CN111806111A - Antenna board resistance welding double-sided printing method and antenna board - Google Patents
Antenna board resistance welding double-sided printing method and antenna board Download PDFInfo
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- CN111806111A CN111806111A CN202010513091.4A CN202010513091A CN111806111A CN 111806111 A CN111806111 A CN 111806111A CN 202010513091 A CN202010513091 A CN 202010513091A CN 111806111 A CN111806111 A CN 111806111A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract
The application provides an antenna board solder mask double-sided printing method and an antenna board, wherein the method comprises the following steps: providing a circuit board to be printed, wherein the circuit board to be printed comprises a flexible substrate, and the flexible substrate is provided with a first surface and a second surface which are opposite; printing solder resist ink on the non-antenna area and the connection position in the unit circuit layer of the first surface by using the screen printing plate; carrying out depth control milling on the flexible base plate to enable the top surface of the flexible base plate to form a groove and a plurality of supporting positions, wherein the positions of the supporting positions correspond to the positions of the antenna circuit layers and the plate edges of the first surface one by one; placing the circuit board on the top surface of the flexible base plate; printing solder resist ink on the second surface; and carrying out pre-baking, exposure, development and post-process manufacturing on the circuit board. The application provides an antenna panel hinders and welds two-sided printing method shortens the two-sided ink printing time of antenna panel when not destroying connection position printing ink structure, reduces because of the printing ink risk of droing that printing ink printing time out leads to, and the preparation is efficient, and the finished product is of high quality.
Description
Technical Field
The application belongs to the technical field of antenna board manufacturing, and particularly relates to a resistance welding double-sided printing method for an antenna board and the antenna board.
Background
With the development of 5G technology, the demand of antenna boards is increasing, and the antenna boards used in 5G base stations are usually made of core boards made of Polytetrafluoroethylene (PTFE) materials with low dielectric constants and low dielectric losses.
When the anti-welding PCB is manufactured, one side of the conventional PCB needs to be printed with ink firstly, copper nails are placed at the connecting positions, and the nail bed is manufactured and used for supporting one side of the PCB where the ink is manufactured, so that the ink can be directly printed on the other side of the PCB, and the printing of the ink on two sides is realized.
The PTFE material has excellent electrical property, but due to the material characteristics, after the outer layer circuit is manufactured, ink printing needs to be manufactured within 8 hours, and if the time exceeds 8 hours, the adhesive force between an ink plate surface and ink is reduced. The problem of gong board burr because of the soft gong board burr that leads to of PTFE material texture ground can greatly be improved to resistance welding in connection position printing, if set up nail preparation nail bed at the connection position and destroy the printing ink structure easily, lead to finished product gong board burr to produce.
Therefore, in order to reduce the generation of burrs, the antenna board made of PTFE material can only be printed with ink on one side, prebaked and then printed with the other side, but this method seriously affects the printing efficiency, and is liable to cause the ink to fall off when the time from the outer layer circuit to the printing of the ink exceeds 8 hours.
Disclosure of Invention
An object of the embodiment of the application is to provide a solder mask double-sided printing method for an antenna board, so as to solve the technical problem that in the prior art, in order to reduce burr generation, only one side of the antenna board manufactured by using a nail bed can be printed with ink first, and then the other side of the antenna board is printed, so that printing efficiency is low.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: the method for solder-resisting double-sided printing of the antenna board comprises the following steps:
providing a circuit board to be printed, wherein the circuit board to be printed comprises a flexible substrate with circuit layers arranged on two sides, the flexible substrate is provided with a first side and a second side which are opposite, the circuit layers on the first side and the second side respectively comprise a plurality of antenna circuit layers and unit circuit layers which are arranged around the antenna circuit layers, each unit circuit layer is arranged in a peripheral board area of the corresponding side of the flexible substrate, and connecting positions are respectively arranged between two adjacent unit circuit layers and between the board edge of the flexible substrate and the unit circuit layers;
printing solder resist ink on the non-antenna area and the connection position in the unit circuit layer of the first surface by using a screen printing plate to finish the manufacture of the ink of the first surface;
providing a flexible base plate, and carrying out depth control milling on the flexible base plate to form a groove and a plurality of supporting positions on the top surface of the flexible base plate, wherein the positions of the supporting positions are respectively in one-to-one correspondence with the positions of the antenna circuit layers and the plate edges of the first surface;
placing the circuit board with the first surface printed with ink on the top surface of the flexible base plate, and enabling each supporting position on the top surface of the flexible base plate to correspondingly support each antenna circuit layer and each board edge of the first surface one by one;
printing solder resist ink on the second surface to finish the preparation of the ink on the second surface;
and carrying out pre-baking, exposure, development and post-process manufacturing on the circuit board subjected to the second-side printing ink to obtain the antenna board.
