CN111795540A - Dehumidification drainage system and semiconductor refrigerator - Google Patents

Dehumidification drainage system and semiconductor refrigerator Download PDF

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Publication number
CN111795540A
CN111795540A CN202010687049.4A CN202010687049A CN111795540A CN 111795540 A CN111795540 A CN 111795540A CN 202010687049 A CN202010687049 A CN 202010687049A CN 111795540 A CN111795540 A CN 111795540A
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CN
China
Prior art keywords
water
refrigerator
compartment
dehumidification
water leakage
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Pending
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CN202010687049.4A
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Chinese (zh)
Inventor
程春明
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Changhong Meiling Co Ltd
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Changhong Meiling Co Ltd
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Priority to CN202010687049.4A priority Critical patent/CN111795540A/en
Publication of CN111795540A publication Critical patent/CN111795540A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/14Collecting or removing condensed and defrost water; Drip trays
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00Self-contained movable devices, e.g. domestic refrigerators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/042Air treating means within refrigerated spaces
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00General constructional features
    • F25D23/003General constructional features for cooling refrigerating machinery
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0251Removal of heat by a gas
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/04Treating air flowing to refrigeration compartments
    • F25D2317/041Treating air flowing to refrigeration compartments by purification
    • F25D2317/0411Treating air flowing to refrigeration compartments by purification by dehumidification

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Removal Of Water From Condensation And Defrosting (AREA)

Abstract

The invention discloses a dehumidification drainage system and a semiconductor refrigerator, and relates to the technical field of refrigerators. The invention comprises a refrigerator, a drainage system, an evaporation system, a refrigerator chamber and a middle frame; a dehumidification system is arranged in the refrigerator; the dehumidification system comprises a plurality of air return inlets and a heat exchange module which are arranged in the refrigerator box; the heat exchange module comprises a fan A and an upper semiconductor chip; a refrigerating block is fixed on the fan A; the refrigeration block comprises a refrigeration block rear side and a refrigeration block front side; the rear side of the refrigeration block is a plane; rib protruding structures A are arrayed on the front side of the refrigerating block; and a drainage groove is arranged between the rib protruding structures A. According to the invention, moisture in the refrigerator is absorbed by the refrigerating surface of the heat exchange module during refrigeration to form condensate water, the condensate water is collected by the first collecting system and the second collecting system, the condensate water is discharged by the drainage system after being intensively converged, and the moisture is evaporated by using the heat of the radiating fins of the heat exchange module, so that the problems of high humidity and water accumulation in the refrigerator are solved.

Description

Dehumidification drainage system and semiconductor refrigerator
Technical Field
The invention belongs to the technical field of refrigerators, and particularly relates to a dehumidification drainage system and a semiconductor refrigerator.
Background
The refrigerator has the following types according to the working principle: the compression refrigerator works on a refrigerating system through a compressor, utilizes liquid-gas two-phase conversion of a low-boiling-point refrigerant, and completes heat exchange through heat absorption and heat dissipation.
The refrigerating principle of the semiconductor refrigerator is completely different from that of a common compressor refrigerator, and when the semiconductor chip is electrified, the refrigerating or heating is realized by utilizing the difference of the kinetic energy levels of the charge carriers in the two materials. The semiconductor refrigerator uses the Peltier effect, has low power consumption, small volume, light weight and easy carrying because of no compressor and other devices, but the semiconductor refrigerator has small refrigerating capacity, large heat dissipation capacity, and poor refrigerating speed and effect.
Most semiconductor refrigerators generally install semiconductor chip at incasement suitable position on the existing market, utilize the cold face of chip to absorb incasement heat and refrigerate, but do not design the inside comdenstion water drainage system of refrigerator, long-term after using, the incasement can constantly store up a large amount of comdenstion water, and can't initiatively discharge, bring very big inconvenience for the use. There has been no good technical solution in the industry to solve such problems. How to solve the problem that a large amount of water is accumulated in the use process of the existing semiconductor refrigerator becomes a technical problem which needs to be solved urgently in the industry.
