CN111808490B - Device surface defect shielding method - Google Patents
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- CN111808490B CN111808490B CN202010693901.9A CN202010693901A CN111808490B CN 111808490 B CN111808490 B CN 111808490B CN 202010693901 A CN202010693901 A CN 202010693901A CN 111808490 B CN111808490 B CN 111808490B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
- C09D167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
- C09D167/08—Polyesters modified with higher fatty oils or their acids, or with natural resins or resin acids
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/22—Expandable microspheres, e.g. Expancel®
Abstract
The invention provides a device surface defect shielding method. The device surface defect shielding method comprises the following steps: step S1, providing a device to be coated, wherein the surface of the device is provided with a defect area; step S2, providing a coating, adding expanded microspheres and hollow glass beads into the coating, and uniformly dispersing the expanded microspheres and the hollow glass beads into the coating; and S3, coating the paint added with the expanded microspheres and the hollow glass beads on the surface of the device, heating the expanded microspheres to expand to form a smooth coating layer capable of shielding the defect area, heating the expanded microspheres in the coating layer to expand to improve the defect covering capacity of the coating layer, providing a pressure-bearing framework for the coating layer by the hollow glass beads, and counteracting the softening of the coating layer caused by the expansion of the expanded microspheres, thereby effectively improving the shielding effect of the surface defects of the device, simplifying the shielding process of the surface defects of the device and reducing the shielding cost of the surface defects of the device.
Description
Technical Field
The invention relates to the technical field of surface coating, in particular to a device surface defect shielding method.
Background
With the development of intelligent terminal technology, people are well acquainted with intelligent terminals such as smart phones, smart vehicle-mounted terminals, smart home terminals, wearable devices, building site handheld terminals, factory production line terminals and logistics intelligent carrying terminals, the intelligent terminals are almost integrated into various fields of modern economic society, and application scenes are very rich. The novel intelligent terminal appearing in the market has the characteristics of strong mobility, high function integration level, safe and convenient communication, strong interactivity, high response speed, vivid individuation and the like. With the rapid development of new-generation information and industrial modernization technologies such as artificial intelligence, big data, cloud computing, internet of things, edge computing, industrial internet and the like, intelligent terminals in various forms come up endlessly, and the high integration of the intelligent terminals with the traditional industry and the consumption field promotes more new business states and develops a huge potential emerging market.
Meanwhile, in a die casting (injection molding) process integrating metal and plastic, a carbon fiber plastic edge wrapping process, a material surface screen process, a pad printing process and the like, which are combined with two or more materials, the forming process is increasingly applied to the manufacturing of appearance parts of electronic products such as intelligent terminals and the like, but due to the limitation of processing methods, precision and inconsistency of expansion and shrinkage rates of the materials, the forming process combining two or more materials often shows poor coating such as fracture marks, gravure marks, bulges and the like at the junction of the two materials and surface defects formed after surface treatment during subsequent surface coating (spraying, printing, transfer printing, roller coating and curtain coating), and a smooth coating layer cannot be obtained. In the prior art, the method for solving the poor coating such as the fracture, the gravure, the bulge and the like comprises the following steps: painting multiple coatings, knife coating putty, multiple times of grinding and the like, but the methods have the defects of low production efficiency, low yield, high cost, uncontrollable process and the like.
The expanded microspheres, also called as expanded microspheres, are microspheres containing expanded gas, and can expand under heat at a certain temperature, in the prior art, some coatings are added with the expanded microspheres, and the expanded microspheres in the coatings generally have the function of reducing the specific gravity of the coatings or forming a three-dimensional pattern protruding from the coating surface on the coated surface of the coatings, but the expanded microspheres are not used for improving the defect shielding capability of the coatings.
Disclosure of Invention
The invention aims to provide a device surface defect shielding method which can improve the shielding effect of the device surface defects, simplify the shielding process of the device surface defects and reduce the shielding cost of the device surface defects.
In order to achieve the above object, the present invention provides a device surface defect masking method, comprising the steps of:
step S1, providing a device to be coated, wherein the surface of the device is provided with a defect area;
step S2, providing a coating, adding expanded microspheres and hollow glass beads into the coating, and uniformly dispersing the expanded microspheres and the hollow glass beads into the coating;
and step S3, coating the paint added with the expanded microspheres and the hollow glass beads on the surface of the device, and enabling the expanded microspheres to expand by heating to form a smooth coating layer capable of shielding the defect area.
The thickness of the coating layer is less than 200 μm.
The expanded microsphere comprises a hollow shell and expanded gas filled in the hollow shell.