Optionally, an area enclosed by the inner sides of the unit circuit layers of the first surface is larger than an area enclosed by the inner sides of the unit circuit layers of the second surface.
Optionally, the screen printing plate and the flexible base plate are provided with expansion and shrinkage compensation, so that the screen printing plate is respectively matched with the expansion and shrinkage values of the circuit board to be printed when solder resist ink is printed and after depth control milling of the flexible base plate.
Optionally, the blocking point of the unit circuit layer corresponding to the first surface of the screen is unilaterally retracted by 0.2mm toward the corresponding antenna circuit layer, and the blocking point of the plate edge corresponding to the first surface of the screen is unilaterally extended by 0.2mm toward the direction close to the unit circuit layer.
Optionally, the supporting position of the unit circuit layer corresponding to the first surface of the flexible cushion plate is 0.2mm smaller than the single edge of the blocking point corresponding to the screen printing plate, and the single edge of the inner side of the supporting position of the plate edge corresponding to the first surface of the flexible cushion plate is 0.2mm larger than the single edge of the blocking point corresponding to the screen printing plate.
Optionally, the depth of the groove is greater than or equal to 1.0 mm.
Optionally, a corner of the flexible pad corresponding to the supporting position of the unit circuit layer on the first surface is provided with a fillet.
Optionally, the radius of the fillet is equal to half the depth of the groove.
Optionally, a positioning hole is formed in a corner of the flexible substrate, and after the flexible base plate is subjected to depth-controlled milling, a positioning column matched with the positioning hole is formed in the position, corresponding to the positioning hole, of the flexible base plate.
Another object of the present application is to provide an antenna board, which is manufactured by using the above method for solder mask double-sided printing.
The application provides an antenna board hinders and welds two-sided printing method's beneficial effect lies in: compared with the prior art, this application antenna panel hinders and welds two-sided printing method, use the flexible backing plate to support the circuit board of accomplishing first face printing, make the interior antenna area of unit, the regional corresponding flexible backing plate of flange limit does not mill empty region, accept the circuit board of having printed first face printing ink, then carry out the solder mask printing of second face again, when not destroying junction printing ink structure, shorten the two-sided printing ink printing time of antenna panel that the PTFE material was made, reduce the printing ink risk of droing that leads to because of printing ink printing time-out, the preparation efficiency is high, the finished product is of high quality.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flow chart of a method for solder resist double-sided printing of an antenna board according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an outer layer circuit of a printed circuit board according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a screen printing plate according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of solder mask printing of a circuit board to be printed according to an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a flexible mat provided in an embodiment of the present application;
FIG. 6 is a cross-sectional view of a flexible shim plate after depth control milling provided by an embodiment of the present application;
FIG. 7 is a schematic diagram showing the comparison of the local positions of the screen, the flexible pad after depth control milling and the design of the finished product;
fig. 8 is an enlarged schematic view of a portion a in fig. 7.