Disclosure of Invention
The invention aims to provide a dehumidification drainage system and a semiconductor refrigerator.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a dehumidification drainage system and a semiconductor refrigerator, which comprise a refrigerator, a drainage system, an evaporation system, a refrigerator chamber and a middle frame; a dehumidification system is arranged in the refrigerator; the dehumidification system comprises a plurality of air return openings and a heat exchange module which are arranged in the refrigerator box; the heat exchange module comprises a fan A and an upper semiconductor chip; a refrigerating block is fixed on the fan A; the refrigeration block comprises a refrigeration block rear side and a refrigeration block front side; the rear side of the refrigeration block is a plane; rib protruding structures A are arrayed on the front side of the refrigerating block; a drainage groove is arranged between the rib protruding structures A; the drainage channel is of a U-shaped structure and has the same direction as the gravity; the upper semiconductor chip comprises a refrigerating surface and a hot surface; the refrigerating surface is attached to the rear side of the refrigerating block; the refrigerator compartment comprises a first compartment and a second compartment; the first compartment comprises a first compartment bottom surface and a first compartment side wall; the second compartment comprises a second compartment bottom surface and a second compartment sidewall; the refrigerator comprises a box body inner barrel, a box body outer barrel and a box body rear cover; the inner barrel of the refrigerator body is connected with the outer barrel of the refrigerator body through the middle frame to form a main body of the refrigerator body of the semiconductor refrigerator, and heat insulation materials are filled in the inner barrel of the refrigerator body; the outer barrel of the box body is fixed with the rear cover of the box body.
Furthermore, the heat exchange module also comprises a clamping seat; the clamping seat is provided with a clamping seat mounting hole; a clamp spring is fixed in the clamp seat mounting hole; the other end of the clamp spring is fixed with the refrigerating block; the clamping seat is provided with a plurality of buckling claws.
Furthermore, a vertical shaft structure and a water tank device for leading out water flow are arranged on the middle frame; the whole vertical shaft structure is of a U-shaped structure; the shaft structure includes a center frame back side; the back side of the middle frame is matched with the inner barrel of the box body to form a square funnel; a scrap edge structure is arranged in the water tank device; the water tank device is provided with a plurality of U-shaped water guide grooves.
Further, the drainage system comprises a first collection system and a second collection system; the first collecting system comprises a first collecting surface and a first water leakage device; the first collecting surface is arranged on the bottom surface of the first chamber; the first water leakage device is a groove structure arranged on the surface of the first collecting surface; the first water leakage device comprises an inclined surface on the side wall and a bottom surface of the first water leakage device; the bottom surface of the first water leakage device is provided with a plurality of first water leakage device drainage holes with regular or irregular shapes.
Further, the second collecting system comprises a second collecting surface and a second water leakage device; the second collecting surface is arranged on the bottom surface of the second chamber; the second collecting surface and the side wall of the second chamber form an included angle alpha; the second collecting surface comprises a low surface part, and a second water leakage device is arranged on the low surface part; a plurality of second water leakage device drain holes with regular or irregular shapes are formed in the second water leakage device; the second water leakage device corresponds to the water tank device.
Furthermore, the evaporation system comprises a water guide device, a water receiving disc, a cooling fan, a cooling device and a box body rear cover; the box body rear cover is provided with a ventilation hole, and water vapor is discharged out of the box body through the ventilation hole.
Furthermore, the water guide device is arranged on the water tank device and is made of sponge materials; one end of the water guide device extends outwards to form the front end of the water guide device; water leakage holes of the water guide device are arrayed on one side face of the front end of the water guide device; trapezoidal notches are arrayed at the end part of the front end of the water guide device.
Furthermore, a plurality of water guide device drainage grooves are formed in the lower portion of the water guide device; both sides of the upper end of the water receiving tray are provided with flanging structures; the flanging structure and the lapping structure are assembled; the heat radiation fan is fixed with the heat radiation device, and the evaporation of water is accelerated during operation.
Furthermore, the heat dissipation device is fixed with the buckling claw; the heat sink includes a heat sink front side; the front side of the heat dissipation device is provided with a rib protruding structure B in an array mode.
A semiconductor refrigerator comprises the dehumidification drainage system.
The invention has the following beneficial effects:
1. according to the invention, through the moisture absorption and dehumidification functions of the heat exchange module and the upper semiconductor chip, when in refrigeration, the refrigeration surface of the heat exchange module can continuously gather and absorb moisture in the refrigerator and form condensate water, after the condensate water is collected by the first collection system and the second collection system in the refrigerator, the condensate water is discharged out of the refrigerator room through the drainage system after being intensively gathered, and then the moisture is evaporated by using the heat of the radiating fins of the heat exchange module outside the refrigerator room, so that the problems of high humidity and water accumulation in the refrigerator room are solved, the interior of the refrigerator room is kept dry, and the user experience is improved.
