poor tensioning effect of the tensioning mechanism 25, which causes the detected object to shake during the detection process, thereby affecting the precision and safety of the detection, in this embodiment, the upper surface of the bearing base 22 is provided with a plurality of position mark arcs 228, the plurality of position mark arcs 228 are all arranged coaxially with the rotation axis of the bearing base 22, when placing the detected object, the circumferential outer edge of the detected object is conveniently aligned with the position mark arcs 228, thereby allowing a worker to place the detected object quickly and accurately, and facilitating the worker to check the position of the detected object.
Further, referring to fig. 1, 10-12, the device further includes a positioning mechanism 3 for fixing the upper end of the object to be detected, and preventing the upper end of the object to be detected from shaking during the detection process, the positioning mechanism 3 includes a slide rail 31 and a clamping assembly 32, the clamping assembly 32 includes two sets of clamps 33 symmetrically arranged for circumferentially clamping the object to be detected, the clamps 33 are slidably disposed on the slide rail 31, the clamps 33 include a sliding bracket 331 and a first rotating member 332 and a second rotating member 333 rotatably mounted on the sliding bracket 331, a rotation axis of the first rotating member 332 and a rotation axis of the second rotating member 333 are parallel and do not coincide, preferably, the first rotating member 332 and the second rotating member 333 are located on the same horizontal plane, so that when the object to be detected is clamped by the two sets of clamps 33, the two sets of clamps 33 slide toward each other through the slide rail 31, the two sets of clamps 33 are respectively disposed on two, the first rotating member 332 and the second rotating member 333 contact with the circumferential surface of the detected object to clamp the detected object, and the first rotating member 332 and the second rotating member 333 are rotatably connected to the sliding support 331, so that the detected object is clamped, and simultaneously, the first rotating member 332 and the second rotating member 333 can synchronously rotate along with the detected object, and the rotation stability of the detected object is ensured.
The sliding support 331 in this embodiment includes a sliding block 3311 and a supporting rod 3312 connected to the sliding block 3311, the sliding block 3311 is slidably connected to the sliding rail 31, and the first rotating member 332 and the second rotating member 333 are rotatably connected to the supporting rod 3312, specifically, the sliding rail 31 is a pneumatic sliding rail 31, which facilitates automatic control of movement of the two sets of clamps 33.
The first rotating member 332 and the second rotating member 333 each include a roller 334 and a sheave 335 coaxially arranged, and an annular groove 336 is formed on the circumferential side of the sheave 335, so that the roller 334 and the sheave 335 respectively correspond to detected objects of different structural types, for example, i-shaped detected objects, and through the annular groove 336 formed on the circumferential side of the sheave 335, when the detected objects are clamped by the two sets of clamps 33, an annular protrusion at one end of the i-shaped detected object is embedded into the annular groove 336, thereby improving the stability of the relative position during clamping; when the cylindrical object to be detected is held, the rollers 334 of the first rotating member 332 and the second rotating member 333 are brought into contact with the circumferential surface of the cylindrical object to be detected, and the object to be detected is set at a position between the rollers 334 of the first rotating member 332 and the second rotating member 333.
Referring to fig. 10 and 11, further, in order to change the positions of the roller 334 and the sheave 335 to adapt to different types of objects to be detected, a reset component 34 is installed on the slider 3311 of this embodiment, the support rod 3312 is rotatably connected to the slider 3311 through the reset component 34 and can move along the length direction of the support rod 3312, the roller 334 and the sheave 335 are respectively disposed on two sides of the support rod 3312, and when in use, the support rod 3312 is pulled out in the length direction and rotated by 180 °, and the support rod 3312 is reset under the action of the reset component 34, so that the position of the roller 334 and the sheave 335 is changed.
Specifically, the reset component 34 in this embodiment includes a spring mounting shaft 341 and a spring 342, the slider 3311 is provided with a guiding hole 3311a, the spring mounting shaft 341 passes through the guiding hole 3311a, the spring 342 is sleeved on the outer side of the spring mounting shaft 341 and abuts against a side of the slider 3311 opposite to the supporting rod 3312, and the supporting rod 3312 is connected to the spring mounting shaft 341.
Referring to fig. 12, further, a side surface of the slider 3311 facing the supporting rod 3312 is provided with a limiting groove 3311b, one end of the supporting rod 3312 close to the slider 3311 is matched with the limiting groove 3311b to limit the supporting rod 3312 to rotate around the length direction, so that when one end of the supporting rod 3312 close to the slider 3311 is embedded in the limiting groove 3311b, the supporting rod 3312 cannot rotate around the length direction of the supporting rod 3312, and when the supporting rod 3312 is pulled out along the length direction, one end of the supporting rod 3312 leaves the limiting groove 3311b, the positions of the roller 334 and the sheave 335 can be changed by rotation, thereby ensuring the position stability of the supporting rod 3312 in the process of clamping the detected object, and at the same time, reducing vibration generated by the movement of the detected object when the clamp 33 clamps the detected object through the spring 342, and.
In order to adapt to ground environments with different flatness, the platform base 21 of the present embodiment is provided with at least three foot cups 27 for supporting the platform base 21, and the platform base 21 is kept in a horizontal state through adjustment of the foot cups 27, so as to ensure that the detected object placed on the bearing platform 2 can be kept vertical.
In conclusion, the bearing platform 2 which is vertically arranged on the detected object is arranged, so that the circumferential surface of the detected object is prevented from being damaged when the detected object is transversely arranged, and the risk of damage to the detected object in the detection process is reduced; in addition, the camera unit 12 and the judgment unit 1 are provided, after the image of the circumferential surface of the detected object is acquired by the camera unit 12, the judgment unit 1 identifies and judges whether the circumferential surface of the detected object has the defect characteristics or not according to the image acquired by the camera unit 12, so that the automation degree of the detection of the detected object is improved, the misjudgment caused by insufficient human experience is reduced, and the detection efficiency is improved, wherein the camera unit 12 or the bearing base 22 can rotate around the vertical direction, so that the detected object placed on the bearing base 22 and the camera unit 12 can rotate relatively, the acquisition of the images at different positions of the circumferential surface of the detected object is realized, and the circumferential surface of the detected object is comprehensively detected.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims (10)