The expansion temperature of the expansion microspheres is 50-300 ℃, the particle size of the expanded microspheres is 3-100 mu m, the shell is made of thermoplastic polymer, and the expansion gas is hydrocarbon gas.
The expanded particle size of the expanded microsphere is the same as that of the hollow glass bead.
The defect region comprises a joint region of two different materials on the surface of the device and one or a combination of two of a raised region or a depressed region formed after the surface treatment of the device.
The step S2 specifically includes: adding the expanded microspheres and the hollow glass beads into the coating and stirring to uniformly disperse the expanded microspheres and the hollow glass beads into the coating;
in the step S2, the rotation speed of stirring the coating, the expanded microspheres and the hollow glass beads is 600 to 800 rpm, the stirring time is 15 to 30 minutes, and the temperature of the coating added with the expanded microspheres and the hollow glass beads is controlled to be less than 50 ℃ during stirring.
In the step S3, the coating to which the expanded microspheres and hollow glass beads are added is coated on the surface of the device by a spraying, silk-screen, pad printing or roller coating process.
The device is an electronic device.
The coating comprises: resin, synthetic dispersant, flatting agent, pigment and filler and solvent;
in the step S2, the paint added with the expanded microspheres and the hollow glass beads comprises the following components in parts by weight: 30-50 parts of resin, 1-5 parts of synthetic dispersant, 0.1-10 parts of expanded microspheres, 5-10 parts of hollow glass beads, 0.1-2 parts of flatting agent, less than 30 parts of pigment and filler and less than 30 parts of solvent.
The invention has the beneficial effects that: the invention provides a device surface defect shielding method, which comprises the following steps: step S1, providing a device to be coated, wherein the surface of the device is provided with a defect area; step S2, providing a coating, adding expanded microspheres and hollow glass beads into the coating, and uniformly dispersing the expanded microspheres and the hollow glass beads into the coating; and S3, coating the paint added with the expanded microspheres and the hollow glass beads on the surface of the device, heating the expanded microspheres to expand to form a smooth coating layer capable of shielding the defect area, heating the expanded microspheres in the coating layer to expand to improve the defect covering capacity of the coating layer, providing a pressure-bearing framework for the coating layer by the hollow glass beads, and counteracting the softening of the coating layer caused by the expansion of the expanded microspheres, thereby effectively improving the shielding effect of the surface defects of the device, simplifying the shielding process of the surface defects of the device and reducing the shielding cost of the surface defects of the device.
Drawings
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description and are not intended to limit the invention.
In the drawings, there is shown in the drawings,
FIG. 1 is a flow chart of a device surface defect masking method of the present invention;
FIG. 2 is a schematic diagram of step S1 of the method for masking surface defects of a device according to the present invention;
FIG. 3 is a schematic diagram of step S2 of the method for masking surface defects of a device according to the present invention;
fig. 4 is a schematic diagram of step S3 of the method for masking surface defects of a device according to the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Referring to fig. 1, the present invention provides a method for masking a surface defect of a device, comprising the following steps:
step S1, please refer to fig. 2, providing a device 1 to be painted, the surface of the device 1 having a defect area 11.
Specifically, the device 1 is an electronic device, such as a smart phone, a notebook computer, or a tablet computer, and further, the electronic device may be a 5G electronic device.
Specifically, the defect region 11 includes a joint region of two different materials on the surface of the device 1 and one or a combination of two of a convex region and a concave region formed after the surface treatment of the device 1.
The joint area of the two different materials may be a joint area of metal and plastic material, a joint area of carbon fiber and plastic material, and the like, and the protrusion or depression area formed after the surface treatment of the device 1 may be a protrusion or depression area formed after the printing treatment, the laser etching treatment, or the local spraying treatment of the surface of the device.
Step S2, please refer to fig. 3, providing a coating 2, adding expanded microspheres 3 and hollow glass beads 4 into the coating 2, and uniformly dispersing the expanded microspheres 3 and the hollow glass beads 4 in the coating 2.
Specifically, the step S2 specifically includes: adding the expanded microspheres 3 and the hollow glass beads 4 into the coating 2 and stirring to uniformly disperse the expanded microspheres 3 and the hollow glass beads 4 into the coating 2;
in the step S2, the rotation speed of stirring the coating 2, the expanded microspheres 3 and the hollow glass beads 4 is 600-800 rpm, and the stirring time is 15-30 minutes.
It is worth mentioning that, because heat may be generated due to friction of the material during the stirring process, in order to avoid the expansion of the expanded microspheres in advance, the temperature of the coating 2 added with the expanded microspheres 3 and the hollow glass beads 4 is controlled to be less than 50 ℃ during the stirring in step S2, and the specific temperature control method may be: when the temperature is too high, circulating water is adopted for cooling.