2. According to the invention, the fan A is fixed with the refrigerating block, the fan absorbs the moisture in the refrigerator to the refrigerating block through the air return opening in the refrigerator, the moisture is condensed into water by utilizing the cold energy generated by the refrigerating surface of the semiconductor chip on the heat exchange module, and the water enters the drainage system along the refrigerating block, so that the moisture in the refrigerator is discharged.
3. According to the invention, the first water leakage device is of a groove structure arranged on the surface of the first collecting surface, the first water leakage device has a fall with the first collecting surface, and the four side walls are all provided with inclined surfaces for transition, so that smooth water flow is ensured; the water is guided out to the water tank device at the bottom of the middle frame through the first water leakage device and the second water leakage device, and the water is further discharged.
4. According to the invention, the rear cover of the box body is provided with the vent hole, and water and air are exhausted out of the box body through the vent hole; one end of the water guide device extends outwards to form the front end of the water guide device, and the water guide device mainly plays a role of a water bearing device; water leakage holes of the water guide device are arrayed on one side face of the front end of the water guide device and receive flowing water from the first collecting system; the end part of the front end of the water guide device is provided with a trapezoid notch in an array mode, and water flow is convenient to collect.
5. The invention is fixed with the heat dissipation device through the heat dissipation fan, and the evaporation of water is accelerated during the operation; the rib protruding structures B are arrayed on the front side of the heat dissipation device, so that the surface heat dissipation area is increased; fixed with the knot claw through heat abstractor, the heat that the hot side produced when mainly utilizing the last semiconductor chip of heat transfer module refrigerates evaporates like the moisture of last adsorbed on the water guide device and the moisture in the water collector.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a dehumidification drainage system and a semiconductor refrigerator according to the present invention;
FIG. 2 is a schematic view of the structure of a refrigerator compartment;
FIG. 3 is a schematic view of a drainage system;
FIG. 4 is a schematic view of the structure of the second compartment;
FIG. 5 is a schematic cross-sectional view taken along line A-A of FIG. 4;
FIG. 6 is an enlarged partial schematic view at C of FIG. 5;
FIG. 7 is a schematic top view of a first collection system;
FIG. 8 is a schematic cross-sectional view taken along line B-B of FIG. 7;
FIG. 9 is a schematic structural diagram of a heat exchange module;
FIG. 10 is a schematic view of a water guide device;
FIG. 11 is a schematic structural diagram of a middle frame;
FIG. 12 is a schematic structural diagram of a middle frame;
in the drawings, the components represented by the respective reference numerals are listed below:
1-a dehumidification system, 2-a drainage system, 3-an evaporation system, 4-a refrigerator compartment, 5-a refrigerator, 6-a middle frame, 11-an air return opening, 12-a heat exchange module, 21-a first collection system, 22-a second collection system, 31-a water guide device, 32-a water receiving tray, 41-a first compartment, 42-a second compartment, 51-a box inner barrel, 52-a box outer barrel, 53-a box back cover, 61-a vertical shaft structure, 62-a water tank device, 121-a fan A, 122-a refrigeration block, 123-an upper semiconductor chip, 124-a clamp spring, 125-a clamp seat, 126-a heat dissipation fan, 127-a heat dissipation device, 211-a first collection surface, 212-a first water leakage device, 221-a second collection surface, 222-second water leaking device, 311-front end of water guiding device, 312-water guiding device water discharging groove, 321-flanging structure, 411-first compartment bottom surface, 412-first compartment side wall, 421-second compartment bottom surface, 422-second compartment side wall, 531-vent hole, 611-back side of middle frame, 621-scrap structure, 622-U type water guiding groove, 1221-rear side of refrigerating block, 1222-front side of refrigerating block, 1231-refrigerating surface, 1232-hot surface, 1251-cassette mounting hole, 1252-snap pawl, 1271-front side of heat dissipating device, 2121-inclined surface, 2122-first water leaking device bottom surface, 2211-low surface part, 2221-second water leaking device water discharging hole, 12221-rib protruding structure A, 12222-water discharging groove, 12711-rib protruding structure B, 21221 water draining hole of the first water leaking device, 31111 water draining hole of the water guiding device, 31112 trapezoid notch.