Wherein, in the figures, the respective reference numerals:
10-a circuit board to be printed; 100-a flexible substrate; 200-screen printing plate; 300-a flexible backing plate; 101-a first side; 102-positioning holes; 110-antenna line layer; 120-unit circuit layer; 130-panel edges; 121-unit line area; 122-in-cell antenna area; 123-inner outermost peripheral region of cell; 131-board edge area; 132-innermost ring region; 140-a junction bit region; 210 — first gear point; 211-the sub-inner ring region; 220-second gear point; 221-sub-peripheral region; 301-grooves; 302-profile edges; 310-a support position; 311-a first support position; 312-a second support position; 320-positioning columns; 330-smallest peripheral area.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 and fig. 2 to fig. 5 together, a method for solder mask double-sided printing of an antenna board according to an embodiment of the present application will now be described. The solder mask double-sided printing method for the antenna board comprises the following steps:
step S100, providing a circuit board to be printed 10, wherein the circuit board to be printed 10 comprises a flexible substrate 100 with circuit layers on two sides, and the flexible substrate 100 can be but is not limited to a substrate made of PTFE material; the flexible substrate 100 has a first surface 101 and a second surface which are opposite to each other, the circuit layers of the first surface 101 and the second surface each include a plurality of antenna circuit layers 110 and unit circuit layers 120 which are arranged around each antenna circuit layer 110, each unit circuit layer 120 is arranged in a peripheral board edge area 131 of the corresponding surface of the flexible substrate 100, and connection positions are respectively arranged between two adjacent unit circuit layers 120 and between a board edge 130 of the flexible substrate 100 and the unit circuit layers 120.
As shown in fig. 2, the first surface 101 of the flexible substrate 100 is provided with 6 unit circuit layers 120 in a matrix array, and the area of the unit circuit layer 120 of the first surface 101 may be equal to or different from the area enclosed by the inner side of the unit circuit layer of the second surface; the unit circuit layer 120 is in a hollow ring shape, and a region enclosed by the inner side and the outer side of the unit circuit layer 120 is a unit circuit region 121; the periphery of the flexible substrate 100 is provided with a plate edge 130, an area enclosed by the plate edge 130 is rectangular, and an area enclosed by the inner side and the outer side of the plate edge 130 is a plate edge area 131; the area surrounded by each unit circuit layer 120 is an in-unit antenna area 122, each in-unit antenna area 122 is provided with an antenna circuit layer 110, and the areas between two adjacent unit circuit layers 120 and between the board edge 130 of the flexible substrate 100 and the unit circuit layers 120 are connection location areas 140.
Step S200, solder resist ink is printed on the non-antenna area and the connection position in the unit circuit layer 120 of the first surface 101 by using the screen 200, thereby completing the preparation of the first surface ink. Antenna plates made of PTFE materials generally have high requirements for signal transmission efficiency and signal loss, and such antenna plates are not covered with ink at the antenna position. As shown in fig. 2 to 4, the outline shape of the screen 200 matches the outline shape of the flexible substrate 100, the screen 200 is provided with a plate edge region 131 stop point and a plurality of in-unit antenna regions 122 stop points, the plate edge region 131 stop point corresponds to the plate edge 130 covering the first surface 101, the in-unit antenna regions 122 stop points in each in-unit antenna region 122 cover the in-unit antenna region 122 in each unit circuit layer 120 of the first surface 101 in a one-to-one correspondence manner, such that the in-unit antenna area 122 and board edge area 131 of the first side 101 are not covered with solder resist ink when the first side ink is printed, solder resist ink is printed on the surfaces of the non-antenna areas and the connection sites in the unit wiring layer 120, the non-antenna areas in the unit wiring layer 120 include the unit wiring layer 120 itself and the areas excluding the antenna wiring layer 110 in the unit wiring layer 120, and a certain distance may be provided between the inner side of the unit wiring layer 120 on which the solder resist ink is printed and the antenna wiring layer 110.
Step S300, providing the flexible cushion plate 300, and performing depth-controlled milling on the flexible cushion plate 300 to form a groove 301 and a plurality of supporting positions 310 on the top surface of the flexible cushion plate 300, where the positions of the supporting positions 310 correspond to the positions of the antenna circuit layers 110 and the plate edges 130 of the first surface 101 one to one.