1. A wafer cutting tool inspection apparatus, comprising:
the detection system comprises a judgment unit for judging whether the circumferential surface of the detected object has defects or not and a camera unit for acquiring the image of the circumferential surface of the detected object, wherein the camera unit is in communication connection with the judgment unit;
the bearing platform comprises a platform base and a bearing base used for the detected object to be vertically placed, and the bearing base is arranged on the platform base;
the camera unit or the bearing base can rotate around the vertical direction to be used for acquiring images of different positions of the circumferential surface of the detected object.
2. The wafer cutting tool inspection apparatus of claim 1, wherein the determination unit comprises a storage module for storing a preset image feature library, an analysis module for comparing the image obtained by the camera unit with the preset image feature library, and a calibration module for marking a defect position on the image obtained by the camera unit and outputting a defect feature type.
3. The wafer cutting tool inspection apparatus of claim 1, further comprising a platform drive mechanism, wherein the platform drive mechanism is drivingly connected to the carrier base, and wherein the carrier base is rotatably mounted to the platform base and is rotatable in a vertical direction.
4. The wafer cutting tool inspection apparatus of claim 3, wherein the platform base mounts a thrust bearing, and the load bearing base is rotatably coupled to the platform base via the thrust bearing.
5. The wafer cutting tool inspection apparatus of claim 3, further comprising a tensioning mechanism, wherein the carrier base defines an axially extending through hole, and the tensioning mechanism is disposed in the through hole for tensioning and fixing the inspected object.
6. The wafer cutting tool inspection apparatus of claim 1, wherein the carrier base defines a safety hand hole.
7. The wafer cutting tool inspection apparatus of claim 1, wherein the upper surface of the carrier base defines a plurality of position mark arcs, each of the plurality of position mark arcs being disposed coaxially with the rotational axis of the carrier base.
8. The wafer cutting tool detection device according to claim 1 or 5, further comprising a positioning mechanism for fixing the upper end of the object to be detected, wherein the positioning mechanism comprises a slide rail and a clamping assembly, the clamping assembly comprises two sets of clamps which are symmetrically arranged and used for circumferentially clamping the object to be detected, the clamps are slidably arranged on the slide rail, the clamps comprise a sliding support and a first rotating member and a second rotating member which are rotatably arranged on the sliding support, and the rotating shaft of the first rotating member is parallel to and does not coincide with the rotating shaft of the second rotating member.
9. The wafer cutting tool inspection apparatus of claim 8, wherein the first and second rotating members each comprise a coaxially disposed roller and a sheave, the sheave having an annular groove formed on a circumferential side thereof.
10. The wafer cutting tool inspection apparatus of claim 9, wherein the sliding bracket includes a slider and a support rod rotatably connected to the slider, the slider is slidably connected to the slide rail, and the roller and the sheave are respectively disposed on both sides of the support rod.
CN202010570850.0A 2020-06-19 2020-06-19 Wafer cutting tool check out test set Pending CN111812097A (en)

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Application Number Priority Date Filing Date Title
CN202010570850.0A CN111812097A (en) 2020-06-19 2020-06-19 Wafer cutting tool check out test set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010570850.0A CN111812097A (en) 2020-06-19 2020-06-19 Wafer cutting tool check out test set

Publications (1)

Publication Number Publication Date
CN111812097A true CN111812097A (en) 2020-10-23

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Application Number Title Priority Date Filing Date
CN202010570850.0A Pending CN111812097A (en) 2020-06-19 2020-06-19 Wafer cutting tool check out test set

Country Status (1)

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CN (1) CN111812097A (en)

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