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention relates to a dehumidification drainage system and a semiconductor refrigerator, comprising a refrigerator 5, a drainage system 2, an evaporation system 3, a refrigerator compartment 4 and a middle frame 6; a dehumidification system 1 is arranged in the refrigerator 5, moist cold air in the refrigerator 5 is continuously condensed into water through the dehumidification system 1, accumulated water and condensed water in the refrigerator 5 are collected through a collecting and discharging system, then are discharged out of the refrigerator chamber 4 through a drainage system 2, and then are evaporated through an evaporation system 3 outside the refrigerator chamber 4 and discharged out of the refrigerator 5; the dehumidification system 1 comprises a plurality of air return openings 11 and a heat exchange module 12 which are arranged in the refrigerator 5; the heat exchange module 12 includes a fan a121 and an upper semiconductor chip 123; the fan A121 is fixed with the refrigerating block 122, the wet air in the refrigerator 5 passes through the air return opening 11 in the refrigerator 5 through the siphon effect of the fan A121 and is adsorbed onto the refrigerating block 122, and the wet air is condensed into water by utilizing the cold energy generated by the refrigerating surface 1231 of the semiconductor chip 123 on the heat exchange module 12 and enters the drainage system 2 along the refrigerating block 122;
the refrigeration block 122 includes a refrigeration block rear side 1221 and a refrigeration block front side 1222; the rear side 1221 of the refrigeration block is a plane; a rib projection structure A12221 is arrayed on the front side 1222 of the refrigeration block to increase the surface refrigeration area; a drainage groove 12222 is arranged between the rib protruding structures A12221 and used for draining condensed water; the drainage channel 12222 is in a U-shaped structure, has the same direction as the gravity, and is convenient for draining condensed water along the gravity;
the upper semiconductor chip 123 includes a cooling surface 1231 and a heating surface 1232; the refrigeration surface 1231 is attached to the rear side 1221 of the refrigeration block; the refrigerator compartment 4 comprises a first compartment 41 and a second compartment 42; the first compartment 41 includes a first compartment bottom 411 and a first compartment sidewall 412; second compartment 42 includes second compartment bottom 421 and second compartment sidewall 422;
the refrigerator 5 comprises a box inner barrel 51, a box outer barrel 52 and a box rear cover 53; the inner box body barrel 51 is connected with the outer box body barrel 52 through the middle frame 6 to form a main body of the semiconductor refrigerator box body, and heat insulation materials are filled in the inner part; the outer tub 52 is fixed to the rear cover 53, and the moisture is discharged to the outside of the refrigerator 5 through the vent holes 531 of the rear cover 53.
Preferably, as shown in fig. 1, the heat exchange module 12 further includes a clamping seat 125; a clamping seat mounting hole 1251 is formed in the clamping seat 125; a clamp spring 124 is fixed in the clamp seat mounting hole 1251; the other end of the clamp spring 124 is fixed with the refrigeration block 122; the clamping seat 125 is provided with a plurality of clamping claws 1252.
Preferably, as shown in fig. 1, the middle frame 6 is provided with a vertical shaft structure 61 and a water tank device 62 for guiding out water flow; the whole shaft structure 61 is a U-shaped structure; the shaft structure 61 includes a center frame back side 611; the back side 611 of the middle frame is matched with the inner barrel 51 of the box body and forms a square funnel; a lapping structure 621 is arranged in the water tank device 62; the water tank device 62 is provided with a plurality of U-shaped water guide grooves 622.
Preferably, as shown in fig. 1, the drainage system 2 includes a first collection system 21 and a second collection system 22, the first collection system 21 is mainly responsible for collecting accumulated water inside the first compartment 41 of the tank body inner barrel 51, the accumulated water is collected by a first water leakage device 212 of the system, and the water is guided out through a vertical shaft structure 61 on the inner middle frame 6, the accumulated water includes not only condensed water generated by the heat exchange module 12, but also condensed water generated by temperature drop inside the refrigerator compartment 4 and moisture of the stored articles, that is, includes all the accumulated water flowing inside the tank of the refrigerator 5; the first collecting system 21 comprises a first collecting surface 211 and a first water leaking device 212; the first collecting surface 211 is provided on the first compartment bottom surface 411 and collects moisture from the four walls of the first compartment 41; the first water leaking device 212 is a groove structure arranged on the surface of the first collecting surface 211, has a fall with the first collecting surface 211, and has inclined surfaces 2121 on four side walls for transition, so as to ensure smooth water flow; the first water leaking device 212 includes an inclined surface 2121 as a side wall and a first water leaking device bottom surface 2122; the bottom 2122 of the first water leaking device is provided with a plurality of first water leaking device discharging holes 21221 having regular or irregular shapes.