Step S400, placing the circuit board with the finished first side ink on the top surface of the flexible pad 300, so that the supporting positions on the top surface of the flexible pad 300 support the antenna circuit layers 110 and the board edges 130 of the first side 101 in a one-to-one correspondence manner. That is, the positions of the antenna circuit layers 110 and the board edges 130 on the first surface 101 of the circuit board correspond to the positions of the supporting positions on the top surface of the flexible substrate 300. As shown in fig. 4 to 6, after depth control milling, a part of the top surface of the flexible pad 300 is hollowed to form a groove 301, and a plurality of support positions are formed at the non-hollowed part; a first supporting position 311 with a contour matched with the contour of the board edge 130 of the first surface 101 is formed at the periphery of the top surface of the flexible pad 300, the first supporting position 311 is used for supporting the board edge 130 of the first surface 101, 6 second supporting positions 312 arranged in a matrix array are formed in the first supporting position 311, the 6 antenna circuit layers 110 are supported by the 6 second supporting positions 312 in a one-to-one correspondence manner, that is, the second supporting positions 312 support the in-unit antenna regions 122 without printing solder resist ink, and the second supporting positions 312 cover the in-unit antenna regions 122.
And S500, printing solder resist ink on the second surface to finish the preparation of the ink on the second surface. It is understood that the other screen 200 may be used to print solder resist ink on the second side, and after the solder resist ink is printed on the second side, the non-antenna area and the connection position in the unit circuit layer 120 on the second side are printed with solder resist ink.
And S600, pre-baking, exposing, developing and post-processing the circuit board with the second surface of the printing ink to obtain the antenna board. After the printing of the solder resist ink on both sides is completed, the areas such as the pads and the antennas need to be exposed through exposure and development.
The application provides an antenna panel hinders and welds two-sided printing method, compared with the prior art, use flexible backing plate 300 to support the circuit board of accomplishing first face 101 printing, make antenna region 122 in the unit, the corresponding flexible backing plate 300 of board edge region 131 does not mill the empty area, accept the circuit board of printing first face printing ink, then carry out the solder mask printing of second face again, when not destroying the joint ink structure, shorten the two-sided printing ink printing time of antenna panel that the PTFE material was made, reduce the printing ink risk of droing that leads to because of printing ink printing time-out, the preparation efficiency is high, the finished product is of high quality.
In an embodiment, the area of the unit circuit layer 120 on the first surface 101 is larger than the area enclosed by the inner side of the unit circuit layer on the second surface, that is, the surface with the larger antenna area is selected to make the screen 200, and then the flexible pad 300 is stressed at the area where the solder resist ink is not printed, so as to complete the solder resist double-sided printing of the PTFE material antenna board, thereby increasing the stressed area of the flexible pad 300.
In an embodiment, the screen 200 and the flexible pad 300 are provided with expansion and shrinkage compensation, so that the screen 200 is matched with the expansion and shrinkage values of the circuit board 10 to be printed respectively during printing solder resist ink and after depth control milling of the flexible pad 300. Thus, during production, the depth-controlled milling of the flexible substrate 300 is ensured to be consistent with the data of the flexible substrate 100 and the data of the screen 200, so that the depth-controlled milling of the flexible substrate 300 corresponds to the area in the unit circuit layer 120 of the flexible substrate 100 and the plate edge area 131.
In an embodiment, as shown in fig. 7 and 8, the blocking points of the unit circuit layers 120 corresponding to the first surface 101 of the screen 200 are inwardly contracted by 0.2mm in the direction of the corresponding antenna circuit layer 110, and the blocking points of the plate edges 130 corresponding to the first surface 101 of the screen 200 are outwardly expanded by 0.2mm in the direction close to the unit circuit layers 120. That is, the inner side of the first notch 210 is 0.2mm larger than the inner side of the board edge 130 of the first surface 101, and the inner side of the second notch 220 is 0.2mm smaller than the inner side of the antenna layer 110. After the solder mask ink is printed, areas such as a bonding pad and an antenna are exposed through exposure and development, but errors exist between the ink printing and the exposure, so that the single-side retraction is required to be 0.2mm on the basis of the design value of the antenna area when the screen 200 is manufactured, the plate edge 130 (close to the unit inner frame) is integrally expanded by 0.2mm, in order to ensure the precision, the expansion and contraction compensation is required to be carried out when the screen 200 is manufactured, the compensation value is matched with the expansion and contraction value of a production plate, and the requirement that the ink is required to be covered after the exposure and development is close to the design requirement of.