Specifically, the expanded beads 3 include a hollow shell 31 and an expansion gas 32 filled in the hollow shell 31.
Preferably, the expansion temperature of the expanded microspheres 3 is 50-300 ℃, and the particle size is 3-100 μm.
Preferably, the material of the housing 31 is a thermoplastic polymer and the expansion gas 32 is a hydrocarbon gas.
More preferably, the particle size of the expanded microsphere 3 is 10-20 μm.
Specifically, the particle size of the expanded microspheres 3 is similar to the particle size of the hollow glass beads 4, so as to prevent the hollow glass beads 4 from protruding out of the surface of the coating layer 5 and affecting the texture of the surface of the coating layer 5.
Preferably, the expanded microspheres 3 have the same particle size after expansion as the hollow glass beads 4.
Specifically, the coating comprises: resin, synthetic dispersant, flatting agent, pigment and filler and solvent;
in the step S2, the coating 2 added with the expanded microspheres 3 and the hollow glass beads 4 respectively comprises the following components in parts by weight: 30-50 parts of resin, 1-5 parts of synthetic dispersant, 0.1-10 parts of expanded microspheres, 5-10 parts of hollow glass beads, 0.1-2 parts of flatting agent, less than 30 parts of pigment and filler and less than 30 parts of solvent.
Further, the resin may be selected from a combination of one or more of the following materials: acrylic resins, alkyd resins, polyester resins, epoxy resins, ultraviolet-curable urethane acrylic resins, epoxy acrylic resins, polyester acrylic resins, and water-based or solvent-based resins such as dual-curing systems.
Specifically, the solvent is preferably an ester solvent.
It should be noted that, depending on the solvent used for the paint 2, the time length of the interval between the step S2 and the step S3 is different, if the solvent used for the paint 2 is water, the time length of the interval between the step S2 and the step S3 is not limited, the step S3 may be performed at any time after the step S2 is completed, and if the solvent used for the paint 2 is other than water, the time length of the interval between the step S2 and the step S3 should be as close as possible, because the expanded microspheres may be dissolved in the solvent, and the too long interval may cause the failure of the expanded microspheres, thereby causing the loss of the defect shielding performance of the paint.
Preferably, if the solvent used for the dope 2 is other than water, the step S3 is performed immediately after the step S2 is completed.
Step S3, please refer to fig. 4, in which the coating 2 added with the expanded microspheres 3 and the hollow glass beads 4 is coated on the surface of the device 1, and the expanded microspheres 3 are expanded by heating to form a smooth coating layer 5 capable of shielding the defect area 11.
Specifically, the thickness of the coating layer 5 is micron-sized and is larger than the particle size of the expanded microspheres 3, so as to ensure that the surface of the coating layer 5 is smooth.
Preferably, the thickness of the coating layer 5 is less than 200 μm.
Specifically, in the step S3, the coating 2 added with the expanded microspheres 3 and the hollow glass beads 4 is coated on the surface of the device 1 by a spraying, silk-screen, pad printing or roller coating process.
It should be noted that the expansion temperature of the expanded microspheres 3 should be selected in combination with the heat-resistant performance of the device 1 to be coated, so as to avoid the device 1 itself from being damaged due to the excessively high expansion temperature.
Specifically, the device surface defect shielding method provided by the invention utilizes the expansion of the expansion microspheres 3 in the coating layer 5, so that the defect shielding capacity of the coating layer 5 is effectively improved, compared with the traditional coating method, the device surface defect shielding method provided by the invention can effectively reduce the coating times and necessary polishing times of the coating layer 5, reduce the coating steps, and improve the coating efficiency by more than 50%, thereby effectively improving the shielding effect of the device surface defects, simplifying the shielding process of the device surface defects, and reducing the shielding cost of the device surface defects.
In summary, the present invention provides a device surface defect masking method, including the following steps: step S1, providing a device to be coated, wherein the surface of the device is provided with a defect area; step S2, providing a coating, adding expanded microspheres and hollow glass beads into the coating, and uniformly dispersing the expanded microspheres and the hollow glass beads into the coating; and S3, coating the paint added with the expanded microspheres and the hollow glass beads on the surface of the device, heating the expanded microspheres to expand to form a smooth coating layer capable of shielding the defect area, heating the expanded microspheres in the coating layer to expand to improve the defect covering capacity of the coating layer, providing a pressure-bearing framework for the coating layer by the hollow glass beads, and counteracting the softening of the coating layer caused by the expansion of the expanded microspheres, thereby effectively improving the shielding effect of the surface defects of the device, simplifying the shielding process of the surface defects of the device and reducing the shielding cost of the surface defects of the device.