Preferably, as shown in fig. 1, the second collection system 22 includes a second collection surface 221 and a second water leaking device 222, the second collection system 22 is mainly responsible for collecting the accumulated water in the second compartment 42 of the tank inner tub 51, and the water is drained through the second water leaking device 222 at the bottom of the side surface; the second collecting surface 221 is disposed on the second chamber bottom surface 421; an included angle alpha is formed between the second collecting surface 221 and the side wall 422 of the second chamber, and an angle is set according to actual needs; the second collecting surface 221 comprises a lower part 2211, a second water leakage device 222 is arranged on the lower part 2211, and water flow of the second collecting surface 221 leads water to the water tank device 62 at the bottom of the middle frame 6 through the second water leakage device 222; a plurality of second water leakage device water drainage holes 2221 with regular or irregular shapes are formed on the second water leakage device 222; the second water leakage device 222 corresponds to the water tank device 62, and the first water leakage device 212 and the second water leakage device 222 guide water to the water tank device 62 at the bottom of the center frame 6 and further discharge the water.
Preferably, as shown in fig. 1, the evaporation system 3 includes a water guide device 31, a water receiving tray 32, a heat dissipation fan 126, a heat dissipation device 127 and a box body rear cover 53; the case rear cover 53 is provided with a vent hole 531, and water vapor is discharged outside the case through the vent hole 531.
Preferably, as shown in fig. 1, the water guide device 31 is disposed on the sink device 62, and the water guide device 31 is made of sponge material; one end of the water guide device 31 extends outwards to form a front end 311 of the water guide device, which mainly plays a role of a water bearing device; a water guide device water leakage hole 31111 is arranged on one side of the front end 311 of the water guide device to receive the flowing water from the first collection system 21; the end part of the front 311 of the water guide device is provided with a trapezoid notch 31112 for collecting water flow.
Preferably, as shown in fig. 1, a plurality of water guiding device drainage grooves 312 are arranged at the lower part of the water guiding device 31, so as to facilitate the guiding out of the collected water flow; both sides of the upper end of the water receiving tray 32 are provided with the flanging structures 321, and the water receiving tray 32 is mainly used for receiving redundant accumulated water, and particularly can guide water into the water receiving tray 32 when the water amount is large; the flanging structure 321 is assembled with the lapping structure 621; the heat dissipation fan 126 is fixed to the heat dissipation device 127, and accelerates the evaporation of water during operation.
Preferably, as shown in fig. 1, the heat sink 127 is fixed to the fastening claw 1252, and mainly uses the heat generated by the hot surface 1232 when the upper semiconductor chip 123 of the heat exchange module 12 cools to evaporate the water absorbed on the water guide 31 and the water in the water receiving tray 32; heat sink 127 includes heat sink front side 1271; the rib protruding structures B12711 are arrayed on the front side 1271 of the heat dissipation device, so that the surface heat dissipation area is increased.
A semiconductor refrigerator comprises the dehumidification drainage system.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims (10)

1. A dehumidification drain system includes a refrigerator (5); a dehumidification system (1) is arranged in the refrigerator (5); the method is characterized in that:
the refrigerator also comprises a drainage system (2), an evaporation system (3), a refrigerator compartment (4) and a middle frame (6);
the dehumidification system (1) comprises a plurality of air return openings (11) and a heat exchange module (12) which are arranged in a refrigerator (5);
the heat exchange module (12) comprises a fan A (121) and an upper semiconductor chip (123); a refrigerating block (122) is fixed on the fan A (121);
the refrigeration block (122) comprises a refrigeration block rear side (1221) and a refrigeration block front side (1222); the rear side (1221) of the refrigeration block is a plane; the front side (1222) of the refrigeration block is provided with a rib projection structure A (12221); a drainage groove (12222) is arranged between the rib protruding structures A (12221); the drainage groove (12222) is of a U-shaped structure and has the same direction as the gravity;
the upper semiconductor chip (123) includes a cooling surface (1231) and a heating surface (1232); the refrigerating surface (1231) is attached to the rear side (1221) of the refrigerating block;
the refrigerator compartment (4) comprises a first compartment (41) and a second compartment (42); the first compartment (41) comprises a first compartment floor (411) and a first compartment side wall (412); the second compartment (42) comprises a second compartment floor (421) and a second compartment sidewall (422);
the refrigerator (5) comprises a box body inner barrel (51), a box body outer barrel (52) and a box body rear cover (53); the inner box barrel (51) is connected with the outer box barrel (52) through a middle frame (6) to form a main body of the semiconductor refrigerator box body, and heat insulation materials are filled in the main body; the outer barrel (52) of the box body is fixed with the rear cover (53) of the box body.