In one embodiment, the flexible pad 300 has a depth-controlled milling unit with an area that is 0.2mm more inward than the entire screen 200 and an area that is 0.2mm more outward than the entire screen 200 at the plate edge 130, so that the flexible pad 300 has a better supporting effect.
In an embodiment, referring to fig. 1, fig. 5 and fig. 6, the positioning holes 102 are disposed at the corners of the flexible substrate 100, and after the depth-control milling is performed on the flexible pad 300, the positioning posts 320 adapted to the positioning holes 102 are formed at the positions of the flexible pad 300 corresponding to the positioning holes 102. While the solder resist ink on one side is printed by the screen 200, the flexible backing plate 300 can be arranged on another printing machine, after the solder resist ink on one side is printed, the plate is placed on the flexible backing plate 300, and the ink on the other side is printed in an aligned mode by the positioning columns 320.
That is to say, the depth-controlled milling is performed on the flexible pad 300 by using the depth-controlled milling method, after the depth-controlled milling, a positioning column 320 for positioning, an area in the unit for supporting the board surface, and a board edge area 131 are formed on the flexible pad 300, and because the solder resist printing has a positioning error, the single side of the second supporting position 312 after the depth-controlled milling of the flexible pad 300 is 0.2mm smaller than the single side of the second shift point 220 in the corresponding unit, the single side outside the first supporting position 311 is 0.2mm larger than the single side outside the first board edge 130 of the first board 101, as shown in fig. 7 and 8, the distance D2 between the single side of the second supporting position 312 and the single side of the second shift point 220 is 0.2mm, and the distance D1 between the single side outside the first supporting position 311 and the single side outside the first board edge 130 of the first board 101 is 0.2 mm. Similar to the manufacturing of the screen printing plate 200, in order to ensure the precision, the depth control milling of the flexible base plate 300 needs to be carried out with expansion and contraction compensation, the compensation value is matched with the expansion and contraction value of the production plate, the data of the flexible base plate 300 after the depth control milling is consistent with the expansion and contraction of the production plate and the data of the screen printing plate 200 are ensured as much as possible, each support position after the depth control milling of the flexible base plate 300 corresponds to the unit inner area and the plate edge area 131 corresponding to the production plate respectively, and the support effect of the flexible base plate 300 is optimal.
As shown in fig. 7 and 8, the intra-cell outermost region 123 is an antenna region required by a customer, that is, a region (cell line region 121) surrounded by the inner sides of the cell line layers 120; a sub-peripheral area 221, which is an area surrounded by printing ink dots, that is, an area surrounded by the second dots 220; the minimum peripheral area 330 is an area surrounded by the second support locations 312 after the depth control milling of the flexible tie plate 300. An innermost ring region 132 of the plate edge region 131 is a region surrounded by the inner side of the plate edge 130 of the first surface 101; a secondary inner ring area 211, which is a printing ink stop point area, i.e. an area surrounded by the inner sides of the first stop points 210; the area sandwiched by the minimum inner ring and the outer edge 302 (the outer edge of the first supporting position 311) is the area of the flexible cushion plate 300 after depth control milling, i.e. the area enclosed by the outer edge and the inner edge of the first supporting position 311. In the area in the unit and the plate edge area 131, the distance between the finished product size and the second stop point 220 is set to be equal to the distance between the second stop point 220 and the second support position 312, taking the antenna area as an example, the distance from the periphery of the finished product design to the periphery of the stop point net is 0.2mm, and the distance from the periphery of the stop point net to the depth control milling periphery of the flexible base plate 300 is 0.2 mm.