As described above, it will be apparent to those skilled in the art that other various changes and modifications may be made based on the technical solution and concept of the present invention, and all such changes and modifications are intended to fall within the scope of the appended claims.
Claims (8)
1. A device surface defect masking method, comprising the steps of:
step S1, providing a device (1) to be painted, wherein the surface of the device (1) is provided with a defect area (11);
step S2, providing a coating (2), adding expanded microspheres (3) and hollow glass beads (4) into the coating (2), and uniformly dispersing the expanded microspheres (3) and the hollow glass beads (4) in the coating (2);
step S3, coating the paint (2) added with the expanded microspheres (3) and the hollow glass beads (4) on the surface of the device (1), and enabling the expanded microspheres (3) to expand under heat to form a smooth coating layer (5) capable of shielding the defect area (11);
the device (1) is an electronic device;
the expanded particle diameter of the expanded microsphere (3) is the same as that of the hollow glass bead (4).
2. A device surface defect masking method according to claim 1, wherein the thickness of the coating layer (5) is less than 200 μm.
3. The device surface defect masking method according to claim 1, wherein the expanded microspheres (3) comprise a hollow shell (31) and an expansion gas (32) filled in the hollow shell (31).
4. The device surface defect masking method according to claim 3, wherein the expansion temperature of the expanded microspheres (3) is 50 to 300 ℃, the expanded particle size is 3 to 100 μm, the material of the shell (31) is a thermoplastic polymer, and the expansion gas (32) is a hydrocarbon gas.
5. The device surface defect masking method of claim 1, wherein said defect region (11) comprises one or a combination of a seam region of two different materials on the surface of said device (1) and a raised or recessed region formed after surface treatment of said device (1).
6. The device surface defect masking method of claim 1, wherein said step S2 specifically comprises: adding the expanded microspheres (3) and the hollow glass beads (4) into the coating (2) and stirring to uniformly disperse the expanded microspheres (3) and the hollow glass beads (4) into the coating (2);
in the step S2, the rotation speed of stirring the coating (2), the expanded microspheres (3) and the hollow glass beads (4) is 600-800 rpm, the stirring time is 15-30 minutes, and the temperature of the coating (2) added with the expanded microspheres (3) and the hollow glass beads (4) is controlled to be less than 50 ℃ during stirring.
7. The device surface defect masking method as claimed in claim 1, wherein said step S3 is performed by coating a coating material (2) added with said expanded microspheres (3) and hollow glass beads (4) on the surface of said device (1) by spraying, silk-screening, pad printing or roll coating process.
8. The device surface defect masking method as claimed in claim 1, wherein said coating (2) comprises: resin, synthetic dispersant, flatting agent, pigment and filler and solvent;
in the step S2, the coating (2) after the expanded microspheres (3) and the hollow glass beads (4) are added comprises the following components in parts by weight: 30-50 parts of resin, 1-5 parts of synthetic dispersant, 0.1-10 parts of expanded microspheres, 5-10 parts of hollow glass beads, 0.1-2 parts of flatting agent, less than 30 parts of pigment and filler and less than 30 parts of solvent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010693901.9A CN111808490B (en) | 2020-07-17 | 2020-07-17 | Device surface defect shielding method |
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| CN202010693901.9A CN111808490B (en) | 2020-07-17 | 2020-07-17 | Device surface defect shielding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3615972A (en) * | 1967-04-28 | 1971-10-26 | Dow Chemical Co | Expansible thermoplastic polymer particles containing volatile fluid foaming agent and method of foaming the same |
| WO2010025383A1 (en) * | 2008-08-28 | 2010-03-04 | International Paper Company | Expandable microspheres and methods of making and using the same |
| CN101434763A (en) * | 2008-12-09 | 2009-05-20 | 朗盛（无锡）化工有限公司 | Yellow stain resistant blowing promoter for coating leather |
| DE102013110977A1 (en) * | 2013-10-02 | 2015-04-02 | Continental Reifen Deutschland Gmbh | Self-sealing tire sealant and pneumatic vehicle tire |
| CN106634504B (en) * | 2016-10-14 | 2019-06-07 | 四川达威科技股份有限公司 | It has a shave and removes from office mending agente and preparation method thereof |
| CN108859187B (en) * | 2018-07-13 | 2021-04-23 | 厦门市豪尔新材料股份有限公司 | Method for repairing damaged area of composite material of airplane |
| CN109454905A (en) * | 2018-11-06 | 2019-03-12 | 康得复合材料有限责任公司 | The restorative procedure of resin tooth carbon fibre composite blibbing, starved defect |
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