2. A dehumidification drainage system according to claim 1, wherein said heat exchange module (12) further comprises a clamping seat (125); a clamping seat mounting hole (1251) is formed in the clamping seat (125);
a clamp spring (124) is fixed in the clamp seat mounting hole (1251); the other end of the clamp spring (124) is fixed with the refrigeration block (122);
the clamping seat (125) is provided with a plurality of buckling claws (1252).
3. A dehumidifying drainage system as claimed in claim 1, wherein the center frame (6) is provided with a shaft structure (61) for guiding water flow and a water tank device (62); the whole vertical shaft structure (61) is of a U-shaped structure; the shaft structure (61) comprises a centre frame back side (611); the back side (611) of the middle frame is matched with an inner barrel (51) of the box body and forms a square funnel; a lapping structure (621) is arranged in the water tank device (62); the water tank device (62) is provided with a plurality of U-shaped water guide grooves (622).
4. A dehumidification drain system according to claim 1 or 3, wherein said drain system (2) comprises a first collection system (21) and a second collection system (22);
the first collection system (21) comprises a first collection surface (211) and a first water leakage device (212); the first collecting surface (211) is arranged on the bottom surface (411) of the first compartment;
the first water leakage device (212) is a groove structure arranged on the surface of the first collecting surface (211); the first water leakage device (212) comprises an inclined surface (2121) and a first water leakage device bottom surface (2122), wherein the side wall of the first water leakage device is an inclined surface; the bottom surface (2122) of the first water leakage device is provided with a plurality of first water leakage device drainage holes (21221) with regular or irregular shapes.
5. A dehumidification drain system as defined in claim 3, wherein said second collection system (22) comprises a second collection surface (221) and a second water leakage means (222);
the second collecting surface (221) is arranged on the bottom surface (421) of the second compartment; the second collecting surface (221) and the second chamber side wall (422) form an included angle alpha; the second collecting surface (221) comprises a low surface part (2211), and a second water leakage device (222) is arranged at the low surface part (2211);
a plurality of second water leakage device drain holes (2221) with regular or irregular shapes are formed in the second water leakage device (222); the second water leakage device (222) corresponds to the water tank device (62).
6. A dehumidification drainage system according to claim 5, wherein said evaporation system (3) comprises a water guide (31), a water pan (32), a heat radiation fan (126), a heat radiation device (127) and a box back cover (53); a ventilation hole (531) is formed in the box body rear cover (53), and water vapor is discharged out of the box body through the ventilation hole (531).
7. A dehumidifying drainage system as claimed in claim 6, wherein the water guide means (31) is disposed on the water tank means (62), the water guide means (31) being of sponge material; one end of the water guide device (31) extends outwards to form a front end (311) of the water guide device; water leakage holes (31111) of the water guide device are arrayed on one side face of the front end (311) of the water guide device; the end part of the front end (311) of the water guide device is provided with a trapezoid notch (31112).
8. A dehumidifying drainage system as claimed in claim 6 or 7, wherein a plurality of water deflector drainage grooves (312) are provided in a lower portion of the water deflector (31); both sides of the upper end of the water receiving tray (32) are provided with flange structures (321); the heat dissipation fan (126) is fixed with the heat dissipation device (127).
9. A dehumidification drain system as set forth in claim 8, wherein said heat sink (127) comprises a heat sink front side (1271); the front side (1271) of the heat dissipation device is provided with a rib protruding structure B (12711).
10. A semiconductor refrigerator comprising a dehumidification drain system as claimed in any one of claims 1 to 9.
CN202010687049.4A 2020-07-16 2020-07-16 Dehumidification drainage system and semiconductor refrigerator Pending CN111795540A (en)

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CN202010687049.4A CN111795540A (en) 2020-07-16 2020-07-16 Dehumidification drainage system and semiconductor refrigerator

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CN2180946Y (en) * 1992-09-24 1994-10-26 合肥美菱电冰箱总厂 Water tray for compressor of refrigerator
CN2700782Y (en) * 2004-04-27 2005-05-18 深圳市龙岗区横岗保安金龙科技制品厂 Refrigerating plant of vehicle-mounted refrigerator
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