In an embodiment, referring to fig. 1 and fig. 6, the height of the positioning post 320 is set to be equal to the thickness of the antenna board, i.e., H1-H2 is the thickness of the antenna board made of PTFE material, the positioning hole 102 penetrates through the antenna board, and the height of the positioning post 320 is equal to the depth of the positioning hole 102.
Section view behind the controlled dark milling of flexible backing plate 300, the controlled dark is divided into three height, wherein H1 is the thickness of whole flexible backing plate 300, wherein reference column 320 position, the controlled dark back thickness is H2, H1-H2 are thick for the antenna panel that the PTFE material was made, locating hole 102 cover is accomplished backing plate and PCB board location on reference column 320, circuit area all needs printing assembly welding printing ink with connection position area 140 in the unit, consequently will fall unit circuit and connection position area 140 controlled dark, the controlled dark back depth is H3, do not control dark flexible backing plate 300 and correspond the regional 131 of flange and be used for supporting the face with the regional 122 of antenna in the unit, lead to the support effect poor for avoiding the thickness inadequately, the requirement is satisfied: H2-H3 is more than or equal to 1.0mm, namely the depth of the groove 301 is more than or equal to 1 mm.
In an embodiment, referring to fig. 6, in the antenna area 122 in the unit, in order to prevent the corner after depth control from damaging the antenna area under the pressure of the printing machine, the depth control gong of the antenna area 122 in the unit is required to perform fillet processing, and the fillet radius R is required to satisfy: r is (H2-H3)/2.
The antenna board provided by the embodiment of the application is manufactured by adopting the solder mask double-sided printing method of the antenna board. The screen printing plate 200 and the flexible base plate 300 are adopted to perfect the double-sided printing process of the solder resist ink, so that the printing time of the double-sided ink of the antenna plate made of the PTFE material is shortened while the ink structure of the connecting position is not damaged, the risk of ink falling caused by overtime printing of the ink is reduced, the product quality is good, the manufacturing efficiency is high, and the method is suitable for batch production.
The following describes the manufacturing process by taking the manufacturing of an antenna board with 6 antenna units on both sides as an example: the production process of the product comprises the following procedures of cutting, inner layer pattern transfer, development, acid etching, film stripping, inner layer optical inspection, pressing, targeting, drilling, copper plate plating, outer layer circuit, pattern electroplating, alkaline etching, outer layer optical inspection, resistance welding and post-processing. Wherein
2.1 drilling: drilling holes are manufactured according to the expansion and contraction coefficient of the drill strip measured by the target hitting after pressing, the drill strip comprises a unit inner hole and a tool hole arranged at the plate edge 130, and the tool hole comprises a positioning hole 102 which is subsequently used for solder resist printing ink.
2.2 solder resist: and the solder resist comprises solder resist pretreatment, solder resist ink printing, solder resist ink pre-baking, solder resist exposure and solder resist development. After the outer layer circuit of the PTFE material is manufactured and subjected to alkaline etching, ink printing needs to be manufactured within 8 hours, if the ink adhesion force of an ink plate surface and ink is reduced after 8 hours, and a period of time is needed for optical inspection after the outer layer circuit, so that the solder mask ink printing time is shortened as much as possible. The specific manufacturing method comprises the following steps:
2.2.1 preparation of first side ink Using Screen 200
In order to increase the stress area of the flexible base plate 300, the side with the larger antenna area is selected to manufacture the screen 200, the screen 200 is used for printing ink on the first side, the solder resist ink is not printed on the antenna area and the plate edge area 131, and the solder resist ink is printed on the non-antenna area and the connection position in the unit.
2.2.2 printing of ink on the second side by means of a Flexible shim plate 300 controlled depth milling shim plate
After the first-side ink is manufactured, the flexible pad 300 is used for controlling the deeply milled pad, the positioning columns 320 of the flexible pad 300 correspond to the positioning holes 102 in the board, so that the antenna area 122 and the board edge area 131 in the unit correspond to the non-milled empty area of the flexible pad 300, the board printed with the first-side ink is received, and the second-side ink is printed.
And after printing the second surface ink, carrying out pre-baking, exposure, development and post-process manufacturing.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A solder mask double-sided printing method for an antenna board is characterized by comprising the following steps: the method comprises the following steps:
providing a circuit board to be printed, wherein the circuit board to be printed comprises a flexible substrate with circuit layers arranged on two sides, the flexible substrate is provided with a first side and a second side which are opposite, the circuit layers on the first side and the second side respectively comprise a plurality of antenna circuit layers and unit circuit layers which are arranged around the antenna circuit layers, each unit circuit layer is arranged in a peripheral board area of the corresponding side of the flexible substrate, and connecting positions are respectively arranged between two adjacent unit circuit layers and between the board edge of the flexible substrate and the unit circuit layers;
printing solder resist ink on the non-antenna area and the connection position in the unit circuit layer of the first surface by using a screen printing plate to finish the manufacture of the ink of the first surface;
providing a flexible base plate, and carrying out depth control milling on the flexible base plate to form a groove and a plurality of supporting positions on the top surface of the flexible base plate, wherein the positions of the supporting positions are respectively in one-to-one correspondence with the positions of the antenna circuit layers and the plate edges of the first surface;
placing the circuit board with the first surface printed with ink on the top surface of the flexible base plate, and enabling each supporting position on the top surface of the flexible base plate to correspondingly support each antenna circuit layer and each board edge of the first surface one by one;
printing solder resist ink on the second surface to finish the preparation of the ink on the second surface;
and carrying out pre-baking, exposure, development and post-process manufacturing on the circuit board subjected to the second-side printing ink to obtain the antenna board.
2. The antenna board solder mask double-sided printing method of claim 1, characterized in that: the area enclosed by the inner sides of the unit circuit layers of the first surface is larger than the area enclosed by the inner sides of the unit circuit layers of the second surface.
3. The antenna board solder mask double-sided printing method of claim 1, characterized in that: and the screen printing plate and the flexible base plate are provided with expansion and shrinkage compensation, so that the screen printing plate is respectively matched with the expansion and shrinkage values of the circuit board to be printed when solder resist ink is printed and after depth control milling of the flexible base plate.
4. The antenna board solder mask double-sided printing method of claim 3, characterized in that: the blocking points of the unit circuit layers of the screen corresponding to the first surface are internally contracted by 0.2mm towards the single side of the corresponding direction of the antenna circuit layers, and the blocking points of the plate edges of the screen corresponding to the first surface are externally expanded by 0.2mm towards the single side of the direction close to the unit circuit layers.
5. The antenna board solder mask double-sided printing method of claim 3, characterized in that: the supporting position of the unit circuit layer corresponding to the first surface of the flexible base plate is 0.2mm smaller than the single edge of the blocking point corresponding to the screen printing plate, and the single edge of the inner side of the supporting position of the plate edge corresponding to the first surface of the flexible base plate is 0.2mm larger than the single edge of the blocking point corresponding to the screen printing plate.
6. An antenna board solder mask double-sided printing method as claimed in any of claims 1 to 5, characterized in that: the depth of the groove is more than or equal to 1.0 mm.
7. An antenna board solder mask double-sided printing method as claimed in any of claims 1 to 5, characterized in that: and the corner of the flexible base plate, which corresponds to the supporting position of the unit circuit layer on the first surface, is provided with a fillet.
8. The antenna board solder mask double-sided printing method of claim 7, characterized in that: the radius of the fillet is equal to half of the depth of the groove.
9. An antenna board solder mask double-sided printing method as claimed in any of claims 1 to 5, characterized in that: and positioning holes are formed in the corners of the flexible substrate, and positioning columns matched with the positioning holes are formed in the positions, corresponding to the positioning holes, of the flexible base plate after the flexible base plate is subjected to depth-controlled milling.
10. An antenna board, characterized in that: the antenna board solder mask double-sided printing method is adopted to manufacture the antenna board solder mask double-sided printing method according to any one of claims 1-9.
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